CN108021843A - High sensitivity fingerprint sensor based on BCD techniques - Google Patents

High sensitivity fingerprint sensor based on BCD techniques Download PDF

Info

Publication number
CN108021843A
CN108021843A CN201610927233.5A CN201610927233A CN108021843A CN 108021843 A CN108021843 A CN 108021843A CN 201610927233 A CN201610927233 A CN 201610927233A CN 108021843 A CN108021843 A CN 108021843A
Authority
CN
China
Prior art keywords
circuit
output
voltage pulse
collecting unit
amplifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610927233.5A
Other languages
Chinese (zh)
Inventor
李富民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Fengyu Technology Co ltd
Original Assignee
Shenzhen Ruiwei Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Ruiwei Technology Co Ltd filed Critical Shenzhen Ruiwei Technology Co Ltd
Priority to CN201610927233.5A priority Critical patent/CN108021843A/en
Publication of CN108021843A publication Critical patent/CN108021843A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1306Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing

Abstract

The present invention provides a kind of high sensitivity fingerprint sensor based on BCD techniques, including:Fingerprint collecting unit circuit, high-voltage pulse generation circuit and internal booster circuit.Fingerprint collecting unit circuit, input terminal connection high-voltage pulse signal and digital analog converter, output terminal connection output circuit or rear class receive amplifying circuit;High-voltage pulse generation circuit, output terminal connect the fingerprint collecting unit circuit, are fingerprint collecting unit circuit output high pressure activation signal, for directly or indirectly driving the formation of finger print;Internal booster circuit, output terminal are connected with high-voltage pulse generation circuit, and the low voltage for power supply to be provided is raised to high voltage, and high pressure is inputted to the high-voltage pulse generation circuit.The present invention uses internal booster circuit, and pumping signal of the present invention puts on chip internal by producing inside circuit, therefore while collection finger surface will not be put on cause finger tingling sensation, it can effectively improve the detectivity of sensor.

