CN108053859A - A kind of series connection programming circuitry, chip array, aerial array and chip slapper choosing method - Google Patents
A kind of series connection programming circuitry, chip array, aerial array and chip slapper choosing method Download PDFInfo
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- CN108053859A CN108053859A CN201810063656.6A CN201810063656A CN108053859A CN 108053859 A CN108053859 A CN 108053859A CN 201810063656 A CN201810063656 A CN 201810063656A CN 108053859 A CN108053859 A CN 108053859A
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- chip
- burning
- series connection
- programming circuitry
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004891 communication Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/18—Auxiliary circuits, e.g. for writing into memory
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
Abstract
The invention discloses a kind of series connection programming circuitries, and to respectively treating the burning of the unique ID of burning/recording chip in chip array, desired signal line only respectively treats the burning connecting line of burning/recording chip between any two, and this connecting line cancels after burning completion, chip array come into operation.The chip array that series connection programming circuitry provided by the invention is process, without any signal wire for piece choosing, each chip receives the chip selection signal of wireless by wireless communication module, and ID wherein included and self ID are compared, you can realizes piece choosing.On the premise of chip array chip select functionality is not influenced, the quantity of signal wire is greatly reduced, and then saves circuit and is taken up space, and avoids the signal interference between signal wire.The present invention also provides a kind of chip array, aerial array and chip slapper choosing methods, have above-mentioned advantageous effect, details are not described herein.
Description
Technical field
The present invention relates to electronic circuit field, more particularly to a kind of series connection programming circuitry, chip array, aerial array and core
Piece piece choosing method.
Background technology
Piece choosing selects chip in digital circuit.Traditional piece is selected there are two types of structures, first, single line selects structure, i.e., it is every
Chip piece is all connected with an address wire, when the signal in this address wire be useful signal, then select the chip；Second
It is to select structure in length and breadth, similar to just as the longitude on tellurion and latitude positioning, two addresses can be connected with per chip piece
Line, one is ordinate, and another is horizontal line, and the chip is selected when ordinate and horizontal line are all useful signal.
But with the increase of number of chips, the quantity of chip selection signal line is also being continuously increased, in circuit integrated core
Piece quantity is more and more, circuit section save space is required under higher and higher trend, and traditional two kinds of pieces select structure all to occur
The problem of signal wire is excessive, not only Expenses Cost, also as signal wire is excessive and causes many other problems, such as signal is easy
It is disturbed and unstable.
Therefore, the quantity of signal wire how is reduced on the premise of the chip select functionality of chip select circuit is not influenced, saves circuit
The space occupied is the current technical issues that need to address of those skilled in the art.
The content of the invention
The object of the present invention is to provide a kind of series connection programming circuitry, chip array, aerial array and chip slapper choosing methods, use
In the quantity that signal wire is reduced on the premise of the chip select functionality for not influencing chip select circuit, the space that circuit occupies is saved.
In order to solve the above technical problems, the present invention provides a kind of series connection programming circuitry, burning/recording chip, each institute are treated including multiple
It states and treats that burning/recording chip includes wireless communication module, programmable enable signal end, programs and complete signal end, make with described may be programmed
Energy signal end and the programming are completed the OTP modules of signal end connection, are connected with the wireless communication module and the OTP modules
Processor；
First in the series connection programming circuitry programmable enable signal end for treating burning/recording chip connects with enable signal source
Connect, from second is treated burning/recording chip, respectively treat the programmable enable signal end of burning/recording chip with preceding a piece of burning/recording chip for the treatment of
Signal end connection is completed in programming.
Optionally, the enable signal source is specially high level signal source.
Optionally, it is described to treat that burning/recording chip is specially millimeter wave chip.
Optionally, further include to show first indicator light treated burning/recording chip burning and completed.
Optionally, the second indicator light chosen for display chip by piece is further included.
Optionally, the wireless communication module is specially GPRS communication modules.
Optionally, the wireless communication module is specially Wi-Fi communication modules.
In order to solve the above technical problems, the present invention also provides a kind of chip array, including string such as described in any one of the above embodiments
Join programming circuitry.
In order to solve the above technical problems, the present invention also provides a kind of aerial array, including chip array described above.
In order to solve the above technical problems, the present invention also provides a kind of chip slapper choosing method, based on described in any one of the above embodiments
Series connection programming circuitry, including：
The wireless communication module receives chip selection signal；
The processor judges whether include being stored in the OTP moulds unique ID in the block in the chip selection signal, if
It is then chip to be controlled to enter working condition.
