CN108012002A - The manufacture method of center component, electronic equipment and center component - Google Patents
The manufacture method of center component, electronic equipment and center component Download PDFInfo
- Publication number
- CN108012002A CN108012002A CN201711251660.7A CN201711251660A CN108012002A CN 108012002 A CN108012002 A CN 108012002A CN 201711251660 A CN201711251660 A CN 201711251660A CN 108012002 A CN108012002 A CN 108012002A
- Authority
- CN
- China
- Prior art keywords
- main part
- electromagnetic radiation
- center component
- radiation portion
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
- H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The center component that the embodiment of the present invention is provided, the manufacture method of electronic equipment and center component, the middle component plays a supportive role the element of the electronic equipment internal, the center component includes main part, electromagnetic radiation portion and connecting portion, institute's connecting portion is connected between the main part and electromagnetic radiation portion, the match circuit for the circuit board that electromagnetic radiation portion passes through electronic equipment is electrically connected to distributing point to launch and receive signal, realize at the same time to supporting role and signal transmitting and receiving effect, improve the compactedness for the electronic component that the electronic equipment internal provided using the embodiment of the present invention is set.
Description
Technical field
The present invention relates to technical field of electronic equipment, and in particular to a kind of center component, electronic equipment and center component
Manufacture method.
Background technology
With the development of the communication technology, people are moved using mobile phone, tablet computer etc. more and more widely in daily life
Dynamic electronic equipment.The communication function of especially electronic equipment is most frequently used.With the trend of electronic equipment slimization, to electricity
The compactedness of the electronic component set inside sub- equipment requires also higher and higher.
Antenna is the Main electronic parts for the communication function for realizing electronic equipment, and indispensable electronic component it
One, still, in the prior art, antenna is an independent electronic component, it is necessary to occupy certain accommodation space, is caused existing
In technology electronic equipment internal set electronic component compactedness it is poor, therefore, how to improve electronic equipment internal set electricity
The compactedness of subcomponent is a technical problem to be solved urgently.
The content of the invention
The embodiment of the present invention provides the manufacture method of a kind of center component, electronic equipment and center component, to improve electronics
The compactedness of the electronic component set inside equipment.
A kind of center component, including：
Main part, the main part are a slab construction；
Electromagnetic radiation portion, the electromagnetic radiation portion are arranged at around the main part；
Connecting portion, the connecting portion are arranged between the main part and electromagnetic radiation portion with the fixation main part and electricity
Magnetic radiation portion.
A kind of electronic equipment, including：
Display screen；
Center component, the center component include：
Main part, the main part are a slab construction；
Electromagnetic radiation portion, the electromagnetic radiation portion are arranged at around the main part；And
Connecting portion, the connecting portion are arranged between the main part and electromagnetic radiation portion with described in fixation
Main part and electromagnetic radiation portion；And
Circuit board, the center component are arranged between the display screen and the circuit board, are set on the circuit board
There are distributing point and match circuit, the electromagnetic radiation portion is electrically connected the distributing point by match circuit.
A kind of manufacture method of center component, the center component are used to support the display screen of electronic equipment, including：
A substrate is provided, the substrate is a slab construction；
Patterned process is carried out to the substrate, forms a frame structure, the frame structure includes main part, electromagnetism spoke
Portion and cradle portion are penetrated, the first gap is formed between the main part and electromagnetic radiation portion, the cradle portion fixes the main body
Portion and electromagnetic radiation portion, the support portions are outside the first gap；
Connecting portion is set to be fixedly connected with the main part and electromagnetic radiation portion at least in first gap；And
The cradle portion is at least removed, forms center component.
The manufacture method of center component, electronic equipment and center component that the embodiment of the present invention is provided, the middle component
Playing a supportive role to the element of the electronic equipment internal, the center component includes main part, electromagnetic radiation portion and connecting portion,
Institute's connecting portion is connected between the main part and electromagnetic radiation portion, the matching for the circuit board that electromagnetic radiation portion passes through electronic equipment
Circuit is electrically connected to distributing point to launch and receive signal, while realizes to supporting role and signal transmitting and receiving effect, improves
The compactedness for the electronic component that the electronic equipment internal provided using the embodiment of the present invention is set.
Brief description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
A kind of structural perspective for the electronic equipment that Fig. 1 is provided by the embodiment of the present invention.
A kind of side view for the electronic equipment that Fig. 2 is provided by the embodiment of the present invention.
