CN107974090A - Heat-conducting pad and preparation method thereof, electronic device - Google Patents
Heat-conducting pad and preparation method thereof, electronic device Download PDFInfo
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- CN107974090A CN107974090A CN201711415010.1A CN201711415010A CN107974090A CN 107974090 A CN107974090 A CN 107974090A CN 201711415010 A CN201711415010 A CN 201711415010A CN 107974090 A CN107974090 A CN 107974090A
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- heat
- conducting pad
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The present invention provides a kind of preparation method of heat-conducting pad, the electronic device as the heat-conducting pad obtained by this method and the application heat-conducting pad.The preparation method of the heat-conducting pad comprises the following steps：By weight, there is provided 750~800 parts of vinyl silicone oil and 200~250 parts of methyl vinyl silicone rubber, mix the vinyl silicone oil and methyl vinyl silicone rubber, obtain colloid mixture；3600~4000 parts of alumina particles are provided, the alumina particle and colloid mixture is mixed, obtains mixture；9.5~10 parts of platinum catalysts are provided, the platinum catalyst and mixture is mixed, obtains base-material；Calendering process and curing process are carried out successively to the base-material, obtain heat-conducting pad, which not only has the function of heat conduction, also with preferable structural strength and screen resilience.
Description
Technical field
The present invention relates to technical field of electronic device, more particularly to a kind of preparation method of heat-conducting pad, by the heat conductive pad
Heat-conducting pad obtained by the preparation method of piece and the electronic device using the heat-conducting pad.
Background technology
With the fast development of electronic equipment, quick charge becomes the important research direction of electronics industry.Electronic equipment exists
Carry out that during quick charge substantial amounts of heat can be produced.Generally use sets the mode of heat-conducting pad in electronic equipment,
To export the heat of electronic equipment generation.However, traditional heat-conducting pad there are structural strength it is low and rebound force difference the shortcomings that, when
Electronic equipment is in vibrations when motion state, and traditional heat-conducting pad cannot play the role of buffer protection to electronic equipment,
And heat-conducting pad is when being distorted or deform with the movement of electronic equipment, it may appear that abrasion is even broken.
In addition, the proportion of traditional heat-conducting pad is high, the trend of the light-weighted development of electronic equipment is not met.Moreover, pass
The heat-conducting pad of system also has the defects of poor fire, so as to further limit traditional heat-conducting pad in electronic equipment
Using.
The content of the invention
It is a primary object of the present invention to provide a kind of preparation method of heat-conducting pad, it is intended to solve the structure of heat-conducting pad
The defects of intensity is low, proportion is high and springs back force difference.
In order to solve the above technical problems, the preparation method of heat-conducting pad provided by the invention, comprises the following steps：
By weight, there is provided 750~800 parts of vinyl silicone oil and 200~250 parts of methyl vinyl silicone rubber, are mixed
The vinyl silicone oil and methyl vinyl silicone rubber are closed, obtains colloid mixture；
3600~4000 parts of alumina particles are provided, the alumina particle and colloid mixture is mixed, obtains mixture；
9.5~10 parts of platinum catalysts are provided, the platinum catalyst and mixture is mixed, obtains base-material；
Calendering process and curing process are carried out successively to the base-material, obtain heat-conducting pad.
Preferably, the content of the methyl vinyl silicone rubber medium vinyl is 0.06~0.1%.
Preferably, the particle size range of the alumina particle is 15~20 μm.
Preferably, the alumina particle has spherical structure, spherical structure or irregular structure.
Preferably, the vinyl silicone oil medium vinyl content is 0.5~1%.
Preferably, it is further comprising the steps of when mixing the alumina particle and colloid mixture：
900~1000 parts of fire retardants are added in the alumina particle and colloid mixture, obtain mixture.
Preferably, it is further comprising the steps of before carrying out calendering process to base-material after obtaining base-material：
9.5~10 parts of delayed-action activators are provided, mix the base-material and delayed-action activator.
