CN107946227B - A kind of wafer positioning method and system based on pallet - Google Patents
A kind of wafer positioning method and system based on pallet Download PDFInfo
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- CN107946227B CN107946227B CN201710069259.5A CN201710069259A CN107946227B CN 107946227 B CN107946227 B CN 107946227B CN 201710069259 A CN201710069259 A CN 201710069259A CN 107946227 B CN107946227 B CN 107946227B
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Abstract
The present invention relates to semiconductor fabrication process technical fields, more particularly to a kind of wafer positioning method and system based on pallet, wherein, a kind of wafer positioning method based on pallet, comprising: obtain the groove location data of prefabricated tray position data and the receiving wafer；Normal data group is formed according to the tray position data and the groove location data；The detection signal for matching the pallet and the wafer current state is obtained, and forms a detection data group；Process of convolution is done to the detection data group in conjunction with the normal data group according to the detection data group and forms process of convolution figure；A roll of actively value is obtained in the process of convolution figure according to the first predetermined mark data and the second predetermined mark data；The location data for matching the wafer position is formed according to the convolution extreme value, and the position data of the wafer is obtained according to the location data.
Description
Technical field
The present invention relates to semiconductor fabrication process technical fields, and in particular to a kind of wafer positioning method based on pallet and
System.
Background technique
In semiconductor fabrication, it usually needs wafer is placed in scheduled tray position, driving device driving support
Disk (wafer) high speed rotation, and go out membrane structure in crystal column surface deposition or epitaxial growth；Because wafer is in the production process
How high speed rotation state determines the specific location of wafer, and the real-time monitoring for realizing growth course and control are to semiconductors manufacture
Efficiency of research and development and the quality of production control play a crucial role.
In the prior art, the measuring device structural schematic diagram of wafer position usually as shown in Figure 1 will be specifically arranged
There is the pallet 2 ' for the groove 3 ' for accommodating wafer to be placed in 1 ' upper end of driving device, driving device 1 ' drives pallet 2 ' to rotate, measurement
Device 4 ' obtains emissivity, temperature, the angularity etc. of 2 ' disk of support or crystal column surface to pallet 2 ' or wafer projection detection light
Data are acquired, wafer are positioned according to acquisition data, the localization method used is mainly by following two:
The first, Relatively orientation method, pass through the station-keeping data calculated between driving device and measuring device, root
The corresponding relationship between acquisition data and pallet or wafer is determined according to station-keeping data；But there are a defects for such method, i.e.,
Such localization method is only applicable to the production equipment that pallet is rigidly connected in driving device, and the pallet of non-rigid connection is adopted
It can not be accurately positioned with Relatively orientation rule or be that can not be positioned；
Second, positioning mode is marked, the auxiliary positioning being arranged on pallet for positioning reference marks, although such method can
Telltale mark itself applied to the manufacturing equipment of non-rigid connecting trays, but on pallet also will affect the accuracy of measurement,
Such as in some specific measurement techniques or in measuring condition, telltale mark can not be accurately identified, so influence measurement
Accuracy in addition in making telltale mark on pallet, while also shortening the service life of pallet.
