CN108007258A - The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method - Google Patents
The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method Download PDFInfo
- Publication number
- CN108007258A CN108007258A CN201710970687.5A CN201710970687A CN108007258A CN 108007258 A CN108007258 A CN 108007258A CN 201710970687 A CN201710970687 A CN 201710970687A CN 108007258 A CN108007258 A CN 108007258A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat transfer
- metal
- micro
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/17—Mechanical parametric or variational design
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computational Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Analysis (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Heat transfer and forming method the present invention provides a kind of metal-containing polymer combined type micro-structure heat exchanger, belong to micro-structure technical field of heat exchangers.It solves the problems such as heat exchange efficiency reduction in the prior art.The heat transfer of this metal-containing polymer combined type micro-structure heat exchanger and forming method, comprise the following steps：A, the composition of entire thermal resistance and calculating；B, heat conduction and radiated energy transmission balance；C, flowing and heat transfer conditions impact analysis；E, processing and forming；F, heat transfer performance is tested.The present invention with the structure composite of high heat conduction and high heat-sink unit to meet high efficient heat exchanging demand the advantages of.
Description
Technical field
The invention belongs to micro-structure technical field of heat exchangers, is related to a kind of metal-containing polymer combined type micro-structure heat exchanger
Heat transfer and forming method.
Background technology
With the development of MEMS (MEMS) and very small chemical mechanical system, in multi-functional, complication system operation
Produce heat to greatly increase, thermal environment is more and more harsher, and traditional heat-exchanger rig has been unable to meet efficient, stable heat exchange, processing
The low basic demand of cost.Metal micro structure heat exchanger, modified composition polymer heat exchanger etc. improve biography to a certain extent
The thermal efficiency, but not yet extensive use so far, it is that difficulty of processing is big to trace it to its cause, and heat exchange efficiency is low, high processing costs.Cause
This, there is an urgent need to propose the novel heat exchanger structure of a kind of high-performance, low cost, easy processing, in research heat conduction and radiation processes
Heat balance mechanism and its processing technology, meet high efficient heat exchanging demand.
Quzhou City is the important chemical industry base in China, possesses many larger chemical enterprises, industry size with
Developing water averagely occupies the leading place in the whole country.With the continuous improvement of properties of product requirement and increasingly fierce, the energy, the heat of market competition
The problems such as have attracted increasing attention, while exchange the requirements such as the corrosion resistance, workability, heat transfer efficient of thermal
It is higher and higher.
The fluorine silicon industry development of Quzhou area is swift and violent, and fluoroplastics have stable chemical performance, and corrosion resistance is strong；Surface is smooth
Dirt is not adsorbed, anti-pollution plug performance is good；Various special present situations are can be made into, are easily installed and adapt to changing for various special statuss
Hot device；Compared with valuable anticorrosion alloy material, cost is low, safeguards that installation is easy.But fluoroplastics mechanical performance and heat conductivility are poor,
Its thermal conductivity factor and strength character can be improved by adding graphite, improve its structure design, can better services
In special operating mode.Therefore the novel heat exchanger structure with high efficient heat exchanging performance is developed using fluoroplastics, so as to improve
The core competitiveness and the capability of sustainable development of enterprise, are that new work is injected in the chemical industry of Quzhou City and the development of fluorine silicon industry
Power.
At present, mainly explored from two approach to improving heat exchanger performance, when modified material, first, structure is excellent
Change.Common heat exchanger materials mainly due to the metal materials such as the of a relatively high aluminium of thermal conductivity factor, copper are made, but from processing and material
Expect that characteristic angle considers, metallic recuperator have processing charges is relatively expensive, the process-cycle is relatively long, processing efficiency relatively
The shortcomings of low, and metal quality is relatively large.Researcher is attempted using polymer as heat exchanger materials, its with it is easily molded,
Resistance to oxidation, it is corrosion-resistant, conductivity is low the features such as, but since thermal conductivity factor is low so that heat exchange efficiency reduces several orders of magnitude.
