CN108063262A - A kind of new copper pull mesh bears grid and its manufacturing method - Google Patents
A kind of new copper pull mesh bears grid and its manufacturing method Download PDFInfo
- Publication number
- CN108063262A CN108063262A CN201711378728.8A CN201711378728A CN108063262A CN 108063262 A CN108063262 A CN 108063262A CN 201711378728 A CN201711378728 A CN 201711378728A CN 108063262 A CN108063262 A CN 108063262A
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- CN
- China
- Prior art keywords
- grid
- copper
- pull mesh
- copper coin
- bears
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/70—Carriers or collectors characterised by shape or form
- H01M4/72—Grids
- H01M4/73—Grids for lead-acid accumulators, e.g. frame plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/06—Lead-acid accumulators
- H01M10/12—Construction or manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/665—Composites
- H01M4/667—Composites in the form of layers, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/82—Multi-step processes for manufacturing carriers for lead-acid accumulators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a kind of new copper pull mesh to bear grid, including square copper coin grid, plate ear and U-shaped plastic package, it is provided with indent among copper coin grid, is also symmetrically arranged with diamond-shaped meshes along indent on copper coin grid, terne metal is plated on copper coin grid, plate ear and U-shaped plastic package；Also disclose its manufacturing method；Copper pull mesh annealing of the present invention can eliminate its internal stress, and stabilized copper grid size makes active material more secured combined with copper coin grid, prolonging service life of battery；Plastic package uses the method that U-shaped plastic package merges again with copper coin grid of first casting, and avoids the non-uniform problem of plastic thickness of the bound edge caused by copper pull mesh deviations in traditional injection moulding, improves the qualification rate of negative grid；Electroplating lead tin alloy layer is solderability alloy layer, is improved the charge acceptance of electrode；Using the technique of first plastic package re-plating terne metal, the qualification rate of negative grid is improved.
Description
Technical field
The invention belongs to battery technology fields, and in particular to a kind of new copper pull mesh bears grid and its manufacturing method.
Background technology
Grid is born compared with traditional metal, it is one of light-type grid technology best at present that copper pull mesh, which bears grid, this
Kind grid both can be used for pregnant solution type lead acid accumulator, it can also be used to valve-control sealed lead acid battery.Current high-performance lead-acid
Accumulator employs copper pull mesh and bears grid electrode technology, which can significantly improve the gravimetric specific energy of accumulator, improves and stores
Battery charge acceptance improves accumulator output power, meets the needs of its high-multiplying power discharge.
Chinese patent【CN103117395A】A kind of manufacturing method of lead-acid storage battery negative grid is provided, this method overcomes
Traditional copper pull mesh bears some shortcomings that grid uses copper strips bound edge technology, but exist after being drawn in the net there is also pure copper strips it is remaining should
Power causes grid size distortion, the combination between grid and active material loosely, shorten the life of storage battery the problem of.The patent
Using traditional Shooting Technique, but since copper mesh is softer, exist positioning it is more difficult, copper mesh both sides plastic thickness is caused to be susceptible to
Deviation, the problem of adding the rejection rate of negative grid.Meanwhile the patent is using the technique of first lead plating plastic package again, due to plating
Lead layer is relatively thin, exists and is easy to destroy plating lead layer in injection-molding edge process operations below, occurs what negative grid qualification rate declined
Problem.
The content of the invention
It is an object of the present invention to insufficient according to prior art, a kind of new copper pull mesh of design bears grid, the copper
The combination of the negative grid of seine and active material is more secured, improves the qualification rate of plastic package process, plating alloy layer can improve
The welding quality of negative plate ear and pole bus-bar, can improve the interfacial property of grid and active material, make the charging of electrode
It is improved by ability.
The technical solution adopted by the present invention to solve the technical problems is：A kind of new copper pull mesh bears grid, including square
Copper coin grid and the plate ear for being arranged on copper coin grid width direction one end, the other end in the copper coin grid width direction and length side
To be provided at both ends with U-shaped plastic package, indent is provided among the copper coin grid, is additionally provided on copper coin grid along indent pair
The diamond-shaped meshes of title are plated with terne metal on the copper coin grid, plate ear and U-shaped plastic package.
A kind of new copper pull mesh bears grid, and plate ear is metal part.
The second object of the present invention is to design the manufacturing method that a kind of new copper pull mesh bears grid, comprise the following steps：
1）Pure copper strips are pulled into the copper pull mesh with water chestnut shape mesh, and are made annealing treatment；
2）Annealing copper pull mesh is cut into rectangle structure, lead alloy plate ear of casting in one end of copper pull mesh width is formed
Copper coin grid；
3）According to the injection of the size of copper coin grid or the U-shaped plastic package of plastic uptake, by the other end in copper coin grid width direction and length side
To both ends flatten, be inserted into U-shaped plastic package, insert in mold, heat, cooling；
4）By the copper coin grid electroplating surface terne metal after bound edge, negative grid is formed.