Preferably, the delayed-action activator is selected from t etram-ethyltetravinylcyclotetrasiloxane, 1- acetenyl -1- cyclohexanol, 2- first
Base -3- butynyl -2- alcohol, 2- methyl isophthalic acids-hexin base -3- alcohol, 3,5- dimethyl -1- hexin base -3- alcohol, 3,7,11- trimethyls -
In 1- dodecyne base -3- alcohol, maleic acid diethyl allyl ester, allyl glycidyl ether and diethylene glycol divinyl ether at least
It is a kind of.
Preferably, it is further comprising the steps of before carrying out calendering process to base-material after obtaining the base-material：
Vacuumize process is carried out to the base-material, the time of the vacuumize process is 15~30 minutes.
The present invention also provides a kind of heat-conducting pad as obtained by the preparation method of above-mentioned heat-conducting pad.
The present invention also provides a kind of electronic device, including housing, the heat generating member that is contained in the housing and above-mentioned heat conductive pad
Piece, the heat-conducting pad are located between housing and heat generating member.
Technical solution of the present invention mixes vinyl silicone oil and methyl vinyl silicone rubber and alumina particle so that is made
Heat-conducting pad not only there is heat conduction, but also there is preferable resilience and structural strength.Specifically, vinyl silicone oil and
Under the action of platinum catalyst polymerisation can occur for methyl vinyl silicone rubber, tridimensional network be formed, due to methyl
Vinylsiloxane rubber has high resiliency so that obtained heat-conducting pad not only has preferable resilience, also has preferably knot
Structure intensity, such as tensile strength and elongation at break.Moreover, the heat-conducting pad by vinyl silicone oil, alumina particle and
Methyl vinyl silicone rubber is made, and heat-conducting pad is had preferable resilience and structure without adding excessive functional stuffing
Intensity so that heat-conducting pad also has the advantages that proportion is small.
The heat-conducting pad of the present invention is applied to electronic equipment, when electronic equipment is kept in motion, heat-conducting pad can
Play the role of buffer protection to electronic equipment, when heat-conducting pad is distorted or deforms with the movement of electronic equipment,
Can promptly it recover to original shape, so as to reduce heat-conducting pad damage and the risk to come off from electronic equipment.
Embodiment
The technical solution in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only the part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this area is general
Logical technical staff all other embodiments obtained without creative efforts, belong to what the present invention protected
Scope.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining the relative position relation under a certain particular pose between each component, motion conditions etc., if the particular pose occurs
During change, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is only used for description purpose, and it is not intended that referring to
Show or imply its relative importance or imply the quantity of the technical characteristic indicated by indicating.Thus, " first ", " are defined
At least one this feature can be expressed or be implicitly included to two " feature.In addition, the technical solution between each embodiment can
To be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical solution occurs
Conflicting or can not realize when, will be understood that the combination of this technical solution is not present, also not in the protection model of application claims
Within enclosing.
The present invention provides a kind of preparation method of heat-conducting pad, comprises the following steps：
By weight, there is provided 750~800 parts of vinyl silicone oil and 200~250 parts of methyl vinyl silicone rubber, will
Vinyl silicone oil and methyl vinyl silicone rubber are put into kneader, the temperature of heating ethylene base silicone oil and methyl vinyl silicone rubber
5~the 20Hz of rotating speed for for 80~100 DEG C, adjusting kneader is spent, is mediated 60~90 minutes, uniformly to mix the vinyl silicone oil
And methyl vinyl silicone rubber, obtain colloid mixture；
3600~4000 parts of alumina particles are provided, alumina particle are added in kneader in three times, to kneader
Vacuumize process is carried out, continues kneading 60~90 minutes, equably to mix the alumina particle and colloid mixture, is mixed
Close material；
9.5~10 parts of platinum catalysts are provided, treat that above-mentioned mixture is cooled to room temperature, using homogenizer or kneader
Mix the platinum catalyst and mixture 15~40 minutes, obtain base-material；
Calendering process and curing process are carried out successively to the base-material, obtain heat-conducting pad.
