CN108059798A - A kind of graphene light curable conductive resin and preparation method thereof - Google Patents

A kind of graphene light curable conductive resin and preparation method thereof Download PDF

Info

Publication number
CN108059798A
CN108059798A CN201810024605.2A CN201810024605A CN108059798A CN 108059798 A CN108059798 A CN 108059798A CN 201810024605 A CN201810024605 A CN 201810024605A CN 108059798 A CN108059798 A CN 108059798A
Authority
CN
China
Prior art keywords
graphene
light curable
conductive resin
curable conductive
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810024605.2A
Other languages
Chinese (zh)
Inventor
林瑞荣
庄焱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Zhongkai New Material Graphene Technology Co Ltd
Original Assignee
Xiamen Zhongkai New Material Graphene Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Zhongkai New Material Graphene Technology Co Ltd filed Critical Xiamen Zhongkai New Material Graphene Technology Co Ltd
Priority to CN201810024605.2A priority Critical patent/CN108059798A/en
Publication of CN108059798A publication Critical patent/CN108059798A/en
Priority to CN201810766203.XA priority patent/CN108912972B/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10Epoxy resins modified by unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/10Epoxy resins modified by unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1466Acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/65Additives macromolecular
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10Epoxy resins modified by unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/04Antistatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)

Abstract

The present invention provides a kind of graphene light curable conductive resin and preparation method thereof, and wherein graphene light-cured resin includes the ingredient of following weight proportion:50~80 parts of epoxy resin, 50~60 parts of methacrylic acid, 2~6 parts of amino-polyethyleneglycols, 4~6 parts of graphene, 10~15 parts of doped polyaniline, 2~4 parts of isocyanates, 3~6 parts of tarine sodium, 1~4 part of adipic acid, 3~8 parts of reactive diluent, 0.5~1 part of catalyst, 0.5~0.8 part of polymerization inhibitor, 0.8~1.4 part of antioxidant, 40~60 parts of solvent.The present invention also provides the preparation methods of graphene light curable conductive resin, the graphene light curable conductive resin prepared by above-mentioned formula and preparation method, solve the problems, such as that graphene and doped polyaniline are easily reunited, conductive energy is outstanding, the advantages of electric conductivity is evenly distributed, suitable for technical fields such as coating, bonding agents, have wide range of applications.

