CN108054149B

CN108054149B - Integrated circuit package

Info

Publication number: CN108054149B
Application number: CN201711388287.XA
Authority: CN
Inventors: 白涛; 安鑫鑫
Original assignee: Dalian Xinxin Genesis Technology Development Co Ltd
Current assignee: Dalian Xinxin Genesis Technology Development Co Ltd
Priority date: 2017-12-20
Filing date: 2017-12-20
Publication date: 2020-01-21
Anticipated expiration: 2037-12-20
Also published as: CN108054149A

Abstract

The invention discloses an integrated circuit package which comprises a box body and an integrated circuit, wherein radiators are fixed on the outer walls of two sides of the box body through bolts, a round opening is formed in the inner wall of one side of the box body, a radiating fan is fixed on the inner wall of the round opening through bolts, a spring is fixed on the inner wall of the bottom end of the box body through a screw, a lower supporting plate is fixed on the outer wall of the top end of the spring through a screw, a lower clamping plate is fixed on the outer wall of the top end of the lower supporting plate through a screw, and a lower compression column is fixed on the outer wall of the top end of the. According to the invention, the heat dissipation fan and the radiator are added, so that the interior of the package can be quickly cooled, the filter cloth can filter dust in the air, the spring can effectively prevent the integrated circuit from being shocked, the integrated circuit package can effectively protect the integrated circuit, can provide a dustless working environment with quick heat dissipation for the integrated circuit, and can quickly replace the dust collecting circuit, so that the integrated circuit package can be recycled.

Description

Integrated circuit package

Technical Field

The invention relates to the technical field of integrated circuit packaging, in particular to integrated circuit packaging.

Background

Along with the continuous development of various industries such as aerospace, aviation, machinery, light industry, chemical industry and the like, the whole machine also changes towards multifunction and miniaturization, the integration level of an integrated circuit is required to be higher and higher, the function is more and more complex, the rationality and the scientificity of a packaging structure directly influence the quality of the integrated circuit, if the heat in the integrated circuit package cannot be dissipated timely, the operation efficiency of the integrated circuit is reduced, the integrated circuit can be disabled seriously, a large amount of dust enters the circuit board, the circuit board can also be disabled, most of packaging structures are discarded together after the circuit board is damaged, certain resource waste is caused, and the pollution to the environment is increased.

Disclosure of Invention

The present invention is directed to an integrated circuit package that solves the problems of the prior art.

In order to achieve the purpose, the invention adopts the following technical scheme:

an integrated circuit package comprises a box body and an integrated circuit, wherein radiators are fixed on the outer walls of two sides of the box body through bolts, a round opening is formed in the inner wall of one side of the box body, a radiating fan is fixed on the inner wall of the round opening through bolts, a spring is fixed on the inner wall of the bottom end of the box body through a screw, a lower supporting plate is fixed on the outer wall of the top end of the spring through a screw, a lower clamping plate is fixed on the outer wall of the top end of the lower supporting plate through a screw, a lower compression column is fixed on the outer wall of the top end of the lower clamping plate through a screw, a clamping block is fixed on the outer wall of one side of the box body through a screw, a box cover is clamped on the outer wall of the top end of the box body, a clamping buckle is fixed on the outer wall of one side of the clamping block through a, the bottom outer wall joint of baffle top outer wall and lid has same filter cloth, and the bottom outer wall of baffle has the second spring through the fix with screw, the bottom outer wall of second spring has last backup pad through the fix with screw, and the bottom outer wall of going up the backup pad has the punch holder through the fix with screw, the bottom outer wall of punch holder has last compression leg through the fix with screw.

Preferably, the integrated circuit is located between the upper plate and the lower plate, and the structure of the upper plate is consistent with that of the lower plate, and the length of the upper plate is consistent with that of the integrated circuit.

Preferably, the number of the heat dissipation fans is two to six, the two to six heat dissipation fans are symmetrically fixed on the inner walls of the two sides of the box body through bolts, and the length of the integrated circuit is smaller than the distance between the two heat dissipation fans.