Description

High sensitivity fingerprint sensor based on BCD techniques
Technical field
The present invention relates to fingerprint identification technology field, is passed more particularly, to a kind of high sensitivity fingerprint based on BCD techniques Sensor.
Background technology
Existing major part fingerprint sensor produces a pumping signal using sensor, and one is installed by sensor periphery A becket and finger to be collected contact the mode of the becket, this pumping signal are applied to finger surface to be collected, with reality Now the principle of finger electrode is driven to realize fingerprint collecting, as shown in Fig. 1 (a).The existing fingerprint using finger excitation principle passes In sensor, in order to avoid groups of people are in fingerprint collecting, finger causes tingling sensation, the pulse excitation voltage max one on finger As be no more than 4V.
In addition, existing operative sensor realizes sensor height using high pressure activation signal driving fingerprint sensor substrate Pumping signal tingling sensation caused by finger surface, such as patent CN103376970A are penetrated and solve, as shown in Fig. 1 (b).By The state being excited by signal is in the substrate of sensor, therefore needs to be DC between the digital signal of sensor output and host computer Isolation processing.So, it is necessary to increase an interface conversion chip between sensor and host computer.Simultaneously as driving sensing The substrate of device needs larger driving force, so, high-voltage signal is boosted by exterior DCDC chips and produced, and passes through interface conversion Substrate high-voltage driven signal is formed after chip copped wave.
In becket incentive program, the power consumption of pumping signal generation circuit is larger.When pumping signal level on becket After 4V, for groups of people during fingerprint collecting, finger surface can experience a degree of shouting pain due to pumping signal Sense.And the pumping signal less than 4V, the detectivity of the great limiting sensor of meeting.Due to needing peripheral metal ring, chip Packaging cost and encapsulation complexity it is generally higher.Becket is the larger conductive electrode of an area, can to its exterior or Person is disturbed by its exterior.Meanwhile the sensor with becket is in an installation, when being bonded with system-level machine casing, The problem of in the presence of installation inconvenience.In bulk driven scheme, DCDC and high voltage interface chip it is system-level can consume it is higher Power consumption, increases the cost of system;Meanwhile system forms complicated, inconvenient debugging.
The content of the invention
The object of the present invention is to provide a kind of high sensitivity fingerprint sensor based on BCD techniques, without external metal ring Excitation, while not using DCDC and high voltage interface chip in applications, improves the collection sensitivity of fingerprint sensor.
To achieve these goals, the high sensitivity fingerprint sensor proposed by the present invention based on BCD techniques, including:Refer to Line collecting unit circuit, high-voltage pulse generation circuit and internal booster circuit.
The fingerprint collecting unit circuit, input terminal connection high-voltage pulse signal VH and digital analog converter DAC, output terminal connect Connect output circuit or rear class receives amplifying circuit;The high-voltage pulse generation circuit, output terminal connect the fingerprint collecting unit Circuit, is fingerprint collecting unit circuit output high pressure activation signal VH, for directly or indirectly driving the formation of finger print.Institute Internal booster circuit is stated, output terminal is connected with high-voltage pulse generation circuit, and the low voltage for power supply to be provided is raised to higher Voltage, to high-voltage pulse generation circuit input high pressure Vout '.
Further, the fingerprint collecting unit circuit also includes the first pole plate and the second pole plate, first pole plate, Fringe field finger capacitance Cf is formed between two pole plates and finger surface.
Further, the fingerprint collecting unit circuit also includes amplifier, reference voltage and feedback capacity;The amplification Device includes normal phase input end, inverting input and output terminal;The reference voltage Vref is produced by front stage circuits, is input to described The normal phase input end of amplifier;One end of the feedback capacity Cfb is connected with the inverting input of the amplifier, the feedback The other end of capacitance is connected with the output terminal of the amplifier;The inverting input of the amplifier is also connected with the second pole plate; The output terminal of the amplifier exports the output signal Vout of the fingerprint collecting unit circuit.
Further, the digital analog converter DAC, produces suitable analog quantity, is coupled to by DC compensation capacitance Cdc The inverting input of the amplifier, for adjusting the direct current biasing of circuit.
Further, the amplifier is low-noise amplifier LNA.
