CN107961053A - Implant transport system and its application method - Google Patents
Implant transport system and its application method Download PDFInfo
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- CN107961053A CN107961053A CN201610916700.4A CN201610916700A CN107961053A CN 107961053 A CN107961053 A CN 107961053A CN 201610916700 A CN201610916700 A CN 201610916700A CN 107961053 A CN107961053 A CN 107961053A
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- 239000007943 implant Substances 0.000 title claims abstract description 102
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 42
- 239000010410 layer Substances 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 16
- 229910001220 stainless steel Inorganic materials 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 4
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 3
- HLXZNVUGXRDIFK-UHFFFAOYSA-N nickel titanium Chemical compound [Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni] HLXZNVUGXRDIFK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052702 rhenium Inorganic materials 0.000 claims description 3
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 10
- 239000004810 polytetrafluoroethylene Substances 0.000 description 10
- 206010002329 Aneurysm Diseases 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 5
- 239000008280 blood Substances 0.000 description 4
- 210000004369 blood Anatomy 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 210000001124 body fluid Anatomy 0.000 description 3
- 239000010839 body fluid Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
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- 201000010099 disease Diseases 0.000 description 3
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- 239000003292 glue Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- 201000008450 Intracranial aneurysm Diseases 0.000 description 2
- 229920002614 Polyether block amide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000004323 axial length Effects 0.000 description 2
- 230000017531 blood circulation Effects 0.000 description 2
- 210000004204 blood vessel Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010102 embolization Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000001356 surgical procedure Methods 0.000 description 2
- 206010010356 Congenital anomaly Diseases 0.000 description 1
- 208000005189 Embolism Diseases 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 210000001367 artery Anatomy 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000001627 cerebral artery Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003073 embolic effect Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/12—Surgical instruments, devices or methods, e.g. tourniquets for ligaturing or otherwise compressing tubular parts of the body, e.g. blood vessels, umbilical cord
- A61B17/12022—Occluding by internal devices, e.g. balloons or releasable wires
- A61B17/12099—Occluding by internal devices, e.g. balloons or releasable wires characterised by the location of the occluder
- A61B17/12109—Occluding by internal devices, e.g. balloons or releasable wires characterised by the location of the occluder in a blood vessel
- A61B17/12113—Occluding by internal devices, e.g. balloons or releasable wires characterised by the location of the occluder in a blood vessel within an aneurysm
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/12—Surgical instruments, devices or methods, e.g. tourniquets for ligaturing or otherwise compressing tubular parts of the body, e.g. blood vessels, umbilical cord
- A61B17/12022—Occluding by internal devices, e.g. balloons or releasable wires
- A61B17/12131—Occluding by internal devices, e.g. balloons or releasable wires characterised by the type of occluding device
- A61B17/1214—Coils or wires
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/12—Surgical instruments, devices or methods, e.g. tourniquets for ligaturing or otherwise compressing tubular parts of the body, e.g. blood vessels, umbilical cord
- A61B17/12022—Occluding by internal devices, e.g. balloons or releasable wires
- A61B2017/1205—Introduction devices
- A61B2017/12054—Details concerning the detachment of the occluding device from the introduction device
- A61B2017/12063—Details concerning the detachment of the occluding device from the introduction device electrolytically detachable
Landscapes
- Health & Medical Sciences (AREA)
- Surgery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- Medical Informatics (AREA)
- Vascular Medicine (AREA)
- Reproductive Health (AREA)
- Engineering & Computer Science (AREA)
- Veterinary Medicine (AREA)
- Heart & Thoracic Surgery (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Molecular Biology (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Neurosurgery (AREA)
- Surgical Instruments (AREA)
- Prostheses (AREA)
Abstract
The present invention provides a kind of implant transport system and its application method, implant transport system includes release, electrolysis means, push rod and microtubular, and it is arranged at the conductive layer on microtubular, one electrode tip of release is electrically connected with push rod, and another electrode tip of release is electrically connected with conductive layer.It is used as implant by adding conductive layer on microtubular and frees a required electrode tip, also it is delivered to while microtubular conveys implant using as the conductive layer of electrode tip in solion, when electrolysis means are contacted with solion and release is powered, circuit is formed between conductive layer and push rod, electrolysis means are electrolysed in solion so that implant is freed with push rod.The present invention avoids injuring caused by patient as electrode tip using conductive pin, and it is ailing to reduce operation；And form circuit and take short and stablize, improve implant frees efficiency；Conductive pin need not be additionally used at the same time, also makes operation more simplified.
Description
Technical field
The present invention relates to the field of medical instrument technology, more particularly to a kind of implant transport system and its application method.
Background technology
Aneurysm is due to that disease, damage or the factor such as congenital cause local weakness, should under the impact of long-term blood flow
It is outstanding to locate the weak spot of arterial wall, gradually expansion, form the cryptomere bulging of circular, ellipse or prismatic.
The method of interventional treatment intracranial aneurysm is very much, mainly there is the close net stent of the reconstructing blood vessel carried out on parent artery
Embolization in art and aneurysm cavity.And embolic implant (such as spring coil) is current treatment aneurysm in aneurysm cavity
Main method.
Guglielmi in 1991 etc. reports GDC embolization of intracranial aneurysm first.The implant material of GDC distal ends is
Platinum, it is connected with push rod, and implant is imported blood vessel and is transported to the aneurysm of tortuous complicated cerebral artery by microtubular
Diseased region, the de- implant filling aneurysm knurl chamber of GDC electrolysis are punctured by couple, implant and push rod connected component
Molten disconnected because of electrolysis, implant is freed and stayed in aneurysm knurl intracavitary, so as to prevent blood flow from flowing into aneurysm.
Please refer to Fig.1, its structure diagram freed for existing implant with push rod.As shown in Figure 1, release 1 '
Cathode be connected with push rod 5 ', the anode of release 1 ' is connected with conductive pin 6 ', due between implant 3 ' and push rod 5 '
Electrolysis means 4 ' be easy to be electrolysed and divided when powered in the presence of solion 7 ' (such as blood or other body fluid),
When electrolysis means 4 ' are left and in the solion from microtubular (not shown) distal end, and conductive pin 6 ' is inserted into patient
In the case of skin, the power supply of release 1 ' is opened, push rod 5 ' is formed into a loop with conductive pin 6 ', and electrolysis means 4 ' are due to electrolysis
And divide, implant 3 ' is freed and stayed in aneurysm.
But freeing for implant and push rod is realized based on the above method, conductive pin needs to be inserted into patient skin, to disease
People brings pain, and user experience effect is poor, in addition, it is longer and unstable the time required to forming circuit, add surgical
Operating procedure and difficulty.
The content of the invention
It is an object of the invention to provide a kind of implant transport system and its application method, with solve to realize implant with
Push rod is freed, and conductive pin need to be inserted into patient skin, push rod is formed circuit with conductive pin, be there is forming circuit and is taken
Between it is longer and unstable, user experience is ineffective, the problem of adding surgical procedure difficulty.
In order to solve the above technical problems, the present invention provides a kind of implant transport system, the implant transport system bag
Include：Release, electrolysis means, push rod, microtubular and the conductive layer being arranged on the microtubular, the implant, electrolysis
Component and push rod are sequentially connected and are placed in the microtubular, and an electrode tip and the push rod of the release are electrically connected
Connect, another electrode tip of the release is electrically connected with the conductive layer.
Optionally, in the implant transport system, the conductive layer be arranged at the microtubular outer surface or
On inner surface.
Optionally, in the implant transport system, the microtubular includes at least two layers of tube wall, the conductive layer
It is arranged in the interlayer between at least two layers of tube wall, expose portion is provided with the outer surface of the microtubular or inner surface
The groove of the conductive layer.
Optionally, in the implant transport system, the groove is arranged at the distal end of the microtubular.
Optionally, in the implant transport system, the groove is along the axial length of the microtubular
0.01mm~2mm.
Optionally, in the implant transport system, filled with conductive developing material in the groove.
Optionally, in the implant transport system, the conductive developing material for platinum group metal, rhenium, tungsten,
One or more of alloys in tantalum, gold or silver.
Optionally, in the implant transport system, the conductive layer includes leads described in conductive core and wrapping portion
The insulating materials of battery core.
Optionally, in the implant transport system, the conductive core is conductive filament, contact tube or conductive mesh, institute
Contact tube or conductive mesh is stated to be wound or worked out by conductive filament.
Optionally, in the implant transport system, the material of the conductive core is in stainless steel, tungsten, gold or silver
One or more alloys.
Optionally, in the implant transport system, the implant is spring coil.
Optionally, in the implant transport system, the material of the push rod is 304V stainless steels, 316LVM not
Become rusty steel or Nitinol.
The present invention also provides a kind of application method of implant transport system, including：
The distal end of the microtubular is delivered to precalculated position, the precalculated position is in solion；
The push rod is controlled to promote the electrolysis means and the implant to pass through the microtubular, until the electrolysis
Component and the implant are pierced by from the distal end of the microtubular and are exposed in the solion；
Start the release, be formed into a loop between the conductive layer and the push rod；
The electrolysis means are electrolysed in the solion so that the implant is freed with the push rod.
Optionally, in the application method of the implant transport system, the operating current of the release is 0.5mA
~4.0mA.
In implant transport system provided by the present invention and its application method, the implant transport system includes solution
De- device, electrolysis means, push rod and microtubular, and the conductive layer being arranged on the microtubular, the microtubular are used to hold
Put sequentially connected implant, electrolysis means and push rod；One electrode tip of the release is electrically connected with the push rod, institute
Another electrode tip for stating release is electrically connected with the conductive layer.It is used as implant by adding conductive layer on microtubular to free
A required electrode tip, also solion is delivered to while microtubular conveys implant using as the conductive layer of electrode tip
In, when electrolysis means are contacted with solion and release is powered, circuit, electrolysis means are formed between conductive layer and push rod
It is electrolysed in solion so that implant is freed with push rod.The present invention is avoided using conductive pin as electrode tip to patient
Caused by injury, it is ailing to reduce operation；And form circuit and take short and stablize, improve implant frees efficiency；At the same time
Conductive pin need not be additionally used, also makes operation more simplified.
Brief description of the drawings
Fig. 1 is the structure diagram that existing implant is freed with push rod；
Fig. 2 is the structure diagram of implant transport system when conductive layer is conductive filament in the embodiment of the present invention one；
Fig. 3 is the structure diagram of implant transport system when conductive layer is contact tube in the embodiment of the present invention one；
Fig. 4 is the structure diagram of implant transport system when conductive layer is conductive mesh in the embodiment of the present invention one；
Fig. 5 is the level-one loop construction schematic diagram of implant in the embodiment of the present invention one；
Fig. 6 is the flow chart of the application method of implant transport system in the embodiment of the present invention two.
In Fig. 1：Release 1 '；Implant 3 '；Electrolysis means 4 '；Push rod 5 '；Conductive pin 6 '；Solion (such as blood
Liquid) 7 '；
In Fig. 2-Fig. 6：Release 1；Microtubular 2；Conductive layer 20；Groove 21；Implant 3；Spring coil 30；Electrolysis means
4；Push rod 5.
Embodiment
Implant transport system proposed by the present invention and its application method are made below in conjunction with the drawings and specific embodiments into
One step describes in detail.According to following explanation and claims, advantages and features of the invention will become apparent from.It should be noted that
Attached drawing uses using very simplified form and non-accurate ratio, only of the invention conveniently, lucidly to aid in illustrating
The purpose of embodiment.
Embodiment one
- Fig. 4 is please referred to Fig.2, it is the structure diagram on the implant transport system of the present invention, such as Fig. 2-Fig. 4 institutes
Show, the implant transport system includes：Release 1, electrolysis means 4, push rod 5 and microtubular 2, the implant 3, electrolysis
Component 4 and push rod 5 are sequentially connected and are placed in the microtubular 1, and 3 transport system of implant, which further includes, is arranged at institute
The conductive layer 20 on microtubular 2 is stated, an electrode tip of the release 1 is electrically connected with the push rod 5, the release 1
Another electrode tip is electrically connected with the conductive layer 20.
In the present embodiment, as shown in figs 2-4, the microtubular 2 includes at least two layers of tube wall, and the conductive layer 20 is set
In interlayer between at least two layers of tube wall, expose portion institute is provided with the outer surface of the microtubular 2 or inner surface
The groove of conductive layer 20 is stated, when being powered so as to release 1, conductive layer 20 contacts transmission electricity with solion 7 ' (please referring to Fig.1)
Lotus.Preferably, the groove is arranged at the distal end of the microtubular 2.
The position relationship of the conductive layer 20 and microtubular 2 is not limited to conductive layer as shown in figs 2-4 described micro-
In interlayer between at least two layers of tube wall of conduit 2, it can also be arranged on outer surface or the inner surface of the microtubular 2, its
Principle be using microtubular 2 as carrying conductive layer carrier, so as to microtubular 2 convey implant while also by conductive layer
It is delivered in solion, is freed for implant and an electrode tip is provided.In this way, doctor in surgical procedure is avoided to need using conductive
Pin is inserted into patient skin, mitigates slight illness, improve implant frees efficiency.
In the present embodiment, there is two layers of tube wall with the microtubular, conductive layer is between two layers of tube wall of the microtubular
Interlayer in exemplified by be described in detail.Specifically, in order to meet the needs of implant transport system implantation process development, it is described
The distal end of the outer surface of microtubular is provided with developing ring or development point；Preferably, at the same time meet development the needs of and for
Groove exposes conductive layer to form the demand of electrode tip, and the groove is arranged at the distal end of the outer surface of the microtubular, described
Developing ring or development point are formed by being filled with conductive developing material in a groove, and the developing material selects conductive material,
Such as one or more of alloys in platinum group metal, rhenium, tungsten, tantalum, gold or silver.Wherein, axial length of the groove along microtubular
For 0.01mm~2mm, more preferably 1mm.
In the present embodiment, the conductive layer includes the insulating materials of conductive core and wrapping portion conductive core.Wherein, it is described to lead
Battery core can be conductive filament (as shown in Figure 2), the contact tube (as shown in Figure 3) that is entwined by conductive filament or conductive filament weave and
Into conductive mesh (as shown in Figure 4), the material of the conductive core is one or more alloys in stainless steel, tungsten, gold or silver.
In the present embodiment, the electrolysis means can be with electrolytic separation, to realize freeing for implant and push rod, the plant
Enter thing to be connected with electrolysis means by the macromolecule glue of insulation, typical macromolecule glue is such as：UV glue, epoxy glue.Wherein, electrolysis portion
Electrolytic separation region is reserved on part, the length in the electrolytic separation region is 0.01mm~1mm, is preferably 0.02mm~0.4mm,
More preferably 0.05mm~0.1mm.The push rod is 0.008 inch~0.016 inch of silk chain system by outer diameter
Into, it is more preferred to 0.010 inch~0.014 inch of silk chain is made.The material of the push rod for 304V stainless steels,
316LVM stainless steels or Nitinol, are preferably 304V stainless steels.The surface of push rod is covered with insulating materials, such as poly- four
Vinyl fluoride (PTFE), polyethylene terephthalate (PET), polyetheramides (PEBAX) and polyimides (Polyimide),
Preferably polytetrafluoroethylene (PTFE) (PTFE).
In a preferred embodiment, it is 0.012 inch by outer diameter, material is 304V stainless steels, and outer surface covers
The push rod for having insulating materials to be polytetrafluoroethylene (PTFE) (PTFE), is connected by electrolysis means and implant, wherein, electrolysis means
The length in upper reserved electrolytic separation region is 0.1mm.
In another preferred embodiment, it is 0.010 inch by outer diameter, material is 304V stainless steels, and outer surface covers
Insulating materials is the push rod of polytetrafluoroethylene (PTFE) (PTFE), is connected by electrolysis means and implant, wherein, in electrolysis means
The length in reserved electrolytic separation region is 0.06mm.
In the present embodiment, the implant is spring coil 30.In order to enable implant is while easy to convey implantation
Also meet the various sizes of aneurysmal demand of embolism, spring coil is made in heat treatment on mould by level-one coil here
30, the spring coil 30 can also include multiple head and the tail subcoils connected in sequence successively.Wherein, the spring coil 30
Primary morphology (pattern under natural conditions) is shape of the level-one coil after heat treatment, and the structure of the level-one coil can join
Examine Fig. 5, level-one coil with spring coil 30 be difference lies in the original pattern of level-one coil it is rod-shaped, and spring coil 30 be by
The shape that level-one coil is formed after heat treatment, the primary morphology of usual spring coil 30 is " bulk ", in spring coil
30 depart from automatic recovery primary morphology after push rod.
Embodiment two
Correspondingly, the present embodiment additionally provides a kind of application method of implant transport system.Below with reference to Fig. 6 and Fig. 1-
4 describe the application method of implant transport system described in the present embodiment in detail.
First, perform step S1, by the distal end of the microtubular 2 be delivered to precalculated position (such as aneurysmal disease conjugate
Put), the precalculated position is in solion 7 ' (such as blood or other body fluid).
Then, step S2 is performed, controls the push rod 5 to promote the electrolysis means 4 and the implant 3 described in
Microtubular 2, until the electrolysis means 4 and the implant 3 are pierced by from the distal end of the microtubular 2 and are exposed to the ion
In solution 7 '.
Then, step S3 is performed, starts the release 1, is formed back between the conductive layer 20 and the push rod 5
Road.
Then, step S4, the electrolysis means 4 electrolysis in the solion 7 ' are performed so that the implant 3 with
The push rod 5 is freed.
The process for starting release is the process being powered, and is formed into a loop between the conductive layer and push rod on microtubular, electricity
The part that solution component is exposed in solion 7 ' (such as blood or other body fluid) is electrolysed and is divided, and realizes implant and push
Bar is freed, and implant fills aneurysmal knurl chamber.The operating current of the release is 0.5mA~4.0mA, is preferably 1.0mA
~2.0mA.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
To sum up, in implant transport system provided by the present invention and its application method, the implant transport system
Including release, electrolysis means, push rod and microtubular, and the conductive layer being arranged on the microtubular, the microtubular
For housing sequentially connected implant, electrolysis means and push rod；One electrode tip of the release and push rod electricity
Connection, another electrode tip of the release are electrically connected with the conductive layer.It is used as plant by adding conductive layer on microtubular
Enter thing and free a required electrode tip, be also delivered to while microtubular conveys implant using as the conductive layer of electrode tip
In solion, when electrolysis means are contacted with solion and release is powered, circuit is formed between conductive layer and push rod,
Electrolysis means are electrolysed in solion so that implant is freed with push rod.The present invention is avoided using conductive pin as electrode
End injury caused by patient, it is ailing to reduce operation；And form circuit and take short and stablize, improve implant frees effect
Rate；Conductive pin need not be additionally used at the same time, also makes operation more simplified.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Scope.
Claims (14)
1. a kind of implant transport system, including：Release, electrolysis means, push rod and microtubular, the implant, electrolysis
Component and push rod are sequentially connected and are placed in the microtubular, it is characterised in that further include and be arranged on the microtubular
Conductive layer, an electrode tip of the release is electrically connected with the push rod, another electrode tip of the release with it is described
Conductive layer is electrically connected.
2. implant transport system as claimed in claim 1, it is characterised in that the conductive layer is arranged at the microtubular
On outer surface or inner surface.
3. implant transport system as claimed in claim 1, it is characterised in that the microtubular includes at least two layers of tube wall,
The conductive layer is arranged in the interlayer between at least two layers of tube wall, is set on the outer surface of the microtubular or inner surface
There is the groove of conductive layer described in expose portion.
4. implant transport system as claimed in claim 3, it is characterised in that the groove is arranged at the remote of the microtubular
End.
5. implant transport system as claimed in claim 3, it is characterised in that the groove is long along the axial direction of the microtubular
Spend for 0.01mm~2mm.
6. implant transport system as claimed in claim 3, it is characterised in that filled with conductive development material in the groove
Material.
7. implant transport system as claimed in claim 6, it is characterised in that the conductive developing material is platinum family gold
One or more of alloys in category, rhenium, tungsten, tantalum, gold or silver.
8. the implant transport system as any one of claim 1-7, it is characterised in that the conductive layer includes conduction
The insulating materials of conductive core described in core and wrapping portion.
9. implant transport system as claimed in claim 8, it is characterised in that the conductive core for conductive filament, contact tube or
Conductive mesh, the contact tube or conductive mesh are wound or are worked out by conductive filament.
10. implant transport system as claimed in claim 8, it is characterised in that the material of the conductive core for stainless steel,
One or more alloys in tungsten, gold or silver.
11. implant transport system as claimed in claim 1, it is characterised in that the implant is spring coil.
12. implant transport system as claimed in claim 1, it is characterised in that the material of the push rod is stainless for 304V
Steel, 316LVM stainless steels or Nitinol.
A kind of 13. application method of implant transport system as any one of claim 1 to 12, it is characterised in that
Including：
The distal end of the microtubular is delivered to precalculated position, the precalculated position is in solion；
The push rod is controlled to promote the electrolysis means and the implant to pass through the microtubular, until the electrolysis means
It is pierced by and is exposed in the solion from the distal end of the microtubular with the implant；
Start the release, be formed into a loop between the conductive layer and the push rod；
The electrolysis means are electrolysed in the solion so that the implant is freed with the push rod.
14. the application method of implant transport system as claimed in claim 13, it is characterised in that the work of the release
Electric current is 0.5mA~4.0mA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610916700.4A CN107961053A (en) | 2016-10-20 | 2016-10-20 | Implant transport system and its application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610916700.4A CN107961053A (en) | 2016-10-20 | 2016-10-20 | Implant transport system and its application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107961053A true CN107961053A (en) | 2018-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610916700.4A Pending CN107961053A (en) | 2016-10-20 | 2016-10-20 | Implant transport system and its application method |
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| CN (1) | CN107961053A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113749718A (en) * | 2020-06-05 | 2021-12-07 | 微创神通医疗科技（上海）有限公司 | Release device, release system, release method, and treatment device |
| WO2023098380A1 (en) * | 2021-12-02 | 2023-06-08 | 微创神通医疗科技（上海）有限公司 | Push rod, release device and medical device |
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| US6077260A (en) * | 1998-02-19 | 2000-06-20 | Target Therapeutics, Inc. | Assembly containing an electrolytically severable joint for endovascular embolic devices |
| CN206355094U (en) * | 2016-10-20 | 2017-07-28 | 微创神通医疗科技（上海）有限公司 | Implant induction system |
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| US6059779A (en) * | 1995-04-28 | 2000-05-09 | Target Therapeutics, Inc. | Delivery catheter for electrolytically detachable implant |
| US6077260A (en) * | 1998-02-19 | 2000-06-20 | Target Therapeutics, Inc. | Assembly containing an electrolytically severable joint for endovascular embolic devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113749718A (en) * | 2020-06-05 | 2021-12-07 | 微创神通医疗科技（上海）有限公司 | Release device, release system, release method, and treatment device |
| WO2021244670A1 (en) * | 2020-06-05 | 2021-12-09 | 微创神通医疗科技（上海）有限公司 | Release apparatus, release system, release method, and treatment apparatus |
| CN113749718B (en) * | 2020-06-05 | 2024-01-26 | 微创神通医疗科技（上海）有限公司 | Release device, release system, release method and treatment device |
| WO2023098380A1 (en) * | 2021-12-02 | 2023-06-08 | 微创神通医疗科技（上海）有限公司 | Push rod, release device and medical device |
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