A kind of new copper pull mesh bears the manufacturing method of grid, step a）Indent is additionally provided among middle copper pull mesh,
The direction of indent both sides seine is on the contrary, the seine of i.e. both sides extends in the opposite direction.
A kind of new copper pull mesh bears the manufacturing method of grid, step a）Middle fine copper tape thickness for 0.10~
0.40mm。
A kind of new copper pull mesh bears the manufacturing method of grid, step a）The size of the diamond-shaped meshes of middle copper pull mesh
For（4.0~7.0）mm×（10.0~15.0）mm.
A kind of new copper pull mesh bears the manufacturing method of grid, step b）Middle copper pull mesh annealing is in vacuum or nitrogen
It is carried out in atmosphere, annealing temperature is 350~550 DEG C, and temperature is down to 30~55 DEG C and comes out of the stove, and annealing total time is 2~5h.
A kind of new copper pull mesh bears the manufacturing method of grid, step c）Middle heating temperature is 180~340 DEG C.
A kind of new copper pull mesh bears the manufacturing method of grid, step c）Middle plastic package be ABS parts, PVC parts,
PP parts or PE parts.
A kind of new copper pull mesh bears the manufacturing method of grid, step d）Middle pb-sn alloy plating leaded 55~
65%, tin 35~45%, thickness of coating is 4~30 μm.
The beneficial effects of the invention are as follows：
1st, copper pull mesh annealing can eliminate its internal stress, stabilized copper grid size so that and active material is more secured combined with copper coin grid,
Prolonging service life of battery.
2nd, plastic package, can be to avoid traditional injection moulding using the method that U-shaped plastic package merges again with copper coin grid of first casting
It is middle because copper pull mesh deviations cause the non-uniform problem of the plastic thickness of both sides bound edge, improve the qualification rate of product.
3rd, electroplating lead tin alloy layer is solderability alloy layer, can improve the welding matter of negative plate ear and pole bus-bar
Amount, while tin can improve the interfacial property of negative grid and active material in coating, be improved the charge acceptance of electrode.
4th, using the technique of first plastic package re-plating terne metal, the qualification rate of negative grid can be improved.
Description of the drawings
Fig. 1 is the structure diagram that the new copper pull mesh of the present invention bears grid；
Fig. 2 is the structure diagram for the plastic package that the new copper pull mesh of the present invention bears grid.
Reference numeral is：1-copper coin grid, 2-indent, 3-plastic package.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings.
Shown in reference picture 1, Fig. 2, the invention discloses a kind of new copper pull mesh to bear grid, including square copper coin grid 1, sets
Plate ear on 1 top margin of copper coin grid and the U-shaped plastic package 3 being arranged on 1 base of copper coin grid and two sides, the copper coin
The indent 2 being provided on grid 1 on 1 base line of symmetry of copper coin grid is also symmetrically arranged with along indent 2 on the copper coin grid 1
Diamond-shaped meshes, terne metal is plated on the copper coin grid 1, plate ear and U-shaped plastic package 3, and the plate ear is that lead closes
Golden part.
The manufacturing method of the present invention is described in further detail with reference to implementation figure.
Embodiment 1
The invention also discloses the manufacturing method that a kind of new copper pull mesh bears grid, embodiment 1 is a base of this manufacturing method
The present embodiment comprises the following steps：
1）Pure copper strips are pulled into the copper pull mesh with water chestnut shape mesh；
2）Copper pull mesh is made annealing treatment, lead alloy plate ear of casting at one end after copper pull mesh shaping of annealing forms copper coin grid 1；
3）According to the injection of the size of copper coin grid 1 or the U-shaped plastic package 3 of plastic uptake, 1 two sides of copper coin grid and base are flattened, are inserted into U
Plastic bound edge 3, is inserted in mold, is heated, cooling；
4）By the 1 electroplating surface terne metal of copper coin grid after bound edge, negative grid is formed.
Embodiment 2
Embodiment 2 is the embodiment further optimized on the basis of implementation 1, than embodiment 1 moreover：
Step 1）Described in copper pull mesh among be additionally provided with indent 2, the direction of 2 both sides of indent seine is on the contrary, the seine of both sides
By stretching in the opposite direction.The fine copper tape thickness be 0.10~0.40mm, the diamond-shaped meshes of the copper pull mesh
Size be（4.0~7.0）mm×（10.0~15.0）mm.