Series connection programming circuitry provided by the present invention treats burning/recording chip including multiple, each described to treat that burning/recording chip includes
Signal end and the programmable enable signal end and the programming are completed in wireless communication module, programmable enable signal end, programming
The OTP modules for completing signal end connection, the processor being connected with the wireless communication module and the OTP modules；The series connection
First in the programming circuitry programmable enable signal end for treating burning/recording chip is connected with enable signal source, and burning is treated from second
Chip rises, and respectively treats that signal end phase is completed in the programmable enable signal end of burning/recording chip with the preceding a piece of programming for treating burning/recording chip
Even.
Series connection programming circuitry provided by the invention, to respectively treating the burning of the unique ID of burning/recording chip, required letter in chip array
Number line only respectively treats the burning connecting line of burning/recording chip between any two, and this connecting line makes in burning completion, chip array input
With rear calcellation.The chip array that is process of series connection programming circuitry provided by the invention, without any signal wire for piece choosing,
Each chip receives the chip selection signal of wireless by wireless communication module, and ID wherein included and self ID are compared, you can
Realize piece choosing.On the premise of chip array chip select functionality is not influenced, the quantity of signal wire is greatly reduced, and then saves electricity
Road is taken up space, and avoids the signal interference between signal wire.The present invention also provides a kind of chip array, aerial array and cores
Piece piece choosing method has above-mentioned advantageous effect, and details are not described herein.
Description of the drawings
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing is briefly described needed in technology description, it should be apparent that, the accompanying drawings in the following description is only this hair
Some bright embodiments, for those of ordinary skill in the art, without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram of the first series connection programming circuitry provided in an embodiment of the present invention；
Fig. 2 is the structure diagram of second provided in an embodiment of the present invention series connection programming circuitry；
Fig. 3 is the structure diagram of the third series connection programming circuitry provided in an embodiment of the present invention；
Fig. 4 is a kind of flow chart of chip slapper choosing method provided in an embodiment of the present invention.
Specific embodiment
The core of the present invention is to provide a kind of series connection programming circuitry, chip array, aerial array and chip slapper choosing method, uses
In the quantity that signal wire is reduced on the premise of the chip select functionality for not influencing chip select circuit, the space that circuit occupies is saved.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the scope of protection of the invention.
Fig. 1 is the structure diagram of the first series connection programming circuitry provided in an embodiment of the present invention.As shown in Figure 1, series connection
Programming circuitry treats burning/recording chip 10 including multiple, respectively treats that burning/recording chip 10 includes wireless communication module 101, programmable enabled letter
Number end 104, programming complete signal end 105, with programmable enable signal end 104 and the OTP moulds that are connected of programming completion signal end 105
Block 103, the processor 102 being connected with wireless communication module 101 and OTP modules 103；
First programmable enable signal end 104 for treating burning/recording chip 10 and enable signal source 11 in series connection programming circuitry
Connection from second is treated burning/recording chip 10, respectively treats that the programmable enable signal end 104 of burning/recording chip 10 a piece of waits to burn with preceding
The programming of recording chip 10 is completed signal end 105 and is connected.
It should be noted that the attached drawing in the present invention is only schematic diagram, the quantity of chip is not limited.In addition, the present invention is real
Apply " treating burning/recording chip " described in example with hereafter (including following embodiments) described in " chip " refer to same chip respectively
Different phase, " treating burning/recording chip " are the chip for not carrying out the unique ID of burning in programming circuitry of connecting, and " chip " is complete for burning
Into the chip of rear input normal use.
In specific implementation, enable signal source 11 is specifically as follows high level signal source, correspondingly, will programmable enabled letter
Number end 104, which is arranged to trigger OTP modules 103 when receiving high level signal, starts the unique ID of burning, after the completion of burning, compiles
Journey completes signal end 105 and is converted to high level signal by low level signal, a piece of burning for treating burning/recording chip 10 under triggering.
GPRS communication modules may be employed in wireless communication module, Wi-Fi communication modules can also be used, depending on chip array
Depending on actual needs.Or it can select to have the millimeter wave chip of high transfer rate as treating burning/recording chip 10.
