CN108062185B - Touch control assembly, manufacturing method thereof and display device - Google Patents
Touch control assembly, manufacturing method thereof and display device Download PDFInfo
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- CN108062185B CN108062185B CN201810098925.2A CN201810098925A CN108062185B CN 108062185 B CN108062185 B CN 108062185B CN 201810098925 A CN201810098925 A CN 201810098925A CN 108062185 B CN108062185 B CN 108062185B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The invention discloses a touch control assembly, a manufacturing method thereof and a display device, wherein the touch control assembly comprises a substrate, a middle layer structure, a bottom layer wiring layer, a hollow connecting structure, an organic functional layer and a cathode layer, wherein the substrate is provided with a first surface; an intermediate layer structure disposed on the first surface, the intermediate layer structure having a pixel defining layer thereon; the bottom wiring layer is arranged on the pixel defining layer; hollow connection structure sets up in one side that the base plate was kept away from on the bottom routing layer and outwards outstanding formation, and organic functional layer and cathode layer set gradually on bottom routing layer and hollow connection structure's outer peripheral face to extend to hollow connection structure's internal face by hollow connection structure's outer peripheral face respectively, the cathode layer switches on with hollow connection structure or bottom routing layer in hollow connection structure, thereby can avoid the technology to organic functional layer punching, simplified process flow, improved touch-control effect.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a display device and a touch assembly thereof, and a manufacturing method of the touch assembly.
Background
The OLED screen has the characteristics of high reaction speed, high contrast, wide viewing angle, low power consumption, flexibility and the like, and becomes a next-generation screen technology. The OLED screen is very thin and a touch layer can be integrated in the screen. At present, a common touch control mode of an OLED product is an external embedded touch technology, typically represented by a samsung Super AMOLED, and a touch control sensor layer is prepared on a thin film encapsulation structure layer, so that a touch sensing panel is reduced, a screen becomes thinner, touch control is more sensitive, and color rendering is brighter.
The embedded technology is mainly divided into two types, namely Hybrid IN CELL technology and FULL multi-point IN CELL technology, and the Hybrid multi-point embedded technology is mainly characterized IN that the Hybrid multi-point embedded technology has two touch sensing layers, wherein the upper layer is positioned on the surface of a thin film packaging structure, and the lower layer is positioned on a voltage regulator (TFT VCOM) circuit of an array substrate, and is similar to a traditional externally embedded display module. Therefore, two flexible circuit board lead-out circuits are needed for connecting the driving chip and the touch chip, so that the complexity of the whole module design is increased undoubtedly, and meanwhile, the cost is also increased.
And the embedded technology of comprehensive multiple spot has adopted special structural design, and the realization of touch-control function only needs the one deck, has simplified the structural design of module, reduces the module cost simultaneously. The comprehensive multi-point embedded technology adopts a single-layer touch wiring design and adopts a self-capacitance principle to realize multi-point touch. Actual test data shows that the touch precision of the comprehensive multi-point embedded technology is comparable to that of the hybrid multi-point embedded technology of the traditional mutual-compatibility mode. In order to solve signal interference caused by integration of a display function and a touch function, a mixed multi-point embedded technology adopts a time-sharing scanning mode, a unit time is divided into two parts, one part is used for touch scanning, the other part is used for display scanning, and the two parts are not interfered with each other, so that the hidden danger of signal interference is fundamentally eliminated. These are all breakthroughs of the comprehensive multi-point embedded technology in overcoming the defects of the hybrid multi-point embedded technology through the revolutionary design.
The OLED embedded touch scheme adopts cathode segmentation, touch and display multiplexing, an additional touch sensor is not required to be prepared, the process is reduced, the cost is reduced, and the yield is improved. The existing embedded touch scheme generally adopts the same layer of wiring, when the size of a screen is increased, a wiring area is too large, namely a touch blind area is too large, and the touch effect is influenced.
Therefore, how to provide a touch device to improve the touch effect is a technical problem that needs to be solved by those skilled in the art.
The above information disclosed in this background section is only for enhancement of understanding of the background of the invention.