Further, the high-voltage pulse generation circuit includes non-overlapping clock generation circuit, dynamic level carry circuit First, dynamic level carry circuit two, output insulated-gate field-effect crystal N pipes, output insulated-gate field-effect crystal P pipes.
The operation principle of high-voltage pulse generation circuit is:Circuit input signal be low voltage high level V0, low level For 0V, by non-overlapping clock generation circuit and dynamic level generation circuit one, one group of non-overlapping clock is generated, while by pulse High level lifting to V1, the control sequential as output N pipes;By dynamic level carry circuit two, by the high level of pulse V1 liftings are to V2, the control sequential as output P pipes;By controlling the switch of output N pipes and P pipes, output and input signal The output high pressure Vout " that high level with sequential is V2, low level is 0V.The signal is input to the input of fingerprint collecting unit circuit End, is high-voltage pulse signal VH.Described V0, V1 are actually needed by circuit and determined, the size of high level V2 is determined by Vout '.
Further, the internal booster circuit is charge pump.
The beneficial effect of this patent:
1. sensor circuit described in this patent, can save the pumping signal and metal of the generation of prior art fingerprint sensor Ring, avoids finger from directly contacting electric signal.So as to save the power consumption of pumping signal generation circuit;Avoid in fingerprint collecting mistake Cheng Zhong, pumping signal tingling sensation caused by finger surface;Due to eliminating peripheral metal ring, reduce chip package cost and The complexity of installation;Improve the antijamming capability of chip.
2. this patent pumping signal puts on chip internal by being produced inside circuit, therefore driving voltage can reach 20V High pressure above, while will not cause tingling sensation to collection finger, can effectively improve the detectivity of sensor.
3. the implementation of this patent, is ensureing the high sensitivity of original sensor and is not causing the premise of tingling sensation to finger Under, the exterior DCDC chips and interface conversion chip for generating high pressure can be removed, so as to effectively reduce fingerprint collecting module Power consumption, saves the volume and cost of module, while system is simplified, improves the reliability of system.
Brief description of the drawings
Fig. 1 (a) uses the fingerprint collecting unit circuit of finger excitation in the prior art;
Fig. 1 (b) fingerprint sensor bulk driven schemes in the prior art;
Fig. 2 is the fingerprint collecting unit circuit based on fringe field finger capacitance and high-voltage pulse of the embodiment of the present invention;
Fig. 3 is the high-voltage pulse generation circuit of the embodiment of the present invention;
Fig. 4 is the charge pump booster circuit of the embodiment of the present invention.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the accompanying drawings come illustrate the present invention it is excellent Embodiment is selected, this patent is retouched in detail by taking the capacitive fingerprint sensing device formed by capacitance type sensing element arrays as an example State, wherein, capacitance type sensing element arrays include two and more than two fingerprint collecting units.Fig. 2 is the embodiment of the present invention The fingerprint collecting unit circuit based on fringe field finger capacitance and high-voltage pulse.Fig. 3 is the high-tension pulse of the embodiment of the present invention Rush generation circuit.Fig. 4 is the charge pump booster circuit of the embodiment of the present invention.
High sensitivity fingerprint sensor proposed by the present invention based on BCD techniques, including:Fingerprint collecting unit circuit 100, High-voltage pulse generation circuit 200 and internal booster circuit.
Fingerprint collecting unit circuit 100, input terminal connection high-voltage pulse signal VH and digital analog converter 101, output terminal connect Connect output circuit or rear class receives amplifying circuit 102;High-voltage pulse generation circuit 200, output terminal connection fingerprint collecting unit electricity Road 100, exports high-voltage pulse signal VH, for directly or indirectly driving the shape of finger print for fingerprint collecting unit circuit 100 Into.Internal booster circuit, output terminal are connected with high-voltage pulse generation circuit 200, and the low voltage for power supply to be provided is raised to High voltage, high pressure Vout ' is inputted to high-voltage pulse generation circuit 200.
Fingerprint collecting unit circuit 100 is also comprising the first pole plate 103, the second pole plate 104, amplifier 105, reference voltage Vref and feedback capacity Cfb.
Wherein, high-voltage pulse signal VH includes but not limited to 16V, 20V, below by taking high-voltage value 20V as an example.
Wherein, fringe field finger capacitance Cf is formed between the first pole plate 103, the second pole plate 104 and finger surface 106; First pole plate 103 and the top-level metallic that the second pole plate 104 is chip, chip surface dielectric layer material include but not limited to chip list The common vehicle materials such as face passivation layer, PI, molding material, coating materials or ceramic cover plate.