Summary of the invention
Aiming at the deficiencies in the prior art, the present invention provides Detection accuracy height, detection use scope extensive one
Wafer positioning method and system of the kind based on pallet, specifically,
The present invention provides a kind of wafer positioning method based on pallet, wherein includes:
Obtain the groove location data of prefabricated tray position data and the receiving wafer；According to the tray position number
Normal data group is formed according to the groove location data；
The detection signal for matching the pallet and the wafer current state is obtained, and forms a detection data group；
Process of convolution is done to the detection data group in conjunction with the normal data group according to the detection data group and is formed
Process of convolution figure；
It is obtained in the process of convolution figure according to the first predetermined mark data and the second predetermined mark data a roll of positive
Value；
The location data for matching the wafer position is formed according to the convolution extreme value, and is obtained according to the location data
The position data of the wafer.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein obtain the matching pallet and the wafer is worked as
The detection signal of preceding state, and form a detection data group and include,
Calculate to form a reference data according to the detection signal, according to the reference data formed one estimate collection point,
And estimate collection point total amount；
It obtains and each estimates the current detection data in collection point；
According to it is each estimate current detection data the combination pre-defined algorithm in collection point and calculate each estimate collection point
Revolving speed, and according to it is each estimate collection point this revolving speed formed a speed curves；
In the speed curves obtain speed curves extreme value, according to the speed curves extreme value formed actual acquisition point,
Actual acquisition point total amount；
Speed curves maximum value, speed curves minimum value are obtained, according to speed curves maximum value, speed curves minimum value meter
Calculation forms first nodal point, the second central point；
Segmentation clustering processing is done to the speed curves according to the first nodal point, the second central point and forms the first cluster
Figure, the second dendrogram；
Binary conversion treatment is done to first dendrogram, second dendrogram, according to described after binary conversion treatment
One dendrogram, second dendrogram form the detection data group.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein calculate to form a ginseng according to the detection signal
Data are examined, collection point is estimated according to reference data formation one and estimate collection point total amount, in which: the detection signal
Including at least the current revolving speed of sample frequency, the pallet；Including,
According to the sample frequency, the pallet, current revolving speed forms the reference data in conjunction with the first pre-defined algorithm；
Wherein, first pre-defined algorithm are as follows:
S: the reference data；
Sa: the sample frequency；
Ro: the current revolving speed of the pallet；
Collection point is estimated according to the second pre-defined algorithm formation one according to the reference data and estimates collection point total amount；
Wherein second pre-defined algorithm are as follows:
M=a × S；
M: collection point total amount is estimated to be described；
A: design factor, a ∈ (0.48,2.2).
Preferably, the above-mentioned wafer positioning method based on pallet, wherein according to it is each estimate collection point it is current described in
Detection data combination third pre-defined algorithm, which calculates, each estimates the revolving speed of collection point, estimates this revolving speed shape of collection point according to each
Include: at a speed curves
The third pre-defined algorithm are as follows:
Wherein: i: for natural number, i ∈ [1, M]；
M: for the total amount for estimating collection point；
S (i): i-th estimates the detection data of collection point；
S (i+M): the i-th+M is estimated the detection data of collection point；
R (M): m-th estimates the revolving speed of collection point.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein according to it is each estimate collection point it is current described in
Detection data combination third pre-defined algorithm, which calculates, each estimates the revolving speed of collection point, estimates this revolving speed shape of collection point according to each
Include: at a speed curves
The third pre-defined algorithm are as follows:
Wherein: i: for natural number, i ∈ [1, M]；
M: for the total amount for estimating collection point；
S (i): i-th estimates the detection data of collection point；
S (i+M): the i-th+M is estimated the detection data of collection point；
R (M): m-th estimates the revolving speed of collection point.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein first dendrogram, described second are gathered
Class figure does binary conversion treatment, forms the detection according to first dendrogram, second dendrogram after binary conversion treatment
Data group specifically includes:
It is labeled as 1 according to the first dendrogram that the first nodal point is formed, the formed according to second central point
Two cluster icons are denoted as 0；And the detection data group is formed according to first dendrogram, the second dendrogram.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein according to the detection data group in conjunction with the mark
Quasi- data group does process of convolution to the detection data group and forms process of convolution figure；Include:
Process of convolution is done to the detection data group, the normal data group using the 4th pre-defined algorithm；Wherein described
Four pre-defined algorithms are as follows:
Wherein:
N: actual acquisition point sum；
Y (k): convolution value；Wherein k is independent variable；
X [(j+k+N) %N]: [(j+k+N) %N] a detection data in the detection data group；
T (j): for j-th of detection data in the normal data group；
The process of convolution figure is formed according to the convolution value.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein according to the first predetermined mark data and second
Predetermined mark data obtains the convolution extreme value in the process of convolution figure；
The described first predetermined mark data is read, judges whether the described first predetermined mark data is greater than 180 °；
In the state that the described first predetermined mark data is greater than 180 °, the first convolution maximum value is read, according to described the
One convolution maximum value forms the convolution extreme value；
In the state that the described first predetermined mark data is no more than 180 °, the second predetermined mark data is read；Judge institute
State whether the first predetermined mark data is less than the described second predetermined mark data；
In the state that the described first predetermined mark data is less than the described second predetermined mark data, read in described first
The second convolution maximum value within the scope of predetermined mark data, and the convolution extreme value is formed according to the second convolution maximum value；
It is examined in the described first predetermined mark data not less than in the state of the described second predetermined mark data, reading is last
A upper location data under survey state, to form third volume apart from nearest convolution maximum value with a upper location data
Product maximum value, forms the convolution extreme value according to the third convolution maximum value.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein the first predetermined mark data is the support
The rotational symmetry angle of disk；The second predetermined mark data is the drift angle of the pallet.