Disclosure of Invention
The invention provides a touch device, which overcomes the defect of poor touch effect.
Another objective of the present invention is to provide a method for manufacturing a touch device, which overcomes the defect of poor touch effect.
Another objective of the present invention is to provide a display device, which overcomes the defect of poor touch effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
according to one aspect of the present invention, a touch assembly is provided, which includes a substrate, a middle layer structure, a bottom wiring layer, a hollow connection structure, an organic functional layer and a cathode layer, wherein the substrate has a first surface; the intermediate layer structure is arranged on the first surface and is provided with a pixel defining layer; the bottom wiring layer is arranged on the pixel defining layer; the hollow connecting structure is arranged on one side of the bottom layer wiring layer, which is far away from the substrate, and is formed by protruding outwards; the organic functional layer and the cathode layer are sequentially arranged on the outer peripheral surfaces of the bottom wiring layer and the hollow connecting structure and respectively extend from the outer peripheral surface of the hollow connecting structure to the inner wall surface of the hollow connecting structure, and the cathode layer is conducted with the hollow connecting structure or the bottom wiring layer in the hollow connecting structure.
According to an embodiment of the present invention, the bottom wiring layer and the hollow connecting structure are formed as an integral structure.
According to an embodiment of the present invention, the bottom wiring layer and the hollow connecting structure are made of conductive materials respectively.
According to an embodiment of the present invention, the hollow connecting structure is a hollow platform-shaped structure, the hollow connecting structure has a top end and a bottom end, the bottom end is fixed on the bottom wiring layer, the top end is provided with an opening, a cross section of an inner cavity of the hollow connecting structure gradually increases from the top end to the bottom end, and the cross section is parallel to a plane on which the bottom wiring layer is located.
According to an embodiment of the present invention, an angle between a side wall of the hollow connecting structure and a plane of the bottom routing layer is 30 ° to 75 °.
According to an embodiment of the present invention, an angle between a side wall of the hollow connecting structure and a plane of the bottom routing layer is 45 ° to 60 °.
According to another aspect of the present invention, there is provided a method for manufacturing a touch device, the touch device being the touch device provided in the present invention, the method comprising:
forming a solid columnar structure on the pixel defining layer;
forming a connecting structure and a bottom wiring layer on the pixel defining layer with the solid columnar structure;
removing the solid columnar structure to form the connecting structure into a hollow connecting structure;
and sequentially forming an organic functional layer and a cathode layer on the bottom wiring layer and the outer peripheral surface of the hollow connecting structure.
According to an embodiment of the present invention, the step of removing the solid columnar structure to form the connection structure into a hollow connection structure includes:
removing the material at the top end of the connecting structure to expose the solid columnar structure;
the solid columnar structure is dissolved to be removed.
According to an embodiment of the present invention, the solid columnar structure is made of an organic material.
According to an embodiment of the present invention, the connection structure and the bottom wiring layer are formed by evaporation, sputtering or electroplating.
According to an embodiment of the present invention, the hollow connection structure has a center line, the organic functional layer and the cathode layer are respectively formed by evaporation, a distance from an organic evaporation source to an underlying routing layer is smaller than or equal to a distance from the cathode evaporation source to the underlying routing layer, and a distance from the organic evaporation source to the center line is greater than or equal to a distance from the cathode evaporation source to the center line, the organic evaporation source and the cathode evaporation source are not on the same circumference, the circumference is parallel to a plane where the underlying routing layer is located, and a center of the circumference is on the center line.
According to an embodiment of the present invention, the relative position relationship between the organic evaporation source and the cathode evaporation source is: the distance from the organic evaporation source to the bottom layer routing layer is the same as the distance from the cathode evaporation source to the bottom layer routing layer, and the distance from the cathode evaporation source to the central line is smaller than the distance from the organic evaporation source to the central line; or the distance from the organic evaporation source to the central line is the same as the distance from the cathode evaporation source to the central line, and the distance from the cathode evaporation source to the bottom routing layer is larger than the distance from the organic evaporation source to the bottom routing layer.
According to another aspect of the present invention, a display device is provided, wherein the display device comprises the touch control assembly provided by the present invention.
