CN108037816A - Through-flow device and immersion liquid-cooled suit business device - Google Patents
Through-flow device and immersion liquid-cooled suit business device Download PDFInfo
- Publication number
- CN108037816A CN108037816A CN201711394203.3A CN201711394203A CN108037816A CN 108037816 A CN108037816 A CN 108037816A CN 201711394203 A CN201711394203 A CN 201711394203A CN 108037816 A CN108037816 A CN 108037816A
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- CN
- China
- Prior art keywords
- weldment
- flow device
- connecting portion
- flow
- weld part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of through-flow device, this is through-flow the first weldment that device, which includes, to be set up in parallel and the second weldment and it is fixedly connected with the first weldment and the second weldment provides a kind of immersion liquid-cooled suit business device with weld part 20 respectively.It is an object of the invention to provide a kind of through-flow device, this is through-flow, and device has stronger through-current capability, to realize effective switching of mainboard and power module in immersion liquid-cooled suit business device.
Description
Technical field
A kind of immersion server the present invention relates to through-flow device and comprising the through-flow device.
Background technology
It is super to be counted as the emphasis of various countries' development in the world with the arrival in information-based big data epoch, it is a country
The embodiment of strength.In order to more energy saving, immersion server becomes the emphasis studied in the world.Electric current transmission how is solved to ask
Topic, becomes immersion server problem to be solved.
In general, blade immersion server be immersed in specific liquid it is cold in, and server is fully sealed with knife shell
With liquid-leakage preventing.Since server energy consumption is usually larger, required electric current is larger, therefore how efficiently to transmit electric current as needing to solve
An emphasis certainly.The processing procedure size of PCBA manufactories is limited to, Power conversion board is generally required in the design and is interconnected with mainboard
To solve the problems, such as to main board power supply, it is therefore desirable to a kind of design suitable for liquid-cooled suit business device Busbar.
The content of the invention
For problem present in correlation technique, it is an object of the invention to provide a kind of through-flow device, this is through-flow device
With stronger through-current capability, to realize effective switching of mainboard and power module in immersion liquid-cooled suit business device.
To achieve the above object, the present invention provides a kind of through-flow device, it includes the first weldment being set up in parallel and
Two weldments and it is fixedly connected respectively with the first weldment and the second weldment so that the connection that the first weldment and the second weldment are electrically connected
Plate.
According to one embodiment of present invention, threaded hole is both provided with the first weldment and the second weldment, connecting plate leads to
The bolt crossed through threaded hole is fixedly connected with the first weldment and the second weldment.
According to one embodiment of present invention, connecting portion is each included and by connecting portion in the first weldment and the second weldment
The weld part of angled extension, threaded hole are arranged on connecting portion.
According to one embodiment of present invention, weld part extends from the edge-perpendicular of connecting portion.
According to one embodiment of present invention, connecting portion has along the taken in section of the axis direction perpendicular to threaded hole
Quadrangular section, weld part extend sideways from least one of connecting portion.
According to one embodiment of present invention, weld part is configured to by three of the connecting portion multiple legs to extend sideways.
According to one embodiment of present invention, three are arranged at intervals with each side in three sides of connecting portion
Leg.
According to one embodiment of present invention, be not provided with the connecting portion of the first weldment and the second weldment leg side that
This is oppositely arranged.
According to one embodiment of present invention, connecting plate is the rectangular slab being covered on the first weldment and the second weldment.
According to another aspect of the present invention, there is provided a kind of immersion liquid-cooled suit business device, immersion liquid-cooled suit business device include
The blade mainboard and power module that are immersed in liquid cryogen and the through-flow device that blade mainboard is electrically connected with power module,
Wherein, through-flow device include the first weldment for being welded on blade mainboard and the second weldment being welded on power module and
It is fixedly connected respectively with the first weldment and the second weldment so that the connecting plate that the first weldment and the second weldment are electrically connected.
The advantageous effects of the present invention are：The through-flow device of the present invention has stronger through-current capability, therefore can
Realize the switching of mainboard and power module in immersion liquid-cooled suit business device.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the top view according to the through-flow device of the embodiment of the present invention；
Fig. 2 a show separately the stereogram of the first weldment of the through-flow device shown in Fig. 1；
Fig. 2 b show the top view of the first weldment shown in Fig. 2 a；
Fig. 3 a show separately the stereogram of the connecting plate of the through-flow device shown in Fig. 1；
Fig. 3 b show the top view of the connecting plate shown in Fig. 3 a；
Fig. 4 is shown for fixed connecting plate and the bolt fastener of the first weldment and the second weldment；And
Fig. 5 shows the perspective view of immersion liquid-cooled suit business device according to embodiments of the present invention, wherein blade mainboard and electricity
Source module is electrically connected by through-flow device.