Description

A kind of graphene light curable conductive resin and preparation method thereof
Technical field
The present invention relates to light curable conductive resin technology field, more particularly to a kind of graphene light curable conductive resin and its Preparation method.
Background technology
Electroconductive resin is the macromolecule resin polymer with certain electric conductivity, is mainly used in conductive adhesive In conductive coating paint.Wherein bonding agent is widely used in conducting wire bonding with electrode, bonding of semiconductor element, electromagnetism wave screen Cover bonding of functional component etc..Electroconductive resin is used in coating generally require the solvent of addition low viscosity, has transmission electric current Effect with accumulation electrostatic charge is excluded, is widely used in the functions such as anticorrosion, radiation protection, antistatic, invisible coating, conductive film Field.
Light-cured resin can occur rapidly physics and chemistry becomes in the short period of time after ultraviolet light is subject to Change, and then crosslinking curing, it is a kind of relatively low photoresist of relative molecular mass, has the reactivity that can carry out photocuring Group, such as unsaturated both shoulders or epoxy group.Light-cured resin is primarily applicable for photocureable coating, as photocureable coating It may make up photocureable coating, photocureable coating tool after matrix resin, with photoinitiator, reactive diluent and various additive compounds There is the advantages of curing rate is fast, organic volatile matter is few, has wide range of applications.
Graphene is the tightly packed single layer of carbon atom into two-dimentional six side's honeycomb crystal lattice structures, between each carbon atom with sp2Hybrid form is connected.On microcosmic, single-layer graphene film is not the flat structure of two dimension, but with " on nanoscale " The single layer structure of stable wavy is presently found unique existing Two Dimensional Free state atomic crystal;Macroscopically, graphene The fullerene of zero dimension can be warped into, be rolled into one-dimensional carbon nanotubes or is stacked to three-dimensional graphite.The two of graphene uniqueness The presence for the carbon hexatomic ring stablized in cycle honeycomb lattice structure is tieed up, imparts its excellent performance:The thickness of single-layer graphene Degree is only 0.35nm, is to be currently known most light most thin material;Its electron mobility at room temperature is 2 × 105cm2·V-1· s-1, it is the 1/300 of the light velocity, theoretical specific surface area can reach 2630m2·g-1, all band light absorption only has 2.3%, thermal conductivity Up to 5000Wm-1·K-1, Young's modulus is more than 1100GPa, and tensile strength is more than 130GPa, and toughness is very good, works as application During external mechanical force, carbon atom can be bent and deformed to adapt to external force, without rearranging carbon atom, so be maintained for The stabilization of structure.Therefore, graphene is a kind of very extensive carbon material of application potential, novel reaction separation, new material, There is huge application prospect in numerous industries such as energy conservation and environmental protection.
Wherein, electroconductive resin is usually that conducting particles is distributed to height by the even action of covalent bond or non-covalent bond In polymeric systems, make between conducting particles that mutually touching forms conductive network after high polymer curing, therefore, conducting particles is mixed It is miscellaneous into light-cured resin, corresponding electric conductivity light-cured resin can be obtained.
Polyaniline is a kind of typical high molecular material, has special electricity, optical property after doped, has excellent Electric conductivity.Existing electrically conductive polyaniline is generally the polyaniline using protonic acid doping, but its dissolution rate in a solvent It is extremely low, and be oxidized easily, dedoping occurs, surface resistivity is made gradually to increase in the solidification process of coating, and it is doped poly- Aniline is easily reunited in resin matrix, is made resin that can not form uniform conductive network after hardening, is reduced resin The binding ability of electric conductivity and resin and matrix.Meanwhile graphene is being set as the nano-particle with superior electrical conductivity energy Equally easily reunite in aliphatic radical body, when graphene and doped polyaniline are added in into resin matrix together, itself Physical property can form it into more serious agglomeration, greatly influence the electric conductivity of resin.