The content of the invention
The purpose of the present invention is for existing technology, there are the above problem, it is proposed that a kind of metal-containing polymer is compound to decline
The heat transfer of structure heat exchanger and forming method, the heat transfer of this metal-containing polymer combined type micro-structure heat exchanger and forming method are with height
The characteristics of structure composite of heat conduction and high heat-sink unit is to meet high efficient heat exchanging demand.
The purpose of the present invention can be realized by following technical proposal：
A kind of heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method, it is characterised in that including following
Step：
A, the composition of entire thermal resistance and calculating：The thermal resistance that interface is closed on metal substrate, polymer fin and boundary is respectively Rmetal、
RpolyAnd Rinter, close interface for metal substrate, polymer fin and its boundary and carry out series coupled, provide the calculating mould of entire thermal resistance
The primary condition of type and governing equation, boundary condition；
B, heat conduction and radiated energy transmission balance：With the computation model of structural composite micro-structure heat exchanger entire thermal resistance, into
The theoretical calculation that row is balanced based on metal substrate heat conduction and polymer fin heat transfer, design reasonable metal substrate geometry and
Polymer fin geometry and its design criteria of the characteristic size in 50 μm of -300 μ m, reach the heat of heat source generation
Amount, metal substrate conduction heat and polymer fin shed the balance of heat, heat load calculation, total rate of heat transfer, mean temperature
Difference, overall heat-transfer coefficient；
C, flowing and heat transfer conditions impact analysis：Based on 6 measuring principles, using the contact at conductometer measure interface
The thermal conductivity factor of thermal resistance and material, with reference to actual measurement metal substrate and the temperature profile data of polymer fin, exchanges heat micro-structure
The heat transfer process and development law of device are analyzed；
D, the influence factor of heat transfer performance：Analyze heat transfer process, the geometric properties of metal substrate and polymer fin
The influence of size and microscopic heat conduction to micro-structure heat exchanger heat exchange property；
E, processing and forming：Analyze metal substrate and the compound place interface geometrical morphology of polymer fin, interface coupling state, work
Make temperature, temperature gradient to the influencing mechanism of interface resistance；
F, heat transfer performance is tested：Obtain the frictional resistance of fin, the flow of fluid, pressure with entrance, outlet temperature, heat source with
Metallic substrates contact surface temperature, environment temperature parameter, theoretical calculation, law-analysing sum number are carried out to the heat exchanger performance after shaping
Model is learned to be verified and corrected.
This method is using metal substrate and polymer fin as object, with micro- thermal conduction study, polymer rheology, micro- continuous media
Mechanics, polymer shaping theory are Research foundation, provide the entire thermal resistance composition and computational methods of combined type micro-structure heat exchanger, obtain
Metal substrate and the epuilibrium thermodynamics mechanism of the heat conduction of polymer fin and radiated energy transmission are obtained, obtains micro-structure heat exchanger metal
Affecting laws with polymer interface pattern to thermal contact resistance and heat transfer conditions, disclose the microscopic heat conductions pair such as geometric feature sizes
The affecting laws of combined type micro-structure heat exchanger heat exchange efficiency and temperature.
It is described in step a in the heat transfer of above-mentioned metal-containing polymer combined type micro-structure heat exchanger and forming method
Entire thermal resistance R=Rconv+Rcond+Rheat,
Wherein, Rconv=Rpoly+RinterFor radiator and thermal resistance, R caused by cooling medium convection currentcondFor heat source and gold
Belong to thermal resistance caused by the heat transfer of substrate, polymer fin, RheatFor thermal resistance caused by cooling Absorption of Medium heat.Determine
After material thermal resistance, thermal conduction characteristic, provide the definite condition of micro-structure heat exchanger transfer process control equation, including primary condition and
Boundary condition.
In the heat transfer of above-mentioned metal-containing polymer combined type micro-structure heat exchanger and forming method, the cooling medium is
Air.