Platinum catalyst is the platinum water after dilution, platinum after being diluted using deionized water, the quality of platinum and water
Than that can be 1:1000.
The calendering process can be：Base-material is coated using coating film, the base-material coated with calender to coating film is pressed
Prolong processing so that base-material forms laminated structure.
The curing process is：Curing process, the curing process are carried out to the base-material at a temperature of 130~150 DEG C
Time be 10~120 minutes.
When base-material is heated to 130~150 DEG C, or when base-material and platinum catalyst are both heated to 130~150 DEG C, second
Vinyl mutually reactive in alkenyl silicone oil, and vinyl silicone oil can also polymerize with methyl vinyl silicone rubber, so as to be formed
Heat-conducting pad.
Technical solution of the present invention mixes vinyl silicone oil and methyl vinyl silicone rubber and alumina particle so that is made
Heat-conducting pad not only there is heat conduction, but also there is preferable resilience and structural strength.Specifically, vinyl silicone oil and
Under the action of platinum catalyst polymerisation can occur for methyl vinyl silicone rubber, tridimensional network be formed, due to methyl
Vinylsiloxane rubber has high resiliency so that obtained heat-conducting pad not only has preferable resilience, also has preferably knot
Structure intensity, such as tensile strength and elongation at break.Moreover, the heat-conducting pad by vinyl silicone oil, alumina particle and
Methyl vinyl silicone rubber is made, and heat-conducting pad is had preferable resilience and structure without adding excessive functional stuffing
Intensity, the proportion of the vinyl silicone oil, alumina particle and methyl vinyl silicone rubber are little so that heat-conducting pad also has
The advantages of proportion is small.
The heat-conducting pad of the present invention is applied to electronic equipment, when electronic equipment is kept in motion, heat-conducting pad can
Play the role of buffer protection to electronic equipment, when heat-conducting pad is distorted or deforms with the movement of electronic equipment,
Can promptly it recover to original shape, so as to reduce heat-conducting pad damage and the risk to come off from electronic equipment.
The content of the methyl vinyl silicone rubber medium vinyl is 0.06~0.1%.
It should be understood that the methyl vinyl silicone rubber medium vinyl content is 0.06%, 0.07%, 0.08%,
0.09%th, 0.1% etc..
Methyl vinyl silicone rubber is that one kind has elastomeric polymeric material.
The methyl vinyl silicone rubber of technical solution of the present invention has high resiliency, can have obtained heat-conducting pad preferable
Elasticity and structural strength.
The particle size range of the alumina particle is 15~20 μm.
The particle size range of the alumina particle is 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm etc..
It should be understood that it is 3.9g/cm that aluminium oxide, which has characteristic, its density such as hard, wear-resisting, stable chemical performance,3。
Technical solution of the present invention, alumina particle is filled in vinyl silicone oil, forms packing structure, alumina particle
Particle size range be 15~20 μm so that the loading and bulk density of alumina particle are larger, improve leading for heat-conducting pad
Thermal effect.Due to the formation of packing structure, and alumina particle is scattered in vinyl silicone oil and methyl vinyl silicone rubber polymerization
In the net structure of formation so that alumina particle is difficult to come off from heat-conducting pad, which is less prone to dry linting
Phenomenon so that the stability of heat-conducting pad is also preferable, has longer life in application.
Moreover, aluminium oxide has anti-flammability, when having more aluminium oxide in heat-conducting pad, which also has
Preferable anti-flammability.Further, since aluminium oxide has insulating properties so that heat-conducting pad also has preferable insulation effect.
Institute's alumina particle has spherical structure, spherical structure or irregular structure.
There is alumina particle spherical structure to refer to the structure of alumina particle similar to spherical.
The alumina particle of technical solution of the present invention has spherical structure, spherical structure or irregular structure, in favor of
Packing structure is formed between alumina particle, improves the loading and bulk density of the alumina particle of heat-conducting pad.
The vinyl silicone oil medium vinyl content is 0.5~1%.
It should be understood that the vinyl silicone oil medium vinyl content is 0.5%, 0.6%, 0.7%, 0.8%, 0.9%,
Or 1% etc..
