CN108088864A - A kind of material three-dimensional microstructure reconstructing method and system - Google Patents
A kind of material three-dimensional microstructure reconstructing method and system Download PDFInfo
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- CN108088864A CN108088864A CN201711343453.4A CN201711343453A CN108088864A CN 108088864 A CN108088864 A CN 108088864A CN 201711343453 A CN201711343453 A CN 201711343453A CN 108088864 A CN108088864 A CN 108088864A
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- 239000000463 material Substances 0.000 title claims abstract description 140
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000001514 detection method Methods 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 13
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- 238000010884 ion-beam technique Methods 0.000 claims description 15
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- 238000001228 spectrum Methods 0.000 claims description 5
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- 238000009826 distribution Methods 0.000 abstract description 6
- 239000007790 solid phase Substances 0.000 abstract description 5
- 239000000523 sample Substances 0.000 description 41
- 238000005516 engineering process Methods 0.000 description 6
- 238000004611 spectroscopical analysis Methods 0.000 description 5
- 239000012071 phase Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 239000006258 conductive agent Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
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- 239000006183 anode active material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000012512 characterization method Methods 0.000 description 1
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/2206—Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement
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- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
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- G—PHYSICS
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- G06T2207/00—Indexing scheme for image analysis or image enhancement
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Abstract
The invention discloses a kind of material three-dimensional microstructure reconstructing methods and system, this method to include：S1. detected materials are performed etching, to obtain material section；S2. microstructure detection is carried out to the material section and Elemental redistribution detects, to obtain micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence；S3. according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, corresponding three-dimensional microstructures are obtained.The present invention can obtain the distributed in three dimensions of material composition；It can realize three-dimensional microstructures in a section etches and be obtained while component distributing, avoid the secondarily etched of material section；The standard divided by the use of elemental composition distribution as material solid phase constituent element, more accurate than now with the way of gray threshold, the division of material component categories is more extensive.
Description
Technical field
The present invention relates to material microstructures and ingredient representational field more particularly to a kind of material three-dimensional microstructure reconstruct side
Method and system.
Background technology
The microstructure and component distributing information of material are to determine the deciding factor of material materialization behavior.However for a long time with
Come, Characterization for Microstructure and component distributing analysis are independent.Scanning electron microscope is microstructure test
One of main tool, scanning electron microscope can carry out microstructure to macroscopic view-to microcosmic or even nano-scale material
Across scale measurement is to disclose the microcosmic multistage institutional framework (such as crystallite dimension, distributed mutually, interface feature, Impurity Distribution etc.) of material
Important means.EDS energy disperse spectroscopies (X-ray Energy Dispersive Spectroscopy, abbreviation EDS) also known as micro- electricity
Sub- probe is a kind of instrument for analyzing material element, is often combined with scanning electron microscope or transmission electron microscope, electronics is used under vacuum chamber
Beam bombards sample surfaces, and excited species launches characteristic X-ray, according to the wavelength of characteristic X-ray, qualitative and semi-quantitative analysis object
Prime element.Scanning electron microscope configuration X-ray energy spectrometer can by the microstructure of material and film micro area composition information and
The data such as crystalline orientation establish contact.However, these technologies are defined in material surface to the detection of material, for material internal
Structure distribution and substance distribution can not obtain.
Technology can perform etching material focused ion beam (Focused Ion Beam, FIB), so that material internal
It is exposed, it is a kind of new micro-processing technology.Focused ion beam has been realized in combining with Scanning electron microscopy at present
(FIB/SEM), a series of acquisition of material internal micro-structure two-dimensional image sequences can be realized by the technology.But at present,
The three-dimensional reconstruction method of material microstructure is come real to the division of different materials component by the adjusting of two dimensional image gray threshold
Existing.The shortcomings that this method to be difficult to accurately to determine there are threshold range, image sequence is difficult to continuously adjust, the micro- knot of three-dimensional of reconstruction
Structure divides constituent element inaccurate.
The content of the invention
An embodiment of the present invention provides a kind of material three-dimensional microstructure reconstructing method and system, for obtaining material composition
Distributed in three dimensions and solve the problems, such as that three-dimensional microstructures divide constituent element inaccurate in the prior art.