In the heat transfer of above-mentioned metal-containing polymer combined type micro-structure heat exchanger and forming method, the metal substrate with
After polymer fin is by micro injection molding, pass through pressure contact, in the slight distance close to interface, contact interface layer
Formed, the skewness of hot flow path forms the heat flux distribution in three-dimensional microstructures, and interfacial layer thickness decides heat flux distribution area
Domain.Metal substrate contact surface roughness δ1With the contact surface roughness δ of polymer fin2The sum of belonged to interfacial thickness δ
In micron dimension.
In the heat transfer of above-mentioned metal-containing polymer combined type micro-structure heat exchanger and forming method, in step c, type of thermal communication
Contact interface is crossed, occurs that the temperature difference T of an interruption, thermal contact resistance R are defined as on Δ T and contact surface between two contact surfaces
The ratio of mean heat flux qContact conductane is expressed asMean free path of phonons is much smaller than interface thickness
Degree, describes boundary layer heat transfer, draws out the solution contact interface on phonon bulk sound velocity, phonon carry-over factor and the interface temperature difference
Layer thermal resistance function expression.
In the heat transfer of above-mentioned metal-containing polymer combined type micro-structure heat exchanger and forming method, in step d, Metal Substrate
Plate meets Fourier's law with the heat transfer in polymer fin, thenWherein, qxFor in the x-direction
Heat flux, k are the temperature fields that solid heating rate T (x, y, z, t) is t moment under rectangular coordinate system；
Reason out setting metal or polymer belongs to Jie's sight and micro-scale, then the measure regulation of hot-fluid is Q ∝ (l2)(l-1)=(l1), the reduction of scale will cause the reduction of whole heat flow in solid；
And on this basis, establish be situated between see and micro-scale, draw metal substrate and polymer fin thermal conductivity and
The prediction model of heat flow：
The measure regulation of NON-UNIFORM SOLID thermal conductivity k under submicron-scale in metal substrate：
For the measure regulation Q ∝ (l of solid hot-fluid in submicron-scale1)(l1)=(l2),
In transient heat conduction analysis, the measure regulation of solid thermal conduction time
Wherein, F0For Fourier number, α is the thermal diffusivity of material, and t is time of the hot-fluid by characteristic length L.
When micro-structure heat exchanger polymer fin scale reduces, the table body of micro-structure fin is relevant with area than increase
The effect of active force is opposite to be strengthened, opposite with the effect of the relevant active force of volume such as inertia force, electromagnetic force etc. to weaken, so as to grind
Study carefully the new rule that heat transfer process shows.Since inertia force and micro- heat exchanger characteristics size are inversely proportional, and viscous force and feature
The quadratic power of size is inversely proportional, therefore when characteristic size reduces, the effect of inertia force and viscous force reduces, and studies under minute yardstick certainly
The relation of the ratio, that is, Gr numbers and Gr numbers and Re numbers of inertia force and viscous force in right convection current, and then derive judgement free convection
With the foundation of forced convection relative importance.Further, since solid wall surface is in static electrification, fluid may polarized, electrostatic field
Presence can hinder the movement of fluid intermediate ion so that fluid flow resistance increases, influence heat exchange efficiency.
In the heat transfer of above-mentioned metal-containing polymer combined type micro-structure heat exchanger and forming method, in step e, use is micro-
Injection molding method, metal substrate is positioned in mold cavity, mold clamping, be plasticized, injected using the completion of micro-structure injector,
Pressurize, cooling, ejection, realize product final molding.Visualization technique is used in forming process, monitoring polymer melt was filled
Journey, meanwhile, pressure and temperature sensor is disposed on mould, monitors mold cavity pressure, temperature variation.
In the heat transfer of above-mentioned metal-containing polymer combined type micro-structure heat exchanger and forming method, the metal substrate is several
What characteristic size is grade, and polymer fin geometric feature sizes are micron order.Between metal substrate and polymer fin
Heat transfer belongs to minute yardstick Heat transmission.
Compared with prior art, the heat transfer of this metal-containing polymer combined type micro-structure heat exchanger and forming method have following
Advantage：
1st, the present invention is with the most important design criteria of structure composite heat exchange material, using metal substrate material as heat conduction list
Member, using polymer fin microstructure as heat-sink unit, carries out the structure composite of high heat conduction and high heat-sink unit, multiple with existing blending
Close Heat Conduction Material to compare, not only there is reliable continuous passage of heat, but also keep the thermal conductivity and heat-sink unit of heat-conducting unit
Rate of heat dispation balance, to reach optimal heat exchanger efficiency.
