CN108070357A - A kind of abrasive material formula finely polished for glass and semiconductor - Google Patents
A kind of abrasive material formula finely polished for glass and semiconductor Download PDFInfo
- Publication number
- CN108070357A CN108070357A CN201610996134.2A CN201610996134A CN108070357A CN 108070357 A CN108070357 A CN 108070357A CN 201610996134 A CN201610996134 A CN 201610996134A CN 108070357 A CN108070357 A CN 108070357A
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- CN
- China
- Prior art keywords
- abrasive
- abrasive material
- total content
- curing
- polyacrylate
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A kind of abrasive material formula finely polished for glass and semiconductor, including adhesive, reactive diluent, initiator, anti-aging agent, plasticizer and solid abrasive.Adhesive is polyacrylate, and reactive diluent is esters of acrylic acid reactive monomer, using ultraviolet light-initiated or heating rapid curing, solid abrasive is silicoglaserite, calcium carbonate, corundum, diamond, silica, one or more of molybdenum disulfide, carborundum etc., abrasive material has water-fast, acid-alkali-corrosive-resisting after curing, the advantages that hardness, wear rate are moderate, and polishing is fine and smooth.
Description
Technical field
The invention belongs to polymer composite application fields.
Background technology
Crystal (ambetti) is used widely in daily life in lamps and lanterns, dress ornament etc. at present, and optical glass, half
Conductor is then the critical component of optical instrument, household digital product and electronic device.China is for crystal glass, optics glass at present
The processing of the fine gtinding of glass and semiconductor is mainly processed with resin ground disk.And existing resin ground material higher price,
And it is excessive or too small wear rate easily occur, causes abrasive material consumption is too fast waste or solid abrasive is caused to be difficult to expose, grinding efficiency
The phenomenon that too low.Current many patents are the polymer composites using polyacrylate as matrix.Publication No.
The Chinese patent of CN101817172A is based on cured solidified abrasive grinding polishing pad of thermal initiation and preparation method thereof and discloses base
In cured solidified abrasive grinding polishing pad of thermal initiation and preparation method thereof, but prepare abrasive material formula needs used in this kind of grinding pad
Heated baking shaping is carried out in baking oven, process is less efficient, and easily lead to the grinding pad internal solids material of preparation
It is unevenly distributed, easily occurs stomata in grinding, density is smaller, and mechanical strength is poor, influences the service life of grinding pad.Publication number
A kind of thermosetting resin grinding pad and preparation method thereof is disclosed for the Chinese patent of CN102632453A, using polyacrylate
180 DEG C of heat cures of prepolymer of class, the formula components are complex, and using compared with multi-diamond and metal powder is added, cost is higher.
The Chinese patent of Publication No. CN101428404A discloses solidified abrasive grinding polishing pad and preparation method thereof, using photocuring
Initiator, the formula components are also complex, and many ingredients used are difficult to achieve the effect that expressed by it.Publication No.
The Chinese patent of CN101096080A is disclosed with the solidified abrasive grinding polishing pad and preparation method for reviewing one's lessons by oneself orthofunction, is used
Free radical photo-initiation, but polymer content is higher in formula, and solid abrasive is less, the phenomenon that grinding efficiency is too low easily occurs.
The content of the invention
The problem of present invention is for existing abrasive material formula at present, a kind of mill finely polished for glass and semiconductor of invention
Material formula, the present invention include following technology contents：
Abrasive material formula includes adhesive, reactive diluent, initiator, anti-aging agent, plasticizer and solid abrasive.
Adhesive uses polyacrylate, polyester modification polyacrylate, one kind in epoxy-modified polyacrylate or
It is several, using ultraviolet light-initiated curing or it is heating and curing, total content 20%-40%.
Reactive diluent uses ethyl methacrylate, methyl methacrylate, tri (propylene glycol) diacrylate, season
Penta tetrol triacrylate, acrylic acid methoxy ethyl ester, acrylic acid ethoxy ethyl ester isoreactivity monomer.
Curing initiator be 1- hydroxycyclohexan Benzophenones, 2- hydroxy-2-methyl -1- phenylacetones, two isobutyl of azo
One or more of nitrile, cumyl hydroperoxide, cumyl peroxide, fluorinated diphenyl titanium cyclopentadienyl etc., total content is
0.05%-2%。
Anti-aging agent can be bisphenol-A, anti-aging agent RD, antioxidant A W, antioxidant 264, one kind in 445 grade of anti-aging agent or
It is several, total content 0.1%-3%.