On the one hand, the embodiment of the present invention proposes a kind of material three-dimensional microstructure reconstructing method, the described method includes：
S1. detected materials are performed etching, to obtain material section；
S2. microstructure detection is carried out to the material section, to obtain the micro-structure two-dimension picture at section position, will obtained
The micro-structure two-dimension picture taken is added to micro-structure two-dimension picture sequence；
Elemental redistribution detection is carried out to the material section, to obtain the component distributing two-dimension picture at section position, will be obtained
The component distributing two-dimension picture taken is added to component distributing two-dimension picture sequence；
S3. according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, it is micro- to obtain corresponding three-dimensional
See structure.
Further, in step S2, further include：Judge the micro-structure two-dimension picture sequence and component distributing two-dimension picture
Whether sequence reaches default quantity；
If reaching, step S3 is performed；
It is no that then detected materials not up to are carried out with lasting sample introduction, until the sample introduction distance of the detected materials reaches default
Sample introduction distance, and return to step S1.
Further, when continue sample introduction to detected materials, sample introduction direction is perpendicular to material section direction.
Further, step S3 is specially：
Micro-structure two-dimension picture sequence is divided into solid skeletal and gap using gray threshold；
According to component distributing two-dimension picture sequence, phase group is carried out to the solid skeletal in the micro-structure two-dimension picture sequence
Member division；
Micro-structure two-dimension picture sequence is reconstructed into corresponding three-dimensional microstructures.
On the other hand, the embodiment of the present invention proposes a kind of material three-dimensional microstructure reconfiguration system, the system comprises：
Focused ion beam apparatus, for being performed etching to detected materials, to obtain material section；
Scanning electron microscope device, for carrying out microstructure detection to the material section, to obtain section position
Micro-structure two-dimension picture, by the micro-structure two-dimension picture of acquisition be added to micro-structure two-dimension picture sequence；
X-ray energy spectrum device, for carrying out Elemental redistribution detection to the material section, to obtain the ingredient at section position
Two-dimension picture is distributed, the component distributing two-dimension picture of acquisition is added to component distributing two-dimension picture sequence；
Image processing module, for according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, obtaining
Take corresponding three-dimensional microstructures.
Further, described image processing module is additionally operable to：
Judge whether micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach default quantity.
Further, further include：
The progressive device of section, for carrying out continuing sample introduction to detected materials, until the sample introduction distance of the detected materials reaches
To default sample introduction distance.
Further, when the progressive device of the section continue sample introduction to detected materials, sample introduction direction is perpendicular to material
Expect section direction.
Further, if image processing module judges that micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach
To default quantity, then described image processing module is according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence
Row, obtain corresponding three-dimensional microstructures；
If described image processing module judges the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence not
Reach default quantity, then the progressive device of section carries out detected materials to continue sample introduction, until the sample introduction distance of the detected materials
After reaching default sample introduction distance, return and obtain material section step.
Further, described image processing module is according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture
Sequence, obtaining corresponding three-dimensional microstructures is specially：
The micro-structure two-dimension picture sequence is divided into solid skeletal and gap using gray threshold；
According to the component distributing two-dimension picture sequence, phase group is carried out to the solid skeletal in micro-structure two-dimension picture sequence
Member division；
Micro-structure two-dimension picture sequence is reconstructed into corresponding three-dimensional microstructures.
The material three-dimensional microstructure reconstructing method and system that the embodiment of the present invention is provided, have the advantages that：
1) distributed in three dimensions of material composition can be obtained；
2) three-dimensional microstructures can be realized and obtained while component distributing in a section etches, avoided material and break
Face it is secondarily etched；
3) standard divided as material solid phase constituent element is distributed by the use of elemental composition, than the way now with gray threshold
More accurate, the division of material component categories is more extensive.
Description of the drawings
Fig. 1 is a kind of material three-dimensional microstructure reconstructing method flow chart in embodiment one；
Fig. 2 is a kind of material three-dimensional microstructure reconfiguration system structure chart in embodiment three.
Specific embodiment
It is specific embodiments of the present invention and with reference to attached drawing below, technical scheme is further described,
But the present invention is not limited to these embodiments.
Technical solution proposed by the present invention is：Section etching is carried out to material using focused ion beam as material etch instrument,
The joint-detection of electron microscope and energy disperse spectroscopy is scanned to the section of formation, obtains the X-Y scheme of micro-structure and component distributing
Picture, and according to micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, reconstruct three-dimensional microstructures.
