CN108051091A - A kind of infrared temperature probe system - Google Patents

A kind of infrared temperature probe system Download PDF

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Publication number
CN108051091A
CN108051091A CN201711107619.2A CN201711107619A CN108051091A CN 108051091 A CN108051091 A CN 108051091A CN 201711107619 A CN201711107619 A CN 201711107619A CN 108051091 A CN108051091 A CN 108051091A
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CN
China
Prior art keywords
microprocessor
temperature probe
infrared
communication module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711107619.2A
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Chinese (zh)
Inventor
余霞
邓军
张晓�
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Hui Yuan Cheng Electric Polytron Technologies Inc
Original Assignee
Anhui Hui Yuan Cheng Electric Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Hui Yuan Cheng Electric Polytron Technologies Inc filed Critical Anhui Hui Yuan Cheng Electric Polytron Technologies Inc
Priority to CN201711107619.2A priority Critical patent/CN108051091A/en
Publication of CN108051091A publication Critical patent/CN108051091A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0096Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

The invention discloses a kind of infrared temperature probe systems, are related to sensor technical field, and including microprocessor, temperature probe, infrared sensor and communication module, temperature probe is connected to microprocessor by the first A/D convertor circuit;The first A/D convertor circuit of infrared sensor is connected to microprocessor;Communication module is connected to microprocessor by an on-off circuit module;Microprocessor passes sequentially through electrical terminals, boost module is connected to and takes electric ring;If electric ring is taken to take electric metal piece including dried layer, sheet metal is connected to boost module.The temperature signal collected and infrared signal are sent to terminal device by the present invention by temperature probe and infrared sensor by communication module, by the cable environment temperature of terminal device real-time monitoring power distribution cabinet, the high temperature of cable are generated and carries out early warning monitoring.By the way that electric ring is taken to obtain use of the electric current on cable for the system power, can automatic electricity getting, additional electric energy is not required to supply.