Plasticizer is dibutyl phthalate, dioctyl phthalate, one kind in diisooctyl phthalate
Or several, total content 1%-10%.
Solid abrasive is silicoglaserite, calcium carbonate, corundum, diamond, silica, molybdenum disulfide, one kind in carborundum etc.
Or it is several, the granularity of each solid abrasive is less than 50 μm, and D50 is 1 ~ 10 μm, total content 60%-80%.
The suitable shape of 0.5-3 mm thickness can be made on a pet film with mold for the abrasive material mixed by formula, by ultraviolet light
10 ~ 30s rapid curings are irradiated, 80 ~ 120 DEG C of 10 ~ 60min is also can be heated to and cures.
Abrasive material formula or except solid abrasive above-mentioned organic materials mixing after, be stored in black plastic under the conditions of 0 ~ 38 DEG C
In bottle, it can keep never degenerating for 6 months.
The advantages that abrasive material has water-fast, acid-alkali-corrosive-resisting after curing, and hardness, wear rate are moderate, and polishing is fine and smooth.
Specific embodiment
Following embodiment is not limited to the scope of the present invention for illustrating the present invention.
Example 1
The polyester modification polyacrylate 20% of molecular weight 2500, reactive diluent ethyl acrylate 10%, photoinitiator 1- hydroxyls
Hexamethylene Benzophenone 1%, anti-aging agent bisphenol-A 1%, plasticizer phthalic acid dibutyl ester 5%.Solid abrasive be silicoglaserite 32%, carbon
Sour calcium is 28%, corundum Al2O32%, diamond 1%.After being mixed except the above-mentioned organic materials of solid abrasive, mixture viscosity is
320 centipoises.The polyester modification polyacrylic acid ester gum mixed is placed in black plastic bottle, the used time remixes solid abrasive, presses
The suitable shape of 1-3 mm thickness is made on a pet film according to mold, is placed under ultraviolet light and irradiates 10 ~ 30s and cure, practical grind
Mill pad.Grinding pad is polished into crystal glass on polishing machine, the average surface roughness of glass surface is 0.5nm after polishing.
Example 2
The epoxy-modified polyacrylate 20% of molecular weight 3000, reactive diluent ethyl acrylate 10%, initiator peroxidating two
Isopropylbenzene 1%, anti-aging agent RD 1%, plasticizer are dibutyl phthalate 5%.Solid abrasive is silicoglaserite 32%, and calcium carbonate is
28%, corundum Al2O32%, diamond 1%.After being mixed except the above-mentioned organic materials of solid abrasive, mixture viscosity is 350 lis
Pool.The epoxy-modified polyacrylic acid ester gum mixed is placed in black plastic bottle, the used time remixes solid abrasive, according to mold
The suitable shape of 1-3 mm thickness is made on a pet film, is placed in constant temperature oven 80 DEG C of curing 30min, practical grinding pad.
By grinding pad mounted in polished silicon slice on polishing machine, the average surface roughness of silicon chip surface is 0.4nm after polishing.
Claims (10)
1. a kind of abrasive material formula finely polished for glass and semiconductor, including adhesive, reactive diluent, initiator, anti-
Old agent, plasticizer and solid abrasive.
2. according to claim 1, which is characterized in that adhesive is polyacrylate, and polyester modification polyacrylate is epoxy-modified
One or more of polyacrylate using ultraviolet light-initiated curing or is heating and curing, total content 20%-40%.
3. according to claim 1, it is characterised in that：Reactive diluent use ethyl methacrylate, methyl methacrylate, two
Contracting tripropylene glycol diacrylate, pentaerythritol triacrylate, acrylic acid methoxy ethyl ester, acrylic acid ethoxy ethyl ester isoreactivity
Monomer, total content 30%-60%.
4. according to claim 1, which is characterized in that curing initiator be 1- hydroxycyclohexan Benzophenones, 2- hydroxy-2-methyls-
One in 1- phenylacetones, azodiisobutyronitrile, cumyl hydroperoxide, cumyl peroxide, fluorinated diphenyl titanium cyclopentadienyl etc.