The structure diagram for the center component that Fig. 3 is provided by the embodiment of the present invention.
Fig. 4 is sectional view of the first embodiment of the center component shown in Fig. 3 along line A-A.
Fig. 5 is sectional view of second of the embodiment of the center component shown in Fig. 3 along line A-A.
Fig. 6 is the C portions enlarged drawing of the center component shown in Fig. 5.
A kind of structure diagram that the center component and circuit board that Fig. 7 is provided by the embodiment of the present invention combine.
The first flow chart of the manufacture method for the center component that Fig. 8 is provided by the embodiment of the present invention..
The structure diagram of the substrate of the manufacture method for the center component that Fig. 9 is provided by the embodiment of the present invention.
The structure diagram of the frame structure of the manufacture method for the center component that Figure 10 is provided by the embodiment of the present invention.
Second of flow chart of the manufacture method for the center component that Figure 11 is provided by the embodiment of the present invention.
The structure diagram of the mould of the manufacture method for the center component that Figure 12 is provided by the embodiment of the present invention.
Frame structure is placed in mould by Figure 13 by the manufacture method of center component that the embodiment of the present invention provides
Structure diagram.
Figure 14 is combined by the frame structure of the manufacture method for the center component that the embodiment of the present invention provides with injected plastics material
Structure diagram.
Figure 15 is sectional view of the structure that is combined with injected plastics material of Figure 14 middle frame structures along line B-B.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, the every other implementation that those skilled in the art are obtained without creative efforts
Example, belongs to the scope of protection of the invention.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Description is of the invention to be described with simplified, rather than the device or element of instruction or hint meaning must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the present invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；It can be directly connected, can also be by between intermediary
Connect connected, can be the interaction relationship of connection inside two elements or two elements.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component and setting of specific examples are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, the present invention provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the embodiment of the present application provides a kind of electronic equipment 100.
The electronic equipment 100 includes a front housing 101 and a rear shell 102.The front housing 101 can include cover sheet
21st, display screen 22 etc..The front housing 101 and rear shell 102 are enclosed jointly is set as a receiving space to house other constituent element, example
Such as, center component 23, circuit board 24 and battery 25 etc..
In certain embodiments, the front housing 101 and the rear shell 102 can be metal shell.It should be noted that this
Front housing 101 and the material of the rear shell 102 are not limited to this described in application embodiment, can also use other manner, such as：Institute
Plastic portions and metal part can be included by stating front housing 101 and the rear shell 102.For another example：The front housing 101 and the rear shell
102 can be plastic casing.
The cover sheet 21 can be glass cover-plate, sapphire cover board, plastic cover plate etc., there is provided to the display screen 22
Protective effect, to prevent dust, aqueous vapor or oil stain etc. to be attached to the display screen 22, avoid external environment to display screen 22
Corrosion, while external environment is prevented to the impact force of display screen 22, avoid the broken of display screen 22.
The cover sheet 21 can include viewing area 221 and non-display area 222.The viewing area 221 is transparent, with right
Answer the light-emitting surface of display screen 22.The non-display area 222 is nontransparent, to cover the internal structure of electronic equipment.It is described non-aobvious
Show that area 222 can open up perforate 2221 and touch controlled key 2222 for sound and light conduction etc..
It should be noted that the electronic equipment 100 of the embodiment of the present invention can also shield design comprehensively, it is non-display without retaining
Area.
Referring to Fig. 2, the electronic equipment 100 can be provided with earpiece holes 105, microphone aperture 106 in its periphery, raise one's voice
Device hole 108, Universal Serial Bus Interface hole 107.The earpiece holes 105, microphone aperture 106, speaker hole 108, general serial are total
Line interface hole 107 is through hole.
The center component 23 is arranged in the receiving space, is played a supportive role to whole electronic equipment 100.In one kind
In embodiment, the side of the center component 23 is towards the front housing 101, and for setting the display screen 22, opposite side is set
Put towards the rear shell 102, for setting the circuit board 24 and the battery 25.
Also referring to Fig. 3 and 4, the center component 23 includes main part 2311, electromagnetic radiation portion 2312 and connecting portion
233。
The main part 23 is a slab construction.The electromagnetic radiation portion 2312 is arranged at the week of the main part 2311
Enclose.The connecting portion 233 is arranged between the main part 2311 and electromagnetic radiation portion 2312 with the fixation main part 2311
With electromagnetic radiation portion 2312.