Description

A kind of infrared temperature probe system
Technical field
The invention belongs to sensor technical field, more particularly to a kind of infrared temperature probe system.
Background technology
Wireless sensor network is the sensing and processing for integrating three big technology of sensor, wireless communication and network Technology is mainly used for realizing the detection of various parameters under varying environment.
For current wireless temperature measurement technology, the power supply of most thermometric product takes power mode using battery or CT.Electricity As soon as the use in pond has service life, exhausted using battery after a period of time and need replacing battery, Er Qie electricity The leakage and explosion in pond can all cause security risk.And CT takes electricity there are the problem of volume is big, installation is inconvenient, and in super-strong magnetic Vibration and fever can be generated in, serious harm is generated to power equipment.
State Intellectual Property Office of the People's Republic of China disclosed Authorization Notice No. on November 05th, 2008 The patent document of CN201145943Y, title are temperature difference wireless infrared temperature sensors, be equipped with semiconductor thermo-electric generation apparatus, Protect thermal resistance, infrared transmitting tube and radiator.Semiconductor thermo-electric generation apparatus is by semiconductor temperature difference module fire end heat conduction Bottom case and hot-side heat dissipation copper coin composition, radiator is equipped on heat dissipation copper coin, is by teflon insulation fastening between each other One.Electro-optic conversion infrared transmitting tube is equipped at the top of radiator.Thermal protection resistance is arranged on inside radiator, with semiconductor temperature difference Module is connected with infrared transmitting tube.This scheme is powered by semiconductor thermo-electric generation apparatus, but in the little environment of the temperature difference Under be difficult to realize the purpose of self-power supply, the scope of application has certain limitation.
The content of the invention
It is an object of the invention to provide a kind of infrared temperature probe system, by the way that electric ring is taken to obtain the electric current on cable For the use of the system power, can automatic electricity getting, additional electric energy is not required to supply, solves existing wireless temperature-measuring sensor The problem of power supply.
In order to solve the above technical problems, the present invention is achieved by the following technical solutions:
The present invention is a kind of infrared temperature probe system, including microprocessor, temperature probe, infrared sensor and communication Module, the temperature probe are connected to microprocessor by the first A/D convertor circuit;The first AD conversion of infrared sensor electricity Road is connected to microprocessor;The communication module is connected to microprocessor by an on-off circuit module;The microprocessor according to Secondary be connected to by electrical terminals, boost module takes electric ring;If described take electric ring to take electric metal piece, the sheet metal including dried layer It is connected to boost module.
Further, the boost module includes bootstrap circuit boost, protective circuit of voltage regulation, charge pump and super capacitor, The anode of the anode connection super capacitor of the protective circuit of voltage regulation, the cathode connection super capacitor of the protective circuit of voltage regulation Cathode.
Further, it is described that electric ring is taken to take electric metal piece including 1-10 layers;The sheet metal contacts company with the cored wire of cable It connects.
Further, the communication module includes wireless communication module or ZigBee or 3G or 4G communications.
Further, the microprocessor is additionally provided with memory.
The temperature signal collected and infrared signal are passed through communication by system principle by temperature probe and infrared sensor Module is sent to terminal device, and by the cable environment temperature of terminal device real-time monitoring power distribution cabinet, the high temperature of cable is generated Carry out early warning monitoring.By the way that electric ring is taken to obtain use of the electric current on cable for the system power, can automatic electricity getting, volume is not required Outer electric energy supply.
The invention has the advantages that:
The temperature signal collected and infrared signal are passed through the mould that communicates by the present invention by temperature probe and infrared sensor Block is sent to terminal device, by the cable environment temperature of terminal device real-time monitoring power distribution cabinet, the high temperature of cable is generated into Row early warning monitoring.By the way that electric ring is taken to obtain the use that the electric current on cable supplies the system power, can automatic electricity getting, need not be additionally Electric energy supply.
Certainly, implement any of the products of the present invention and do not necessarily require achieving all the advantages described above at the same time.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, embodiment will be described below required Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, for ability For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached Figure.
Fig. 1 is a kind of structural system of infrared temperature probe system of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained all other without creative efforts Embodiment belongs to the scope of protection of the invention.
Refering to Figure 1, the present invention is a kind of infrared temperature probe system, including microprocessor, temperature probe, red Outer sensor and communication module,
Temperature probe is connected to microprocessor by the first A/D convertor circuit;
The first A/D convertor circuit of infrared sensor is connected to microprocessor;
Communication module is connected to microprocessor by an on-off circuit module;
Microprocessor passes sequentially through electrical terminals, boost module is connected to and takes electric ring;
If electric ring is taken to take electric metal piece including dried layer, sheet metal is connected to boost module.
Wherein, boost module includes bootstrap circuit boost, protective circuit of voltage regulation, charge pump and super capacitor, voltage-stabilizing protection The anode of the anode connection super capacitor of circuit, the cathode of the cathode connection super capacitor of protective circuit of voltage regulation.
Wherein, electric ring is taken to take electric metal piece including 1-10 layers;The cored wire of sheet metal and cable connects.
Wherein, communication module includes wireless communication module or ZigBee or 3G or 4G communications.
Wherein, microprocessor is additionally provided with memory.
The temperature signal collected and infrared signal are passed through communication by system principle by temperature probe and infrared sensor Module is sent to terminal device, and by the cable environment temperature of terminal device real-time monitoring power distribution cabinet, the high temperature of cable is generated Carry out early warning monitoring.By the way that electric ring is taken to obtain use of the electric current on cable for the system power, can automatic electricity getting, volume is not required Outer electric energy supply.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means At least one implementation of the present invention is contained in reference to the embodiment or example particular features, structures, materials, or characteristics described In example or example.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example. Moreover, particular features, structures, materials, or characteristics described can close in any one or more embodiments or example Suitable mode combines.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification, It can make many modifications and variations.This specification is chosen and specifically describes these embodiments, is in order to preferably explain the present invention Principle and practical application so that skilled artisan can be best understood by and utilize the present invention.The present invention is only It is limited by claims and its four corner and equivalent.

