CN108091606A - Convenient for reducing the chip clamping device of vibrations - Google Patents
Convenient for reducing the chip clamping device of vibrations Download PDFInfo
- Publication number
- CN108091606A CN108091606A CN201711317683.3A CN201711317683A CN108091606A CN 108091606 A CN108091606 A CN 108091606A CN 201711317683 A CN201711317683 A CN 201711317683A CN 108091606 A CN108091606 A CN 108091606A
- Authority
- CN
- China
- Prior art keywords
- clamping device
- sliding slot
- babinet
- chip
- convenient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Vibration Prevention Devices (AREA)
Abstract
The invention discloses the chip clamping devices convenient for reduction vibrations, including babinet, babinet is provided at both ends with sliding slot, several cushioning fenders made of elastic material are provided in babinet, the both ends of cushioning fender are connected respectively with two sliding slots, the junction of cushioning fender and sliding slot is provided with clamping device, and clamping device can be moved along sliding slot；Described clamping device one end is located in the sliding slot, and the other end, which runs through to screw, is provided with screw rod, and screw rod is provided with movable pressure plate close to one end of sliding slot；Handle is provided on babinet, the bottom of box is hingedly provided with installation axle, the universal wheel with auto-lock function is provided in installation axle.The situation for the chip that the present invention places as needed, adjusts the spacing between each cushioning fender, and cushioning fender is made to play the role of fixed and damping to chip.
Description
Technical field
The present invention relates to computer realms, and in particular to convenient for reducing the chip clamping device of vibrations.
Background technology
Computer integrated manufacturing system (Computer Integrated Manufacturing System, abbreviation CIMS)
It is to be generated with the development of computer aided design and manufacture.It is the basis in automation of information technology and manufacture
On, it is organically integrated by computer technology various isolated automation subsystems in product design manufacturing process are dispersed in
Come, formed and produced suitable for multi items, small lot, realize the integrated and intelligent manufacturing system of overall efficiency.
Currently, the CIMS in China has been changed to " contemporary integrated manufacture (Contemporary Integrated
Manufacturing) with Modern Integrated Manufacturing System (Contemporary Integrated Manufacturing
System)”.It has expanded the intension of former CIM/CIMS in extensiveness and intensiveness.Wherein, " modern times " are meant that computer
Change, is information-based, is intelligent." integrated " has wider content, it is included integrated etc. three between information integration, process integration and enterprise
The integrated optimization in a stage；The integrated optimization of three elements and three streams in business activity；Integrated optimizations of the CIMS in relation to technology and each
Integrated optimization of class personnel etc..CIMS not only together with technological system and the management and production system integration, and people (people's
Thought, theory and intelligence) also integrate, the workflow, logistics and information flow of entire enterprise is made all to keep clear and phase
Mutual organic connections, so, CIMS is the product that people, operation and technology three integrate.
Computer systems chip is one of essential component in Integrated manufacture, as circuit is integrated already,
It is the same to develop into IC chip, light path will also move towards integrated, develop into integrated optical circuit chip, optical waveguide technique is
The basis of integrated optics, it is the same that integrated optical circuit chip substitutes traditional product also with New Product comprehensively, progressively moves towards wider
General market application, then integrated circuit progressively develops into large scale integrated circuit then, so as to substitute traditional wire on a large scale
Road plate, the high technology content of product result in the mode of production and also greatly change, employ it is increasingly automated, can be mass-produced
Semiconductor machining mode go to produce, i.e., the mode of production of the wafer usually said processing, our similary optical integrated chip is also adopted
With the processing method of semiconductor, high performance optical integrated chip is produced to substitute traditional optical device and large-scale integrated
Circuit chip is the same, equally realizes high-volume, high efficiency production mode, the cost of product is lower, and volume smaller, performance are more steady
The fixed, low energy consumption of production procedure, production process is pollution-free, reduction is largely artificial, with high content of technology, performance indicator is high, product is attached
The features such as value added high.
At present, Computer systems chip is completing the production or in the production process, typically directly carried or
It covers with the protective films such as foamed plastics to be carried, the vibrations in carelessness or transportational process due to operating personnel are easy to cause higher
Scrappage.
The content of the invention
The technical problems to be solved by the invention, which are Computer systems chips, to be completed the production or in the production process,
It is typically directly carried or is coverd with the protective films such as foamed plastics to be carried, carelessness or transportational process due to operating personnel
In vibrations the problem of being easy to cause higher scrappage, and it is an object of the present invention to provide convenient for reducing the chip clamping device of vibrations, solution
The certainly above problem.