According to the technical scheme, the touch control assembly, the manufacturing method thereof and the display device have the advantages and positive effects that: the cathode layer and the organic functional layer of the touch control assembly extend from the outer peripheral surface of the hollow connecting structure to the inner wall surface, and the cathode layer can be conducted with the hollow connecting structure or the bottom wiring layer in the hollow connecting structure, so that the process of punching the organic functional layer can be avoided, the process flow is simplified, and the touch control effect is improved.
Drawings
Various objects, features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the invention, when considered in conjunction with the accompanying drawings. The drawings are merely exemplary of the invention and are not necessarily drawn to scale. In the drawings, like reference characters designate the same or similar parts throughout the different views. Wherein:
fig. 1 is a cross-sectional view of a hybrid multi-touch panel in the prior art.
Fig. 2 is a cross-sectional view of a full-face multi-touch in-cell touch panel in the prior art.
Fig. 3 is a cross-sectional view of an in-cell touch panel with via connection and different layer routing.
Fig. 4 is a structural diagram of a touch device according to an exemplary embodiment of the invention.
Fig. 5 is a flowchart of a process for forming the touch assembly of fig. 4.
Fig. 6 is a diagram of relative position relationship between the touch assembly and the evaporation source during the evaporation process.
Fig. 7 is a schematic diagram of a relative positional relationship between the touch device and the organic evaporation source.
Wherein the reference numerals are as follows:
101. a touch layer; 102. A cathode layer;
103. a thin film encapsulation structure; 104. A touch sensor;
105. a glass cover plate; 106. A substrate;
107. a pixel defining layer; 108. A bottom routing layer;
109. a hollow connecting structure; 110. A solid columnar structure;
111. an organic functional layer; 113. An organic evaporation source;
114. a cathode evaporation source; 115. A pixel layer;
116. a centerline.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Referring to fig. 4 and 6, according to an aspect of the present invention, a touch device is provided, which may include a substrate 106 (not shown), an intermediate layer structure (not shown), an underlying routing layer 108, and a hollow connecting structure 109, wherein the substrate 106 may have a first surface on which the intermediate layer structure may be disposed, and a pixel defining layer 107 may be on top of the intermediate layer structure. According to a specific embodiment of the present invention, the intermediate layer structure may include a buffer layer, a barrier layer, an anode layer, and the like, which are not important aspects of the present invention and are not described herein in detail. An underlying wiring layer 108 may be disposed on the pixel defining layer 107, and the organic functional layer 111 and the cathode layer 102 may be sequentially disposed on the underlying wiring layer 108. Wherein the hollow connecting structure 109 may be formed by protruding the bottom layer wiring layer 108, wherein the hollow connecting structure 109 may be electrically conductive with the bottom layer wiring layer 108, the organic functional layer 111 and the cathode layer 102 may be respectively disposed on an outer circumferential surface of the hollow connecting structure 109 and extend from the outer circumferential surface to an inner wall surface of the hollow connecting structure 109, and the cathode layer 102 may be electrically connected with the hollow connecting structure 109 or the bottom layer wiring layer 108 within the hollow connecting structure 109. With continued reference to fig. 6, the areas of the cathode layer 102 and the organic functional layer 111 may be adjusted such that the cathode layer 102 may be directly contacted on the hollow connection structure 109 or the bottom wiring layer 108, and the hollow connection structure 109 and the bottom wiring layer 108 may be made of conductive materials, respectively, such that the cathode layer 102 may be directly conducted with the hollow connection structure 109 or the bottom wiring layer 108.
With continued reference to fig. 4 and 6, according to an embodiment of the present invention, the bottom wiring layer 108 may be formed as an integral structure with the hollow connecting structure 109, for example, but not limited to, the bottom wiring layer 108 may be formed with the hollow connecting structure 109 by using an evaporation structure. It is within the scope of the present invention that the bottom wiring layer 108 and the hollow connecting structure 109 can be assembled together after being formed separately. According to an embodiment of the present invention, a plurality of hollow connecting structures 109 may be disposed on the bottom wiring layer 108. According to an embodiment of the present invention, the plurality of hollow connecting structures 109 may be uniformly distributed on the bottom wiring layer 108.