The content of the invention
It is added in solve graphene in the prior art mentioned above with doped polyaniline to light-cured resin The problem of more serious agglomeration occurred in matrix, the present invention provides a kind of graphene light curable conductive resin and its Preparation method, graphene light curable conductive resin provided by the invention add graphene and doping in photocuring matrix resin State polyaniline solves the problems, such as that graphene and doped polyaniline are easily reunited in resin, has outstanding electric conductivity, can Suitable for multiple fields such as coating, bonding agents.
The present invention adopts the following technical scheme that:
A kind of graphene light curable conductive resin includes the ingredient of following weight proportion:
Further, the graphene light curable conductive resin includes the ingredient of following weight proportion:
Further, the epoxy resin for bisphenol A type epoxy resin, novolac epoxy resin, aliphatic epoxy resin or One or more mixing in cycloaliphatic epoxy resin.
Further, the isocyanates is hexamethylene diisocyanate, isophorone diisocyanate and two hexamethylenes One kind in dicyclohexylmethane diisocyanate.
Further, the catalyst is N, in N- dimethyl benzylamines, tetraethylammonium bromide and trimethyl benzyl ammonia chloride One kind.
Further, the polymerization inhibitor is in p-hydroxyanisole, hydroquinone and 2,6- toluene di-tert-butyl phenol It is a kind of.
Further, the antioxidant is in two different certain herbaceous plants with big flowers ester of Wytox 312 and diphosphites pentaerythrite One kind.
Further, the solvent is n,N-Dimethylformamide, the one or more in ethyl acetate, butyl acetate are mixed It closes.
Further, the reactive diluent be polyfunctional acrylic ester, selected from tri (propylene glycol) diacrylate, One or more in trimethylolpropane trimethacrylate, tripropylene glycol diacrylate, pentaerythritol triacrylate Mixing.
The present invention also provides a kind of preparation methods of graphene light curable conductive resin, comprise the following steps:
Step 1:Epoxy resin is placed in reaction vessel, controlled at 90 DEG C~100 DEG C, using 500 turns of rotating speed/ The speed of min~600 turn/min is stirred, and methacrylic acid and the poly- second of part amino are added dropwise in 40min~50min The mixture of glycol;
Step 2:On the basis of step 1, adipic acid, catalyst, polymerization inhibitor are added dropwise in 20min~25min With the mixture of antioxidant, after being stirred to react 80min~90min, 110 DEG C~120 DEG C are warming up to, adds in reactive diluent, after It is continuous to be stirred to react 25min~35min, stop stirring, be cooled to 75 DEG C~80 DEG C;
Step 3: by graphene dispersion in partial solvent, stirred with the speed of 1000 turns/min~1500 turn/min After 30min~35min, ultrasonic vibration 20min~25min;
Step 4:On the basis of step 3, the solution for being dispersed with graphene is transferred in stirring container, 500 turns/ Under the stirring condition of min~800 turn/min, part amino-polyethyleneglycols are added in, after being warming up to 70 DEG C~80 DEG C, add in amino second Sodium sulfonate and doped polyaniline continue after stirring 20min~25min, be warming up to 130 DEG C~160 DEG C constant temperature reflux 90min~ 120min, cold filtration wash drying;
Step 5: the product that step 2 and step 4 are obtained is blended in partial solvent, isocyanates is added in, is warming up to 80 DEG C~90 DEG C, after speed stirring 80min~100min of 600 turns/min~700 turn/min, you can obtain the graphene Light curable conductive resin.
Graphene light curable conductive resin provided by the invention carries out the preparation of epoxy acrylate in preparation process It improves, reduces the viscosity of epoxy acrylate, improve toughness and intensity after curing, while make epoxy acrylate Segment spacing increases, convenient for inserting for follow-up graphene and doped polyaniline.The doped polyaniline that the present invention uses is matter The polyaniline of sub- acid doping, when Bronsted acid polyaniline is used to be doped, Hydrogen Proton is transferred on strand, generates charged member Excitation state polaron, the quinone ring of intramolecular disappear, electronics member redistribution, the positive charge delocalization on N atoms to big conjugatedπbond In, make high conductivity at polyaniline presentation.