Amplifier 105 includes normal phase input end, inverting input and output terminal;Reference voltage Vref is produced by front stage circuits It is raw, it is input to the normal phase input end of amplifier 105;One end of the feedback capacity Cfb and the inverting input phase of amplifier 105 Even, the other end of the feedback capacity Cfb is connected with the output terminal of amplifier 105, feedback capacity Cfb by the second pole plate 104 and The parasitic capacitance of lower metal is formed, and capacitance size is in the 10fF orders of magnitude;The inverting input of amplifier 105 also with the second pole Plate 104 is connected;The output signal Vout of the output terminal output fingerprint collecting unit circuit 100 of amplifier 105.Put in the present embodiment Big device 105 is low-noise amplifier LNA.
DAC is digital analog converter 101 in Fig. 2, produces suitable analog quantity, is coupled to by DC compensation capacitance Cdc and put The inverting input of big device 105, for adjusting the direct current biasing of circuit.DC compensation capacitance Cdc is by the second pole plate 4 and lower floor The parasitic capacitance of metal is formed, and capacitance size is in the 1fF orders of magnitude.
The output circuit or rear class that Output Circuit circuits are LNA in Fig. 2 receive amplifying circuit 105.In the fingerprint In collecting unit circuit, using the first pole plate 103 of high-voltage pulse driving finger capacitance, pass through amplifier 105 and feedback capacity Cfb, element circuit output terminal is mirrored to by high-voltage pulse signal VH and fringe field finger capacitance Cf.
Fig. 3 is the high-voltage pulse generation circuit of the embodiment of the present invention.High-voltage pulse generation circuit 200 includes non-overlapping clock Generation circuit 201, dynamic level carry circuit 1, dynamic level carry circuit 2 203, output insulated-gate field-effect crystal N Pipe 204, output insulated-gate field-effect crystal P pipes 205.Change Pump circuits are charge pump circuit 206 in Fig. 3.
Assuming that the input signal of circuit is high level 1.8V, the pulse signal of low level 0V, is produced by non-overlapping clock Circuit 201 and dynamic level generation circuit 1, generate one group of non-overlapping clock, while the high level of pulse is lifted to phase To high voltage, such as 3V, in this, as the control sequential of output N pipes 204.By the use of the pulse signal that high level is 3V as defeated Enter signal, by the dynamic level carry circuit 2 203 of 3V to 20V, obtain the pulse signal that high level is 20V, in this, as Export the control sequential of P pipes 205.By controlling the switch of output N pipes 204 and P pipes 205, realize with input signal at the same time The high level of sequence is 20V high pressures, and low level is the output signal of 0V.The signal is input to fingerprint collecting unit circuit 100 and inputs End, is high-voltage pulse signal VH.
In the present embodiment, internal booster circuit is charge pump.Fig. 4 is the charge pump booster circuit of the embodiment of the present invention.Adopt Charge pump capacitor with the non-overlapping clock of two-phase and step by step, after n+1 clock cycle (n is capacitance number), circuit can be with The low voltage that power supply is provided is raised to high voltage Vout ', such as 1.8V input voltages are increased to 20V outputs.The high pressure Vout ' is input to high-voltage pulse generation circuit 200, the high-pressure section power supply as high-voltage pulse generation circuit.
This patent uses BCD techniques, and on piece is produced by internal booster circuit integration realization high pressure, then passes through high-voltage pulse Generation circuit 200, produces a high-voltage pulse.A fringe field capacitance can be formed between two pole plates in array element Cf.Finger surface is nearer from pole plate, and the field effect between two pole plates is weaker, and Cf is smaller, on the contrary then anti-.Using the high-voltage pulse The first pole plate of finger capacitance is driven, by amplifier 105 and Cfb feedback capacities, high-voltage pulse signal and Cf are mirrored to list First circuit output end, element circuit output voltage Vout, according to principle of charge conservation,
Wherein, Vout is the output signal of the fingerprint collecting unit circuit, and VH is the high-voltage pulse signal, and Cf is side Edge electric field finger capacitance, Cfb are feedback capacity.
Know that element circuit output voltage Vout and Cf is positively correlated from formula (1), illustrate the corresponding Vout of fingerprint ridge Small, the corresponding Vout of fingerprint valley is big.After obtaining the Vout of circuit output, changed by the amplification of late-class circuit and ADC, circuit Finger print information may finally be converted into fixed bit digital output.
The detailed description and the accompanying drawings of the embodiment of the present invention are only intended to the explanation present invention, rather than limitation by claim and The scope of the present invention that its equivalent defines.