With continued reference to fig. 4 and 6, according to an embodiment of the present invention, wherein the hollow connecting structure 109 may be a hollow mesa structure, the hollow connecting structure 109 may have a top end and a bottom end, the bottom end may be fixed on the bottom wiring layer 108, the top end may be disposed opposite to the bottom end, the top end may be provided with an opening, and a diameter of an inner cavity of the hollow connecting structure 109 may gradually increase from the top end to the bottom end. According to an embodiment of the present invention, the hollow connecting structure 109 may be a truncated cone structure or a truncated square structure, and the specific structural shape may be selected according to actual needs, which is within the protection scope of the present invention. According to an embodiment of the present invention, the distance between the plane of the top end of the hollow connecting structure 109 and the plane of the bottom end thereof may be 0.5-3 μm. According to an embodiment of the present invention, the distance between the plane of the top end of the hollow connecting structure 109 and the plane of the bottom end thereof may be 0.8-1 μm. According to an embodiment of the present invention, the thickness of the sidewall of the hollow connecting structure 109 is uniform, but not limited thereto, the thickness of the sidewall of the hollow connecting structure 109 may also be non-uniform.
With continued reference to fig. 4 and 6, the present invention will be described by taking the truncated-cone-shaped hollow connecting structure 109 as an example, and particularly, according to an embodiment of the present invention, the included angle between the side wall of the hollow connecting structure 109 and the plane of the underlying routing layer 108 can be 30-75 °. According to an embodiment of the present invention, the angle between the sidewall of the hollow connecting structure 109 and the plane of the underlying routing layer 108 may be 45 ° to 60 °.
Referring to fig. 5, according to another aspect of the present invention, there is provided a method for manufacturing a touch device, the touch device provided by the present invention, the method comprising:
with continued reference to fig. 5, first, a solid pillar structure 110 may be formed on the pixel defining layer 107, for example, but not limited to, may be formed using a photolithography process. According to an embodiment of the present invention, the solid pillar structure 110 may be a frustum-shaped structure, and the solid pillar structure 110 may have a top end and a bottom end, wherein the bottom end may be fixed on the pixel defining layer 107, and the cross-sectional dimension of the solid pillar structure 110 gradually decreases along a direction extending from the bottom end to the top end.
With continued reference to fig. 5, next, a connection structure and a bottom wiring layer 108 may be formed on the pixel defining layer 107 having the solid pillar structure 110, for example, but not limited to, an evaporation method may be used to form the bottom wiring layer 108 on the pixel defining layer 107; the connection structure is formed on the outer periphery of the solid columnar structure 110, and the connection structure is formed by vapor deposition simultaneously with the underlying wiring layer 108, so that the connection structure can be formed integrally. Because the connection structure is formed by the same evaporation process, the connection structure may be formed of the same material as the bottom wiring layer 108, for example, but not limited to, the connection structure may be formed of the same conductive material, for example, but not limited to, a metal material.
With continued reference to fig. 5, again, the solid pillar structures 110 may be removed to form the connecting structures as the hollow connecting structures 109, wherein the solid pillar structures 110 may be formed of different materials from the hollow connecting structures 109 according to an embodiment of the present invention, for example, but not limited to, the solid pillar structures 110 may be formed of organic materials, for example, but not limited to, an organic solvent may be selected to dissolve the solid pillar structures 110 during the process of removing the same.
In an embodiment of the present invention, before the solid columnar structure 110 is removed, the connecting structure may be a closed truncated cone-shaped structure, and the top end of the connecting structure may be removed to expose the solid columnar structure 110 inside the connecting structure. According to an embodiment of the present invention, the top end of the connecting structure may be removed by grinding, but not limited thereto, and the top end may also be removed by cutting or the like, which is within the protection scope of the present invention.