When handling graphene and doped polyaniline, appropriate amino-polyethyleneglycols are first added in graphene dispersing solution, In a heated condition amino-polyethyleneglycols is made to uniformly disperse into graphene dispersing solution, iris action is played to graphene, at this time Graphene agglomeration unobvious after sonic oscillation, add tarine sodium and doped polyaniline, improve temperature into Row reaction, makes doped polyaniline be covered on graphene particle, forms the interlayer structure of polyaniline-graphite alkene-polyaniline, simultaneously Amino-polyethyleneglycols generate conjugation with the benzene ring units on polyaniline chain segments, and amino-polyethyleneglycols is made to become barrier material, solve The problem of doped polyaniline is easy to reunite.Wherein, the preferred N of tarine sodium, N- bis- (2- ethoxys) -2- amino second sulphurs Sour sodium.
In addition, graphene and doped polyaniline mixture after treatment is being inserted to epoxy acrylate In after, since the electron cloud on amino-polyethyleneglycols is pullled by the benzene ring units on polyaniline chain segments, polarity increase, with epoxy third The binding ability of olefin(e) acid ester gets a promotion, and further avoids agglomeration traits.The combination of graphene and doped polyaniline makes tree Fat possesses outstanding electric conductivity, while is dispersed in the densely covered conductive network formed in resin, also ensures resin Electric conductivity stability.
A kind of graphene light curable conductive resin provided by the invention and preparation method thereof, by treated graphene and Doped polyaniline is added in into epoxy acrylate, forms uniformly densely covered conductive network, and resin is made to have excellent conduction Performance, is applicable to the technical fields such as coating, bonding agent, and application range is very extensive.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention, Technical scheme is clearly and completely described, it is clear that described embodiment is that a part of the invention is implemented Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creativeness All other embodiments obtained under the premise of work, belong to the scope of protection of the invention.
Embodiment provided by the invention is shown in Table 1:
Table 1
Specific preparation method is as follows:
Embodiment 1:
Step 1:62 parts of epoxy resin are placed in reaction vessel, controlled at 90 DEG C, use 550 turns/min of rotating speed Speed be stirred, the mixture of 53 parts of methacrylic acids and 1.8 parts of amino-polyethyleneglycols is added dropwise in 45min;
Step 2:On the basis of step 1,1 part of adipic acid, 0.53 part of catalyst, 0.55 are added dropwise in 25min The mixture of part polymerization inhibitor and 0.87 part of antioxidant after being stirred to react 90min, is warming up to 120 DEG C, adds in 5.6 parts of activity dilutions Agent continues to be stirred to react 30min, stops stirring, be cooled to 75 DEG C;
Step 3: by 4.5 parts of graphene dispersions in 20 parts of solvents, after the speed stirring 35min of 1200 turns/min, surpass 25min is swung in acoustic shock;
Step 4:On the basis of step 3, the solution for being dispersed with graphene is transferred in stirring container, 700 turns/ Under the stirring condition of min, 1.2 parts of amino-polyethyleneglycols are added in, after being warming up to 70 DEG C, add in 4.5 parts of tarine sodium and 12 Part protonic acid doping state polyaniline continues after stirring 25min, is warming up to 150 DEG C of constant temperature reflux 100min, cold filtration, washing It is dry;
Step 5: the product that step 2 and step 4 are obtained is blended in 23 parts of solvents, 2.8 parts of isocyanates are added in, 90 DEG C are warming up to, after the speed stirring 100min of 650 turns/min, you can obtain the graphene light curable conductive resin.
Embodiment 2:
Step 1:65 parts of epoxy resin are placed in reaction vessel, controlled at 90 DEG C, use 550 turns/min of rotating speed Speed be stirred, the mixture of 55 parts of methacrylic acids and 1.8 parts of amino-polyethyleneglycols is added dropwise in 45min;
Step 2:On the basis of step 1,1 part of adipic acid, 0.55 part of catalyst, 0.58 are added dropwise in 25min The mixture of part polymerization inhibitor and 0.91 part of antioxidant after being stirred to react 90min, is warming up to 120 DEG C, adds in 6.8 parts of activity dilutions Agent continues to be stirred to react 30min, stops stirring, be cooled to 75 DEG C;
Step 3: by 5 parts of graphene dispersions in 20 parts of solvents, after the speed stirring 35min of 1200 turns/min, ultrasound Shake 25min;
Step 4:On the basis of step 3, the solution for being dispersed with graphene is transferred in stirring container, 700 turns/ Under the stirring condition of min, 2.2 parts of amino-polyethyleneglycols are added in, after being warming up to 70 DEG C, add in 5.1 parts of tarine sodium and 13 Part protonic acid doping state polyaniline continues after stirring 25min, is warming up to 150 DEG C of constant temperature reflux 100min, cold filtration, washing It is dry;