The present invention is achieved through the following technical solutions：
Convenient for reducing the chip clamping device of vibrations, including babinet, babinet is provided at both ends with sliding slot, is provided in babinet
Several cushioning fenders made of elastic material, the both ends of cushioning fender are connected respectively with two sliding slots, cushioning fender and sliding slot
Junction be provided with clamping device, and clamping device can be moved along sliding slot；Described clamping device one end is located at the sliding slot
Interior, the other end, which runs through to screw, is provided with screw rod, and screw rod is provided with movable pressure plate close to one end of sliding slot；Handle is provided on babinet
Hand, the bottom of box are hingedly provided with installation axle, the universal wheel with auto-lock function are provided in installation axle.
Chip is placed into babinet, along sliding slot mobile cushioning baffle, is then fixed cushioning fender by clamping device
On the chute, that is, screw rod is rotated, movable pressure plate is made to compress on the chute, the situation for the chip placed as needed, adjustment is respectively
Spacing between a cushioning fender makes cushioning fender play the role of fixed and damping, installation axle using the present invention to chip
And universal wheel, directly chip can be carried, the installation axle of the present invention and universal wheel can also be packed up, it is then that babinet is whole
It is placed in the vehicles such as lorry and is transported.
Further, the size of the sliding slot opening is less than groove width size, and clamping device is avoided to come off from sliding slot.
Further, the quantity of the cushioning fender is 3~8.
Further, one end that the clamping device is located in the sliding slot is completely fitted with the sliding slot.
Further, auxiliary guide rod is provided through on the movable pressure plate, and aids in guide rod and the screw rod
It is parallel.
Further, limited block is provided on the auxiliary guide rod, auxiliary guide rod is avoided to come off from clamping device.
Further, the one end of the screw rod away from movable pressure plate is provided with rotation handle, and personnel easy to operation rotate
Screw rod.
Further, the elastic material is foam or rubber.
Compared with prior art, the present invention it has the following advantages and advantages：
Chip is placed into babinet, is kept off along sliding slot mobile cushioning convenient for reducing the chip clamping device of vibrations by the present invention
Then cushioning fender by clamping device is fixed on the chute, that is, rotates screw rod, movable pressure plate is made to be pressed on sliding slot by plate
On, the situation for the chip placed as needed adjusts the spacing between each cushioning fender, cushioning fender is made to play chip solid
Fixed and damping effect.
Description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is schematic structural view of the invention；
Fig. 2 is clamping device structure diagram of the present invention.
Mark and corresponding parts title in attached drawing：
1- babinets, 2- sliding slots, 3- cushioning fenders, 4- clamping devices, 5- screw rods, 6- movable pressure plates, 7- rotation handles, 8-
Handle, 9- installation axles, 10- universal wheels.
Specific embodiment
Understand to make the object, technical solutions and advantages of the present invention clearer, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment
As shown in Fig. 1~Fig. 2, convenient for reducing the chip clamping device of vibrations, including babinet 1, babinet 1 is provided at both ends with
Sliding slot 2, is provided with several cushioning fender 3 made of elastic material in babinet 1, the both ends of cushioning fender 3 respectively with two cunnings
Slot 2 is connected, and cushioning fender 3 and the junction of sliding slot 2 are provided with clamping device 4, and clamping device 4 can be moved along sliding slot 2；Folder
Tight 4 one end of device is located in sliding slot 2, and the other end, which runs through to screw, is provided with screw rod 5, and screw rod 5 is provided with work close to one end of sliding slot 2
Dynamic pressure strip 6；Handle 8 is provided on babinet 1,1 bottom of babinet is hingedly provided with installation axle 9, and band self-locking is provided in installation axle 9
The universal wheel 10 of function.
Chip is placed into babinet 1, along 2 mobile cushioning baffle 3 of sliding slot, then by clamping device 4 by cushioning fender 3
It is fixed on sliding slot 2, that is, rotates screw rod 5, movable pressure plate 6 is made to be pressed on sliding slot 2, the feelings for the chip placed as needed
Condition adjusts the spacing between each cushioning fender 3, cushioning fender 3 is made to play the role of fixed and damping to chip, using this hair
Bright installation axle 9 and universal wheel 10, can directly carry chip, can also receive the installation axle 9 of the present invention and universal wheel 10
It rises, then babinet 1 is integrally placed in the vehicles such as lorry and is transported.