With continued reference to fig. 5 and 6, according to an embodiment of the present invention, a functional layer 111 and a cathode layer 102 may be disposed on the outer peripheral surfaces of the pixel defining layer 107, the underlying routing layer 108, and the hollow connecting structure 109. For example, but not limited to, the organic functional layer 111 may be formed by evaporation, and then the cathode layer 102 is formed by another evaporation, in which two evaporation sources may be shifted from the bottom wiring layer 108 in position in the two evaporation processes, so that the cathode layer 102 can be disposed on the inner wall of the hollow connecting structure 109 and is conducted with the hollow connecting structure 109 or the bottom wiring layer 108. According to an embodiment of the present invention, the cathode layer 102 may be disposed at intervals to be separated, so that the cathode layer 102 can be repeatedly used in time intervals for display and touch.
Finally, the touch device may be packaged, for example, but not limited to, the top end of the touch device may be provided with a thin film packaging structure (not shown), a glass substrate (not shown), and the like, which are within the protection scope of the present invention.
Referring to fig. 6, in which the hollow connecting structures 109 may have a centerline 116, the position of the centerline 116 is shown in dotted lines in fig. 6, according to an embodiment of the present invention. The organic functional layer 111 and the cathode layer 102 may be formed by evaporation, and the organic functional layer 111 and the cathode layer 102 may be subjected to evaporation processes by an organic evaporation source 113 and a cathode evaporation source 114, respectively. The distance from the organic evaporation source 113 to the bottom wiring layer 108 can be smaller than or equal to the distance from the cathode evaporation source 114 to the bottom wiring layer 108, the distance from the organic evaporation source 113 to the center line 116 can be larger than or equal to the distance from the cathode evaporation source 114 to the center line 116, the organic evaporation source 113 and the cathode evaporation source 114 are not on the same circumference, the circumference can be parallel to the plane of the bottom wiring layer 108, and the center of the circumference can be located on the center line 116.
Specifically, the organic evaporation source 113 and the cathode evaporation source 114 may be located on the same plane, which may be parallel to the plane where the bottom layer routing layer 108 is located, and the organic evaporation sources 113 may be multiple and uniformly distributed on the same circumference, specifically referring to fig. 7, where fig. 7 shows a schematic diagram that the multiple organic evaporation sources 113 are uniformly distributed on the same circumference to perform evaporation on the touch control assembly. Similarly, the cathode evaporation sources 114 may be distributed uniformly in a plurality. In the evaporation process of the cathode evaporation source 114, the arrangement of the cathode evaporation source 114 may be the same as that of the cathode evaporation source 113, and will not be described herein again. The cathode evaporation source 114 may be disposed on another circumference within the circumference of the organic evaporation source 113, that is, the circumference of the cathode evaporation source 114 may be disposed concentrically with the circumference of the organic evaporation source 113, and the circumference of the cathode evaporation source 114 may have a smaller radius than the circumference of the organic evaporation source 113.
According to an embodiment of the present invention, the organic evaporation source 113 and the cathode evaporation source 114 can be located on the same cylindrical surface, and the cylindrical surface can be perpendicular to the plane of the bottom wiring layer 108. On the cylindrical surface, the distance of the cathode evaporation source 114 to the plane of the underlying wiring layer 108 may be larger than the distance of the organic evaporation source 113 to the plane of the underlying wiring layer 108.
With continued reference to fig. 6, the relative positional relationship of the organic evaporation source 113 and the cathode evaporation source 114 may be: in the case where the distance from the organic evaporation source 113 to the underlying wiring layer is the same as the distance from the cathode evaporation source to the underlying wiring layer, the distance from the cathode evaporation source 114 to the center line may be smaller than the distance from the organic evaporation source 113 to the center line. Or the distance from the organic evaporation source 113 to the center line is the same as the distance from the cathode evaporation source 114 to the center line, the distance from the cathode evaporation source 114 to the underlying wiring layer may be larger than the distance from the organic evaporation source 113 to the underlying wiring layer.