Preferably, the above-mentioned wafer positioning method based on pallet, wherein formed according to the convolution extreme value described in matching
The location data of wafer position；Including,
It is read in the normal data group according to the convolution extreme value and the matched normal data of convolution extreme value；
The location data for matching the wafer position is formed according to the normal data.
On the other hand, the present invention provides a kind of wafer alignment system based on pallet again, wherein includes:
Normal data group forms unit: obtaining the groove location number of prefabricated tray position data and the receiving wafer
According to；Normal data group is formed according to the tray position data and the groove location data；
Detection unit: the detection signal for matching the pallet and the wafer current state is obtained, and forms a testing number
According to group；
Convolution processing unit: the detection data group is rolled up in conjunction with the normal data group according to the detection data group
Product handles and forms process of convolution figure；
Computing unit: it is obtained in the process of convolution figure according to the first predetermined mark data and the second predetermined mark data
Take a roll of actively value；
Positioning unit: the location data for matching the wafer position is formed according to the convolution extreme value；And according to described fixed
The position data of wafer described in the data acquisition of position.
In the present invention, following technical effect can get using the above method:
1, it is not provided on pallet between auxiliary positioning label and/or pallet and driving device using non-gun iron link
In the state of, identification positioning is carried out to the wafer in pallet by detection signal, detection is applied widely, is not connected by hardware
Or use environment limitation；
2, wafer can be arbitrarily placed in any groove, without deliberately symmetrically placed, the time of reduction wafer placement.
3, the accurate tach signal for obtaining pallet is calculated by detection signal, avoids reducing because detection device detects inaccuracy
The accuracy of positioning.
Detailed description of the invention
Fig. 1 is the present invention structural schematic diagram of the measuring device of wafer position a kind of in the prior art；
Fig. 2 is a kind of wafer positioning method flow diagram based on pallet provided in an embodiment of the present invention；
Fig. 3 is a kind of wafer positioning method flow diagram based on pallet provided in an embodiment of the present invention；
Fig. 4 is a kind of wafer positioning method flow diagram based on pallet provided in an embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of pallet provided in an embodiment of the present invention；
Fig. 6 is a kind of waveform of the wafer positioning method Plays data group based on pallet provided in an embodiment of the present invention
Figure；
Fig. 7 is the waveform of sorting measured data in the middle part of a kind of wafer positioning method based on pallet provided in an embodiment of the present invention
Figure；
Fig. 8 is a kind of one of wafer positioning method based on pallet provided in an embodiment of the present invention speed curves figure；
Fig. 9 is the first dendrogram in a kind of wafer positioning method based on pallet provided in an embodiment of the present invention, second
The waveform diagram of dendrogram；
Figure 10 is the wave of the detection data group in a kind of wafer positioning method based on pallet provided in an embodiment of the present invention
Shape figure；
Figure 11 is a kind of one of wafer positioning method based on pallet provided in an embodiment of the present invention process of convolution figure；
Figure 12 is a kind of one of wafer positioning method based on pallet provided in an embodiment of the present invention process of convolution figure；
Figure 13 is a kind of one of wafer positioning method based on pallet provided in an embodiment of the present invention process of convolution figure；
Figure 14 is the positioning schematic diagram in a kind of wafer positioning method based on pallet provided in an embodiment of the present invention.
