CN108078324A - A kind of intelligent temperature control cup - Google Patents
A kind of intelligent temperature control cup Download PDFInfo
- Publication number
- CN108078324A CN108078324A CN201810107174.6A CN201810107174A CN108078324A CN 108078324 A CN108078324 A CN 108078324A CN 201810107174 A CN201810107174 A CN 201810107174A CN 108078324 A CN108078324 A CN 108078324A
- Authority
- CN
- China
- Prior art keywords
- cup
- switch circuit
- control switch
- silica gel
- semiconductor refrigerating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2288—Drinking vessels or saucers used for table service with means for keeping liquid cool or hot
Abstract
The invention discloses a kind of intelligent temperature control cups, are made of cup body and cup lid, cup body is sealed by cup lid.The cup body includes shell and liner;The bottom of the shell is equipped with power supply, heat-insulating shield, thermosensitive control switch circuit from bottom to top;The lower part of the liner is come into full contact with by heat-conducting medium and thermosensitive control switch circuit, and side wall of inner is stained with several spaced silica gel heating sheets and semiconductor refrigerating item;The thermosensitive control switch circuit is connected respectively with adjusting knob, silica gel heating sheet, semiconductor refrigerating item.Liquid in cup can be heated or cooled to preferred temperature by the temperature control cup of the present invention according to the demand of different crowd, Various Seasonal, embody humanized design theory.
Description
Technical field
The present invention relates to cup more particularly to one kind can both heat or coolable intelligent temperature control cup.
Background technology
At present, cup on the market rarely has heat or cool in addition to electric cup.Not only power consumption is big for electric heating cup, and
And it is easy to cause user's scald even fire.It is few that improvement is made in terms of cup temperature adjustment, Chinese invention patent application
CN107114976A discloses a kind of intelligent temperature control cup of combination room temperature, by the mild water temperature of temperature sensor sensing chamber, PTC temperature-sensitives
Resistance Heating Film is arranged at liner bottom surface, and water in the cup is heated by PTC thermistor.However the intelligent temperature control cup can not will be in cup
Liquid cooling is to the preferred temperature of user, and the efficiency of heating surface is low, and manufacture is of high cost, is poorly suited for applying.
The content of the invention
The present invention is intended to provide a kind of intelligent temperature control cup, the temperature control cup is according to different crowd, the demand of Various Seasonal, by cup
Middle liquid is heated or cooled to preferred temperature, so as to embody humanized design theory.
To achieve these goals, the technical solution adopted in the present invention is:
A kind of intelligent temperature control cup, is made of cup body and cup lid, and cup body is sealed by cup lid, and the cup body includes shell and interior
Courage;The bottom of the shell is equipped with power supply, heat-insulating shield, thermosensitive control switch circuit from bottom to top;The lower part of the liner passes through
Heat-conducting medium comes into full contact with thermosensitive control switch circuit, and side wall of inner is stained with several spaced silica gel heating sheets and half
Conductor refrigeration item;The thermosensitive control switch circuit is connected respectively with adjusting knob, silica gel heating sheet, semiconductor refrigerating item.
Shell described further is equipped with adjusting knob, switch;The power supply is thermosensitive control switch circuit, semiconductor system
Cold item, silica gel heating sheet provide electric power support;The thermosensitive control switch circuit is mainly by NTC thermistor Rn, MOSFET member
Part Q1, MOSFET element Q2, resistance R1, resistance R2, resistance R3, rheostat R0 are formed;In order to absorb the heat of semiconductor chilling plate
Face is distributed to the heat in space, and the semiconductor refrigerating item is by the phase-change material and the semiconductor system that are packaged in advance in heat-conducting medium
Cold composition, the phase-change material are adhered to the hot face of semiconductor chilling plate.
Adjusting knob described further sets rheostat R0 resistance value sizes, and then adjusts preferred temperature;The NTC temperature-sensitives electricity
Resistance Rn changes the resistance value of itself, and then fluid temperature in detection cup in real time with fluid temperature in cup;NTC thermistor Rn is combined
Rheostat R0 resistance value sizes generate a temperature-independent current potential according to Ohm's law;The temperature-independent current potential is added in MOSFET
On the grid 1 of element Q1, the grid 2 of MOSFET element Q2;MOSFET element Q1, MOSFET element Q2 are according to temperature-independent current potential
With the logical relation between self-contained conduction threshold current potential, can draw in preferred temperature and temperature control cup between fluid temperature
Magnitude relationship, further by controlling the break-make of conducting channel between source electrode 1 and drain electrode 1, source electrode 2 and drain electrode 2, so as to control silicon
The conducting and shut-off of heating circuit and cooling circuit where semiconductor refrigerating item where glue heating plate;If fluid temperature is higher than in cup
Preferred temperature, then silica gel heating sheet do not work, semiconductor refrigerating item is to liquid cooling in temperature control cup to preferred temperature;If liquid in cup
Temperature is less than preferred temperature, then semiconductor refrigerating item does not work, and silica gel heating sheet is heated to liquid in temperature control cup it is expected temperature
Degree;And then fluid temperature in monitoring cup in real time is realized, and the preferred temperature set is combined, automatically to the liquid temperature in Intelligent cup
Degree control.