With continued reference to fig. 6, the intersection of the center line 116 defining the hollow connecting structure 109 and the top surface may be a center point, and a line connecting the evaporation source to the center point may be defined as an evaporation direction. According to an embodiment of the present invention, an angle between the evaporation direction of the cathode evaporation source 114 and the plane of the underlying wiring layer 108 may be larger than an angle between the evaporation direction of the organic evaporation source 113 and the plane of the underlying wiring layer 108. According to an embodiment of the present invention, the evaporation direction of the cathode evaporation source 114 and the plane of the bottom layer wiring layer 108 may be in a range of 30-75 °. According to an embodiment of the present invention, an angle between a vapor deposition direction of the organic evaporation source 113 and a plane of the bottom wiring layer 108 may range from 30 ° to 75 °. According to the touch control assembly, the side wall of the hollow connecting structure 109 can shield an evaporation source, so that a coating film generates a blind area on the bottom wiring layer 108 in the hollow connecting structure 109. Because the included angle between the evaporation direction of the cathode evaporation source 114 and the plane of the bottom layer routing layer 108 is larger than the included angle between the evaporation direction of the organic evaporation source 113 and the plane of the bottom layer routing layer 108, the blind area of the cathode evaporation source 114 is small, so that the lap joint of the cathode layer 102 and the bottom layer routing layer 108 can be realized, and the conduction is realized.
Fig. 1 is a cross-sectional view of a hybrid multi-touch panel, which may include a substrate 106, a touch layer 101, a pixel layer 115, a cathode layer 102, a thin film encapsulation structure 103, and a glass cover plate 105 sequentially disposed on the substrate 106, wherein the touch sensor 104 is disposed on the thin film encapsulation structure 103, so that the overall thickness of the touch panel may be reduced.
Fig. 2 is a cross-sectional view of a full-scale multi-touch in-cell touch panel, which may include a substrate 106, a touch layer 101, a pixel layer 115, a cathode layer 102, a thin film encapsulation structure 103 and a glass cover plate 105 sequentially disposed on the substrate 106, wherein the cathode layer 102 is separated, so that touch and display can be repeatedly used at different time intervals, and additional touch sensors are not required, thereby reducing the manufacturing process, reducing the manufacturing cost and improving the yield.
However, as the desire of the client for pursuing large-screen display is continuously expanded, the two touch technologies are still adopted, which may cause the area of the routing area to be significantly increased, that is, the touch blind area of the touch panel is increased, thereby affecting the touch effect. Adopt the via connection, the different layer is walked the line is a technical scheme who solves above-mentioned problem, as shown in fig. 3, however in this scheme OLED luminescent layer adopts refined metal mask version evaporation coating by vaporization preparation usually, other functional layers adopt open mask version evaporation coating by vaporization preparation usually, functional layer material in the display area is for there being not graphical face-like arranging, therefore cathode via connection need pierce through organic functional layer 111, however organic material is not resistant to water oxygen, can not adopt traditional lithography process to accomplish, how to make the cathode layer realize via connection, the important problem that technical staff in the field need to solve urgently, this technical problem has all been solved to above-mentioned technical scheme.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the above description, numerous specific details are provided to give a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.
Claims (10)
1. A manufacturing method of a touch control assembly is characterized by comprising the following steps:
forming a solid columnar structure on the pixel defining layer;
forming a connecting structure and a bottom wiring layer on the pixel defining layer with the solid columnar structure;
removing the solid columnar structure to form the connecting structure into a hollow connecting structure;
sequentially forming an organic functional layer and a cathode layer on the bottom wiring layer and the outer peripheral surface of the hollow connecting structure;
the solid columnar structure and the hollow connecting structure are made of different materials.
2. The method of claim 1, wherein the removing the solid pillar structure to form the connection structure as a hollow connection structure comprises:
removing the material at the top end of the connecting structure to expose the solid columnar structure;
the solid columnar structure is dissolved to be removed.
3. The method of manufacturing a touch assembly according to claim 1, wherein the solid pillar structure is made of an organic material.
4. The method of claim 1, wherein the hollow connection structure has a center line, the organic functional layer and the cathode layer are formed by evaporation, and a distance from an organic evaporation source to an underlying routing layer is smaller than or equal to a distance from a cathode evaporation source to the underlying routing layer, and a distance from the organic evaporation source to the center line is greater than or equal to a distance from the cathode evaporation source to the center line, the organic evaporation source and the cathode evaporation source are not located on a same circumference, the circumference is parallel to a plane on which the underlying routing layer is located, and a center of the circumference is located on the center line.