Preferably, the number of the springs and the number of the second springs are six to eighteen, and the six to eighteen springs are fixed on the outer wall of the top end of the box body at equal intervals through screws.

Preferably, the structure of the partition plate and the structure of the filter cloth are both rectangular structures, the length and the width of the close partition plate are matched with those of the inner wall of the box cover, and the outer wall of the top end of the partition plate is provided with an air vent.

Preferably, the structure of going up the backup pad is unanimous with the structure of bottom suspension fagging, and second spring, go up backup pad, punch holder, goes up crimping post and spring, bottom suspension fagging, lower crimping post symmetric distribution in integrated circuit's upper and lower both ends.

The invention has the beneficial effects that:

this integrated circuit package through having increased a plurality of radiator fan to at the outer wall increased the radiator, thereby can be fast with the inside heat dissipation that dispels of encapsulation.

This integrated circuit encapsulation through having increased the air inlet to increased the filter cloth between air inlet and integrated circuit, thereby can filter the dust in the air, guaranteed the dustless operational environment of dust collecting circuit.

This integrated circuit encapsulation has all increased the spring through the upper and lower both ends at collection dirt circuit to can effectually move away to avoid possible earthquakes to integrated circuit, the effectual integrated circuit that has protected.

To sum up this integrated circuit encapsulation can effectual protection integrated circuit, can provide the dustless, the fast operational environment of heat dissipation of integrated circuit, can quick replacement dust collecting circuit for this integrated circuit encapsulation can recycle.

Drawings

Fig. 1 is a schematic front view of an integrated circuit package according to the present invention;

fig. 2 is a schematic side view of an integrated circuit package according to the present invention.

In the figure: the heat dissipation device comprises a box body 1, a spring 2, a lower supporting plate 3, a lower clamping plate 4, an integrated circuit 5, a lower compression joint column 6, an upper clamping plate 7, an upper supporting plate 8, a heat dissipation fan 9, a clamping block 10, a clamping buckle 11, a box cover 12, an air inlet 13, filter cloth 14, a partition plate 15, a second spring 16 and a heat radiator 17.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-2, an integrated circuit package includes a case body 1 and an integrated circuit 5, wherein two outer walls of the case body 1 are both fixed with a heat sink 17 by bolts, and one inner wall of the case body 1 is provided with a circular opening, the inner wall of the circular opening is fixed with a heat dissipation fan 9 by bolts, the inner wall of the bottom end of the case body 1 is fixed with a spring 2 by screws, and the outer wall of the top end of the spring 2 is fixed with a lower support plate 3 by screws, and the outer wall of the top end of the lower support plate 3 is fixed with a lower clamp plate 4 by screws, the outer wall of the top end of the lower clamp plate 4 is fixed with a lower compression post 6 by screws, one outer wall of the case body 1 is fixed with a clamping block 10 by screws, and the outer wall of the top end of the case body 1 is clamped with a case cover 12, the outer wall of the case cover 12, and the bottom of lid 12 both sides inner wall has same baffle 15 through the fix with screw, 15 top outer walls of baffle and the bottom inner wall joint of lid 12 have same filter cloth 14, and the bottom outer wall of baffle 15 has second spring 16 through the fix with screw, the bottom outer wall of second spring 16 has last backup pad 8 through the fix with screw, and the bottom outer wall of going up backup pad 8 has punch holder 7 through the fix with screw, the bottom outer wall of punch holder 7 has last compression leg through the fix with screw.