Kind or several, total content 0.05%-20%.
5. according to claim 1, it is characterised in that：Anti-aging agent can be bisphenol-A, anti-aging agent RD, antioxidant A W, antioxidant 264,
One or more of 445 grade of anti-aging agent, total content 0.1%-5%.
6. according to claim 1, it is characterised in that：Plasticizer is dibutyl phthalate, dioctyl phthalate, adjacent benzene
One or more of dioctyl phthalate di-isooctyl, total content 0.1%-10%.
7. according to claim 1, it is characterised in that：Solid abrasive is silicoglaserite, calcium carbonate, corundum, diamond, silica, two
One or more of molybdenum sulfide, carborundum etc., the granularity of each solid abrasive are less than 50 μm, and D50 is 0.5 ~ 10 μm, total content
For 60%-80%.
8. according to claim 1, it is characterised in that：The abrasive material mixed by formula 0.5-3 can be made on a pet film with mold
The suitable shape of mm thickness by ultraviolet light 10 ~ 30s rapid curings, also can be heated to 80 ~ 120 DEG C of 10 ~ 60min and cure.
9. according to claim 1, it is characterised in that：Abrasive material formula or except the above-mentioned organic materials mixing of solid abrasive after, 0 ~
It is stored under the conditions of 38 DEG C in black plastic bottle, can keep never degenerating for 6 months.
10. according to claim 1, it is characterised in that：Abrasive material has water-fast, acid-alkali-corrosive-resisting after curing, and hardness, wear rate are fitted
In, polish the advantages that fine and smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996134.2A CN108070357A (en) | 2016-11-12 | 2016-11-12 | A kind of abrasive material formula finely polished for glass and semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996134.2A CN108070357A (en) | 2016-11-12 | 2016-11-12 | A kind of abrasive material formula finely polished for glass and semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108070357A true CN108070357A (en) | 2018-05-25 |
Family
ID=62154883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610996134.2A Pending CN108070357A (en) | 2016-11-12 | 2016-11-12 | A kind of abrasive material formula finely polished for glass and semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108070357A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108912756A (en) * | 2018-05-30 | 2018-11-30 | 广州市精合致新材料科技有限公司 | A kind of aluminum ceiling coating and preparation method thereof |
| CN109956703A (en) * | 2019-02-26 | 2019-07-02 | 苏州超徕精工科技有限公司 | A kind of abrasive material formula for infra-red material processing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101096080A (en) * | 2007-06-29 | 2008-01-02 | 南京航空航天大学 | Solidified abrasive lapping polishing pad having self-modifying function and preparation method |
| CN101428404A (en) * | 2008-12-22 | 2009-05-13 | 南京航空航天大学 | Fixed abrasive grinding polishing pad and method of manufacturing the same |
| CN102632453A (en) * | 2012-04-24 | 2012-08-15 | 浙江浦江敏锐精密机械科技有限公司 | Thermosetting resin grinding pad and preparation method thereof |
| CN104449542A (en) * | 2014-12-11 | 2015-03-25 | 江南大学 | Preparation method of novel dual-cured UV curing binder |
-
2016
- 2016-11-12 CN CN201610996134.2A patent/CN108070357A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101096080A (en) * | 2007-06-29 | 2008-01-02 | 南京航空航天大学 | Solidified abrasive lapping polishing pad having self-modifying function and preparation method |
| CN101428404A (en) * | 2008-12-22 | 2009-05-13 | 南京航空航天大学 | Fixed abrasive grinding polishing pad and method of manufacturing the same |
| CN102632453A (en) * | 2012-04-24 | 2012-08-15 | 浙江浦江敏锐精密机械科技有限公司 | Thermosetting resin grinding pad and preparation method thereof |
| CN104449542A (en) * | 2014-12-11 | 2015-03-25 | 江南大学 | Preparation method of novel dual-cured UV curing binder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108912756A (en) * | 2018-05-30 | 2018-11-30 | 广州市精合致新材料科技有限公司 | A kind of aluminum ceiling coating and preparation method thereof |
| CN109956703A (en) * | 2019-02-26 | 2019-07-02 | 苏州超徕精工科技有限公司 | A kind of abrasive material formula for infra-red material processing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180525 |
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| RJ01 | Rejection of invention patent application after publication |