Compared with prior art, the beneficial effects of the invention are as follows:
1) this temperature control cup selects the MOSFET element of low-power to be controlled as break-make, saves space, reduces cost, switch speed
Degree is fast, and provides higher controllability energy;
2) this temperature control cup is heated using silica gel heating sheet, the cooling of semiconductor refrigerating item, compact-sized, intelligently, conveniently, soon
It is prompt;
3) for silica gel heating sheet with semiconductor refrigerating item using annular arrangement, heating, cooling efficiency are high;
4) this temperature control cup is as needed, can liquid in cup be heated or cooled to preferred temperature.
Description of the drawings
Fig. 1 is the structural profile illustration of intelligent temperature control cup of the present invention;
Fig. 2 is the horizontal cross-section schematic diagram of liner of the present invention;
Fig. 3 is the structure diagram of semiconductor refrigerating item of the present invention;
Fig. 4 is the circuit diagram of heating circuit and cooling circuit of the present invention.
In figure
1- liners;2- shells;3- cup lids;4- power supplys;5- heat-insulating shields;6- thermosensitive control switch circuits;7- heat-conducting mediums;8-
Semiconductor refrigerating item;9- silica gel heating sheets;10- adjusting knobs;11- is switched;12- cup bodies;13- semiconductor chilling plates;14- phase transformations
Material;V- power supplys;R1- resistance R1;R2- resistance R2;R3- resistance R3;R0- rheostats R0;Rn-NTC thermistors Rn;Q1-
MOSFET element Q1;Q2-MOSFET elements Q2;A1- semiconductor refrigerating items;A2- silica gel heating sheets;G1- grids 1;G2- grids 2;
S1- source electrodes 1;S2- source electrodes 2;D1- drain electrodes 1;D2- drain electrodes 2.
Specific embodiment
Below with reference to the embodiment of the present invention, the invention will be further described, following embodiment be it is descriptive, no
It is limited, it is impossible to which protection scope of the present invention is limited with this.
As shown in FIG. 1 to 3, a kind of intelligent temperature control cup is made of cup body (12) and cup lid (3), and cup body (12) is by cup lid
(3) seal, the cup body (12) includes shell (2) and liner (1);The bottom of the shell (2) is equipped with power supply from bottom to top
(4), heat-insulating shield (5), thermosensitive control switch circuit (6);The lower part of the liner (1) is controlled by heat-conducting medium (7) and temperature-sensitive
On-off circuit (6) comes into full contact with, and liner (1) side wall is stained with several spaced silica gel heating sheets (9) and semiconductor refrigerating
Item (8);The thermosensitive control switch circuit (6) respectively with adjusting knob (10), silica gel heating sheet (9), semiconductor refrigerating item (8)
It is connected.
With reference to Fig. 1~Fig. 4, the shell (2) is equipped with adjusting knob (10), switch (11);The power supply (4) is temperature-sensitive
On-off circuit (6), semiconductor refrigerating item (8), silica gel heating sheet (9) is controlled to provide electric power support;The thermosensitive control switch electricity
Road (6) is mainly by NTC thermistor Rn, MOSFET element Q1, MOSFET element Q2, resistance R1, resistance R2, resistance R3, variable resistance
Device R0 is formed;In order to which the hot face for absorbing semiconductor chilling plate (13) is distributed to the heat in space, the semiconductor refrigerating item (8) by
The phase-change material (14) and semiconductor chilling plate (13) being packaged in advance in heat-conducting medium are formed, which is adhered to
The hot face of semiconductor chilling plate (13).
With reference to Fig. 1 and Fig. 4, the adjusting knob (10) sets rheostat R0 resistance value sizes, and then adjusts preferred temperature;Institute
It states NTC thermistor Rn and changes the resistance value of itself, and then fluid temperature in detection cup in real time with fluid temperature in cup;NTC heat
Quick resistance Rn combinations rheostat R0 resistance value sizes generate a temperature-independent current potential according to Ohm's law;By temperature-independent electricity
Position is added in the grid 1 of MOSFET element Q1, on the grid 2 of MOSFET element Q2;MOSFET element Q1, MOSFET element Q2 according to
Logical relation between temperature-independent current potential and self-contained conduction threshold current potential can draw preferred temperature and liquid in temperature control cup
Magnitude relationship between temperature, while the break-make by controlling conducting channel between source electrode 1 and drain electrode 1, source electrode 2 and drain electrode 2,
Heating circuit where further controlling silica gel heating sheet (9) and the conducting on cooling circuit where semiconductor refrigerating item (8) and pass
It is disconnected;If fluid temperature is higher than preferred temperature in cup, silica gel heating sheet (9) does not work, and semiconductor refrigerating item (8) is in temperature control cup
Liquid cooling is to preferred temperature;If fluid temperature is less than preferred temperature in cup, semiconductor refrigerating item (8) does not work, and silica gel adds
Backing (9) is heated to preferred temperature to liquid in temperature control cup;And then fluid temperature in monitoring cup in real time is realized, and combine and set
Preferred temperature, automatically in Intelligent cup fluid temperature control.