In the invention, an integrated circuit 5 is positioned between an upper clamping plate 7 and a lower clamping plate 4, the structure of the upper clamping plate 7 is consistent with that of the lower clamping plate 4, the length of the upper clamping plate 7 is consistent with that of the integrated circuit 5, the number of the heat radiation fans 9 is two to six, the two to six heat radiation fans 9 are symmetrically fixed on the inner walls of two sides of a box body 1 through bolts, the length of the integrated circuit 5 is smaller than the distance between the heat radiation fans 9 of the two sides, the number of the springs 2 and the number of the second springs 16 are six to eighteen, the six to eighteen springs 2 are fixed on the outer wall of the top end of the box body 1 at equal intervals through screws, the structure of a partition plate 15 and the structure of a filter cloth 14 are both rectangular structures, the length and the width of a close partition plate 15 are matched with the length and the width of the inner wall of a box cover 12, the outer wall of, and the second spring 16, the upper supporting plate 8 and the upper clamping plate 7, the upper compression joint column and the spring 2, the lower supporting plate 3, the lower clamping plate 4 and the lower compression joint column 6 are symmetrically distributed at the upper end and the lower end of the integrated circuit 5.

Through placing integrated circuit 5 on the top outer wall of lower plate 4, then pass through fixture block 10 and buckle 11 joint with lid 12 on the top of box body 1, punch holder 7 and last crimping post are fixed integrated circuit 5 on lower plate 4, then work, radiator fan 9 can dispel the heat to integrated circuit 5, external air enters into the lid through air inlet 13, then filters through filter cloth 14, dustless air is directly to in the box body 1, dispel the heat to integrated circuit 5.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. An integrated circuit package comprises a box body (1) and an integrated circuit (5), and is characterized in that radiators (17) are fixed on the outer walls of the two sides of the box body (1) through bolts, a round opening is formed in the inner wall of one side of the box body (1), a radiating fan (9) is fixed on the inner wall of the round opening through bolts, a spring (2) is fixed on the inner wall of the bottom end of the box body (1) through a screw, a lower supporting plate (3) is fixed on the outer wall of the top end of the spring (2) through a screw, a lower clamping plate (4) is fixed on the outer wall of the top end of the lower supporting plate (3) through a screw, a lower compression column (6) is fixed on the outer wall of the top end of the lower clamping plate (4) through a screw, a clamping block (10) is fixed on the outer wall of one side of the box body (1) through a screw, a box cover (12) is clamped on the outer wall of the, and buckle (11) joint is on fixture block (10), air inlet (13) have been seted up to the top outer wall of lid (12), and the bottom of lid (12) both sides inner wall has same baffle (15) through the fix with screw, baffle (15) top outer wall has same filter cloth (14) with the bottom inner wall joint of lid (12), and the bottom outer wall of baffle (15) has second spring (16) through the fix with screw, the bottom outer wall of second spring (16) has last backup pad (8) through the fix with screw, and the bottom outer wall of going up backup pad (8) has punch holder (7) through the fix with screw, the bottom outer wall of punch holder (7) has last compression leg through the fix with screw.

2. An integrated circuit package according to claim 1, characterized in that the integrated circuit (5) is located between the upper clamping plate (7) and the lower clamping plate (4), and the upper clamping plate (7) has a structure corresponding to the structure of the lower clamping plate (4), and the upper clamping plate (7) has a length corresponding to the length of the integrated circuit (5).

3. An ic package according to claim 1, wherein the number of the heat dissipation fans (9) is two to six, and the two to six heat dissipation fans (9) are symmetrically fixed on the inner walls of the two sides of the box body (1) by bolts, and the length of the ic (5) is less than the distance between the heat dissipation fans (9) on the two sides.

4. An integrated circuit package according to claim 1, characterized in that the number of springs (2) and the number of second springs (16) are six to eighteen, and that the six to eighteen springs (2) are fixed to the top outer wall of the box (1) by screws at equal distances.

5. The integrated circuit package according to claim 1, wherein the structure of the partition (15) and the structure of the filter cloth (14) are both rectangular structures, the length and the width of the partition (15) are matched with those of the inner wall of the box cover (12), and the outer wall of the top end of the partition (15) is provided with a vent.

6. An integrated circuit package according to claim 1, characterized in that the structure of the upper support plate (8) is identical to the structure of the lower support plate (3), and the second spring (16), the upper support plate (8), the upper clamp (7), the upper crimping posts and the springs (2), the lower support plate (3), the lower clamp (4), and the lower crimping posts (6) are symmetrically distributed at the upper and lower ends of the integrated circuit (5).