Claims (5)

1. a kind of infrared temperature probe system, special including microprocessor, temperature probe, infrared sensor and communication module Sign is:
The temperature probe is connected to microprocessor by the first A/D convertor circuit;
First A/D convertor circuit of infrared sensor is connected to microprocessor;
The communication module is connected to microprocessor by an on-off circuit module;
The microprocessor passes sequentially through electrical terminals, boost module is connected to and takes electric ring;
If described take electric ring to take electric metal piece including dried layer, the sheet metal is connected to boost module.
2. a kind of infrared temperature probe system according to claim 1, which is characterized in that the boost module is included certainly Volt circuit, protective circuit of voltage regulation, charge pump and super capacitor are lifted, the anode connection super capacitor of the protective circuit of voltage regulation Anode, the cathode of the cathode connection super capacitor of the protective circuit of voltage regulation.
3. a kind of infrared temperature probe system according to claim 1, which is characterized in that described that electric ring is taken to include 1-10 Layer takes electric metal piece;The cored wire of the sheet metal and cable connects.
4. a kind of infrared temperature probe system according to claim 1, which is characterized in that the communication module includes nothing Line communication module or ZigBee or 3G or 4G communication.
5. a kind of infrared temperature probe system according to claim 1, which is characterized in that the microprocessor is also set up There is memory.
CN201711107619.2A 2017-11-10 2017-11-10 A kind of infrared temperature probe system Pending CN108051091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711107619.2A CN108051091A (en) 2017-11-10 2017-11-10 A kind of infrared temperature probe system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711107619.2A CN108051091A (en) 2017-11-10 2017-11-10 A kind of infrared temperature probe system

Publications (1)

Publication Number Publication Date
CN108051091A true CN108051091A (en) 2018-05-18

Family

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CN201711107619.2A Pending CN108051091A (en) 2017-11-10 2017-11-10 A kind of infrared temperature probe system

Country Status (1)

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CN (1) CN108051091A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111650475A (en) * 2020-06-24 2020-09-11 国家电网有限公司 Power distribution network cable monitoring method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203799471U (en) * 2013-09-26 2014-08-27 国家电网公司 Self-powered high-voltage transmission line warning device
CN204373789U (en) * 2015-02-10 2015-06-03 邯郸市奥瑞电子机械有限公司 A kind of CT power taking wireless temperature measuring device
CN104677502A (en) * 2015-02-11 2015-06-03 国家电网公司 Infrared remote wired alarm device for high-voltage isolation switch heat fault and operation method
CN204831613U (en) * 2015-08-14 2015-12-02 泰州斯贝勒电气科技有限公司 Wireless temperature sensor
CN205059295U (en) * 2015-10-08 2016-03-02 山东理工职业学院 Electric installation is got to high -speed railway
CN205483278U (en) * 2016-03-17 2016-08-17 北京斯拓高科电气有限公司 Wireless temperature measurement system based on passive CT asks for
CN105953926A (en) * 2016-07-01 2016-09-21 杨志强 Passive wireless non-contact temperature measuring device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203799471U (en) * 2013-09-26 2014-08-27 国家电网公司 Self-powered high-voltage transmission line warning device
CN204373789U (en) * 2015-02-10 2015-06-03 邯郸市奥瑞电子机械有限公司 A kind of CT power taking wireless temperature measuring device
CN104677502A (en) * 2015-02-11 2015-06-03 国家电网公司 Infrared remote wired alarm device for high-voltage isolation switch heat fault and operation method
CN204831613U (en) * 2015-08-14 2015-12-02 泰州斯贝勒电气科技有限公司 Wireless temperature sensor
CN205059295U (en) * 2015-10-08 2016-03-02 山东理工职业学院 Electric installation is got to high -speed railway
CN205483278U (en) * 2016-03-17 2016-08-17 北京斯拓高科电气有限公司 Wireless temperature measurement system based on passive CT asks for
CN105953926A (en) * 2016-07-01 2016-09-21 杨志强 Passive wireless non-contact temperature measuring device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111650475A (en) * 2020-06-24 2020-09-11 国家电网有限公司 Power distribution network cable monitoring method

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Application publication date: 20180518

RJ01 Rejection of invention patent application after publication