It is the specific embodiment of the invention below.
Embodiment one
Fig. 1 is a kind of material three-dimensional microstructure reconstructing method flow chart in the present embodiment, as shown in Figure 1, the present embodiment
A kind of middle material three-dimensional microstructure reconstructing method includes：
S1. detected materials are performed etching, to obtain material section；
In this step, detected materials are performed etching using focused ion beam apparatus, obtain material section；Focused ion beam
It is the ion beam generated by Ga ion sources, focused ion beam accelerates by ion gun, material is performed etching；Focused ion beam
Accelerating potential is adjusted according to different material characters.
In the present embodiment, the accelerating potential intensity of focused ion beam ejecting gun can be arranged to 20kV, utilize generation
Accelerated ion beam carries out section etching to detected materials, and cross-sectional area can be 5 μm of 5 μ m.
S2. microstructure detection is carried out to the material section, to obtain the micro-structure two-dimension picture at section position, will obtained
The micro-structure two-dimension picture taken is added to micro-structure two-dimension picture sequence；
Elemental redistribution detection is carried out to the material section, to obtain the component distributing two-dimension picture at section position, will be obtained
The component distributing two-dimension picture taken is added to component distributing two-dimension picture sequence；
In this step, microstructure detection is carried out to the material section by scanning electron microscope device, to obtain
The micro-structure two-dimension picture of acquisition is added to micro-structure two-dimension picture sequence by the micro-structure two-dimension picture at section position；
Scanning electron microscope (SEM) is the relatively modern RESEARCH ON CELL-BIOLOGY instrument of nineteen sixty-five invention, mainly profit
The configuration of surface of sample is observed with secondary electron signal imaging, i.e., removes scanning sample with extremely narrow electron beam, passes through electronics
The interaction of beam and sample generates various effects, wherein the mainly secondary of sample.Secondary electron can generate
The X rays topographs of sample surfaces amplification, this seems chronologically to be set up when sample is scanned, i.e., using being imaged point by point
Method obtains intensified image.
In this step, Elemental redistribution detection is carried out to the material section by X-ray energy spectrum device (energy disperse spectroscopy), to obtain
The component distributing two-dimension picture at section position is taken, the component distributing two-dimension picture of acquisition is added to component distributing two-dimension picture sequence
Row.
Energy disperse spectroscopy (EDS, Energy Dispersive Spectrometer) is for material domain component element kind
Class and content analysis coordinate the use of scanning electron microscope and transmission electron microscope.Various elements have the X-ray of oneself
Characteristic wavelength, the size of characteristic wavelength then depend on the characteristic energy △ E released during energy level transition, and energy disperse spectroscopy is exactly profit
Constituent analysis is carried out with this different feature of different element x-ray photon characteristic energies.
In this step, the micro-structure two-dimension picture and component distributing two-dimension picture of detected materials can obtain simultaneously, realize
Micro structure testing and on-line checking while composition detection.
S3. according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, it is micro- to obtain corresponding three-dimensional
See structure.
In this step, image processing module is according to scanning electron microscope device and the section of X-ray energy spectrum device acquisition
The micro-structure two-dimension picture at position and component distributing two-dimension picture obtain corresponding three-dimensional microstructures by image procossing, tool
Body process includes：
S31. micro-structure two-dimension picture sequence is divided into solid skeletal and gap using gray threshold；
S32. according to component distributing two-dimension picture sequence, the solid skeletal in the micro-structure two-dimension picture sequence is carried out
Phase constituent element divides；
In this step, the alternate subregion of clear and definite solid skeletal is carried out by using component distributing X-Y scheme, makes solid skeletal
Composition is more detailed.
S33. micro-structure two-dimension picture sequence is reconstructed into corresponding three-dimensional microstructures.
In the present embodiment, in step S2, further include：Judge the micro-structure two-dimension picture sequence and component distributing X-Y scheme
Whether piece sequence reaches default quantity；
If the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach default quantity, step is performed
S3；
If the not up to default quantity of the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, to be measured
Material carries out continuing sample introduction, until the sample introduction distance of the detected materials reaches default sample introduction distance, and return to step S1.
Wherein, when continue sample introduction to detected materials, sample introduction direction is perpendicular to material section direction.