Embodiment
Below with reference to attached drawing, the embodiment of the present invention is specifically described.It should be noted that following each implementation
Example can be mutually combined in any possible manner or partial replacement.
Referring to figs. 1 to Fig. 4, the embodiment of the present invention provides a kind of through-flow device 10, this is through-flow, and device 10 includes being set up in parallel
The first weldment 12 and the second weldment 14, connecting plate 18 is fixedly connected with the first weldment 12 and the second weldment 14 respectively, by
One weldment 12 and the second weldment 14 are electrically connected.When in use, the first weldment 12 and the second weldment 14 can be respectively welded to needs
Blade mainboard and power module in two components being electrically connected, such as immersion liquid-cooled suit business device, to realize therebetween
Switching.
As shown in Figure 2 a and 2 b, Fig. 2 a and Fig. 2 b respectively illustrate the first weldment according to an embodiment of the invention
12 stereogram and top view, wherein, threaded hole 26 is provided with the first weldment 12, and Fig. 3 a, Fig. 3 b and Fig. 4 are combined,
The matching hole 16 to align with threaded hole 26 is provided with connecting plate 18, bolt 22 sequentially passes through the matching hole 16 and screw thread of alignment
Connecting plate 18 is fixedly connected by hole 26 with the first weldment 12.
It should be noted that since the second weldment 14 and the first weldment 12 have identical structure and in the same way
It is fixedly connected with connecting plate 18, therefore for brevity, only the first weldment 12 is described in detail herein, the second weldment 14
Concrete structure and connection mode are with reference to the first weldment 12.
Referring to Fig. 2 a and Fig. 2 b, the first weldment 12 includes connecting portion 24 and the weld part by the angled extension of connecting portion 24
20, threaded hole 26 is arranged on connecting portion 24.For example, in the possible embodiment of the present invention, such as Fig. 2 a and Fig. 2 b institutes
Show, weld part 20 extends from the edge-perpendicular of connecting portion 24.
Specifically, a possible embodiment according to the present invention, as shown in Figure 2 a and 2 b, connecting portion 24 have along vertical
Directly in threaded hole 26 central axis taken in section quadrangular section, and connecting plate 18 is is covered in 12 He of the first weldment
Rectangular slab on second weldment 14, weld part 20 extend sideways from least one of connecting portion 24.
For example, in the possible embodiment of the present invention, as shown in Figure 2 a and 2 b, weld part 20 is configured to by even
Multiple legs that three of socket part 24 extend sideways.Exemplarily, between on each side in three sides of connecting portion 24
Every being provided with three legs.In assembling, as shown in Figure 1, being not provided with the connecting portion 24 of the first weldment 12 and the second weldment 14
The side of leg is positioned opposite to each other.
Referring to Fig. 5, the embodiment of the present invention also provides a kind of immersion liquid-cooled suit business device 30, immersion liquid-cooled suit business device 30
Including the blade mainboard 32 and power module 34 being immersed in liquid cryogen, blade mainboard 32 and power module 34 pass through through-flow device
10 are electrically connected, wherein, with reference to Fig. 1 to Fig. 4, through-flow device 10 includes the first weldment 12 being welded on blade mainboard 32 and welding
The second weldment 14 on power module 34 and it is fixedly connected respectively with the first weldment 12 and the second weldment 14 so that the first weldering
The connecting plate 18 that 12 and second weldment 14 of part is electrically connected.
In the embodiment shown in fig. 5, since server 30 is the cold type of immersion liquid, to the material of through-flow device 10
It there are certain requirements, for example, 10 selected materials of through-flow device cannot be chemically reacted with the liquid cryogen in server 30, Yi Mianzao
Into the pollution and the infringement of server 30 of liquid.
When server 30 is run, the power consumption of 32 full load of blade mainboard can reach 2400W, and required electric current is up to 200A,
Therefore through-flow 10 selected materials of device should also possess the through-current capability of 200A, reduce take PCB usable floor areas to greatest extent, be
Other components save more placement spaces, while keep solid and reliable and easily install.
The through-flow device 10 of the embodiment of the present invention has many advantages, such as, such as, through-flow device 10 of the invention is not only suitable for
Immersion liquid-cooled suit business device, and suitable for conventional air-cooled server；The flow through devices 10 of the present invention are suitable for any kind of
Electric current transmission between two boards, and there is stronger through-current capability, such as up to 200A；The through-flow device 10 of the present invention accounts for
PCB space is smaller, and space is saved for part placement；The leg number of the flow through devices 10 of the present invention is moderate, both meets
It is through-flow to require again easily welding so that PCBA factories technique is simpler；In addition, the present invention through-flow device 10 install it is simple and firm
Gu facilitate later maintenance, while its is small, cost is low, has good autgmentability.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention, for the skill of this area
For art personnel, the invention may be variously modified and varied.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
- A kind of 1. through-flow device, it is characterised in that including the first weldment being set up in parallel and the second weldment and respectively with it is described First weldment is fixedly connected with second weldment so that the connecting plate that first weldment and second weldment are electrically connected.