Figure 15 is a kind of one of wafer positioning method based on pallet provided in an embodiment of the present invention speed curves figure.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
The present invention provides a kind of wafer positioning method based on pallet, wherein as shown in Figure 2, comprising:
Step S10, tray position data are obtained and accommodates the groove location data of the wafer；According to the tray position
Data and the groove location data form normal data group；The wherein groove of tray position data, and/or the receiving wafer
Position data (or wafer number data of tray loading) can be voluntarily manually entered by user, i.e., in each process, use
Family inputs tray position data by external equipment or input unit, and/or accommodates the groove location data of the wafer；Root
Matching normal data group is selected according to the data of user's input, normal data group can be stored in standard database.
Step S20, the detection signal for matching the pallet and the wafer current state is obtained, and forms a detection data
Group；It detects signal and includes at least reflectivity signals, temperature signal, angularity signal, driving tacho-angle signal.
Specifically:
Step S201, it calculates to form a reference data according to the detection signal, it is pre- to form one according to the reference data
Estimate collection point and estimates collection point total amount；Further wherein: the detection signal includes at least sample frequency, the support
The current revolving speed of disk；As shown in figure 3, include,
Step S2011, described in being formed according to the current revolving speed of the sample frequency, the pallet in conjunction with the first pre-defined algorithm
Reference data；Wherein, first pre-defined algorithm are as follows:
S: the reference data；
Sa: the sample frequency；
Ro: the current revolving speed of the pallet；
Step S2012, it estimates collection point according to the second pre-defined algorithm formation one according to the reference data and estimates and adopt
Collection point total amount；Wherein second pre-defined algorithm are as follows:
M=a × S；
M: collection point total amount is estimated to be described；
A: design factor, a ∈ (0.48,2.2).
Step S202, it obtains and each estimates the current detection data in collection point；
Step S203, each according to the current detection data combination third pre-defined algorithm calculating in collection point is each estimated
The revolving speed for estimating collection point, according to it is each estimate collection point this revolving speed formed a speed curves；Further, the third is pre-
Determine algorithm are as follows:
Wherein: i: for natural number, i ∈ [1, M]；
M: for the total amount for estimating collection point；
S (i): i-th estimates the detection data of collection point；
S (i+M): the i-th+M is estimated the detection data of collection point；
R (M): m-th estimates the revolving speed of collection point.
Step S204, speed curves extreme value is obtained in the speed curves, and reality is formed according to the speed curves extreme value
Border collection point, actual acquisition point total amount；In the present embodiment, the speed curves extreme value is formed with speed curves maximum value.
Step S205, speed curves maximum value, speed curves minimum value are obtained, it is bent according to speed curves maximum value, revolving speed
Line minimum value calculates to form first nodal point, the second central point；For example, according to speed curves maximum value, speed curves minimum value
It calculates to form first nodal point, the second central point using iterative algorithm.
Step S206, segmentation clustering processing shape is done to the speed curves according to the first nodal point, the second central point
At the first dendrogram, the second dendrogram；Wherein in the first dendrogram any practical collection point to the first nodal point distance
Distance of any practical collection point to first nodal point in respectively less than the second dendrogram；Similarly any practical is adopted in the second dendrogram
The distance of collection point to second central point is respectively less than in the first dendrogram any practical collection point to the distance of the second central point.
Step S207, binary conversion treatment is done to first dendrogram, second dendrogram, after binary conversion treatment
First dendrogram, second dendrogram form the detection data group, further, according to the first nodal point
The first dendrogram formed is labeled as 1, is labeled as 0 according to the second dendrogram that second central point is formed；And according to described
First dendrogram, the second dendrogram form the detection data group.