The electromagnetic radiation portion 2312 is installed on the inside of the electronic equipment 100.The electromagnetic radiation portion 2312 is used for
To external emission wireless signal, or receive the wireless signal of other electronic equipments transmission.The electromagnetic radiation portion 2312 is for example
Can be radio-frequency antenna, Bluetooth antenna, Wireless Fidelity (WiFi) antenna etc..The electromagnetic radiation portion 2312 is in the display screen 22
Stagger setting strengthens signal quality to reduce electromagnetic interference.
There is the first gap 232 between the main part 2311 and electromagnetic radiation portion 2312, the connecting portion 233 is set
Within first gap 232.
In one embodiment, the main part 2311 and electromagnetic radiation portion 2312 can be integrally formed.The main part
2311 and electromagnetic radiation portion 2312 can use magnesium alloy.The connecting portion 233 uses nonmetallic materials.
Please refer to fig. 5, in one embodiment, in the main part 111 and electromagnetic radiation portion 2312 towards described
The side in the first gap 232 forms some first engaging portions 237.The connecting portion 233 is towards the main part 2311 and electromagnetism
The side of irradiation unit 2312 is provided with the second engaging portion 238.First engaging portion, 237 and second engaging portion 238 cooperates,
To strengthen the bond strength between the main part 2311 and electromagnetic radiation portion 2312.
In one embodiment, first engaging portion 237 is 2312 direction of the main part 2311 and electromagnetic radiation portion
The protrusion that the side in first gap 232 is formed, second engaging portion 238 are the connecting portion 233 towards described first
The depression that the side in gap 232 is formed.
Also referring to Fig. 6, in one embodiment, first engaging portion 237 is T-shape structure.First knot
Conjunction portion 237 has first end 2371 and second end 2372, and the first end 2371 connects the main part 2311 or electromagnetic radiation
Portion 2312, the second end 2372 are more than first end 2371 towards first gap 232, the width D 2 of the second end 2372
Width D 1.
When forming the connecting portion 233, the first end 2371 and second end 2372 of first engaging portion 237 are embedded in
In second engaging portion 238 of the connecting portion 233, the main part 2311 and electromagnetic radiation portion 2312 and the connection are added
Bond strength between portion 233, improves stability.
The thickness of the connecting portion 233 is less than or equal to the thickness of the main part 2311.
The second gap 236 is also formed between the electromagnetic radiation portion 2312, the connecting portion 233 is also provided at described
Within two gaps 236.
The circuit board 24 is installed in the electronic equipment 100, and the circuit board 24 can be the master of electronic equipment 100
Plate.Motor, microphone 62, loudspeaker 64, earphone interface 61, Universal Serial Bus Interface can be integrated with the circuit board 24
63rd, one, two in the functional unit such as camera, range sensor, ambient light sensor, receiver and processor 60 or
It is multiple.The circuit board 24 can be integrated with microphone 62, loudspeaker 64, earphone interface 61, Universal Serial Bus Interface 63.Ear
Machine interface 61 is arranged at 105 position of earpiece holes, and microphone 62 is arranged at 106 position of microphone aperture, Universal Serial Bus Interface 63
107 position of Universal Serial Bus Interface hole is arranged at, loudspeaker 64 is arranged at 108 position of speaker hole.
In certain embodiments, the circuit board 24 is fixed in electronic equipment 100.Specifically, the circuit board 24 can
To be screwed to by screw on the center component 23, card can also be fitted on by the way of buckle on the center component 23.
It should be noted that the mode that circuit board 24 described in the embodiment of the present application is specifically fixed on center component 23 is not limited to this,
Can be with other manner, such as by way of being buckled and screw fixes jointly.
Referring to Fig. 7, distributing point 241 and match circuit 242 are provided with the circuit board 24, the electromagnetic radiation portion
2312 are electrically connected the distributing point 241 by match circuit 242.
The battery 25 be installed on electronic equipment 100 in, the battery 25 is electrically connected with the circuit board 24, with to
The electronic equipment 100 provides power supply.The rear cover 102 can be as the battery cover of the battery 25.The rear cover 102 covers
The battery 25 is to protect the battery 25, and particularly the rear cover 102 covers the battery 25 to protect the battery 25,
Reduce collision, the damage falling etc. and be subject to of the battery 25 due to the electronic equipment 100.
Referring to Fig. 8, the embodiment of the present application provides a kind of manufacture method of center component 23.The described method includes：
Step S1：Also referring to Fig. 9, there is provided a substrate 230, the substrate 230 are a slab construction.