2nd, heat-conducting metal underlying structure and the fin structure design of heat dissipation polymer fin microstructure are reasonable in the present invention, calculate
Go out metal and polymer contact interface resistance in heat exchanger, and the heat transfer process of polymer micro-structural heat dissipation, study metal
The heat transfer process of substrate and polymer fin microstructure unit, micro- geometric scale effect is to micro-structure heat exchanger heat exchange property
Affecting laws, further include heat balance mechanism, particularly the influence in boundary layer, Transfer Boundary Condition, compound and micro-structured form mistake
Cheng Yuanli and its heat exchanging and mechanical strength, the influence of rigidity.
Brief description of the drawings
Fig. 1 is the technology path block diagram of the present invention.
Embodiment
It is the specific embodiment of the present invention and with reference to attached drawing below, technical scheme is further described,
But the present invention is not limited to these embodiments.
As shown in Figure 1, a kind of heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method, its feature exist
In comprising the following steps：
A, the composition of entire thermal resistance and calculating：The thermal resistance that interface is closed on metal substrate, polymer fin and boundary is respectively Rmetal、
RpolyAnd Rinter, close interface for metal substrate, polymer fin and its boundary and carry out series coupled, provide the calculating mould of entire thermal resistance
The primary condition of type and governing equation, boundary condition, entire thermal resistance R=Rconv+Rcond+Rheat, wherein, Rconv=Rpoly+Rinter
For radiator and thermal resistance, R caused by cooling medium convection currentcondFor heat source and metal substrate, the heat transfer institute of polymer fin
The thermal resistance of generation, RheatFor thermal resistance caused by cooling Absorption of Medium heat, cooling medium is air, determines material thermal resistance, leads
After thermal characteristics, the definite condition of micro-structure heat exchanger transfer process control equation, including primary condition and boundary condition are provided, just
Beginning condition is t=t0When, metal substrate heat source side, with the temperature, close of polymer fin interface, fin with cooling down medium interface
The initial values such as degree, pressure and speed, boundary condition include the velocity conditions at fin wall, temperature conditionss, metal and polymer
The boundary condition of interface；
B, heat conduction and radiated energy transmission balance：With the computation model of structural composite micro-structure heat exchanger entire thermal resistance, into
The theoretical calculation that row is balanced based on metal substrate heat conduction and polymer fin heat transfer, design reasonable metal substrate geometry and
Polymer fin geometry and its design criteria of the characteristic size in 50 μm of -300 μ m, reach the heat of heat source generation
Amount, metal substrate conduction heat and polymer fin shed the balance of heat, heat load calculation, total rate of heat transfer, mean temperature
Difference, overall heat-transfer coefficient so that heat from heat source can effectively, timely shed, and avoid the waste of metal substrate high heat conduction ability
The shortcomings that low with polymer bond's coefficient, each make the most of the advantage, realize heat balance, reasonable distribution；
C, flowing and heat transfer conditions impact analysis：Micro-structure heat exchanger polymer fin scale reduces, and interface surface is coarse
The relative size enhancing of degree, so that heat exchange efficiency is influenced, in the case of two kinds of heat transfer free convection and forced-convection heat transfer, air
The resistance coefficient of flowing, Reynolds number are with the changing rule of minute yardstick, the critical Reynolds number value of laminar flow and turbulent flow, based on 6 points of measurements
Principle, using the thermal contact resistance and the thermal conductivity factor of material at conductometer measure interface, with reference to actual measurement metal substrate and polymer
The temperature profile data of fin, analyzes the heat transfer process and development law of micro-structure heat exchanger, hot-fluid passes through contact
Interface, the temperature difference T of an interruption occurs between two contact surfaces, thermal contact resistance R is defined as evenly heat on Δ T and contact surface