Step 2）Described in copper pull mesh annealing carried out in vacuum or nitrogen atmosphere, annealing temperature be 350~550 DEG C,
Temperature is down to 30~55 DEG C and comes out of the stove, and annealing total time is 2~5h.
Step 3）Described in heating temperature for 180~340 DEG C, the plastic package 3 is ABS parts, PVC parts, PP parts
Or PE parts.
Step 4）Described in pb-sn alloy plating leaded 55~65%, tin 35~45%, thickness of coating be 4~30 μm.
Embodiment 3
Embodiment 3 is the preferred embodiment on the basis of embodiment 2.
1）The pure copper strips of 0.20mm thickness are pulled into the water chestnut shape hole copper pull mesh that pore size is 5.0mm × 12.0mm, in copper pull mesh
Between be provided with indent 2,2 both sides of indent seine direction it is opposite.
2）Copper pull mesh is inserted in vacuum and is annealed, annealing temperature is 400 DEG C, and temperature is down to 45 DEG C and comes out of the stove, and is annealed total time
For 5h.To anneal copper pull mesh shaping, and lead-antimony alloy plate ear of casting forms copper coin grid 1.
3）U-shaped ABS plastic bound edge 3 is molded, 1 two sides of copper coin grid and base are flattened, U-shaped plastic package 3 is inserted into, inserts
In mold, 200 DEG C are heated to, forms modeling side copper coin grid 1；
4）By the 1 electroplating surface terne metal of copper coin grid behind modeling side, 60% lead, 40% tin, 20 μm of thickness of coating, the negative grid of formation.
Embodiment 4
Embodiment 4 is the preferred embodiment on the basis of embodiment 2.
1）The pure copper strips of 0.30mm thickness are pulled into the water chestnut shape hole copper pull mesh that pore size is 4.0mm × 15.0mm, in copper pull mesh
Between be provided with indent 2,2 both sides of indent seine direction it is opposite.
2）Copper pull mesh is inserted in nitrogen atmosphere and is annealed, annealing temperature is 450 DEG C, and temperature is down to 40 DEG C and comes out of the stove, and annealing is total
Time is 4.5h.To anneal copper pull mesh shaping, and lead-antimony alloy plate ear of casting forms copper coin grid 1.
3）U-shaped PVC plastic bound edge 3 is molded, 1 two sides of copper coin grid and base are flattened, U-shaped plastic package 3 is inserted into, puts
Enter in mold, be heated to 220 DEG C, form modeling side copper coin grid 1.
4）By the 1 electroplating surface terne metal of copper coin grid behind modeling side, 55% lead, 45% tin, 25 μm of thickness of coating.
Embodiment 5
Embodiment 5 is the preferred embodiment on the basis of embodiment 2.
1）The pure copper strips of 0.25mm thickness are pulled into the water chestnut shape hole copper pull mesh that pore size is 6.0mm × 10.0mm, in copper pull mesh
Between be provided with indent 2,2 both sides of indent seine direction it is opposite.
2）Copper pull mesh is inserted in vacuum and is annealed, annealing temperature is 500 DEG C, and temperature is down to 50 DEG C and comes out of the stove, and is annealed total time
For 4h.To anneal copper pull mesh shaping, and lead-antimony alloy plate ear of casting forms copper coin grid 1；
3）U-shaped PP plastic packages 3 are molded, 1 two sides of copper coin grid and base are flattened, U-shaped plastic package 3 is inserted into, inserts mold
In, 180 DEG C are heated to, forms modeling side copper coin grid 1；
4）By the 1 electroplating surface terne metal of copper coin grid behind modeling side, 65% lead, 35% tin, 28 μm of thickness of coating.
The embodiment that the above-described embodiments merely illustrate the principles and effects of the present invention and part uses, for
For those of ordinary skill in the art, without departing from the concept of the premise of the invention, can also make it is several deformation and
It improves, these belong to protection scope of the present invention.
Claims (10)
1. a kind of new copper pull mesh bears grid, it is characterised in that：Including square copper coin grid（1）And it is arranged on copper coin grid（1）It is wide
Spend the plate ear of direction one end, the copper coin grid（1）The other end of width and length direction are provided at both ends with U-shaped plastics
Bound edge（3）, the copper coin grid（1）Centre is provided with indent（2）, copper coin grid（1）On be additionally provided with along indent（2）Symmetrical water chestnut
Shape mesh, the copper coin grid（1）, plate ear and U-shaped plastic package（3）On be plated with terne metal.
2. a kind of new copper pull mesh according to claim 1 bears grid, it is characterised in that：The plate ear is metal
Part.