Polymerisation can occur for the vinyl in the vinyl silicone oil of technical solution of the present invention, form netted silica gel structure.
Since vinyl silicone oil medium vinyl content is 0.5~1%, vinyl silicone oil can fully react so that in heat-conducting pad not
There are, there are a small amount of vinyl silicone oil, but a small amount of existing vinyl silicone oil is bound by vinyl silicone oil, or heat-conducting pad
It is difficult to overflow in the structure of net structure so that the oil yield of heat-conducting pad is relatively low.
It is further comprising the steps of when mixing the alumina particle and colloid mixture：
900~1000 parts of fire retardant is added in the kneader equipped with the alumina particle and colloid mixture, is obtained
Mixture.
It should be understood that the fire retardant can be added in kneader in three times, vacuumize process is carried out to kneader,
Continue kneading 60~90 minutes, equably to mix the alumina particle and colloid mixture and fire retardant, obtain mixture；
The fire retardant is preferably halogen-free flame retardants.Smoke amount is small when halogen-free flame retardants burns, and does not produce poisonous, corrosivity
Gas so that heat-conducting pad has the feature of environmental protection.
Halogen-free flame retardants is divided into halogen-free inorganic flame retardant and non-halogen organic flame retardants.
Halogen-free inorganic flame retardant phosphorus series non-halogen fire retardant, phosphorous-nitrogen system bittern-free fire retardant, inorganic combustion inhibitor
Phosphorus series non-halogen fire retardant, i.e. DOPO (that is, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) is derivative
Thing, its polyphenol hydroxyl or polyamino derivative are used as the platinum catalyst of high polymer, by their cured asphalt mixtures modified by epoxy resin of institute
The performance of fat is very different with brominated epoxy resin, and especially difference is obvious in terms of anti-flammability, heat endurance.
Phosphorous-nitrogen system bittern-free fire retardant further includes expanding halide-free fire-retardant, e.g., poly- ammonium polyphosphate, melamine, intumescent
Graphite, melamine phosphate, zinc borate, triglycidyl group chlorinated isocyanurates.Expanding halide-free fire-retardant is mainly by solidifying
Rephasing plays a role.
Inorganic combustion inhibitor can be aluminium hydroxide, magnesium hydroxide, expansible graphite or ammonium polyphosphate.
Aluminium hydroxide has the function of fire-retardant, smoke elimination, filling three in itself, nontoxic because its is non-volatile, and can be with many kinds of substance
Cooperative flame retardant effect is produced, is known as nuisanceless inorganic combustion inhibitor.Magnesium hydroxide have low cigarette, it is nontoxic, combustion process can be neutralized
In acidity, corrosive gas the characteristics of, therefore be a kind of environment-friendly fire retardant.
Expansible graphite primarily serves following effect during fire-retardant：(1) tough and tensile layer of charcoal is formed in Polymer Surface,
Combustible and heat source are separated；(2) largely absorb heat in expansion process, reduce the temperature of system；(3) released in expansion process
The acid ion in interlayer is put, promotes dehydration carbonization, and the free radical for burning and producing can be combined so as to middle chain-breaking reaction.It is inflatable
Graphite is used in combination with phosphorus compound, metal oxide, can produce coordinative role, adds on a small quantity with regard to that can reach fire-retardant purpose.
Ammonium polyphosphate is a kind of inorganic combustion inhibitor of good performance, is the more active research field of phosphorus flame retardant, its
Appearance is white powder, decomposition temperature>256 DEG C, for the degree of polymerization between 10 and 20 to be water miscible, the degree of polymerization is more than 20 indissoluble
Yu Shui.Ammonium polyphosphate is more inexpensive than organic fire-retardant, and toxicity is low, and heat endurance is good, can individually or with other fire retardants are compound is used for
Flame retardant of plastic.Under high temperature, ammonium polyphosphate resolves into rapidly ammonia and polyphosphoric acid, and the oxygen that ammonia can be diluted in gas phase is dense
Degree, so as to play a part of to prevent burning.Polyphosphoric acid is strong dehydrating agent, and polymer dehydration carbonization can be made to form layer of charcoal, isolation polymerization
Contact of the thing with oxygen, plays a part of to prevent burning in solid phase.
