CN107978682B - Flexible AMOLED substrate and preparation method thereof - Google Patents
Flexible AMOLED substrate and preparation method thereof Download PDFInfo
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- CN107978682B CN107978682B CN201610933726.XA CN201610933726A CN107978682B CN 107978682 B CN107978682 B CN 107978682B CN 201610933726 A CN201610933726 A CN 201610933726A CN 107978682 B CN107978682 B CN 107978682B
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- polymer material
- material layer
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- flexible amoled
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/865—Intermediate layers comprising a mixture of materials of the adjoining active layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electromagnetism (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of displays, in particular to a flexible AMOLED substrate and a preparation method thereof, wherein the substrate comprises a double-layer structure formed by bonding a first polymer material layer and a second polymer material layer together, wherein the second polymer material layer is made of amorphous polymer; therefore, when the AMOLED substrate is impacted by the outside, the point deformation of the impacted point is converted into surface deformation, the deformation of the impacted point is reduced, and the OLED pixel point at the corresponding position is prevented from being invalid.
Description
Technical Field
The invention relates to the technical field of displays, in particular to a flexible AMOLED substrate and a preparation method thereof.
Background
The OLED, i.e., an Organic Light-Emitting Diode (Organic Light-Emitting Diode), has characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, low power consumption, etc., and thus has attracted much attention as a new generation of display mode, and has begun to gradually replace the conventional liquid crystal display, and is widely applied to mobile phone screens, computer monitors, full-color televisions, etc.
At present, the flexible AMOLED substrate located below the PI substrate is usually made of a single foam cotton material, a single PMMA material, and the like, and although the foam cotton material and the PMMA material are polymers capable of absorbing external impact energy, and have a certain difference in the magnitude of absorbing the external impact energy, the deformation generated when the substrate is impacted is the largest deformation amount at the impact point, so that even if the substrate material absorbs energy transmitted from the impact point, the OLED pixel point at the corresponding display position is easy to fail, which is not expected by those skilled in the art.
Disclosure of Invention
In order to solve the existing problems, the invention discloses a double-layer structure which comprises a plurality of double-layer structures which are sequentially stacked:
the double-layer structure comprises a first polymer material layer and a second polymer material layer positioned above the first polymer material layer, and the first polymer material layer and the second polymer material layer are bonded together through a bonding glue;
wherein the material of the second polymer material layer is amorphous polymer
The invention also discloses a preparation method of the flexible AMOLED substrate, which is characterized by comprising the following steps:
step S1, providing a first polymer material layer and a second polymer material layer, wherein the second polymer material layer is made of amorphous polymer;
step S2, forming adhesive glue on the surface of the first polymer material layer and/or the second polymer material layer; and
step S3, bonding the first polymer material layer and the second polymer material layer together by the bonding glue.
The invention has the following advantages or beneficial effects:
the invention discloses a flexible AMOLED substrate and a preparation method thereof, wherein the prepared substrate at least comprises a double-layer structure formed by bonding a first polymer material layer and a second polymer material layer together, wherein the second polymer material layer is made of amorphous polymer; therefore, when the AMOLED substrate is impacted by the outside, the point deformation of the impacted point is converted into surface deformation, the deformation of the impacted point is reduced, and the OLED pixel point at the corresponding position is prevented from being invalid.
Drawings
The invention and its features, aspects and advantages will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.
FIG. 1 is a schematic structural diagram of a flexible AMOLED substrate in an embodiment of the invention;
fig. 2 is a flow chart of a method of fabricating a flexible AMOLED substrate in an embodiment of the invention.
Detailed Description
The invention will be further described with reference to the following drawings and specific examples, which are not intended to limit the invention thereto.
As shown in fig. 1, the present embodiment discloses a flexible AMOLED substrate, specifically, the flexible AMOLED substrate includes several two-layer structures 1 stacked in sequence (only the flexible AMOLED substrate is shown in the figure to include two-layer structures 1, and in fact, the flexible AMOLED substrate may include 1, 3 or more two-layer structures 1): the double-layer structure 1 comprises a first polymer material layer 11 and a second polymer material layer 13 positioned on the first polymer material layer 11, and the first polymer material layer 11 and the second polymer material layer 13 are bonded together through a bonding glue 12, wherein the second polymer material layer 13 is made of an amorphous polymer, which is characterized in that the amorphous polymer is soft and hard after absorbing energy (the amorphous polymer changes the glass transition temperature of the amorphous polymer after absorbing energy, so that the material can be soft and hard); this property of amorphous polymer allows the single point deformation of the second polymer material layer 13 under external impact to be transformed into a global deformation, thereby reducing the damage level, and then transmits the impact energy to the underlying first polymer material layer 11, and after the energy is transmitted to the underlying first polymer material layer 11 (referring to the underlying first polymer material layer in the single bilayer structure), the glass transition temperature of the second polymer material layer 13 is restored to the temperature before impact, and the material is also changed from hard to soft; in other words, the second polymer material layer 13 has the property of being able to change its material briefly under an external impact so that it becomes soft and hard, and then to recover its softness after energy transmission. The first polymer material layer 11 and the second polymer material layer 13 may be made of the same material, and both are made of soft material.