Step 5: the product that step 2 and step 4 are obtained is blended in 24 parts of solvents, 3.3 parts of isocyanates are added in, 90 DEG C are warming up to, after the speed stirring 100min of 650 turns/min, you can obtain the graphene light curable conductive resin.
Embodiment 3:
Step 1:68 parts of epoxy resin are placed in reaction vessel, controlled at 90 DEG C, use 550 turns/min of rotating speed Speed be stirred, the mixture of 58 parts of methacrylic acids and 1.6 parts of amino-polyethyleneglycols is added dropwise in 45min;
Step 2:On the basis of step 1, be added dropwise in 25min 1.5 parts of adipic acids, 0.58 part of catalyst, The mixture of 0.59 part of polymerization inhibitor and 0.96 part of antioxidant after being stirred to react 90min, is warming up to 120 DEG C, adds in 7.3 parts of activity Diluent continues to be stirred to react 30min, stops stirring, be cooled to 75 DEG C;
Step 3: by 5.5 parts of graphene dispersions in 20 parts of solvents, after the speed stirring 35min of 1200 turns/min, surpass 25min is swung in acoustic shock;
Step 4:On the basis of step 3, the solution for being dispersed with graphene is transferred in stirring container, 700 turns/ Under the stirring condition of min, 3.4 parts of amino-polyethyleneglycols are added in, after being warming up to 70 DEG C, add in 5.7 parts of tarine sodium and 14 Part protonic acid doping state polyaniline continues after stirring 25min, is warming up to 150 DEG C of constant temperature reflux 100min, cold filtration, washing It is dry;
Step 5: the product that step 2 and step 4 are obtained is blended in 25 parts of solvents, 3.8 parts of isocyanates are added in, 90 DEG C are warming up to, after the speed stirring 100min of 650 turns/min, you can obtain the graphene light curable conductive resin.
To detect a kind of performance of the practical application of graphene light curable conductive resin provided by the invention, inventor devises Multigroup check experiment, specific testing program are as follows:
Comparative example 1:Common commercially available light curable conductive resin;
Comparative example 2:It is added in common commercially available light curable conductive resin identical with 1 model of embodiment, dosage doped Polyaniline and graphene, specific preparation method are:Graphene and doped polyaniline are dispersed in solvent N, N- dimethyl formyl In amine, mixing is stirred using the rate of 800 turns/min, the product of comparative example 2 is obtained by filtration;
Test procedure:
1. the light curable conductive resin of embodiment 1, embodiment 2, embodiment 3, comparative example 1, comparative example 2 is coated in substrate On, cured using ultraviolet light, produce the tabular sample of 10cmx10cmx2cm;
2. tabular sample is cut into the rod-like samples of 2cmx10cmx2cm;
3. the volume resistance of rod-like samples is measured.
Result of the test is as shown in table 2:
Table 2
By the comparison of the volumetric resistivity value to embodiment 1, embodiment 2, embodiment 3 and comparative example 1, it can be found that this hair The electric conductivity of the graphene light curable conductive resin of bright offer is more outstanding.While from
Embodiment 1, embodiment 2, the test result of more than 3 a sample of embodiment, which compare, to be understood, graphene provided by the invention The volume resistance numeric distribution of light curable conductive resin is uniform, illustrates that graphene is being set with doped polyaniline as conductive filler It is uniformly distributed in fat, agglomeration does not occur, and in comparative example 2, there is the situation that volume resistance is unevenly distributed, in sample 4 and sample 5 in there is more outstanding electric conductivity, and the electric conductivity of sample 1, sample 2 and sample 3 is poor, this be by Although in being with the addition of graphene and doped polyaniline in comparative example 2, due to not according to method provided by the invention into Row processing, causes graphene and doped polyaniline that agglomeration has occurred in the resin matrix of comparative example 2, is used in enhancing The graphene and doped polyaniline of electric conductivity are gathered in some positions, so as to the situation that electric conductivity is unevenly distributed occur.
Finally it should be noted that:The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that:Its according to Can so modify to the technical solution recorded in foregoing embodiments either to which part or all technical characteristic into Row equivalent substitution;And these modifications or replacement, the essence of appropriate technical solution is not made to depart from various embodiments of the present invention technology The scope of scheme.