Step S30, the detection data group is done at convolution in conjunction with the normal data group according to the detection data group
It manages and forms process of convolution figure；Further include:
Step S301, process of convolution is done to the detection data group, the normal data group using the 4th pre-defined algorithm；Its
Described in the 4th pre-defined algorithm are as follows:
Wherein:
N: actual acquisition point sum；
Y (k): convolution value；Wherein k is independent variable；
X [(j+k+N) %N]: [(j+k+N) %N] a detection data in the detection data group；
T (j): for j-th of detection data in the normal data group；
Step S302, the process of convolution figure is formed according to the convolution value.
Step S40, it is obtained in the process of convolution figure according to the first predetermined mark data and the second predetermined mark data
The convolution extreme value；It specifically includes: as shown in figure 4,
Step S401, the first predetermined mark data is read, judges whether the described first predetermined mark data is greater than
180°；Wherein, the described first predetermined mark data is the rotational symmetry angle of the pallet；The second predetermined mark data is
The drift angle of the pallet.
Step S402, in the state that the described first predetermined mark data is greater than 180 °, the first convolution maximum value, root are read
The convolution extreme value is formed according to the first convolution maximum value；
Step S403, in the state that the described first predetermined mark data is no more than 180 °, the second predetermined mark number is read
According to；Judge whether the described first predetermined mark data is less than the described second predetermined mark data；
Step S404, it in the state that the described first predetermined mark data is less than the described second predetermined mark data, reads
In the second convolution maximum value within the scope of the described first predetermined mark data, and formed according to the second convolution maximum value described
Convolution extreme value；
Step S405, it is read in the described first predetermined mark data not less than in the state of the described second predetermined mark data
Take a upper location data under last detecting state, with a upper location data apart from nearest convolution maximum value shape
At third convolution maximum value, the convolution extreme value is formed according to the third convolution maximum value.
Step S50, the location data for matching the wafer position is formed according to the convolution extreme value, and according to the positioning
The position data of wafer described in data acquisition.
Step S501, it is read in the normal data group according to the convolution extreme value and the matched mark of convolution extreme value
Quasi- data；
Step S502, the location data for matching the wafer position is formed according to the normal data.
In the present invention, following technical effect can get using the above method:
1, it is not provided on pallet between auxiliary positioning label and/or pallet and driving device using non-gun iron link
In the state of, identification positioning is carried out to the wafer in pallet by detection signal, detection is applied widely, is not connected by hardware
Or use environment limitation；
2, wafer can be arbitrarily placed in any groove, without deliberately symmetrically placed, the time of reduction wafer placement.
3, the accurate tach signal for obtaining pallet is calculated by detection signal, avoids reducing because detection device detects inaccuracy
The accuracy of positioning.
Enumerate a specific embodiment
Pallet as shown in Figure 5, wherein obtain user input pallet 1 position data, when in front tray 1 accommodate described in
2 position data of groove of wafer 3, arrow are the direction of rotation of pallet.According to the position data of the pallet 1, accommodate wafer
32 position data of groove formed normal data group.The normal data group of polar form can also be used in normal data, into
One step can carry out subregion, the respectively area A, the area B, the area C, the area D to pallet, obtain center point coordinate in each region, center
Point angle, the groove number for being placed with wafer number, pallet number, wafer number etc., form matrix form according to above-mentioned data
Normal data group or polar form normal data group.In the present embodiment, using normal data group as shown in FIG. 6.
Continue, be under rotation status in pallet, detection device detects light to pallet or wafer projection, and according to feedback
Detection light to form detection signal, wherein the detection signal include at least the current revolving speed of sample frequency, the pallet,
The reflectivity (as shown in fig. 7, being the reflectance curve figure in each region) of pallet or crystal column surface, temperature, warpage, driving device
Tacho-angle combine the according to the current revolving speed of the sample frequency, the pallet by taking the reflectance curve figure in the area A as an example
One pre-defined algorithm forms the reference data；Wherein, first pre-defined algorithm are as follows:
S: the reference data；
Sa: the sample frequency；
Ro: the current revolving speed of the pallet；
By taking the revolving speed that sample frequency is 10Khz, pallet is current is 1000rpm as an example, reference can be calculated according to formula one
Data S is 600.