The ratio of current density qContact conductane is expressed asMean free path of phonons is much smaller than interfacial layer thickness, description
Boundary layer heat transfer, draws out the solution contact interface layer thermal resistance on phonon bulk sound velocity, phonon carry-over factor and the interface temperature difference
Function expression；
D, the influence factor of heat transfer performance：Analyze heat transfer process, the geometric properties of metal substrate and polymer fin
The influence of size and microscopic heat conduction to micro-structure heat exchanger heat exchange property, metal substrate are accorded with the heat transfer in polymer fin
Fourier's law is closed, thenWherein, qxFor heat flux in the x-direction, k be solid heating rate T (x, y, z,
T) it is the temperature field of t moment under rectangular coordinate system；
Reason out setting metal or polymer belongs to Jie's sight and micro-scale, then the measure regulation of hot-fluid is Q ∝ (l2)(l-1)=(l1), the reduction of scale will cause the reduction of whole heat flow in solid；
And on this basis, establish be situated between see and micro-scale, draw metal substrate and polymer fin thermal conductivity and
The prediction model of heat flow：
The measure regulation of NON-UNIFORM SOLID thermal conductivity k under submicron-scale in metal substrate：
For the measure regulation Q ∝ (l of solid hot-fluid in submicron-scale1)(l1)=(l2),
In transient heat conduction analysis, the measure regulation of solid thermal conduction time
Wherein, F0For Fourier number, α is the thermal diffusivity of material, and t is time of the hot-fluid by characteristic length L.
When micro-structure heat exchanger polymer fin scale reduces, the table body of micro-structure fin is relevant with area than increase
The effect of active force is opposite to be strengthened, opposite with the effect of the relevant active force of volume such as inertia force, electromagnetic force etc. to weaken, so as to grind
Study carefully the new rule that heat transfer process shows.Since inertia force and micro- heat exchanger characteristics size are inversely proportional, and viscous force and feature
The quadratic power of size is inversely proportional, therefore when characteristic size reduces, the effect of inertia force and viscous force reduces, and studies under minute yardstick certainly
The relation of the ratio, that is, Gr numbers and Gr numbers and Re numbers of inertia force and viscous force in right convection current, and then derive judgement free convection
With the foundation of forced convection relative importance.Further, since solid wall surface is in static electrification, fluid may polarized, electrostatic field
Presence can hinder the movement of fluid intermediate ion so that fluid flow resistance increases, influence heat exchange efficiency；
E, processing and forming：Analyze metal substrate and the compound place interface geometrical morphology of polymer fin, interface coupling state, work
Make temperature, temperature gradient to the influencing mechanism of interface resistance, using micro injection molding method, metal substrate is positioned at mold cavity
In, mold clamping, completes plasticizing, injection, pressurize, cooling, ejection using micro-structure injector, realizes product final molding, into
Visualization technique is used during type, monitoring polymer melt filling process, disposes pressure and temperature sensor, prison on mould
After survey mold cavity pressure, temperature variation, metal substrate and polymer fin are by micro injection molding, by contacting with pressure,
Close in the slight distance of interface, the formation of contact interface layer, the skewness of hot flow path is formed in three-dimensional microstructures
Heat flux distribution, interfacial layer thickness decide heat flux distribution region.Metal substrate contact surface roughness δ1With polymer fin
Contact surface roughness δ2The sum of belonged to interfacial thickness δ in micron dimension, metal substrate geometric feature sizes are grade,
Polymer fin geometric feature sizes are micron order, and the heat transfer between metal substrate and polymer fin belongs to minute yardstick heat and passes
It is defeated；
F, heat transfer performance is tested：Obtain the frictional resistance of fin, the flow of fluid, pressure with entrance, outlet temperature, heat source with
Metallic substrates contact surface temperature, environment temperature parameter, theoretical calculation, law-analysing sum number are carried out to the heat exchanger performance after shaping
Model is learned to be verified and corrected.