Claims (10)

1. a kind of graphene light curable conductive resin, it is characterised in that:The graphene light curable conductive resin includes following heavy Measure the ingredient of proportioning:
2. a kind of graphene light curable conductive resin according to claim 1, it is characterised in that:The graphene photocuring Electroconductive resin includes the ingredient of following weight proportion:
3. a kind of graphene light curable conductive resin according to claim 1 or 2, it is characterised in that:The epoxy resin It is mixed for the one or more in bisphenol A type epoxy resin, novolac epoxy resin, aliphatic epoxy resin or cycloaliphatic epoxy resin It closes.
4. a kind of graphene light curable conductive resin according to claim 1 or 2, it is characterised in that:The isocyanates For one kind in hexamethylene diisocyanate, isophorone diisocyanate and dicyclohexyl methyl hydride diisocyanate.
5. a kind of graphene light curable conductive resin according to claim 1 or 2, it is characterised in that:The catalyst is One kind in N, N- dimethyl benzylamine, tetraethylammonium bromide and trimethyl benzyl ammonia chloride.
6. a kind of graphene light curable conductive resin according to claim 1 or 2, it is characterised in that:The polymerization inhibitor is One kind in p-hydroxyanisole, hydroquinone and 2,6- toluene di-tert-butyl phenols.
7. a kind of graphene light curable conductive resin according to claim 1 or 2, it is characterised in that:The antioxidant is One kind in two different certain herbaceous plants with big flowers ester of Wytox 312 and diphosphites pentaerythrite.
8. a kind of graphene light curable conductive resin according to claim 1 or 2, it is characterised in that:The solvent is N, One or more mixing in dinethylformamide, ethyl acetate, butyl acetate.
9. a kind of graphene light curable conductive resin according to claim 1 or 2, it is characterised in that:The activity dilution Agent is polyfunctional acrylic ester, selected from tri (propylene glycol) diacrylate, trimethylolpropane trimethacrylate, three contractings third One or more mixing in omega-diol diacrylate, pentaerythritol triacrylate.
10. a kind of preparation method of graphene light curable conductive resin as claimed in claim 1 or 2, which is characterized in that including Following steps:
Step 1:Epoxy resin is placed in reaction vessel, controlled at 90 DEG C~100 DEG C, uses 500 turns/mi of rotating speed n The speed of~600 turns/mi n is stirred, and methacrylic acid and the poly- second of part amino are added dropwise in 40mi n~50mi n The mixture of glycol;
Step 2:On the basis of step 1, be added dropwise in 20mi n~25mi n adipic acid, catalyst, polymerization inhibitor and The mixture of antioxidant after being stirred to react 80mi n~90mi n, is warming up to 110 DEG C~120 DEG C, adds in reactive diluent, after It is continuous to be stirred to react 25mi n~35mi n, stop stirring, be cooled to 75 DEG C~80 DEG C;
Step 3: by graphene dispersion in partial solvent, 30mi is stirred with the speed of 1000 turns/mi n~1500 turn/mi n After n~35mi n, ultrasonic vibration 20mi n~25mi n;
Step 4:On the basis of step 3, the solution for being dispersed with graphene is transferred in stirring container, 500 turns/mi n~ Under the stirring condition of 800 turns/mi n, part amino-polyethyleneglycols are added in, after being warming up to 70 DEG C~80 DEG C, add in tarine Sodium and doped polyaniline continue after stirring 20mi n~25mi n, be warming up to 130 DEG C~160 DEG C constant temperature reflux 90mi n~ 120mi n, cold filtration wash drying;
Step 5: the product that step 2 and step 4 are obtained is blended in partial solvent, isocyanates is added in, is warming up to 80 DEG C ~90 DEG C, after speed stirring 80mi n~100mi n of 600 turns/mi n~700 turn/mi n, you can obtain the graphene Light curable conductive resin.
CN201810024605.2A 2018-01-11 2018-01-11 A kind of graphene light curable conductive resin and preparation method thereof Pending CN108059798A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201810024605.2A CN108059798A (en) 2018-01-11 2018-01-11 A kind of graphene light curable conductive resin and preparation method thereof
CN201810766203.XA CN108912972B (en) 2018-01-11 2018-07-12 Graphene photocuring conductive resin and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810024605.2A CN108059798A (en) 2018-01-11 2018-01-11 A kind of graphene light curable conductive resin and preparation method thereof