In one embodiment, the substrate 230 uses metal material.
Step S2：Also referring to Figure 10, patterned process is carried out to the substrate 230, forms a frame structure 231,
The frame structure 231 includes main part 2311, electromagnetic radiation portion 2312 and cradle portion 2313, in the main part 2311 and electricity
The first gap 232 is formed between magnetic radiation portion 2312, the cradle portion 2313 fixes the main part 2311 and electromagnetic radiation portion
2312, the cradle portion 2313 is located at outside the first gap 232.
In certain embodiments, patterned process can be carried out to the substrate 230 by the way of punching press, described in formation
Frame structure 231.In certain embodiments, patterned process, shape can also be carried out to the substrate 230 by the way of etching
Into the frame structure 231.In other embodiments, numerically-controlled machine tool (CNC) can also be used to carry out pattern to the substrate 230
Change is handled, and forms the frame structure 231.
Step S3：Also referring to Figure 11-15, connecting portion 233 is at least set to connect with fixed in first gap 232
Meet the main part 2311 and electromagnetic radiation portion 2312.
In certain embodiments, the step S3 can include：
Step S31：Please refer to Fig.1 2, there is provided a mould 234, the mould 234 include a resettlement section 2341.
Step S32：3 are please referred to Fig.1, the frame structure 231 is placed in the resettlement section 2341 of the mould 234.
Step S33：Filling liquid injected plastics material 235 is in the resettlement section 2341.
Step S34：4 are please referred to Fig.1, cures the injected plastics material 235, removes mould 234.
Step S35：5 are please referred to Fig.1, the injected plastics material 235 is rebuild so that the thickness of the injected plastics material 235
H1 is less than or equal to the thickness H2 of the frame structure 231.
In one embodiment, the injected plastics material 235 uses thermoset material or photo-curing type.When the injection
When material 235 is thermoset material, the liquid injection molding material 235 can be cured by the way of baking.Work as injection
When material 235 is photo-curing type, it can be cured using liquid injection molding material 235 described in ultraviolet light.
In one embodiment, when being rebuild the thickness H1 so that the injected plastics material 235 to the injected plastics material 235
Equal to the frame structure 231 thickness H2 when, the surface that can improve the center component 23 manufactured by the embodiment of the present application is put down
Whole degree.In one embodiment, when being rebuild to the injected plastics material 235 so that the thickness H1 of the injected plastics material 235 is small
When the thickness H2 of the frame structure 231, the main part 2311 and electricity can be fixedly connected with the guarantee connecting portion 233
On the premise of magnetic radiation portion 2312, it is possible to reduce the weight of the center component 23 manufactured by the embodiment of the present application, so as to adapt to work as
Preceding electronic equipment gently with thin development trend.
Step S4：The cradle portion 2313 is at least removed, forms center component 23.
The manufacture method of center component, electronic equipment and center component that the embodiment of the present invention is provided, the middle component
Playing a supportive role to the element of the electronic equipment internal, the center component includes main part, electromagnetic radiation portion and connecting portion,
Institute's connecting portion is connected between the main part and electromagnetic radiation portion, the matching for the circuit board that electromagnetic radiation portion passes through electronic equipment
Circuit is electrically connected to distributing point to launch and receive signal, while realizes to supporting role and signal transmitting and receiving effect, improves
The compactedness for the electronic component that the electronic equipment internal provided using the embodiment of the present invention is set.
The manufacture method of center component provided in an embodiment of the present invention, electronic equipment and center component has been carried out in detail above
Thin to introduce, specific case used herein is set forth the principle of the present invention and embodiment, and above example is said
It is bright to be only intended to help and understand the present invention.Meanwhile for those skilled in the art, according to the thought of the present invention, specific real
There will be changes in mode and application range are applied, in conclusion this specification content should not be construed as the limit to the present invention
System.
Claims (12)
1. a kind of center component, including：
Main part, the main part are a slab construction；
Electromagnetic radiation portion, the electromagnetic radiation portion are arranged at around the main part；And
Connecting portion, the connecting portion are arranged between the main part and electromagnetic radiation portion with the fixation main part and electromagnetism spoke
Penetrate portion.
2. center component as claimed in claim 1, it is characterised in that：Have the between the main part and electromagnetic radiation portion
One gap, the connecting portion are arranged within first gap.