This method is accurate with the most important design of structure composite heat exchange material using metal substrate and polymer fin as object
Then, using metal substrate material as heat-conducting unit, using polymer fin microstructure as heat-sink unit, carry out high heat conduction and high heat dissipation is single
The structure composite of member, compared with existing composite Heat Conduction Material, not only has reliable continuous passage of heat, but also keeps leading
The balance of the thermal conductivity of hot cell and the rate of heat dispation of heat-sink unit, to reach optimal heat exchanger efficiency.According to micro- thermal conduction study, poly-
Compound rheology, micro-continuum mechanics, polymer shaping theory are Research foundation, design rational heat-conducting metal underlying structure
With heat dissipation polymer fin microstructure fin structure, metal and polymer contact interface resistance in heat exchanger are calculated, obtains gold
Belong to substrate and the epuilibrium thermodynamics mechanism of the heat conduction of polymer fin and radiated energy transmission, obtain micro-structure heat exchanger metal with gathering
Compound interface topography discloses the microscopic heat conductions such as geometric feature sizes to compound to the affecting laws of thermal contact resistance and heat transfer conditions
Decline structure heat exchanger heat exchange efficiency and the affecting laws of temperature, further includes heat balance mechanism, particularly boundary layer, Heat transfer boundary
The influence of condition, compound and micro-structured form Principle of Process and its heat exchanging and mechanical strength, the influence of rigidity.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology belonging to the present invention is led
The technical staff in domain can do various modifications or additions to described specific embodiment or replace in a similar way
Generation, but without departing from spirit of the invention or beyond the scope of the appended claims.
Although term is used more herein, it does not preclude the possibility of using other terms.Use these terms
It is only for the convenience of describing and explaining the nature of the invention；Be construed as any one of the additional limitations be all with
What spirit of the present invention was disagreed.
Claims (8)
1. heat transfer and the forming method of a kind of metal-containing polymer combined type micro-structure heat exchanger, it is characterised in that including following step
Suddenly：
A, the composition of entire thermal resistance and calculating：The thermal resistance that interface is closed on metal substrate, polymer fin and boundary is respectively Rmetal、RpolyWith
Rinter, for metal substrate, polymer fin and its boundary close interface carry out series coupled, provide entire thermal resistance computation model and
The primary condition of governing equation, boundary condition；
B, heat conduction and radiated energy transmission balance：With the computation model of structural composite micro-structure heat exchanger entire thermal resistance, base is carried out
In the theoretical calculation that metal substrate heat conduction and polymer fin heat transfer balance, reasonable metal substrate geometry and feature are designed
Polymer fin geometry and its design criteria of the size in 50 μm of -300 μ m, reach heat, the gold of heat source generation
Belong to substrate conduction heat and polymer fin sheds the balance of heat, it is heat load calculation, total rate of heat transfer, average temperature difference, total
Heat transfer coefficient；
C, flowing and heat transfer conditions impact analysis：Based on 6 measuring principles, using the thermal contact resistance at conductometer measure interface
With the thermal conductivity factor of material, with reference to actual measurement metal substrate and polymer fin temperature profile data, to micro-structure heat exchanger
Heat transfer process and development law are analyzed；
D, the influence factor of heat transfer performance：Analyze heat transfer process, the geometric feature sizes of metal substrate and polymer fin
With influence of the microscopic heat conduction to micro-structure heat exchanger heat exchange property；
E, processing and forming：Analyze metal substrate and the compound place interface geometrical morphology of polymer fin, interface coupling state, work temperature
Degree, temperature gradient are to the influencing mechanism of interface resistance；
F, heat transfer performance is tested：The frictional resistance of fin, the flow of fluid, pressure are obtained with entrance, outlet temperature, heat source and metal
Substrate contact surface temperature, environment temperature parameter, theoretical calculation, law-analysing and mathematical modulo are carried out to the heat exchanger performance after shaping
Type is verified and corrected.
2. heat transfer and the forming method of metal-containing polymer combined type micro-structure heat exchanger according to claim 1, its feature
It is, in step a, the entire thermal resistance R=Rconv+Rcond+Rheat,
Wherein, Rconv=Rpoly+RinterFor radiator and thermal resistance, R caused by cooling medium convection currentcondFor heat source and Metal Substrate
Plate, polymer fin heat transfer caused by thermal resistance, RheatFor thermal resistance caused by cooling Absorption of Medium heat.