In this step, material is carried out using section progressive device to continue sample introduction, sample introduction direction is perpendicular to material section
Direction；
In addition, by setting default sample introduction distance (such as 200 nanometers), it can reach and material internal particle is realized at many levels
The purpose of cutting.
The material three-dimensional microstructure reconstructing method that the present embodiment is provided, has the advantages that：
1) distributed in three dimensions of material composition can be obtained；
2) three-dimensional microstructures can be realized and obtained while component distributing in a section etches, avoided material and break
Face it is secondarily etched；
3) standard divided as material solid phase constituent element is distributed by the use of elemental composition, than the way now with gray threshold
More accurate, the division of material component categories is more extensive.
Embodiment two
In the present embodiment, before the reconstruct of material three-dimensional microstructure, further include：Material preparation process, specially：
A certain amount of anode active material of lithium ion battery (cobalt acid lithium), conductive agent (carbon black), bonding agent (PVDF) are pressed
It is fully dry grinded according to certain proportion, adds in a certain amount of NMP (N-Methyl pyrrolidone) and carry out wet-milling；
The slurry of milled is formed into the porous material coating that thickness is about 100 microns by scratching on aluminium foil；
Material is cut into 3mm × 3mm sizes, and carries out vapor deposition and leads gold；
The sample for plating good gold is placed in sample stage, and passes through scanning electron microscope device and determines detection zone.
The present embodiment is divided by three-dimensional microstructures reconstructing method by the use of elemental composition distribution as material solid phase constituent element
Standard can form each component (conductive agent, bonding agent, active material etc.) of lithium ion battery porous electrode apparent draw
Point, more accurate using the way of gray threshold than existing, the division of material component categories is more extensive；And material can be obtained
Expect the distributed in three dimensions of ingredient, this is that current three-dimensional reconstruction method does not possess.
Embodiment three
Fig. 2 is a kind of material three-dimensional microstructure reconfiguration system structure chart in the present embodiment, as shown in Fig. 2, the present embodiment
A kind of middle material three-dimensional microstructure reconfiguration system includes：
Focused ion beam apparatus 10, for being performed etching to detected materials, to obtain material section；
Scanning electron microscope device 20, for carrying out microstructure detection to the material section, to obtain section portion
The micro-structure two-dimension picture of acquisition is added to micro-structure two-dimension picture sequence by the micro-structure two-dimension picture of position；
X-ray energy spectrum device 30, for the material section carry out Elemental redistribution detection, with obtain section position into
The component distributing two-dimension picture of acquisition is added to component distributing two-dimension picture sequence by distribution two-dimension picture；
Image processing module 40, for according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence,
Obtain corresponding three-dimensional microstructures.
Described image processing module 40 is additionally operable to：
Judge whether micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach default quantity.
In the present embodiment, which further includes：
The progressive device 50 of section, for carrying out continuing sample introduction to detected materials, until the sample introduction distance of the detected materials
Reach default sample introduction distance.
When the progressive device 50 of section continue sample introduction to detected materials, sample introduction direction is perpendicular to material section side
To.
If image processing module 40 judges that micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach default
Quantity, then described image processing module 40 obtained according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence
Take corresponding three-dimensional microstructures；
If described image processing module 40 judges the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence
Not up to default quantity, then the progressive device 50 of section carries out detected materials to continue sample introduction, until the sample introduction of the detected materials
After distance reaches default sample introduction distance, return and obtain material section step, by focused ion beam apparatus 10 again to detected materials
It performs etching, to obtain new material section.
Described image processing module 40 is obtained according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence
The corresponding three-dimensional microstructures are taken to be specially：
The micro-structure two-dimension picture sequence is divided into solid skeletal and gap using gray threshold；
According to the component distributing two-dimension picture sequence, phase group is carried out to the solid skeletal in micro-structure two-dimension picture sequence
Member division；
Micro-structure two-dimension picture sequence is reconstructed into corresponding three-dimensional microstructures.
In the present embodiment, which further includes sample stage 60, for fixing detected materials, the progressive device 50 of section and sample
Platform 60 is connected.
In the present embodiment, which further includes housing 70, for shielding to each device in system and module.