5. The method of claim 1, wherein the relative position relationship between the organic evaporation source and the cathode evaporation source is: the distance from the organic evaporation source to the bottom layer routing layer is the same as the distance from the cathode evaporation source to the bottom layer routing layer, and the distance from the cathode evaporation source to the central line is smaller than the distance from the organic evaporation source to the central line; or the distance from the organic evaporation source to the central line is the same as the distance from the cathode evaporation source to the central line, and the distance from the cathode evaporation source to the bottom routing layer is larger than the distance from the organic evaporation source to the bottom routing layer.
6. A touch device manufactured by the method for manufacturing a touch device according to any one of claims 1 to 5, the touch device comprising:
a substrate having a first surface;
an intermediate layer structure disposed on the first surface, the intermediate layer structure having a pixel defining layer thereon;
the bottom layer wiring layer is arranged on the pixel defining layer;
the hollow connecting structure is arranged on one side of the bottom wiring layer, which is far away from the substrate, and is formed by protruding outwards;
the organic functional layer and the cathode layer are sequentially arranged on the outer peripheral surfaces of the bottom wiring layer and the hollow connecting structure and respectively extend from the outer peripheral surface of the hollow connecting structure to the inner wall surface of the hollow connecting structure, and the cathode layer is conducted with the hollow connecting structure or the bottom wiring layer in the hollow connecting structure.
7. The touch-sensitive assembly of claim 6, wherein the bottom wiring layer and the hollow connecting structure are integrally formed.
8. The touch-sensitive assembly of claim 6, wherein the bottom wiring layer and the hollow connecting structure are made of conductive material.
9. The touch-control assembly of claim 6, wherein the hollow connecting structure is a hollow mesa structure, the hollow connecting structure has a top end and a bottom end, the bottom end is fixed on the bottom wiring layer, the top end is provided with an opening, the cross-sectional dimension of the inner cavity of the hollow connecting structure gradually increases from the top end to the bottom end, and the cross-sectional dimension is parallel to the plane of the bottom wiring layer.
10. A display device, characterized in that the display device comprises the touch-control assembly according to any one of claims 6 to 9.
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054672A (en) * | 2009-11-05 | 2011-05-11 | 上海华虹Nec电子有限公司 | Process method for forming minisize pattern on substrate with waved surface |
| CN104485350A (en) * | 2014-12-26 | 2015-04-01 | 北京维信诺科技有限公司 | Organic light-emitting display device and manufacturing method thereof |
| CN104752426A (en) * | 2013-12-26 | 2015-07-01 | 昆山国显光电有限公司 | Common-gate stereoscopic CMOS (Complementary Metal-Oxide-Semiconductor Transistor) device, OLED (Organic Light Emitting Diode) device and manufacturing method thereof |
| CN105094491A (en) * | 2015-08-24 | 2015-11-25 | 京东方科技集团股份有限公司 | Touch display panel, manufacturing method therefor, driving method therefor and touch display apparatus |
| CN106000123A (en) * | 2016-05-27 | 2016-10-12 | 成都易态科技有限公司 | Preparation method of porous film |
| CN106373982A (en) * | 2016-09-06 | 2017-02-01 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display apparatus |
| CN205959986U (en) * | 2016-08-24 | 2017-02-15 | 昆山工研院新型平板显示技术中心有限公司 | Organic electroluminescent display device |