3. heat transfer and the forming method of metal-containing polymer combined type micro-structure heat exchanger according to claim 2, its feature
It is, the cooling medium is air.
4. heat transfer and the forming method of metal-containing polymer combined type micro-structure heat exchanger according to claim 1, its feature
It is, in step c, when hot-fluid passes through contact interface, the temperature difference T of an interruption, contact occurs between two contact surfaces
Thermal resistance R is defined as the ratio of mean heat flux q on Δ T and contact surfaceContact conductane is expressed asPhonon
Mean free path is much smaller than interfacial layer thickness, describes boundary layer heat transfer, derives on phonon bulk sound velocity, phonon transmission system
The solution contact interface layer thermal resistance function expression of number and the interface temperature difference.
5. heat transfer and the forming method of metal-containing polymer combined type micro-structure heat exchanger according to claim 1, its feature
It is, in step d, metal substrate meets Fourier's law with the heat transfer in polymer fin, then
Wherein, qxFor heat flux in the x-direction, k is the temperature field that solid heating rate T (x, y, z, t) is t moment under rectangular coordinate system；
Reason out setting metal or polymer belongs to Jie's sight and micro-scale, then the measure regulation of hot-fluid is Q ∝ (l2)(l-1)=
(l1), the reduction of scale will cause the reduction of whole heat flow in solid；
And on this basis, establish the thermal conductivity and hot-fluid in sight and the micro-scale of being situated between, drawing metal substrate and polymer fin
The prediction model of amount：
The measure regulation of NON-UNIFORM SOLID thermal conductivity k under submicron-scale in metal substrate：
For the measure regulation Q ∝ (l of solid hot-fluid in submicron-scale1)(l1)=(l2),
In transient heat conduction analysis, the measure regulation of solid thermal conduction time
Wherein, F0For Fourier number, α is the thermal diffusivity of material, and t is time of the hot-fluid by characteristic length L.
6. heat transfer and the forming method of metal-containing polymer combined type micro-structure heat exchanger according to claim 1, its feature
It is, in step e, using micro injection molding method, metal substrate is positioned in mold cavity, mold clamping, utilizes micro- knot
Structure injector completes plasticizing, injection, pressurize, cooling, ejection, realizes product final molding.
7. heat transfer and the forming method of the metal-containing polymer combined type micro-structure heat exchanger according to claim 1 or 6, it is special
Sign is, after the metal substrate and polymer fin are by micro injection molding, by pressure contact, close to interface
In slight distance, the formation of contact interface layer, the skewness of hot flow path forms the heat flux distribution in three-dimensional microstructures, interface
Layer thickness decides heat flux distribution region.
8. heat transfer and the forming method of metal-containing polymer combined type micro-structure heat exchanger according to claim 7, its feature
It is, the metal substrate geometric feature sizes are grade, and polymer fin geometric feature sizes are micron order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710970687.5A CN108007258A (en) | 2017-10-18 | 2017-10-18 | The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710970687.5A CN108007258A (en) | 2017-10-18 | 2017-10-18 | The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108007258A true CN108007258A (en) | 2018-05-08 |
Family
ID=62051692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710970687.5A Pending CN108007258A (en) | 2017-10-18 | 2017-10-18 | The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108007258A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110161077A (en) * | 2019-06-10 | 2019-08-23 | 衢州学院 | A kind of method of detection channel surface convection transfer rate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201708147U (en) * | 2010-04-29 | 2011-01-12 | 中科恒达石墨股份有限公司 | Composite graphite radiator |
| EP2314973A1 (en) * | 2008-05-27 | 2011-04-27 | Daikin Industries, Ltd. | Fin-tube heat exchanger |
| CN104180929A (en) * | 2014-08-06 | 2014-12-03 | 山东省计算中心（国家超级计算济南中心） | Calibration method of thermal resistance type hot-fluid sensor |