Above-described is only the preferred embodiment of the present invention, it is noted that for those of ordinary skill in the art
For, on the premise of inventive concept is not departed from, various modifications and improvements can be made, such as silica gel heating sheet and semiconductor
Freeze the shape of item, quantity, the position of switch, the shape etc. of cup body, these belong to protection scope of the present invention.
Claims (2)
1. a kind of intelligent temperature control cup is made of cup body (12) and cup lid (3), cup body (12) is sealed by cup lid (3), the cup body
(12) shell (2) and liner (1) are included;It is characterized in that, the bottom of the shell (2) is equipped with power supply (4), thermal insulation from bottom to top
Plate (5), thermosensitive control switch circuit (6);
The lower part of the liner (1) is come into full contact with by heat-conducting medium (7) and thermosensitive control switch circuit (6), liner (1) side wall
It is stained with several spaced silica gel heating sheets (9) and semiconductor refrigerating item (8);
The thermosensitive control switch circuit (6) respectively with adjusting knob (10), silica gel heating sheet (9), semiconductor refrigerating item (8) phase
Even.
2. intelligent temperature control cup according to claim 1, which is characterized in that the shell (2) be equipped with adjusting knob (10),
It switchs (11);
The power supply (4) is thermosensitive control switch circuit (6), semiconductor refrigerating item (8), silica gel heating sheet (9) provide electric power branch
It holds;
The thermosensitive control switch circuit (6) is mainly by NTC thermistor Rn, MOSFET element Q1, MOSFET element Q2, resistance
R1, resistance R2, resistance R3, rheostat R0 are formed;
The semiconductor refrigerating item (8), by the phase-change material (14) and semiconductor chilling plate being packaged in advance in heat-conducting medium
(13) form, which is adhered to the hot face of semiconductor chilling plate (13).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810107174.6A CN108078324A (en) | 2018-02-02 | 2018-02-02 | A kind of intelligent temperature control cup |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810107174.6A CN108078324A (en) | 2018-02-02 | 2018-02-02 | A kind of intelligent temperature control cup |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108078324A true CN108078324A (en) | 2018-05-29 |
Family
ID=62194374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810107174.6A Withdrawn CN108078324A (en) | 2018-02-02 | 2018-02-02 | A kind of intelligent temperature control cup |
Country Status (1)
Country | Link |
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CN (1) | CN108078324A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112773158A (en) * | 2020-07-24 | 2021-05-11 | 深圳思路文脉科技有限公司 | Intelligent temperature control cup |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013013383A1 (en) * | 2011-07-25 | 2013-01-31 | He Jingcang | Electric water heating cup for use in automobile |
CN204292782U (en) * | 2014-12-10 | 2015-04-29 | 杜美莹 | Temperature control type water tumbler |
CN204950388U (en) * | 2015-08-20 | 2016-01-13 | 河海大学 | Variable warm water cup of chargeable type |
CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
CN206062777U (en) * | 2016-05-27 | 2017-04-05 | 江苏建筑职业技术学院 | A kind of intelligent temperature control water tumbler |
CN206453636U (en) * | 2016-11-24 | 2017-09-01 | 卢永强 | A kind of rapid temperature rise and drop power generation water cup |
CN107114976A (en) * | 2017-05-31 | 2017-09-01 | 华南理工大学 | A kind of intelligent temperature control cup of combination room temperature |
CN206933903U (en) * | 2016-09-23 | 2018-01-30 | 东莞理工学院 | A kind of portable refrigeration heats thermos cup |
-
2018
- 2018-02-02 CN CN201810107174.6A patent/CN108078324A/en not_active Withdrawn
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013013383A1 (en) * | 2011-07-25 | 2013-01-31 | He Jingcang | Electric water heating cup for use in automobile |
CN204292782U (en) * | 2014-12-10 | 2015-04-29 | 杜美莹 | Temperature control type water tumbler |
CN204950388U (en) * | 2015-08-20 | 2016-01-13 | 河海大学 | Variable warm water cup of chargeable type |
CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
CN206062777U (en) * | 2016-05-27 | 2017-04-05 | 江苏建筑职业技术学院 | A kind of intelligent temperature control water tumbler |
CN206933903U (en) * | 2016-09-23 | 2018-01-30 | 东莞理工学院 | A kind of portable refrigeration heats thermos cup |
CN206453636U (en) * | 2016-11-24 | 2017-09-01 | 卢永强 | A kind of rapid temperature rise and drop power generation water cup |
CN107114976A (en) * | 2017-05-31 | 2017-09-01 | 华南理工大学 | A kind of intelligent temperature control cup of combination room temperature |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112773158A (en) * | 2020-07-24 | 2021-05-11 | 深圳思路文脉科技有限公司 | Intelligent temperature control cup |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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WW01 | Invention patent application withdrawn after publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180529 |