3. a kind of new copper pull mesh as described in claim 1 bears the manufacturing method of grid, which is characterized in that including following step
Suddenly：
a）Pure copper strips are pulled into the copper pull mesh with water chestnut shape mesh, and are made annealing treatment；
b）Annealing copper pull mesh is cut into rectangle structure, lead alloy plate ear of casting in one end of copper pull mesh width is formed
Copper coin grid（1）；
c）According to copper coin grid（1）Size injection or the U-shaped plastic package of plastic uptake（3）, by copper coin grid（1）The other end of width
It is flattened with the both ends of length direction, is inserted into U-shaped plastic package（3）, it inserts in mold, heats, cooling；
d）By the copper coin grid after bound edge（1）Electroplating surface terne metal forms negative grid.
4. a kind of new copper pull mesh according to claim 3 bears the manufacturing method of grid, which is characterized in that the step a）
Indent is additionally provided among middle copper pull mesh（2）, indent（2）The direction of both sides seine is opposite.
5. a kind of new copper pull mesh according to claim 3 bears the manufacturing method of grid, which is characterized in that the step
a）Middle fine copper tape thickness is 0.10~0.40mm.
6. a kind of new copper pull mesh according to claim 3 bears the manufacturing method of grid, which is characterized in that the step
a）The size of the diamond-shaped meshes of middle copper pull mesh is（4.0~7.0）mm×（10.0~15.0）mm.
7. a kind of new copper pull mesh according to claim 3 bears the manufacturing method of grid, which is characterized in that the step
b）Middle copper pull mesh annealing carries out in vacuum or nitrogen atmosphere, and annealing temperature is 350~550 DEG C, and temperature is down to 30~55 DEG C and is gone out
Stove, annealing total time are 2~5h.
8. a kind of new copper pull mesh according to claim 3 bears the manufacturing method of grid, which is characterized in that the step
c）Middle heating temperature is 180~340 DEG C.
9. a kind of new copper pull mesh according to claim 3 bears the manufacturing method of grid, which is characterized in that the step
c）Middle plastic package（3）It is ABS parts, PVC parts, PP parts or PE parts.
10. a kind of new copper pull mesh according to claim 3 bears the manufacturing method of grid, which is characterized in that the step
Rapid d）Middle pb-sn alloy plating leaded 55~65%, tin 35~45%, thickness of coating are 4~30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711378728.8A CN108063262A (en) | 2017-12-19 | 2017-12-19 | A kind of new copper pull mesh bears grid and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711378728.8A CN108063262A (en) | 2017-12-19 | 2017-12-19 | A kind of new copper pull mesh bears grid and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108063262A true CN108063262A (en) | 2018-05-22 |
Family
ID=62139698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711378728.8A Pending CN108063262A (en) | 2017-12-19 | 2017-12-19 | A kind of new copper pull mesh bears grid and its manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108063262A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736366A (en) * | 2020-12-29 | 2021-04-30 | 上海应用技术大学 | Method for cast welding light metal negative grid lead storage battery busbar |
| CN114284369A (en) * | 2021-12-29 | 2022-04-05 | 明冠新材料股份有限公司 | Hollowed-out copper foil and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101820064A (en) * | 2009-02-27 | 2010-09-01 | 深圳市倍特力电池有限公司 | Base material of cathode of nickel zinc battery |
| CN103117395A (en) * | 2013-01-30 | 2013-05-22 | 淄博火炬能源有限责任公司 | Manufacturing method of lead-acid storage battery negative grid |
| CN203895570U (en) * | 2014-06-15 | 2014-10-22 | 中国船舶重工集团公司第七一二研究所 | Valve-regulated sealed lead-acid battery |
-
2017
- 2017-12-19 CN CN201711378728.8A patent/CN108063262A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101820064A (en) * | 2009-02-27 | 2010-09-01 | 深圳市倍特力电池有限公司 | Base material of cathode of nickel zinc battery |
| CN103117395A (en) * | 2013-01-30 | 2013-05-22 | 淄博火炬能源有限责任公司 | Manufacturing method of lead-acid storage battery negative grid |
| CN203895570U (en) * | 2014-06-15 | 2014-10-22 | 中国船舶重工集团公司第七一二研究所 | Valve-regulated sealed lead-acid battery |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736366A (en) * | 2020-12-29 | 2021-04-30 | 上海应用技术大学 | Method for cast welding light metal negative grid lead storage battery busbar |
| CN114284369A (en) * | 2021-12-29 | 2022-04-05 | 明冠新材料股份有限公司 | Hollowed-out copper foil and preparation method thereof |
| CN114284369B (en) * | 2021-12-29 | 2023-09-01 | 明冠新材料股份有限公司 | Hollowed-out copper foil and preparation method thereof |
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Application publication date: 20180522 |