In an alternative embodiment of the present invention, the material of the first polymer material layer 11 is PMMA or PU, etc., but the first polymer material layer 11 may also be other materials as long as the material is a soft material with impact absorption capability.
In an alternative embodiment of the present invention, the material of the second polymer material layer 13 may be a foam-type material or a PMMA-type amorphous polymer (e.g., PU/PE/EPE/EPDM/EVA/EPP, etc.).
In an alternative embodiment of the present invention, the adhesive 12 is Optically Clear Adhesive (OCA) or Pressure Sensitive Adhesive (PSA).
In an alternative embodiment of the present invention, the thickness of the first polymer material layer 11 is 20 to 200 μm (e.g. 20 μm, 50 μm, 110 μm, or 200 μm).
In an alternative embodiment of the present invention, the thickness of the second polymer material layer 13 is 30 to 200 μm (e.g. 30 μm, 50 μm, 115 μm, or 200 μm).
In an alternative embodiment of the invention, the thickness of the adhesive glue 12 is greater than 10 μm (for example 10 μm, 15 μm, 17 μm or 20 μm, etc.).
In an alternative embodiment of the present invention, wherein a plurality of the above-mentioned two-layer structures 1 are connected by the adhesive 2, in an embodiment of the present invention, the adhesive 2 may also be an adhesive material such as Optically Clear Adhesive (OCA) or Pressure Sensitive Adhesive (PSA).
As shown in fig. 2, the embodiment also discloses a method for preparing a flexible AMOLED substrate, and specifically, the method includes the following steps:
the method comprises the following steps of firstly, providing a first polymer material layer and a second polymer material layer, and particularly, independently preparing the first polymer material layer and the second polymer material layer.
In an alternative embodiment of the present invention, the material for preparing the second polymer material layer is a foam-type material or a PMMA-type amorphous polymer material (e.g., PU/PE/EPE/EPDM/EVA/EPP, etc.), and the material for preparing the first polymer material layer is PMMA or PU; and the first polymer material layer and the second polymer material layer are prepared in the same manner as a foam-based substrate or a PMMA-based substrate (e.g., coating, printing, or ink-jetting).
In an alternative embodiment of the present invention, the first polymer material layer is prepared to have a thickness of 20 to 200 μm.
In an alternative embodiment of the present invention, the second polymer material layer is prepared to have a thickness of 30 to 200 μm.
And step two, forming a bonding adhesive on the surface of the first polymer material layer and/or the second polymer material layer, specifically, coating (or ink-jet printing, or transfer printing, or the like) the bonding adhesive on one side of the first polymer material layer or one side of the second polymer material layer, or coating the bonding adhesive on both the one side of the first polymer material layer and the one side of the second polymer material layer, as long as the first polymer material layer and the second polymer material layer can be bonded together.
In an alternative embodiment of the present invention, the adhesive is an optically clear adhesive or a pressure sensitive adhesive.
In an alternative embodiment of the invention, the thickness of the glue is greater than 10 μm.
And step three, bonding the first polymer material layer and the second polymer material layer together through a bonding adhesive, specifically, laminating the first polymer material layer and the second polymer material layer in a roll-to-roll (roll-to-roll) mode, and if the flexible AMOLED substrate only comprises a double-layer structure, coating a layer of glue material attached to the PI substrate side on the second polymer material layer.
In an alternative embodiment of the invention, the first layer of polymeric material and the second layer of polymeric material form a bilayer, the method further comprising:
and step four, repeating the step one to the step four to form a plurality of double-layer structures, and sequentially stacking the plurality of double-layer structures to form the flexible AMOLED substrate, specifically, stacking the plurality of double-layer structures together through an adhesive, wherein in the embodiment of the invention, the adhesive may also be an adhesive material such as Optically Clear Adhesive (OCA) or Pressure Sensitive Adhesive (PSA). And then coating a layer of glue material attached to the PI substrate side on the second polymer material layer positioned at the uppermost part of the flexible AMOLED substrate.
It should be appreciated that the present embodiment is a method embodiment corresponding to the above-described embodiment of the flexible AMOLED substrate, and the present embodiment may be implemented in cooperation with the above-described embodiment of the flexible AMOLED substrate. The related technical details mentioned in the above embodiments of the flexible AMOLED substrate are still valid in this embodiment, and are not described herein again in order to reduce repetition. Accordingly, the related art details mentioned in this embodiment can also be applied to the above-described embodiments of the flexible AMOLED substrate.