OTP modules 103 can include OTP register and LOCK registers, LOCK registers with OTP register it is the same only
Carry out a burning, after the completion of OTP register burning, i.e., lockked by LOCK registers, thus generate can not change it is unique
ID.In addition, in the program for respectively treating burning/recording chip 10, unique ID including needing programming triggers enable signal and the control of burning
The mode of 105 converted output signal of signal end is completed in system programming.
Series connection programming circuitry provided in an embodiment of the present invention is used in chip array process to each burning chip only
In the link of one ID, after the completion of burning, the signal connecting line in programming circuitry of connecting cancels.
Series connection programming circuitry provided in an embodiment of the present invention treats burning/recording chip including multiple, each described to treat that burning/recording chip is equal
Including wireless communication module, programmable enable signal end, programming complete signal end, with the programmable enable signal end and described
The OTP modules of signal end connection, the processor being connected with the wireless communication module and the OTP modules are completed in programming；It is described
First programmable enable signal end for treating burning/recording chip in series connection programming circuitry is connected with enable signal source, is treated from second
Burning/recording chip rises, and respectively treats that signal end is completed in the programmable enable signal end of burning/recording chip with the preceding a piece of programming for treating burning/recording chip
It is connected.By the burning to respectively treating the unique ID of burning/recording chip in chip array, desired signal line only respectively treats burning/recording chip two-by-two
Between burning connecting line, and this connecting line cancels after burning completion, chip array come into operation.The embodiment of the present invention provides
The chip array that is process of series connection programming circuitry, without any signal wire for piece choosing, each chip passes through wireless communication
Module receives the chip selection signal of wireless, and ID wherein included and self ID are compared, you can realizes piece choosing.Do not influencing core
On the premise of chip arrays chip select functionality, the quantity of signal wire is greatly reduced, and then saves circuit and is taken up space, and is avoided
Signal interference between signal wire.
Fig. 2 is the structure diagram of second provided in an embodiment of the present invention series connection programming circuitry.In above-described embodiment
On the basis of, in another embodiment, series connection programming circuitry, which further includes to show, treats that 10 burning of burning/recording chip is completed first refers to
Show lamp 20.
In specific implementation, the first indicator light 20 can be arranged at so that user checks on external panel, wherein each
First indicator light 20 carries the corresponding label for treating burning/recording chip 10.Or the first indicator light 20 can be pre-assembled with treating
On burning/recording chip 10.First indicator light 20 could be provided as not working during non-burning, be lighted after the completion of burning or opposite.
It treats that the first corresponding indicator light 20 of the processor 102 of burning/recording chip 10 connects, passes through the program write in advance
Control, after the completion of burning, processor 102 controls the first corresponding indicator light 20 to send the indication signal that burning is completed.
Series connection programming circuitry provided in an embodiment of the present invention further includes to show and treats burning/recording chip burning is completed first
Indicator light, so that user checks burning chip progress, so as to carry out following process, use operation.
Fig. 3 is the structure diagram of the third series connection programming circuitry provided in an embodiment of the present invention.In above-described embodiment
On the basis of, in another embodiment, series connection programming circuitry further includes the second indicator light chosen for display chip 10 by piece
30。
In specific implementation, the second indicator light 30 can be arranged at so that user checks on external panel, wherein each
Second indicator light 30 carries the corresponding label for treating burning/recording chip 10.Or the second indicator light 30 can be pre-assembled with treating
On burning/recording chip 10.Second indicator light 30 could be provided as not working when chip is not selected, when selected after light, Huo Zhexiang
Instead.
It treats that the second corresponding indicator light 30 of the processor 102 of burning/recording chip 10 connects, passes through the program write in advance
Control, in the chip selection signal received after unique ID comprising chip itself, processor 102 controls corresponding second to refer to
Show that lamp 30 sends the indication signal of burning completion.
It should be noted that corresponding the second indicator light 30 of same chip 10 and the first indicator light 20 can be same
Indicator light, the indicator light, as showing the first indicator light 20 of burning completion, select the stage to make in the burning stage in chip slapper
To be used for the second indicator light 30 that display chip is selected.
Series connection programming circuitry provided in an embodiment of the present invention further includes the second instruction chosen for display chip by piece
Lamp, so that user checks whether chip is selected, if corresponding second indicator light of chip of selection does not send indication signal,
Illustrate that the chip is likely to occur failure, so as to which staff be prompted to investigate failure in time.