Non-halogen organic flame retardants may include phosphorus flame retardant.Phosphorus flame retardant mainly has phosphate, phosphonate ester and phosphine oxide
And heterocyclic etc..
Phosphate flame retardant may include tricresyl phosphate, triphenyl phosphate, phosphoric acid tri-isopropyl benzene ester, tributyl phosphate,
Trioctyl phosphate, cresyl diphenyl phosphate, three (1- oxo -1- phosphas -2,6,7- trioxa-l-phosphabicyclos [2,2,2] octane -4-
Methylene) phosphate (Trimer) and 1- oxygen -4- methylols -2,6,7- trioxa -1- phosphabicyclos [2,2,2] octane (PEPA)
Deng.
Phosphonate fire retardant may include N- methylol Propionamides methyl phosphonates, phosphonate ester, N in ring, N- p-phenylenediamine
Base (2- hydroxyls) dibenzyl phosphonic acids tetra-ethyl ester, dimethyl methyl phosphonate (DMMP).
Organic phosphorous heterocylic compound is one of field very active in fire retardant research, mainly there is five-membered ring, hexatomic ring
And volution compound.Wherein five-variant connection number fire retardant is of less types, is generally used for the resistance of polyester and polyamide and polyolefin
Combustion；Hexa-member heterocycle occupies leading position in phosphorus heterocycle fire retardant, mainly there is phospha phosphine oxide, phosphate, young laying ducks in cage, phosphine
Acid esters and phosphite ester etc., the flame retardant treatment available for multiple materials such as polyester, epoxy resin and polyurethane.Phosphorus loop coil fire retardant
Most of reacted by pentaerythrite and phosphorus compound is made, and generally all contains a large amount of carbon in molecule, phosphorous containing 2 phosphorus atoms
Amount is high, and good flame retardation effect, can be used as expansion type flame retardant, play plasticising, thermostabilization and fire-retardant effect in the material.
Contain fire retardant in the heat-conducting pad of technical solution of the present invention so that the heat-conducting pad has flame retardant effect.
It is further comprising the steps of before carrying out calendering process to base-material after obtaining base-material：
9.5~10 parts of delayed-action activators are provided, mix the base-material and delayed-action activator.
The delayed-action activator is selected from t etram-ethyltetravinylcyclotetrasiloxane, 1- acetenyl -1- cyclohexanol, 2- methyl -3- fourths
Alkynyl -2- alcohol, 2- methyl isophthalic acids-hexin base -3- alcohol, 3,5- dimethyl -1- hexin base -3- alcohol, 3,7,11- trimethyl -1- 12
At least one of alkynyl -3- alcohol, maleic acid diethyl allyl ester, allyl glycidyl ether and diethylene glycol divinyl ether.
The delayed-action activator can be such that vinyl silicone oil and methyl vinyl silicone rubber does not hand over for a long time for (20 DEG C) at normal temperatures
Quick cross-linking when joining or delay is crosslinked, and reaching certain temperature, it is ensured that add before curing, in vinyl silicone oil enough
Filler and be sufficiently mixed.
It is further comprising the steps of before carrying out calendering process to base-material after obtaining the base-material：
Vacuumize process is carried out to the base-material, to remove the air in base-material, the time of the vacuumize process is 15
~30 minutes.
Embodiment one：
By weight, there is provided 750 parts of vinyl silicone oil and 200 parts of methyl vinyl silicone rubber, by vinyl silicone oil
It is put into methyl vinyl silicone rubber in kneader, the temperature of heating ethylene base silicone oil and methyl vinyl silicone rubber is 80 DEG C,
The rotating speed 5Hz of kneader is adjusted, mediates 60 minutes, uniformly to mix the vinyl silicone oil and methyl vinyl silicone rubber, obtains
To colloid mixture, wherein vinyl silicone oil medium vinyl content is 0.5%, the methyl vinyl silicone rubber medium vinyl content
For 0.06%；
The alumina particle that 3600 parts of particle diameters are 15 μm is provided, alumina particle is added in kneader, to kneader
Vacuumize process is carried out, continues to mediate 60 minutes, equably to mix the alumina particle and colloid mixture, is mixed
Material, wherein, alumina particle has spherical structure.