| CN106521423A (en) * | 2016-11-28 | 2017-03-22 | 上海天马有机发光显示技术有限公司 | Vacuum evaporation device and method and organic light-emitting display panel |
| CN106565947A (en) * | 2016-11-14 | 2017-04-19 | 江苏科技大学 | Pore forming substance for reticular porous material and preparation method thereof |
| CN107305881A (en) * | 2016-04-25 | 2017-10-31 | 联华电子股份有限公司 | Semiconductor structure and its manufacture method |
| CN107604306A (en) * | 2017-09-12 | 2018-01-19 | 深圳市华星光电半导体显示技术有限公司 | For the mask plate of OLED evaporation and its OLED of manufacture |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100499155C (en) * | 2007-01-29 | 2009-06-10 | 友达光电股份有限公司 | Double-side organic luminescence display device and its making method |
| KR101671342B1 (en) * | 2010-04-06 | 2016-11-02 | 삼성디스플레이 주식회사 | Organic light emitting devices and method of manufacturing the same |
| KR101839533B1 (en) * | 2010-12-28 | 2018-03-19 | 삼성디스플레이 주식회사 | Organic light emitting display device, driving method for the same, and method for manufacturing the same |
| CN102544053B (en) * | 2010-12-30 | 2015-07-15 | 上海天马微电子有限公司 | Active OLED display |
| JP2014192149A (en) * | 2013-03-28 | 2014-10-06 | Japan Display Inc | Oled display panel and manufacturing method thereof |
| KR102060364B1 (en) * | 2013-04-19 | 2019-12-31 | 삼성디스플레이 주식회사 | Method for manufacturing organic light emitting display |
| JP6219656B2 (en) * | 2013-09-30 | 2017-10-25 | 株式会社ジャパンディスプレイ | Organic EL display device |
| CN104393191B (en) * | 2014-12-04 | 2017-01-25 | 京东方科技集团股份有限公司 | Organic electroluminescence device, display device and preparation method of organic electroluminescence device |
| CN104360524B (en) * | 2014-12-09 | 2017-12-08 | 京东方科技集团股份有限公司 | Touch display screen and preparation method thereof |
| CN206210848U (en) * | 2016-11-22 | 2017-05-31 | 信利（惠州）智能显示有限公司 | The organic light-emitting display device that negative electrode thickeies |
| CN106875851A (en) * | 2017-04-20 | 2017-06-20 | 京东方科技集团股份有限公司 | Display device and its manufacture method |
| CN106910766B (en) * | 2017-05-09 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of organic electroluminescent display panel, its production method and display device |
-
2018
- 2018-01-31 CN CN201810098925.2A patent/CN108062185B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054672A (en) * | 2009-11-05 | 2011-05-11 | 上海华虹Nec电子有限公司 | Process method for forming minisize pattern on substrate with waved surface |
| CN104752426A (en) * | 2013-12-26 | 2015-07-01 | 昆山国显光电有限公司 | Common-gate stereoscopic CMOS (Complementary Metal-Oxide-Semiconductor Transistor) device, OLED (Organic Light Emitting Diode) device and manufacturing method thereof |
| CN104485350A (en) * | 2014-12-26 | 2015-04-01 | 北京维信诺科技有限公司 | Organic light-emitting display device and manufacturing method thereof |
| CN105094491A (en) * | 2015-08-24 | 2015-11-25 | 京东方科技集团股份有限公司 | Touch display panel, manufacturing method therefor, driving method therefor and touch display apparatus |
| CN107305881A (en) * | 2016-04-25 | 2017-10-31 | 联华电子股份有限公司 | Semiconductor structure and its manufacture method |
| CN106000123A (en) * | 2016-05-27 | 2016-10-12 | 成都易态科技有限公司 | Preparation method of porous film |
| CN205959986U (en) * | 2016-08-24 | 2017-02-15 | 昆山工研院新型平板显示技术中心有限公司 | Organic electroluminescent display device |
| CN106373982A (en) * | 2016-09-06 | 2017-02-01 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display apparatus |
| CN106565947A (en) * | 2016-11-14 | 2017-04-19 | 江苏科技大学 | Pore forming substance for reticular porous material and preparation method thereof |
| CN106521423A (en) * | 2016-11-28 | 2017-03-22 | 上海天马有机发光显示技术有限公司 | Vacuum evaporation device and method and organic light-emitting display panel |
| CN107604306A (en) * | 2017-09-12 | 2018-01-19 | 深圳市华星光电半导体显示技术有限公司 | For the mask plate of OLED evaporation and its OLED of manufacture |
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