The corresponding each embodiment of series connection programming circuitry as detailed above, on this basis, the invention also discloses with it is upper
The corresponding chip array of series connection programming circuitry and aerial array are stated, wherein, chip array provided in an embodiment of the present invention is included such as
Series connection programming circuitry described in any of the above-described embodiment；Aerial array provided in an embodiment of the present invention, including above-mentioned chip
Array.
Chip array and aerial array provided in an embodiment of the present invention are to therein each using above-mentioned series connection programming circuitry
It treats the finished product tested or come into operation after the completion of the unique ID of burning/recording chip burning, is burnt including the series connection after the completion of burning
Circuit is recorded, the signal connecting line in programming circuitry of connecting directly cancels without removal.
Wherein, chip array can include through the chipset after the unique ID of programming circuitry burning that connects, and can also include
Other control elements or the chip for not carrying out burning.
Aerial array can include said chip array, including with unique ID can wireless communication chip, also
It can include the common chip for traditional piece mode being selected to carry out piece choosing.
Since the embodiment of chip array and aerial array part is corresponded with the embodiment of series connection programming circuitry part,
Therefore the embodiment of chip array and aerial array part refers to the description of the embodiment of series connection programming circuitry part, here temporarily
It does not repeat.
Fig. 4 is a kind of flow chart of chip slapper choosing method provided in an embodiment of the present invention.As shown in figure 4, described above
The corresponding each embodiment of series connection programming circuitry on the basis of, the invention also discloses the cores based on above-mentioned series connection programming circuitry
Piece piece choosing method, including：
S40：Wireless communication module receives chip selection signal.
S41：Processor judges whether include being stored in OTP moulds unique ID in the block in chip selection signal, if it is, into
Step S42.
S42：Control chip enters working condition.
After the completion of above-mentioned series connection programming circuitry burning, every chip itself therein all has unique ID.Each chip
Chip selection signal is sent to the processor of itself, processor comparison piece choosing letter by wireless communication module after chip selection signal is received
Number ID included and the OTP moulds unique ID of itself in the block is stored in, judges whether to be selected, work is entered if selected
Make state, otherwise remain waiting for.
Chip slapper choosing method provided in an embodiment of the present invention, based on the series connection programming circuitry described in above-described embodiment, bag
It includes：The wireless communication module receives chip selection signal；The processor judges whether include being stored in institute in the chip selection signal
OTP moulds unique ID in the block is stated, if it is, control chip enters working condition.It is real by the wireless communication module in chip
Existing wireless communication and piece choosing of unique ID realizations to chip for passing through advance burning in chip, without any signal for piece choosing
Piece choosing can be realized in line.On the premise of chip array chip select functionality is not influenced, the quantity of signal wire, Jin Erjie are greatly reduced
Power saving road is taken up space, and avoids the signal interference between signal wire.
In several embodiments provided herein, it should be understood that disclosed series connection programming circuitry, chip battle array
Row, aerial array and chip slapper choosing method, can realize by another way.For example, series connection burning electricity described above
Road, chip array and antenna array embodiment are only schematical, for example, the division of module, is only a kind of logic function
Division, can have other dividing mode, such as multiple module or components may be combined or can be integrated into actual implementation
Another system or some features can be ignored or does not perform.It is another, shown or discussed mutual coupling or
Direct-coupling or communication connection can be by some interfaces, the INDIRECT COUPLING or communication connection of device or module, can be electricity
Property, mechanical or other forms.The module illustrated as separating component may or may not be physically separate, work
Physical module is may or may not be for the component that module is shown, you can be located at a place or can also divide
Cloth is on multiple network modules.Some or all of module therein can be selected to realize the present embodiment according to the actual needs
The purpose of scheme.
In addition, each function module in each embodiment of the application can be integrated in a processing module, it can also
That modules are individually physically present, can also two or more modules be integrated in a module.Above-mentioned integrated mould
The form that hardware had both may be employed in block is realized, can also be realized in the form of software function module.
If integrated module is realized in the form of software function module and is independent production marketing or in use, can
To be stored in a computer read/write memory medium.Based on such understanding, the technical solution of the application substantially or
Saying all or part of the part contribute to the prior art or the technical solution can be embodied in the form of software product
Out, which is stored in a storage medium, is used including some instructions so that a computer equipment
(can be personal computer, funcall device or the network equipment etc.) performs the whole of each embodiment method of the application
Or part steps.And foregoing storage medium includes：USB flash disk, mobile hard disk, read-only memory (Read-Only Memory,
ROM), random access memory (Random Access Memory, RAM), magnetic disc or CD etc. are various can store program
The medium of code.