9.5 parts of platinum catalysts are provided, treat that above-mentioned mixture is cooled to room temperature, the platinum is mixed using homogenizer
Catalyst and mixture 15 minutes, obtain base-material；
Base-material is coated using coating film, calendering process is carried out to base-material with calender, forms laminated structure；
Curing process is carried out to the base-material, obtains heat-conducting pad.The curing process is：It is right at a temperature of 130 DEG C
The base-material carries out curing process, and the time of the curing process is 60 minutes.
Embodiment two：
By weight, there is provided 770 parts of vinyl silicone oil and 210 parts of methyl vinyl silicone rubber, by vinyl silicone oil
It is put into methyl vinyl silicone rubber in kneader, the temperature of heating ethylene base silicone oil and methyl vinyl silicone rubber is 90 DEG C,
The rotating speed 15Hz of kneader is adjusted, mediates 70 minutes, uniformly to mix the vinyl silicone oil and methyl vinyl silicone rubber, obtains
To colloid mixture, wherein the vinyl silicone oil medium vinyl content is 0.6%, the methyl vinyl silicone rubber medium vinyl
Content is 0.08%；
The alumina particle and 900 parts of aluminium hydroxide that 3800 parts of particle diameters are 18 μm are provided, by alumina particle and hydrogen-oxygen
Change aluminium to be added in kneader in three times, vacuumize process is carried out to kneader, continue to mediate 80 minutes, equably to mix institute
Alumina particle and aluminium hydroxide and colloid mixture are stated, obtains mixture, wherein, alumina particle has irregular structure；
9.6 parts of platinum catalysts are provided, treat that above-mentioned mixture is cooled to room temperature, the platinum is mixed using homogenizer
Catalyst and mixture 20 minutes, obtain base-material；
Vacuumize process is carried out to base-material；
Base-material is coated using coating film, calendering process is carried out to base-material with calender, forms laminated structure；
Curing process is carried out to the base-material, obtains heat-conducting pad.The curing process is：It is right at a temperature of 150 DEG C
The base-material carries out curing process, and the time of the curing process is 20 minutes.
Embodiment three：
By weight, there is provided 800 parts of vinyl silicone oil and 250 parts of methyl vinyl silicone rubber, by vinyl silicone oil
It is put into methyl vinyl silicone rubber in kneader, the temperature of heating ethylene base silicone oil and methyl vinyl silicone rubber is 100 DEG C,
The rotating speed 20Hz of kneader is adjusted, mediates 90 minutes, uniformly to mix the vinyl silicone oil and methyl vinyl silicone rubber, obtains
To colloid mixture, wherein vinyl silicone oil medium vinyl content is 1%, and the methyl vinyl silicone rubber medium vinyl content is
0.1%；
The alumina particle and 1000 parts of aluminium hydroxide that 4000 parts of particle diameters are 20 μm are provided, by alumina particle and hydrogen-oxygen
Change aluminium to be added in kneader in three times, vacuumize process is carried out to kneader, continue to mediate 90 minutes, equably to mix institute
Alumina particle, aluminium hydroxide and colloid mixture are stated, obtains mixture；Wherein, alumina particle has spherical structure；
Mixture is cooled to room temperature, t etram-ethyltetravinylcyclotetrasiloxane is added into kneader, is mediated 30 minutes,
To mix mixture and t etram-ethyltetravinylcyclotetrasiloxane；
10 parts of platinum catalysts are provided, treat that above-mentioned mixture and t etram-ethyltetravinylcyclotetrasiloxane are cooled to room temperature,
The platinum catalyst and mixture and t etram-ethyltetravinylcyclotetrasiloxane are mixed 40 minutes using homogenizer, obtained
Base-material；
Base-material is coated using coating film, calendering process is carried out to base-material with calender, forms laminated structure；
Curing process is carried out successively to the base-material, obtains heat-conducting pad.The curing process is：In 140 DEG C of temperature
Under curing process is carried out to the base-material, time of the curing process is 50 minutes.