Claims (10)

  1. A kind of 1. high sensitivity fingerprint sensor based on BCD techniques, it is characterised in that including:Fingerprint collecting unit circuit, height Press pulse-generating circuit and internal booster circuit;
    The fingerprint collecting unit circuit, input terminal connection high-voltage pulse signal VH and digital analog converter DAC, output terminal connection are defeated Go out circuit or rear class receives amplifying circuit;
    The high-voltage pulse generation circuit, output terminal connect the fingerprint collecting unit circuit, are that fingerprint collecting unit circuit is defeated Go out high pressure activation signal VH, for directly or indirectly driving the formation of finger print;
    The internal booster circuit, output terminal is connected with high-voltage pulse generation circuit, for the low voltage liter for providing power supply To high voltage, to high-voltage pulse generation circuit input high pressure Vout '.
  2. 2. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 1, it is characterised in that the fingerprint is adopted Collection element circuit also includes the first pole plate and the second pole plate, and side is formed between first pole plate, the second pole plate and finger surface Edge electric field finger capacitance Cf.
  3. 3. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 2, it is characterised in that first pole Plate and the top-level metallic that the second pole plate is chip;Chip surface dielectric layer is made of common vehicle material.
  4. 4. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 2, it is characterised in that the fingerprint is adopted Collection element circuit also includes amplifier, reference voltage and feedback capacity;
    The amplifier includes normal phase input end, inverting input and output terminal;
    The reference voltage Vref is produced by front stage circuits, is input to the normal phase input end of the amplifier;
    One end of the feedback capacity Cfb is connected with the inverting input of the amplifier, the other end of the feedback capacity with The output terminal of the amplifier is connected;The feedback capacity Cfb, is made of the parasitic capacitance of the second pole plate and lower metal.
  5. 5. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 4, it is characterised in that the digital-to-analogue turns Parallel operation DAC, produces suitable analog quantity, and the inverting input of the amplifier is coupled to by DC compensation capacitance Cdc, is used for Adjust the direct current biasing of circuit;The DC compensation capacitance Cdc, is made of the parasitic capacitance of the second pole plate and lower metal.
  6. 6. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 4, it is characterised in that the amplifier Inverting input be also connected with the second pole plate.
  7. 7. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 4, it is characterised in that the amplifier Output terminal export the output signal Vout of the fingerprint collecting unit circuit, output signal is:
    <mrow> <mi>V</mi> <mi>o</mi> <mi>u</mi> <mi>t</mi> <mo>=</mo> <mi>V</mi> <mi>H</mi> <mo>&amp;times;</mo> <mfrac> <mrow> <mi>C</mi> <mi>f</mi> </mrow> <mrow> <mi>C</mi> <mi>f</mi> <mi>b</mi> </mrow> </mfrac> </mrow>
    Wherein, Vout is the output signal of the fingerprint collecting unit circuit, and VH is the high-voltage pulse signal, and Cf is edge electricity Field finger capacitance, Cfb is feedback capacity.
  8. 8. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 4, it is characterised in that the amplifier For low-noise amplifier LNA.
  9. 9. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 1, it is characterised in that the high-tension pulse Rushing generation circuit includes non-overlapping clock generation circuit, dynamic level carry circuit one, dynamic level carry circuit two, output absolutely Edge gate field-effect crystal N pipes, output insulated-gate field-effect crystal P pipes;
    The operation principle of high-voltage pulse generation circuit is:Circuit input signal is high level V0, the low level 0V of low voltage, By non-overlapping clock generation circuit and dynamic level generation circuit one, one group of non-overlapping clock is generated, while by the height of pulse Level boost is to V1, the control sequential as output N pipes;By dynamic level carry circuit two, the high level V1 of pulse is carried V2 is raised to, the control sequential as output P pipes;By controlling the switch of output N pipes and P pipes, output and input signal are at the same time The output high pressure Vout " that the high level of sequence is V2, low level is 0V;Described V0, V1 are actually needed by circuit and determined, high level V2 Size by Vout ' determine.
  10. 10. the high sensitivity fingerprint sensor based on BCD techniques as claimed in claim 1, it is characterised in that the internal liter Volt circuit is charge pump.
CN201610927233.5A 2016-10-31 2016-10-31 High sensitivity fingerprint sensor based on BCD techniques Pending CN108021843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610927233.5A CN108021843A (en) 2016-10-31 2016-10-31 High sensitivity fingerprint sensor based on BCD techniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610927233.5A CN108021843A (en) 2016-10-31 2016-10-31 High sensitivity fingerprint sensor based on BCD techniques

Publications (1)

Publication Number Publication Date
CN108021843A true CN108021843A (en) 2018-05-11

Family

ID=62070457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610927233.5A Pending CN108021843A (en) 2016-10-31 2016-10-31 High sensitivity fingerprint sensor based on BCD techniques

Country Status (1)

Country Link
CN (1) CN108021843A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111353406A (en) * 2020-02-24 2020-06-30 成都世纪天知科技有限公司 Fingerprint sensor acquisition unit without excitation signal and BOOST chip
WO2020232632A1 (en) * 2019-05-21 2020-11-26 Boe Technology Group Co., Ltd. A sensor circuit for generating and detecting ultrasonic sensing signal, an ultrasonic sensing display apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237852A (en) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd Radio transmission circuit and radio transmitter
US20070092117A1 (en) * 2005-10-24 2007-04-26 Baohua Qi Fingerprint Sensing device using pulse processing
WO2015139447A1 (en) * 2014-03-20 2015-09-24 深圳市汇顶科技股份有限公司 Capacitive fingerprint sensing circuit and sensor
CN105117684A (en) * 2015-07-27 2015-12-02 深圳市汇顶科技股份有限公司 Fingerprint detection circuit and fingerprint recognition system
CN105378755A (en) * 2013-07-09 2016-03-02 指纹卡有限公司 Fingerprint sensing system and method
US20160180619A1 (en) * 2014-12-22 2016-06-23 Fingerprint Cards Ab Capacitive fingerprint sensing device with demodulation circuitry in sensing element