Above to a kind of series connection programming circuitry provided by the present invention, chip array, aerial array and chip slapper choosing method
It is described in detail.Each embodiment is described by the way of progressive in specification, the highlights of each of the examples are
Difference from other examples, just to refer each other for identical similar portion between each embodiment.It is disclosed for embodiment
Device for, since it is corresponded to the methods disclosed in the examples, so description is fairly simple, related part is referring to method
Part illustrates.It should be pointed out that for those skilled in the art, before the principle of the invention is not departed from
Put, can also to the present invention some improvement and modification can also be carried out, these improvement and modification also fall into the guarantor of the claims in the present invention
In the range of shield.
It should also be noted that, in the present specification, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only include that
A little elements, but also including other elements that are not explicitly listed or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except also there are other identical elements in the process, method, article or apparatus that includes the element.
Claims (10)
1. a kind of series connection programming circuitry, which is characterized in that treat burning/recording chip including multiple, it is each described to treat that burning/recording chip includes nothing
Line communication module, programmable enable signal end, programming complete signal end, with the programmable enable signal end and described having programmed
The OTP modules connected into signal end, the processor being connected with the wireless communication module and the OTP modules；
First in the series connection programming circuitry programmable enable signal end for treating burning/recording chip is connected with enable signal source, from
Second is treated that burning/recording chip rises, respectively treat the programmable enable signal end of burning/recording chip with it is preceding it is a piece of treat burning/recording chip programming it is complete
It is connected into signal end.
2. series connection programming circuitry according to claim 1, which is characterized in that the enable signal source is specially high level letter
Number source.
3. series connection programming circuitry according to claim 1, which is characterized in that described to treat that burning/recording chip is specially millimeter wave core
Piece.
4. series connection programming circuitry according to claim 1, which is characterized in that further include to show and described treat burning/recording chip
The first indicator light that burning is completed.
5. series connection programming circuitry according to claim 1, which is characterized in that further include and chosen for display chip by piece
The second indicator light.
6. series connection programming circuitry according to claim 1, which is characterized in that the wireless communication module is specially that GPRS leads to
Believe module.
7. series connection programming circuitry according to claim 1, which is characterized in that the wireless communication module is specially Wi-Fi
Communication module.
8. a kind of chip array, which is characterized in that including series connection programming circuitry as described in any one of claim 1 to 7.
9. a kind of aerial array, which is characterized in that including chip array as claimed in claim 8.
10. a kind of chip slapper choosing method, based on claim 1 to 7 any one of them series connection programming circuitry, which is characterized in that
Including：
The wireless communication module receives chip selection signal；
The processor judges whether include being stored in the OTP moulds unique ID in the block in the chip selection signal, if it is,
Control chip enters working condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810063656.6A CN108053859A (en) | 2018-01-23 | 2018-01-23 | A kind of series connection programming circuitry, chip array, aerial array and chip slapper choosing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810063656.6A CN108053859A (en) | 2018-01-23 | 2018-01-23 | A kind of series connection programming circuitry, chip array, aerial array and chip slapper choosing method |
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| CN108053859A true CN108053859A (en) | 2018-05-18 |
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|---|---|---|---|---|
| US20050098881A1 (en) * | 2003-08-28 | 2005-05-12 | Martin Perner | Memory module and method for operating a memory module |
| US20070058411A1 (en) * | 2005-08-11 | 2007-03-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor storage device including electrical fuse module |
| KR101622521B1 (en) * | 2015-11-09 | 2016-05-18 | 박정원 | Programmable Logic Controller Communication Device |
| CN207742938U (en) * | 2018-01-23 | 2018-08-17 | 广东工业大学 | A kind of series connection programming circuitry, chip array and aerial array |
-
2018
- 2018-01-23 CN CN201810063656.6A patent/CN108053859A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050098881A1 (en) * | 2003-08-28 | 2005-05-12 | Martin Perner | Memory module and method for operating a memory module |
| US20070058411A1 (en) * | 2005-08-11 | 2007-03-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor storage device including electrical fuse module |
| KR101622521B1 (en) * | 2015-11-09 | 2016-05-18 | 박정원 | Programmable Logic Controller Communication Device |
| CN207742938U (en) * | 2018-01-23 | 2018-08-17 | 广东工业大学 | A kind of series connection programming circuitry, chip array and aerial array |
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