- 2. through-flow device according to claim 1, it is characterised in that on first weldment and second weldment Threaded hole is provided with, the connecting plate is consolidated by the bolt through the threaded hole and first weldment and second weldment Fixed connection.
- 3. through-flow device according to claim 2, it is characterised in that every in first weldment and second weldment A weld part that extension is at an angle of including connecting portion and by the connecting portion, the threaded hole are arranged on the connecting portion.
- 4. through-flow device according to claim 3, it is characterised in that edge-perpendicular of the weld part from the connecting portion Ground extends.
- 5. through-flow device according to claim 4, it is characterised in that the connecting portion has along perpendicular to the threaded hole Axis direction taken in section quadrangular section, the weld part extends sideways from least one of the connecting portion.
- 6. through-flow device according to claim 5, it is characterised in that the weld part is configured to by the three of the connecting portion A multiple legs to extend sideways.
- 7. through-flow device according to claim 6, it is characterised in that every in three sides of the connecting portion Three legs are arranged at intervals with a side.
- 8. through-flow device according to claim 7, it is characterised in that first weldment and second weldment it is described The side that the leg is not provided with connecting portion is positioned opposite to each other.
- 9. through-flow device according to claim 9, it is characterised in that the connecting plate for be covered in first weldment and Rectangular slab on second weldment.
- The device 10. a kind of immersion liquid-cooled suit is engaged in, it is characterised in that including the blade mainboard and power supply mould being immersed in liquid cryogen Block and the through-flow device that the blade mainboard is electrically connected with the power module,Wherein, the through-flow device includes the first weldment being welded on the blade mainboard and is welded on the power module The second weldment and be fixedly connected respectively with first weldment and second weldment so that first weldment and described The connecting plate that second weldment is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711394203.3A CN108037816A (en) | 2017-12-21 | 2017-12-21 | Through-flow device and immersion liquid-cooled suit business device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711394203.3A CN108037816A (en) | 2017-12-21 | 2017-12-21 | Through-flow device and immersion liquid-cooled suit business device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108037816A true CN108037816A (en) | 2018-05-15 |
Family
ID=62100361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711394203.3A Pending CN108037816A (en) | 2017-12-21 | 2017-12-21 | Through-flow device and immersion liquid-cooled suit business device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108037816A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108845658A (en) * | 2018-06-01 | 2018-11-20 | 曙光信息产业(北京)有限公司 | Power supply power supply plate for liquid cooled server |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200994158Y (en) * | 2006-12-14 | 2007-12-19 | 大唐移动通信设备有限公司 | Powersupply allocating device capable of filtering high frequency |
| CN103370785A (en) * | 2010-12-17 | 2013-10-23 | 泰塞拉公司 | Enhanced stacked microelectronic assemblies with central contacts |
| CN204361628U (en) * | 2015-01-07 | 2015-05-27 | 加弘科技咨询(上海)有限公司 | A kind of sheet-metal type busbar electric power-feeding structure |
-
2017
- 2017-12-21 CN CN201711394203.3A patent/CN108037816A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200994158Y (en) * | 2006-12-14 | 2007-12-19 | 大唐移动通信设备有限公司 | Powersupply allocating device capable of filtering high frequency |
| CN103370785A (en) * | 2010-12-17 | 2013-10-23 | 泰塞拉公司 | Enhanced stacked microelectronic assemblies with central contacts |
| CN204361628U (en) * | 2015-01-07 | 2015-05-27 | 加弘科技咨询(上海)有限公司 | A kind of sheet-metal type busbar electric power-feeding structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108845658A (en) * | 2018-06-01 | 2018-11-20 | 曙光信息产业(北京)有限公司 | Power supply power supply plate for liquid cooled server |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20181225 Address after: 610213 846, southern section of Tianfu Avenue, Huayang street, Tianfu New District, Chengdu, Sichuan Applicant after: CHINESE CORPORATION DAWNING INFORMATION INDUSTRY CHENGDU CO., LTD. Applicant after: Dawning Information Industry (Beijing) Co., Ltd. Address before: 100193 No. 36 Building, No. 8 Hospital, Wangxi Road, Haidian District, Beijing Applicant before: Dawning Information Industry (Beijing) Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180515 |
|
| RJ01 | Rejection of invention patent application after publication |