3. center component as claimed in claim 2, it is characterised in that：In the main part and electromagnetic radiation portion towards described
The side in one gap forms some first engaging portions, and the connecting portion is set towards the side in the main part and electromagnetic radiation portion
There is the second engaging portion, first engaging portion and the second engaging portion cooperate.
4. center component as claimed in claim 3, it is characterised in that：First engaging portion is the main part and electromagnetism spoke
The protrusion that the side in portion towards first gap is formed is penetrated, second engaging portion is the connecting portion towards between described first
The depression that the side of gap is formed.
5. center component as claimed in claim 4, it is characterised in that：First engaging portion has a first end and a second end,
The first end connects the main part or electromagnetic radiation portion, the second end towards first gap, the second end
Width is more than the width of first end.
6. center component as claimed in claim 1, it is characterised in that：The thickness of the connecting portion is less than or equal to the main part
Thickness.
7. center component as claimed in claim 6, it is characterised in that：There is the second gap between the electromagnetic radiation portion,
The connecting portion is also provided within second gap.
8. center component as claimed in claim 1, it is characterised in that：The connecting portion is nonmetallic.
9. center component as claimed in claim 1, it is characterised in that：The main part and the electromagnetic radiation portion one into
Type.
10. center component as claimed in claim 1, it is characterised in that：The main part and the electromagnetic radiation portion are magnesium
Alloy.
11. a kind of electronic equipment, it is characterised in that including：
Display screen；
Such as claim 1-10 any one of them center components；And
Circuit board, the center component are arranged between the display screen and the circuit board, and feedback is provided with the circuit board
Electricity point and match circuit, the electromagnetic radiation portion are electrically connected the distributing point by match circuit.
12. a kind of manufacture method of center component, the center component are used to support the display screen of electronic equipment, including：
A substrate is provided, the substrate is a slab construction；
Patterned process is carried out to the substrate, forms a frame structure, the frame structure includes main part, electromagnetic radiation portion
And cradle portion, form the first gap between the main part and electromagnetic radiation portion, the cradle portion fix the main part and
Electromagnetic radiation portion, the support portions are outside the first gap；
Connecting portion is set to be fixedly connected with the main part and electromagnetic radiation portion at least in first gap；And
The cradle portion is at least removed, forms center component.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711251660.7A CN108012002A (en) | 2017-12-01 | 2017-12-01 | The manufacture method of center component, electronic equipment and center component |
| PCT/CN2018/117164 WO2019105294A1 (en) | 2017-12-01 | 2018-11-23 | Middle frame member, electronic device and manufacturing method for middle frame member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711251660.7A CN108012002A (en) | 2017-12-01 | 2017-12-01 | The manufacture method of center component, electronic equipment and center component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012002A true CN108012002A (en) | 2018-05-08 |
Family
ID=62056333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711251660.7A Pending CN108012002A (en) | 2017-12-01 | 2017-12-01 | The manufacture method of center component, electronic equipment and center component |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108012002A (en) |
| WO (1) | WO2019105294A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019105294A1 (en) * | 2017-12-01 | 2019-06-06 | Oppo广东移动通信有限公司 | Middle frame member, electronic device and manufacturing method for middle frame member |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012002A (en) * | 2017-12-01 | 2018-05-08 | 广东欧珀移动通信有限公司 | The manufacture method of center component, electronic equipment and center component |
-
2017
- 2017-12-01 CN CN201711251660.7A patent/CN108012002A/en active Pending
-
2018
- 2018-11-23 WO PCT/CN2018/117164 patent/WO2019105294A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204168352U (en) * | 2014-10-28 | 2015-02-18 | 广东欧珀移动通信有限公司 | Metallic mobile phone housing and mobile phone |
| CN205846212U (en) * | 2016-07-01 | 2016-12-28 | 瑞声科技(新加坡)有限公司 | Whole frequency band antenna structure of mobile phole |
| CN206181107U (en) * | 2016-08-26 | 2017-05-17 | 博罗县东明化工有限公司 | Cell -phone center and cell -phone |
| CN107293847A (en) * | 2017-07-31 | 2017-10-24 | 广东欧珀移动通信有限公司 | Center, antenna module and electronic equipment |
| CN107394354A (en) * | 2017-08-07 | 2017-11-24 | 广东欧珀移动通信有限公司 | Backboard, fore shell and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019105294A1 (en) * | 2017-12-01 | 2019-06-06 | Oppo广东移动通信有限公司 | Middle frame member, electronic device and manufacturing method for middle frame member |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019105294A1 (en) | 2019-06-06 |
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