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237852A (en) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd Radio transmission circuit and radio transmitter
US20070092117A1 (en) * 2005-10-24 2007-04-26 Baohua Qi Fingerprint Sensing device using pulse processing
CN105378755A (en) * 2013-07-09 2016-03-02 指纹卡有限公司 Fingerprint sensing system and method
WO2015139447A1 (en) * 2014-03-20 2015-09-24 深圳市汇顶科技股份有限公司 Capacitive fingerprint sensing circuit and sensor
US20160180619A1 (en) * 2014-12-22 2016-06-23 Fingerprint Cards Ab Capacitive fingerprint sensing device with demodulation circuitry in sensing element
CN105117684A (en) * 2015-07-27 2015-12-02 深圳市汇顶科技股份有限公司 Fingerprint detection circuit and fingerprint recognition system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈祝明等: "《MOS 集成电路工艺与制造 技术》", 电子科技大学 出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020232632A1 (en) * 2019-05-21 2020-11-26 Boe Technology Group Co., Ltd. A sensor circuit for generating and detecting ultrasonic sensing signal, an ultrasonic sensing display apparatus
CN111353406A (en) * 2020-02-24 2020-06-30 成都世纪天知科技有限公司 Fingerprint sensor acquisition unit without excitation signal and BOOST chip

Similar Documents

Publication Publication Date Title
US9880675B2 (en) Capacitive sensing array modulation
US20190266375A1 (en) Capacitive Sensing Array Having Electrical Isolation
US20060114241A1 (en) Identification method for touch control device
CN110110691B (en) Fingerprint identification driving circuit, fingerprint identification driving device, touch screen and driving method
CN102751868B (en) Voltage converter
WO2018201460A1 (en) Capacitive touch control apparatus, capacitive screen, and touch control method for capacitive screen
CN107102761A (en) Touching control panel controller and semiconductor devices
CN103810479A (en) Fingerprint collection system and fingerprint information collection method
US20160054853A1 (en) System and method for 3d position and gesture sensing of human hand
CN103902971A (en) Fingerprint detection circuit and fingerprint detection device
WO2018090366A1 (en) Fingerprint sensor and electronic terminal
EP3239894B1 (en) Fingerprint detection circuit and fingerprint recognition system
US10921158B2 (en) Power supply generating circuit, capacitive array sensing apparatus and terminal device
TWI793750B (en) Capacitive fingerprint sensing device
CN108021843A (en) High sensitivity fingerprint sensor based on BCD techniques
WO2020186606A1 (en) Fingerprint recognition architecture and touch control panel
CN206388202U (en) A kind of fingerprint sensor of the high-penetration ability based on BCD techniques
CN206388195U (en) A kind of high sensitivity fingerprint sensor based on BCD techniques
CN107918749A (en) The fingerprint sensor of high-penetration ability based on BCD techniques
US7795957B1 (en) Power supply circuit for south bridge chip
CN114487784A (en) Capacitance detection circuit, touch chip and electronic equipment
TWI737216B (en) Self-capacitance detection circuit and information processing device with the capacitance detection circuit
EP3493096B1 (en) Fingerprint sensor and terminal device
TW202136975A (en) Touch detection drive circuit and touch display using the same capable of reducing output drive load of the amplifier and making sure of the linear operation of the amplifier
CN103051166A (en) Soft start circuit for switching power supply

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20200511

Address after: 518000 No.103, No.3, Fuyong first industrial village, Zhengcheng 1st Road, Xintian community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province

Applicant after: Shenzhen Fengyu Technology Co.,Ltd.

Address before: 518101 Guangdong city of Shenzhen province Baoan District Fuyong street Xintian Road No. 71-6 Funing High-tech Industrial Park building F F301

Applicant before: SHENZHEN ZHIRUIWEI TECHNOLOGY Co.,Ltd.

TA01 Transfer of patent application right
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180511

WD01 Invention patent application deemed withdrawn after publication