The material three-dimensional microstructure reconfiguration system that the present embodiment is provided, has the advantages that：
1) distributed in three dimensions of material composition can be obtained；
2) three-dimensional microstructures can be realized and obtained while component distributing in a section etches, avoided material and break
Face it is secondarily etched；
3) standard divided as material solid phase constituent element is distributed by the use of elemental composition, than the way now with gray threshold
More accurate, the division of material component categories is more extensive.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology belonging to the present invention is led
The technical staff in domain can do various modifications or additions to described specific embodiment or replace in a similar way
Generation, but without departing from spirit of the invention or beyond the scope of the appended claims.
Claims (10)
1. a kind of material three-dimensional microstructure reconstructing method, which is characterized in that including：
S1. detected materials are performed etching, to obtain material section；
S2. microstructure detection is carried out to the material section, to obtain the micro-structure two-dimension picture at section position, by acquisition
Micro-structure two-dimension picture is added to micro-structure two-dimension picture sequence；
Elemental redistribution detection is carried out to the material section, to obtain the component distributing two-dimension picture at section position, by acquisition
Component distributing two-dimension picture is added to component distributing two-dimension picture sequence；
S3. according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, corresponding three-dimensional microcosmic knot is obtained
Structure.
2. material three-dimensional microstructure reconstructing method according to claim 1, which is characterized in that in step S2, further include：
Judge whether the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach default quantity；
If reaching, step S3 is performed；
It is no that then detected materials not up to are carried out with lasting sample introduction, until the sample introduction distance of the detected materials reaches default sample introduction
Distance, and return to step S1.
3. material three-dimensional microstructure reconstructing method according to claim 2, which is characterized in that detected materials are held
During continuous sample introduction, sample introduction direction is perpendicular to material section direction.
4. material three-dimensional microstructure reconstructing method according to claim 1, which is characterized in that step S3 is specially：
Micro-structure two-dimension picture sequence is divided into solid skeletal and gap using gray threshold；
According to component distributing two-dimension picture sequence, phase constituent element is carried out to the solid skeletal in the micro-structure two-dimension picture sequence and is drawn
Point；
Micro-structure two-dimension picture sequence is reconstructed into corresponding three-dimensional microstructures.
5. a kind of material three-dimensional microstructure reconfiguration system, which is characterized in that including：
Focused ion beam apparatus, for being performed etching to detected materials, to obtain material section；
Scanning electron microscope device, for carrying out microstructure detection to the material section, to obtain the micro- of section position
The micro-structure two-dimension picture of acquisition is added to micro-structure two-dimension picture sequence by structure two-dimension picture；
X-ray energy spectrum device, for carrying out Elemental redistribution detection to the material section, to obtain the component distributing at section position
The component distributing two-dimension picture of acquisition is added to component distributing two-dimension picture sequence by two-dimension picture；
Image processing module, for according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence, acquisition pair
The three-dimensional microstructures answered.
6. material three-dimensional microstructure reconfiguration system according to claim 5, which is characterized in that described image processing module
It is additionally operable to：
Judge whether micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach default quantity.
7. material three-dimensional microstructure reconfiguration system according to claim 5, which is characterized in that further include：
The progressive device of section, for carrying out continuing sample introduction to detected materials, until the sample introduction distance of the detected materials reaches pre-
If sample introduction distance.
8. material three-dimensional microstructure reconfiguration system according to claim 7, which is characterized in that the progressive device of section
When continue sample introduction to detected materials, sample introduction direction is perpendicular to material section direction.
9. the material three-dimensional microstructure reconfiguration system according to claim 6 or 7 or 8, which is characterized in that if image procossing
Module judges that micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence reach default quantity, then described image processing mould
Root tuber obtains corresponding three-dimensional microstructures according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence；
If described image processing module judges that the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence are not up to
Default quantity, then the progressive device of section carries out detected materials to continue sample introduction, until the sample introduction distance of the detected materials reaches
After default sample introduction distance, return and obtain material section step.
10. material three-dimensional microstructure reconfiguration system according to claim 5, which is characterized in that described image handles mould
It is specific to obtain corresponding three-dimensional microstructures according to the micro-structure two-dimension picture sequence and component distributing two-dimension picture sequence for root tuber
For：
The micro-structure two-dimension picture sequence is divided into solid skeletal and gap using gray threshold；
According to the component distributing two-dimension picture sequence, phase constituent element is carried out to the solid skeletal in micro-structure two-dimension picture sequence and is drawn
Point；
Micro-structure two-dimension picture sequence is reconstructed into corresponding three-dimensional microstructures.
Priority Applications (1)
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