The above description is of the preferred embodiment of the invention. It is to be understood that the invention is not limited to the particular embodiments described above, in that devices and structures not described in detail are understood to be implemented in a manner common in the art; those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or modify equivalent embodiments, without affecting the spirit of the invention, using the methods and techniques disclosed above, without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (12)
1. A flexible AMOLED substrate, comprising:
a plurality of bilayer structures:
the double-layer structure comprises a first polymer material layer and a second polymer material layer positioned above the first polymer material layer, and the first polymer material layer and the second polymer material layer are bonded together through a bonding glue;
the material of the second polymer material layer is amorphous polymer;
two adjacent double-layer structures are connected through an adhesive;
wherein the first polymer material layer of one of the two-layer structures is connected to the second polymer material layer of the other of the two-layer structures below the two-layer structure by the adhesive;
the first polymer material layer is made of PMMA or PU;
the second polymer material layer is made of foam materials or PMMA materials.
2. The flexible AMOLED substrate of claim 1, wherein the first polymer material layer has a thickness of 20-200 μm.
3. The flexible AMOLED substrate of claim 1, wherein the second layer of polymer material has a thickness of 30-200 μm.
4. The flexible AMOLED substrate of claim 1, wherein the adhesive glue is an optically clear glue or a pressure sensitive glue.
5. A flexible AMOLED substrate as recited in claim 4, wherein the adhesive glue is greater than 10 μm thick.
6. The flexible AMOLED substrate of claim 1, wherein the adhesive is an optically clear adhesive or a pressure sensitive adhesive.
7. A preparation method of a flexible AMOLED substrate is characterized by comprising the following steps:
step S1, providing a first polymer material layer and a second polymer material layer, wherein the second polymer material layer is made of amorphous polymer;
step S2, forming adhesive glue on the surface of the first polymer material layer and/or the second polymer material layer; and
step S3, bonding the first polymer material layer and the second polymer material layer together through the bonding glue to form a double-layer structure;
step S4, repeating the steps S1-S3 to form a plurality of double-layer structures, and stacking the double-layer structures in sequence to form the flexible AMOLED substrate;
the first polymer material layer is prepared from PMMA or PU;
the second polymer material layer is made of foam materials or PMMA materials.
8. The method of fabricating a flexible AMOLED substrate according to claim 7, wherein the first polymer material layer is fabricated to a thickness of 20-200 μm.
9. The method of fabricating a flexible AMOLED substrate according to claim 7, wherein the second polymer material layer is fabricated to a thickness of 30-200 μm.
10. The method of making a flexible AMOLED substrate of claim 7, wherein the adhesive glue is an optically clear glue or a pressure sensitive glue.
11. The method of fabricating a flexible AMOLED substrate of claim 10, wherein the adhesive glue is greater than 10 μ ι η thick.
12. The method for preparing a flexible AMOLED substrate according to claim 7, wherein in the step S2, the adhesive glue is formed on the surface of the first polymer material layer and/or the second polymer material layer by coating, inkjet printing and transfer printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610933726.XA CN107978682B (en) | 2016-10-25 | 2016-10-25 | Flexible AMOLED substrate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610933726.XA CN107978682B (en) | 2016-10-25 | 2016-10-25 | Flexible AMOLED substrate and preparation method thereof |
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| CN107978682A CN107978682A (en) | 2018-05-01 |
| CN107978682B true CN107978682B (en) | 2019-12-27 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1142799A (en) * | 1994-09-30 | 1997-02-12 | 钟渊化学工业株式会社 | Laminated heat-resistant optical plastic sheet and process for producing the same |
| CN1756660A (en) * | 2003-01-14 | 2006-04-05 | 通用电气公司 | A formable thermoplastic laminate, a formed laminate, an article, and a method of making an article |
| CN101557935A (en) * | 2006-12-13 | 2009-10-14 | 赢创德固赛有限责任公司 | Transparent part |
| CN102046749A (en) * | 2008-07-16 | 2011-05-04 | 阿肯马法国公司 | Use of an encapsulated adhesion promoter in an aqueous adhesive joint bonding two substrates, at least one of which comprises a (TPE-PA) material |
| CN103337595A (en) * | 2013-07-04 | 2013-10-02 | 上海和辉光电有限公司 | Flexible packaging substrate, manufacturing method thereof, and packaging method of OLED using substrate |
-
2016
- 2016-10-25 CN CN201610933726.XA patent/CN107978682B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1142799A (en) * | 1994-09-30 | 1997-02-12 | 钟渊化学工业株式会社 | Laminated heat-resistant optical plastic sheet and process for producing the same |
| CN1756660A (en) * | 2003-01-14 | 2006-04-05 | 通用电气公司 | A formable thermoplastic laminate, a formed laminate, an article, and a method of making an article |
| CN101557935A (en) * | 2006-12-13 | 2009-10-14 | 赢创德固赛有限责任公司 | Transparent part |
| CN102046749A (en) * | 2008-07-16 | 2011-05-04 | 阿肯马法国公司 | Use of an encapsulated adhesion promoter in an aqueous adhesive joint bonding two substrates, at least one of which comprises a (TPE-PA) material |
| CN103337595A (en) * | 2013-07-04 | 2013-10-02 | 上海和辉光电有限公司 | Flexible packaging substrate, manufacturing method thereof, and packaging method of OLED using substrate |
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| CN107978682A (en) | 2018-05-01 |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |