CN107953243B - Polishing pad capable of removing chips quickly - Google Patents
Polishing pad capable of removing chips quickly Download PDFInfo
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- CN107953243B CN107953243B CN201711240524.8A CN201711240524A CN107953243B CN 107953243 B CN107953243 B CN 107953243B CN 201711240524 A CN201711240524 A CN 201711240524A CN 107953243 B CN107953243 B CN 107953243B
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- 238000005498 polishing Methods 0.000 title claims abstract description 110
- 238000012545 processing Methods 0.000 abstract description 20
- 238000007599 discharging Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 239000002002 slurry Substances 0.000 description 10
- 238000003754 machining Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000009471 action Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000002699 waste material Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000003733 optic disk Anatomy 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a polishing pad capable of rapidly discharging chips, which comprises a main chip discharge groove and an auxiliary chip discharge groove, wherein the main chip discharge groove is a divergent groove, the cross section of the groove is in an inverted trapezoid shape, and the groove forms a slightly downward oblique wave from a starting point to an end point; the auxiliary chip removal groove is a spiral groove, the cross section of the groove is rectangular, and the shape of the groove meets a certain mathematical relationship. The invention can realize the quick discharge of the processing scraps, reduce the influence of the scraps on the processing process, improve the surface quality of the workpiece and reduce the damage.
Description
Technical Field
The invention relates to a tool for precision machining, in particular to a polishing pad for chemical mechanical polishing, and specifically relates to a polishing pad capable of rapidly discharging chips.
Background
Chemical Mechanical Polishing (CMP) technology, as the only process that can achieve global planarization, has wide applications in ultra-precision machining of integrated circuits, computer heads, hard disks, optics, and the like.
In the CMP process, material removal from the surface to be processed is mainly achieved by interaction of the polishing liquid with the polishing pad. The polishing solution has the functions of lubricating a processing surface, softening and corroding the processing surface, absorbing the heat of chemical reaction and taking away processing scraps; the polishing pad can transfer mechanical load, maintain polishing environment, mechanically remove workpieces and transport polishing solution.
The grooves on the surface of the polishing pad can transport polishing solution, so that chemical substances on the surface of the processed object can be continuously updated, and the chemical action can be continuously and effectively carried out. The shape and size of the groove are important parameters influencing the flow path and flow speed of the polishing solution, and play an important role in the lubrication and chip removal effects of the polishing solution. The shape of the groove also determines whether the polishing solution can effectively flow to the polishing area in time, and influences the thickness and pressure of a liquid film of the polishing area.
In various chemical mechanical polishing pads, various structures such as closed ring grooves, diverging grooves, spiral grooves, etc. are widely used. Other novel designs, such as the 200810005414.8 patent, provide a polishing pad with grooves for retaining slurry on the pad structure that specifically constrain the groove direction to attempt to retain slurry on the pad surface; patent application No. 200810005426.0 discloses a polishing pad with grooves for reducing slurry consumption, which combines the groove design with the carrier ring design to make the grooves of the two surface portions have coincident characteristics, so as to obtain the effect of reducing slurry consumption; patent application No. 200410036675.8 proposes a polishing pad with optimized grooves and method of use that achieves more uniform CMP performance by unifying the circumferential grooving rate on each radius. The design goals of these polishing pads are often focused on helping to reduce slurry consumption or increase slurry fluidity, and the improvement in slurry fluidity is achieved by changing the shape of the grooves. For example, the divergent groove design facilitates rapid discharge of the slurry, and the closed annular groove enables efficient slurry storage, reduced consumption, and the like.
When the polishing pad surface is grooveless, the resulting fluid film is at its greatest pressure in the center, and such a pressure distribution is detrimental to uniform removal of workpiece material. Furthermore, when the surface of the polishing pad is free of grooves, the shavings generated by the mechanical removal action of the abrasive particles are always pressed in the region to be processed under the common pressure of the polishing pad and the workpiece, and it is difficult to obtain effective removal. In this case, the scraps will continuously exert mechanical action on the surface to be processed in the region to be processed, and scratch the surface of the workpiece.
When slurry flows slowly in the grooves of the polishing pad, it is difficult for debris deposited in the grooves to rapidly leave the region to be processed. In this case, the in-groove dust may be re-introduced into the region to be processed with the rotation of the polishing pad, and may scratch the surface of the workpiece. Therefore, in order to reduce the influence of the waste chips on the machining, it is necessary to increase the speed of discharging the waste chips from the machining area.
Disclosure of Invention
In order to solve the defect that the scraps generated by polishing are difficult to discharge in a processing area in the prior art, so that the scraps continuously scratch the surface of a workpiece, the invention provides the polishing pad capable of discharging the scraps rapidly.
In order to achieve the purpose, the invention adopts the following technical scheme:
a polishing pad capable of rapidly discharging chips comprises a main chip discharge groove and an auxiliary chip discharge groove, wherein the main chip discharge groove consists of 10-14 divergent grooves, and each divergent groove is distributed on the surface of the polishing pad at an equal angle by taking the circle center of the polishing pad as the center;
the auxiliary chip removal grooves consist of 10-14 spiral grooves, and each spiral groove is distributed on the surface of the polishing pad at an equal angle by taking the circle center of the polishing pad as the center.
Furthermore, the section of the main chip removing groove is in an inverted trapezoid shape, the width range of the upper bottom of the section is 2-10mm, and the ratio of the length of the lower bottom of the section to the length of the upper bottom is (0.5-0.8): 1;
the distance between the starting point of the main chip removal groove and the center of the polishing pad is r0/5-r0/4, wherein r0Is the polishing pad radius.
Further, the depth h of the main chip-removing grooves is continuously changed along with the difference of the center distance r of the polishing pad, namely, the main chip-removing grooves form a slightly downward slope from the starting point to the end point, and the depth h of the main chip-removing grooves and the center distance r of the polishing pad satisfy the following relation:
in the formula, r0Radius of polishing pad, h0Is the polishing pad thickness.
Furthermore, the cross section of the auxiliary chip removal groove is rectangular, the width of the cross section ranges from 2 mm to 10mm, the width of the cross section is consistent with the width of the upper bottom of the main chip removal groove, and the ratio of the depth to the width of the cross section is (0.5-0.8): 1.
Further, the shape of the auxiliary chip removal groove satisfies the following relational expression:
x＝r0cosθ-kr0cos(θ/k)
y＝r0sinθ-kr0sin(θ/k)
in the formula, r0The radius of the polishing pad is defined, k is a curve parameter of the auxiliary chip removal groove, and the range of the parameter k is 0.5-0.65;
and the auxiliary chip discharge grooves are connected among the plurality of main chip discharge grooves.
Has the advantages that:
1. the invention utilizes the centrifugal force generated by rotation in the polishing process to the maximum extent through the divergent main chip-discharging groove, so that the waste chips generated by processing can leave the processing area as soon as possible in a continuously accelerated manner. Because the main chip removal groove is a divergent groove, compared with a bent groove, the main chip removal groove has relatively less barrier effect caused by collision with chips, and the chip removal effect of the groove is better.
2. Because the main chip-discharging groove is a divergent groove, although the chip discharging effect in the groove is good, the chip sometimes is difficult to enter the main chip-discharging groove in the machining process. In order to solve the problem, the invention introduces a spiral secondary chip removal groove. Because the spiral auxiliary chip removal groove covers the whole polishing pad and is connected with the main chip removal groove, when the chips on the surface of the polishing pad continuously move towards the outer edge due to the rotating centrifugal force to enter the auxiliary chip removal groove and continuously flow and then enter the main chip removal groove to be rapidly discharged out of a polishing area.
3. The cross section of the main chip removal groove is in an inverted trapezoid shape, so that the chips generated by machining can reach the bottom area of the groove more quickly, and the chips are not easy to return to the machining area again to scratch the surface of a workpiece. In addition, compare in the rectangle slot, trapezoidal slot has better drag reduction effect, can reduce the resistance of slot to polishing solution and sweeps.
4. The primary debris ejection channel defines a slight downward slope from the beginning to the end of the channel that imparts an acceleration of the process debris toward the outer edge of the polishing pad, causing the debris to accelerate continuously away from the polishing region. Moreover, the slope type main chip removal groove can accelerate the flow of polishing liquid in the groove, so that the polishing liquid can rapidly flush the waste chips out of a polishing area, and the polishing liquid is more rapidly updated.
5. Through the combined action of the main chip removal groove and the auxiliary chip removal groove, the polishing liquid on the surface of the polishing pad flows rapidly, and the polishing liquid in a processing area is updated timely. The chemical action of the polishing solution on the workpiece cannot be changed due to the content change of each component in the polishing solution, and the stability of the material removal rate in the processing process is ensured.
Drawings
FIG. 1 is a schematic view of a polishing pad of one embodiment of the present invention;
FIG. 2 is a graph comparing the removal rate of material during use of the polishing pad of the present invention with a conventional polishing pad.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
As shown in fig. 1, the present embodiment provides a polishing pad for rapid chip removal, which includes a main chip removal groove 1 and an auxiliary chip removal groove 2, where the main chip removal groove 1 is composed of 10 to 14 divergent grooves, and each divergent groove is distributed on the surface of the polishing pad at an equal angle with the center of the polishing pad;
the auxiliary chip removal grooves 2 are composed of 10-14 spiral grooves, and each spiral groove is distributed on the surface of the polishing pad at an equal angle by taking the center of the polishing pad as the center.
The invention utilizes the centrifugal force generated by rotation in the polishing process to the maximum extent through the divergent main chip-discharging groove, so that the waste chips generated by processing can leave the processing area as soon as possible in a continuously accelerated manner. Because the main chip removal groove is a divergent groove, compared with a bent groove, the main chip removal groove has relatively less barrier effect caused by collision with chips, and the chip removal effect of the groove is better. Because the main chip-discharging groove is a divergent groove, although the chip discharging effect in the groove is good, the chip sometimes is difficult to enter the main chip-discharging groove in the machining process. In order to solve the problem, the invention introduces a spiral secondary chip removal groove. Because the spiral auxiliary chip removal groove covers the whole polishing pad and is connected with the main chip removal groove, when the chips on the surface of the polishing pad continuously move towards the outer edge due to the rotating centrifugal force to enter the auxiliary chip removal groove and continuously flow and then enter the main chip removal groove to be rapidly discharged out of a polishing area.
On the basis of the technical scheme, the section of the main chip removing groove 1 is in an inverted trapezoid shape, the width range of the upper bottom of the section is 2-10mm, and the ratio of the length of the lower bottom to the length of the upper bottom of the section is (0.5-0.8): 1;
the distance between the starting point of the main chip removal groove 1 and the center of the polishing pad is r0/5-r0/4, wherein r0Is the polishing pad radius.
According to the arrangement, the cross section of the main chip removal groove is in the shape of an inverted trapezoid, so that the processed chips can reach the bottom area of the groove more quickly and are not easy to return to the processing area again to scratch the surface of a workpiece. In addition, compare in the rectangle slot, trapezoidal slot has better drag reduction effect, can reduce the resistance of slot to polishing solution and sweeps.
On the basis of the technical scheme, a slightly downward slope is formed from the starting point to the end point of the main chip discharge groove 1, and the depth h of the main chip discharge groove 1 and the center distance r of the polishing pad satisfy the following relational expression:
in the formula, r0Radius of polishing pad, h0Is the polishing pad thickness.
As set forth above, the primary debris-dislodging grooves form a slight downward slope from the beginning to the end of the groove that imparts an acceleration of the process debris toward the outer edge of the polishing pad, causing the debris to accelerate continuously away from the polishing region. Moreover, the slope type main chip removal groove can accelerate the flow of polishing liquid in the groove, so that the polishing liquid can rapidly flush the waste chips out of a polishing area, and the polishing liquid is more rapidly updated.
On the basis of the technical scheme, the cross section of the auxiliary chip removal groove 2 is rectangular, the width range of the cross section is 2-10mm, the width of the cross section is consistent with the width of the upper bottom of the cross section of the main chip removal groove 1, and the ratio of the depth to the width of the cross section is (0.5-0.8) to 1.
On the basis of the technical scheme, the shape of the auxiliary chip removal groove 2 meets the following relational expression:
x＝r0cosθ-kr0cos(θ/k)
y＝r0sinθ-kr0sin(θ/k)
in the formula, r0The radius of the polishing pad is defined, k is a curve parameter of the auxiliary chip removal groove 2, and the range of the parameter k is 0.5-0.65;
the secondary chip removal grooves 2 are connected among a plurality of primary chip removal grooves 1.
According to the arrangement, the polishing solution on the surface of the polishing pad flows rapidly through the combined action of the main chip removal groove and the auxiliary chip removal groove, and the polishing solution in the processing area is updated timely. The chemical action of the polishing solution on the workpiece cannot be changed due to the content change of each component in the polishing solution, and the stability of the material removal rate in the processing process is ensured.
In the conventional polishing pad processing, serious surface damage is caused because the scraps cannot be discharged in time; in the machining process, the chip removal effect is improved, so that the surface damage of the workpiece is obviously reduced, and the surface quality is improved.
The removal rate of material during use of the polishing pad of the present invention is compared to that of a conventional polishing pad as shown in FIG. 2. In the conventional polishing pad processing, since the polishing solution is not updated in time, the removal rate of the polished material is continuously reduced along with the increase of the polishing duration, and the removal rate of the material is unstable in the whole polishing process. In the processing of the invention, new polishing solution continuously flows into the processing area by accelerating the flow rate of the polishing solution, the change range of the material removal rate is small in the polishing process, and the processing process is relatively stable.
The limitation of the protection scope of the present invention is understood by those skilled in the art, and various modifications or changes which can be made by those skilled in the art without inventive efforts based on the technical solution of the present invention are still within the protection scope of the present invention.
Claims (4)
1. The utility model provides a polishing pad of quick chip removal, it includes main chip removal slot (1) and vice chip removal slot (2), its characterized in that: the main chip removal grooves (1) consist of 10-14 divergent grooves, and each divergent groove is distributed on the surface of the polishing pad at an equal angle by taking the circle center of the polishing pad as the center;
the auxiliary chip removal grooves (2) consist of 10-14 spiral grooves, and each spiral groove is distributed on the surface of the polishing pad at an equal angle by taking the circle center of the polishing pad as the center;
the main chip-removing groove (1) forms a slightly downward slope from a starting point to an end point, and the depth h of the main chip-removing groove (1) and the center distance r of the polishing pad satisfy the following relational expression:
in the formula, r0Radius of polishing pad, h0Is the polishing pad thickness.
2. The rapid chip evacuation polishing pad of claim 1, wherein: the section of the main chip removal groove (1) is in an inverted trapezoid shape, the width range of the upper bottom of the section is 2-10mm, and the ratio of the length of the lower bottom of the section to the length of the upper bottom is (0.5-0.8): 1;
the distance between the starting point of the main chip removal groove (1) and the center of the polishing pad is r0/5-r0/4, wherein r0Is the polishing pad radius.
3. The rapid chip evacuation polishing pad of claim 1, wherein: the cross section of the auxiliary chip removal groove (2) is rectangular, the width range of the cross section is 2-10mm, the width of the cross section is consistent with the width of the upper bottom of the cross section of the main chip removal groove (1), and the ratio of the depth to the width of the cross section is (0.5-0.8): 1.
4. The rapid chip evacuation polishing pad of claim 1 or 3, wherein: the shape of the auxiliary chip removal groove (2) meets the following relational expression:
x--r0cosθ-kr0cos(θ/k)
y＝r0sinθ-kr0sin(θ/k)
in the formula, r0The radius of the polishing pad is defined, k is a curve parameter of the auxiliary chip removal groove (2), and the range of the parameter k is 0.5-0.65;
the auxiliary chip removal grooves (2) are connected among the main chip removal grooves (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711240524.8A CN107953243B (en) | 2017-11-30 | 2017-11-30 | Polishing pad capable of removing chips quickly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711240524.8A CN107953243B (en) | 2017-11-30 | 2017-11-30 | Polishing pad capable of removing chips quickly |
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| CN107953243B true CN107953243B (en) | 2020-04-07 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109854179B (en) * | 2018-12-21 | 2021-01-26 | 太重（天津）滨海重型机械有限公司 | Drilling tool of pile top drilling machine |
| CN112207877B (en) * | 2020-09-07 | 2022-04-26 | 中国工程物理研究院激光聚变研究中心 | Method for generating spiral groove on surface of asphalt polishing disc in annular polishing |
| CN114643532A (en) * | 2021-04-26 | 2022-06-21 | 宁波赢伟泰科新材料有限公司 | Chemical mechanical polishing pad for improving utilization efficiency of polishing solution |
| CN113910101B (en) * | 2021-09-03 | 2023-01-31 | 广东粤港澳大湾区黄埔材料研究院 | Polishing pad |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001018163A (en) * | 1999-07-06 | 2001-01-23 | Speedfam Co Ltd | Polishing pad |
| KR20050008051A (en) * | 2003-07-14 | 2005-01-21 | 매그나칩 반도체 유한회사 | polishing pad |
| CN100584536C (en) * | 2006-02-16 | 2010-01-27 | 罗门哈斯电子材料Cmp控股股份有限公司 | Three-dimensional network for chemical mechanical polishing |
| CN102284916A (en) * | 2011-07-04 | 2011-12-21 | 南京航空航天大学 | Grinding and polishing pad with composite chip removal structure |
| CN105856063B (en) * | 2016-04-22 | 2017-09-15 | 南京航空航天大学 | The polishing pad of polishing fluid Uniform Flow |
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