| CN105353847A (en) * | 2015-10-08 | 2016-02-24 | 北京化工大学 | CPU application oriented metal-polymer composite micro-structure heat dissipator structure |
| JP2017155973A (en) * | 2016-02-29 | 2017-09-07 | 株式会社Uacj | Fin material for heat exchanger and heat exchanger |
-
2017
- 2017-10-18 CN CN201710970687.5A patent/CN108007258A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2314973A1 (en) * | 2008-05-27 | 2011-04-27 | Daikin Industries, Ltd. | Fin-tube heat exchanger |
| CN201708147U (en) * | 2010-04-29 | 2011-01-12 | 中科恒达石墨股份有限公司 | Composite graphite radiator |
| CN104180929A (en) * | 2014-08-06 | 2014-12-03 | 山东省计算中心（国家超级计算济南中心） | Calibration method of thermal resistance type hot-fluid sensor |
| CN105353847A (en) * | 2015-10-08 | 2016-02-24 | 北京化工大学 | CPU application oriented metal-polymer composite micro-structure heat dissipator structure |
| JP2017155973A (en) * | 2016-02-29 | 2017-09-07 | 株式会社Uacj | Fin material for heat exchanger and heat exchanger |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110161077A (en) * | 2019-06-10 | 2019-08-23 | 衢州学院 | A kind of method of detection channel surface convection transfer rate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Hayat et al. | Flow of nanofluid due to convectively heated Riga plate with variable thickness | |
| Liu et al. | Experimental investigations on liquid flow and heat transfer in rectangular microchannel with longitudinal vortex generators | |
| Hua et al. | Experimental study on thermal performance of micro pin fin heat sinks with various shapes | |
| Zhou et al. | Investigation of fluid flow and heat transfer characteristics of parallel flow double-layer microchannel heat exchanger | |
| Peng et al. | Analysis of heat transfer and flow characteristics over serrated fins with different flow directions | |
| Shiriny et al. | Forced convection heat transfer of water/FMWCNT nanofluid in a microchannel with triangular ribs | |
| CN114154262B (en) | Forward design method for cross-flow printed circuit board type heat exchanger | |
| Carl et al. | The theoretical and experimental investigation of the heat transfer process of an automobile radiator | |
| Wang et al. | Heat transfer and flow characteristics of straight-type PCHEs with rectangular channels of different widths | |
| Li et al. | Numerical study and experimental verification of transverse direction type serrated fins and field synergy principle analysis | |
| Mousavi et al. | Numerical study of heat transfer enhancement from a heated circular cylinder by using nanofluid and transverse oscillation: A comparative study | |
| CN102332041A (en) | Heat radiating performance analysis and structure design system for tube and fin type radiator | |
| Jabbour et al. | High performance finned-tube heat exchangers based on filled polymer | |
| Alqarni et al. | Numerical simulation and exergy analysis of a novel nanofluid-cooled heat sink | |
| Fan et al. | Thermal and exergy efficiency of magnetohydrodynamic Fe3O4‐H2O nanofluids flowing through a built‐in twisted turbulator corrugated tube under magnetic field | |
| Chen et al. | Effects of metal foam filling heights and tilt angles on the cooling performance of a heat sink filled with nanofluids | |
| CN108007258A (en) | The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method | |
| Sivasankaran et al. | Effect of a partition on hydro-magnetic convection in an enclosure | |
| Kabir et al. | Numerical study of MHD mixed convection heat transfer of nanofluid in a lid-driven porous rectangular cavity with three square heating blocks | |
| KR101405394B1 (en) | Printed Circuit Heat Exchanger | |
| Mao et al. | Numerical investigation of forced convection flow characteristics on hydrophobic surface with nanofluid | |
| Mao et al. | Numerical simulation of forced convection heat transfer mechanism and comprehensive performance on hydrophobic structure surface | |
| Hua et al. | Experimental study on the flow/heat transfer performance of micro-scale pin fin coating with super-hydrophobic surface adding Nano particle | |
| Hassan et al. | Numerical study of fan coil heat exchanger with copper‐foam | |
| Lihua et al. | Geometrical optimization and mould wear effect on HPD type steel offset strip fin performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180508 |