In said program, the size of 2 opening of sliding slot is less than groove width size, and clamping device 4 is avoided to come off from sliding slot 2,
The quantity of cushioning fender 3 is 3~8, and one end that clamping device 4 is located in sliding slot 2 is completely fitted with sliding slot 2, and activity compresses
Auxiliary guide rod is provided through on plate 6, and aids in guide rod parallel with screw rod 5, aids in being provided with limited block on guide rod, keep away
Exempt from that guide rod is aided in come off from clamping device 4, the one end of screw rod 5 away from movable pressure plate 6 is provided with rotation handle 7, is convenient for
Operating personnel rotate screw rod 5, and elastic material is foam or rubber.
Above specific embodiment has carried out the purpose of the present invention, technical solution and advantageous effect further in detail
Illustrate, it should be understood that these are only the specific embodiment of the present invention, the protection model being not intended to limit the present invention
It encloses, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done should be included in the present invention
Protection domain within.
Claims (8)
1. convenient for reducing the chip clamping device of vibrations, which is characterized in that including babinet (1), babinet (1) is provided at both ends with cunning
Slot (2), is provided with several cushioning fenders made of elastic material (3) in babinet (1), the both ends of cushioning fender (3) respectively with
Two sliding slots (2) are connected, and cushioning fender (3) and the junction of sliding slot (2) are provided with clamping device (4), and clamping device (4) energy
It is enough mobile along sliding slot (2)；
Described clamping device (4) one end is located in the sliding slot (2), and the other end, which runs through to screw, is provided with screw rod (5), screw rod (5)
One end of sliding slot (2) is provided with movable pressure plate (6)；
Handle (8) is provided on the babinet (1), babinet (1) bottom is hingedly provided with installation axle (9), and installation axle is set on (9)
There is the universal wheel (10) with auto-lock function.
2. the chip clamping device according to claim 1 convenient for reduction vibrations, which is characterized in that the sliding slot (2) is opened
Size at mouthful is less than groove width size.
3. the chip clamping device according to claim 1 convenient for reduction vibrations, which is characterized in that the cushioning fender
(3) quantity is 3~8.
4. the chip clamping device according to claim 3 convenient for reduction vibrations, which is characterized in that the clamping device
(4) one end being located in the sliding slot (2) is completely fitted with the sliding slot (2).
5. the chip clamping device convenient for reduction vibrations according to any one in Claims 1 to 4, which is characterized in that
Auxiliary guide rod is provided through on the movable pressure plate (6), and aids in guide rod parallel with the screw rod (5).
6. the chip clamping device according to claim 5 convenient for reduction vibrations, which is characterized in that the auxiliary guide rod
On be provided with limited block.
7. the chip clamping device convenient for reduction vibrations according to any one in Claims 1 to 4, which is characterized in that
The one end of the screw rod (5) away from movable pressure plate (6) is provided with rotation handle (7).
8. the chip clamping device convenient for reduction vibrations according to any one in Claims 1 to 4, which is characterized in that
The elastic material is foam or rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711317683.3A CN108091606A (en) | 2017-12-12 | 2017-12-12 | Convenient for reducing the chip clamping device of vibrations |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711317683.3A CN108091606A (en) | 2017-12-12 | 2017-12-12 | Convenient for reducing the chip clamping device of vibrations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108091606A true CN108091606A (en) | 2018-05-29 |
Family
ID=62175212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711317683.3A Withdrawn CN108091606A (en) | 2017-12-12 | 2017-12-12 | Convenient for reducing the chip clamping device of vibrations |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108091606A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109085895A (en) * | 2018-08-27 | 2018-12-25 | 李连庚 | Computer CPU damping device |
| CN112437555A (en) * | 2020-11-25 | 2021-03-02 | 江苏汇成光电有限公司 | Mechanism capable of reducing jitter in Tape Bonding technological process |
-
2017
- 2017-12-12 CN CN201711317683.3A patent/CN108091606A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109085895A (en) * | 2018-08-27 | 2018-12-25 | 李连庚 | Computer CPU damping device |
| CN109085895B (en) * | 2018-08-27 | 2020-04-21 | 李连庚 | Computer CPU damping device |
| CN112437555A (en) * | 2020-11-25 | 2021-03-02 | 江苏汇成光电有限公司 | Mechanism capable of reducing jitter in Tape Bonding technological process |
| CN112437555B (en) * | 2020-11-25 | 2021-11-09 | 江苏汇成光电有限公司 | Mechanism capable of reducing jitter in Tape Bonding technological process |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180529 |