The present invention also provides the heat-conducting pad obtained by the preparation method as above-mentioned heat-conducting pad.
Since the heat-conducting pad employs whole technical solutions of above-mentioned all embodiments, at least there is above-mentioned implementation
All beneficial effects caused by the technical solution of example, this is no longer going to repeat them.
The physical property of the heat-conducting pad of the present invention meets 20671 non-metallic gasket index requests of GB/T.
The tensile strength of the heat-conducting pad, elongation at break, thermal conductivity, anti-flammability and hardness are tested, tested
As a result table 1 is joined：
1 heat-conducting pad test result of table
| Detection project | Execution standard | Index request | Examinations result |
| Tensile strength | ASTM D412 | ≥0.6MPa | 4.0MPa |
| Elongation at break/% | ASTM D412 | ≥200 | 975 |
| Thermal conductivity/W/mK | ASTM D5470 | ≥0.8 | 1.0 |
| Anti-flammability | UL94 | V0 | V0 |
| Tearing strength | ASTM D624 | ≥2KN/M | 4.5KN/M |
| Hardness/shore C | ASTM D2240 | 30-40 | 35 |
Test result shows, heat-conducting pad of the invention have preferable tensile strength, elongation at break, tearing strength,
Thermal conductivity and anti-flammability.And the hardness of the heat-conducting pad is moderate.
The present invention also provides a kind of electronic device, including housing, the heat generating member that is contained in the housing and above-mentioned heat conductive pad
Piece, the heat-conducting pad are located between housing and heat generating member.
Since the electronic device employs whole technical solutions of above-mentioned all embodiments, at least there is above-mentioned implementation
All beneficial effects caused by the technical solution of example, this is no longer going to repeat them.
It should be understood that the electronic device can be automobile, mobile phone, tablet computer, laptop, LED light etc..
The heat generating member can be battery component, circuit board, display screen etc..
The electronic device may also include the heat sink being contained in housing, which is arranged on heat generating member with to fever
Part radiates.The heat-conducting pad can be located between heat generating member and heat sink, so that heat is transferred to heat dissipation from heat generating member
Part.
It these are only the preferred embodiment of the present invention, be not intended to limit the scope of the invention, it is every in the present invention
Inventive concept under, the equivalent structure transformation made using present specification is directly or indirectly used in other phases
The technical field of pass is included in the scope of patent protection of the present invention.
Claims (10)
1. a kind of preparation method of heat-conducting pad, comprises the following steps：
By weight, there is provided 750~800 parts of vinyl silicone oil and 200~250 parts of methyl vinyl silicone rubber, mix institute
Vinyl silicone oil and methyl vinyl silicone rubber are stated, obtains colloid mixture；
3600~4000 parts of alumina particles are provided, the alumina particle and colloid mixture is mixed, obtains mixture；
9.5~10 parts of platinum catalysts are provided, the platinum catalyst and mixture is mixed, obtains base-material；
Calendering process and curing process are carried out successively to the base-material, obtain heat-conducting pad.
2. the preparation method of heat-conducting pad as claimed in claim 1, it is characterised in that second in the methyl vinyl silicone rubber
The content of alkenyl is 0.06~0.1%.
3. the preparation method of heat-conducting pad as claimed in claim 1, it is characterised in that the particle size range of the alumina particle
For 15~20 μm；And/or the alumina particle has spherical structure, spherical structure or irregular structure.
4. the preparation method of heat-conducting pad as claimed in claim 1, it is characterised in that the vinyl silicone oil medium vinyl contains
Measure as 0.5~1%.