Publications (1)

Publication Number Publication Date
CN108059798A true CN108059798A (en) 2018-05-22

Family

ID=62141385

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201810024605.2A Pending CN108059798A (en) 2018-01-11 2018-01-11 A kind of graphene light curable conductive resin and preparation method thereof
CN201810766203.XA Active CN108912972B (en) 2018-01-11 2018-07-12 Graphene photocuring conductive resin and preparation method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810766203.XA Active CN108912972B (en) 2018-01-11 2018-07-12 Graphene photocuring conductive resin and preparation method thereof

Country Status (1)

Country Link
CN (2) CN108059798A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113004812A (en) * 2021-03-30 2021-06-22 刘新宽 Graphene modified resin packaging material and preparation method thereof
CN113845754A (en) * 2021-09-30 2021-12-28 广东博汇新材料科技股份有限公司 Preparation method of epoxy resin electronic and electric insulating material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101397256B1 (en) * 2013-02-28 2014-05-20 포항공과대학교 산학협력단 Conductive thin films and electronic devices comprising the same
CN104592857A (en) * 2014-12-30 2015-05-06 安科智慧城市技术(中国)有限公司 Graphene modified polyaniline conductive coating and preparation method thereof
CN104910752B (en) * 2015-06-10 2017-08-25 华南理工大学 A kind of polyaniline graphene nano composite anticorrosion coating and preparation method thereof
CN105176310B (en) * 2015-10-14 2017-06-27 南昌航空大学 A kind of preparation method of the conductive anti-corrosion coating of modified graphene
CN106832921A (en) * 2017-03-25 2017-06-13 山东本源晶体科技有限公司 A kind of preparation method of ionic liquid doped polymer conductive graphene material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113004812A (en) * 2021-03-30 2021-06-22 刘新宽 Graphene modified resin packaging material and preparation method thereof
CN113845754A (en) * 2021-09-30 2021-12-28 广东博汇新材料科技股份有限公司 Preparation method of epoxy resin electronic and electric insulating material
CN113845754B (en) * 2021-09-30 2022-07-08 广东博汇新材料科技有限公司 Preparation method of epoxy resin electronic and electric insulating material

Also Published As

Publication number Publication date
CN108912972B (en) 2020-05-22
CN108912972A (en) 2018-11-30

Similar Documents

Publication Publication Date Title
TW459032B (en) An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
KR101321099B1 (en) Multiple film based on epoxy resin having carbon nanoparticles and process for producing the same
CN109825010A (en) A method of brick-mud structure thermal conductive polymer composite material is prepared using magnetic field orientating
JP6555532B2 (en) Heat resistant epoxy resin composition
CN101857789B (en) Epoxy silsesquioxane/epoxy resin hybridized glue for packaging photoelectric devices and preparation method thereof
Khandelwal et al. Study on the effect of carbon nanotube on the properties of electrically conductive epoxy/polyaniline adhesives
CN108059798A (en) A kind of graphene light curable conductive resin and preparation method thereof
CN113845775B (en) Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material
CN102083899A (en) Thixotropic conductive composition
Jiao et al. Improving the interfacial strength of carbon fiber/vinyl ester resin composite by self-migration of acrylamide: a molecular dynamics simulation
CN1740207A (en) A kind of epoxy resin roughening and curing agent
CN102604456B (en) Preparation method of light-cured nano-grade polyaniline-epoxy acrylic resin interpenetrating network antistatic paint
CN109868084A (en) A kind of UV aggretion type POSS modified acroleic acid ester pressure-sensitive and preparation method
CN109776830B (en) Preparation method of polyurethane/carboxymethyl chitosan/polyaniline conductive film
JP5099998B2 (en) Epoxy resin composition for fiber reinforced composite materials
CN115926379A (en) Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof
JPH0735433B2 (en) Epoxy amine composition using unsaturated imides
CN112480808A (en) UV-EB dual-curing coating and preparation method and application thereof
CN109575595A (en) A kind of preparation method of polyetherimide/barium titanate/graphene dielectric composite material
EP0026263A2 (en) A method for improving the mechanical strength of elastomers
JP2002194057A (en) Thermosetting resin composition
CN108912304B (en) Preparation method of high-thermal-conductivity modified TPU (thermoplastic polyurethane) film
CN111925523B (en) Polyimide, preparation and application thereof, polyimide-epoxy resin interpenetrating network polymer composite material, preparation and application thereof
JP2018021156A (en) Resin composition, and cured molding, adhesive sheet, and substrate comprising the same
JP6241647B2 (en) Method for producing heat-cured conductive polymer composition

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180522

WD01 Invention patent application deemed withdrawn after publication