5. such as the preparation method of Claims 1-4 any one of them heat-conducting pad, it is characterised in that mix the aluminium oxide
It is further comprising the steps of when particle and colloid mixture：
900~1000 parts of fire retardant is added in the alumina particle and colloid mixture, obtains mixture.
6. such as the preparation method of Claims 1-4 any one of them heat-conducting pad, it is characterised in that after obtaining base-material, to base
It is further comprising the steps of before material carries out calendering process：
9.5~10 parts of delayed-action activators are provided, mix the base-material and delayed-action activator.
7. the preparation method of heat-conducting pad as claimed in claim 6, it is characterised in that the delayed-action activator is selected from tetramethyl tetrem
Alkenyl cyclotetrasiloxane, 1- acetenyl -1- cyclohexanol, 2- methyl -3- butynyl -2- alcohol, 2- methyl isophthalic acids-hexin base -3- alcohol, 3,
5- dimethyl -1- hexin base -3- alcohol, 3,7,11- trimethyl -1- dodecyne base -3- alcohol, maleic acid diethyl allyl ester, pi-allyl
At least one of glycidol ether and diethylene glycol divinyl ether.
8. such as the preparation method of Claims 1-4 any one of them heat-conducting pad, it is characterised in that after obtaining the base-material,
It is further comprising the steps of before carrying out calendering process to base-material：
Vacuumize process is carried out to the base-material, the time of the vacuumize process is 15~30 minutes.
A kind of 9. heat-conducting pad as obtained by the preparation method of claim 1-8 any one of them heat-conducting pads.
10. a kind of electronic device, it is characterised in that including housing, the heat generating member being contained in the housing and such as claim 9
The heat-conducting pad, the heat-conducting pad are located between housing and heat generating member.
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| CN201711415010.1A CN107974090A (en) | 2017-12-21 | 2017-12-21 | Heat-conducting pad and preparation method thereof, electronic device |
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| CN201711415010.1A CN107974090A (en) | 2017-12-21 | 2017-12-21 | Heat-conducting pad and preparation method thereof, electronic device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112778767A (en) * | 2020-12-29 | 2021-05-11 | 深圳德邦界面材料有限公司 | High-temperature-resistant asphalt heat-conducting gasket and preparation method thereof |
| CN116120890A (en) * | 2023-02-23 | 2023-05-16 | 东莞市富颖电子材料有限公司 | Heat-conducting adhesive tape and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011178821A (en) * | 2010-02-26 | 2011-09-15 | Shin-Etsu Chemical Co Ltd | Heat conductive silicone composition and cured product of the same |
| CN103436019A (en) * | 2013-08-23 | 2013-12-11 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conductivity electric-insulation heat-conducting silica gel gasket and preparation method thereof |
| CN107057371A (en) * | 2017-05-19 | 2017-08-18 | 深圳市德镒盟电子有限公司 | A kind of low-density heat conductive silica gel pad and preparation method thereof |
-
2017
- 2017-12-21 CN CN201711415010.1A patent/CN107974090A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011178821A (en) * | 2010-02-26 | 2011-09-15 | Shin-Etsu Chemical Co Ltd | Heat conductive silicone composition and cured product of the same |
| CN103436019A (en) * | 2013-08-23 | 2013-12-11 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conductivity electric-insulation heat-conducting silica gel gasket and preparation method thereof |
| CN107057371A (en) * | 2017-05-19 | 2017-08-18 | 深圳市德镒盟电子有限公司 | A kind of low-density heat conductive silica gel pad and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112778767A (en) * | 2020-12-29 | 2021-05-11 | 深圳德邦界面材料有限公司 | High-temperature-resistant asphalt heat-conducting gasket and preparation method thereof |
| CN116120890A (en) * | 2023-02-23 | 2023-05-16 | 东莞市富颖电子材料有限公司 | Heat-conducting adhesive tape and preparation method thereof |
| CN116120890B (en) * | 2023-02-23 | 2023-08-18 | 东莞市富颖电子材料有限公司 | Heat-conducting adhesive tape and preparation method thereof |
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Application publication date: 20180501 |