Then, the reference data formed is calculated according to formula one estimates acquisition according to the second pre-defined algorithm formation one
Point and estimate collection point total amount；Wherein second pre-defined algorithm are as follows:
M=a × S；Formula two
M: collection point total amount is estimated to be described；
A: design factor, a ∈ (0.48,2.2).
As it appears from the above, reference data is 600, the maximum value of design factor a takes the minimum value of 2, design factor a to go 0.5, root
Can get according to formula two and estimate the value range of collection point total amount M is 300~1200；
According to it is each estimate current detection data the combination third pre-defined algorithm in collection point and calculate each estimate acquisition
Point revolving speed, according to it is each estimate collection point this revolving speed formed a speed curves；Further, the third pre-defined algorithm
Are as follows:
Wherein: i: for natural number, i ∈ [1, M]；
M: for the total amount for estimating collection point；
S (i): i-th estimates the detection data of collection point；
S (i+M): the i-th+M is estimated the detection data of collection point；
R (M): m-th estimates the revolving speed of collection point.
It is calculated according to formula two it is found that the value range of M is 300~1200；Continue to obtain each estimate according to formula three
The revolving speed of collection point, according to it is each estimate collection point this revolving speed formed a speed curves.
Continue as shown in figure 8, obtaining speed curves maximum value, speed curves maximum value is 857, according to the speed curves
Maximum value forms actual acquisition point, actual acquisition point total amount, i.e. actual acquisition point total amount is 857.
Acquisition speed curves maximum value, minimum value in speed curves is continued at, according to speed curves maximum value, speed curves
Minimum value calculates to form first nodal point, the second central point；For example, being adopted according to speed curves maximum value, speed curves minimum value
It is calculated to form first nodal point, the second central point with iterative algorithm；According to the first nodal point, the second central point to described turn
Fast curve does segmentation clustering processing and forms the first dendrogram 100 as shown in Figure 9, the second dendrogram 200；As shown in figure 9, when adopting
When collection point is in tray surface, the revolving speed of the collection point is indicated with "+", when collection point is in crystal column surface, the collection point
Revolving speed use "." indicate, wherein the distance of any practical collection point to the first nodal point is respectively less than the in the first dendrogram 100
Distance of any practical collection point to first nodal point in two cluster Figure 200；Similarly any practical acquires in the second dendrogram 200
The distance of point to second central point be respectively less than any practical collection point in the first dendrogram 100 to the second central point away from
From.
Binary conversion treatment is done to first dendrogram 100, second dendrogram 200, after binary conversion treatment
First dendrogram 100, second dendrogram 200 form the detection data group as shown in Figure 10, wherein according to institute
The first dendrogram 100 of first nodal point formation is stated labeled as 1, the second dendrogram to be formed according to second central point
200 are labeled as 0；And a detection data group is formed according to first dendrogram 100, the second dendrogram 200.
Process of convolution is done to the detection data group, the normal data group using the 4th pre-defined algorithm；Wherein described
Four pre-defined algorithms are as follows:
Wherein:
N: actual acquisition point sum；
Y (k): convolution value；Wherein k is independent variable；
X [(j+k+N) %N]: [(j+k+N) %N] a detection data in the detection data group；
T (j): for j-th of detection data in the normal data group；
The value of N is 857.And the process of convolution figure is formed according to the convolution value.Process of convolution figure may go out at this time
Existing three kinds of states.Continue to do following judgement for three kinds of states of appearance:
First, the first predetermined mark data is read, judges whether the described first predetermined mark data is greater than 180 °；Wherein,
The first predetermined mark data is the rotational symmetry angle of the pallet；The second predetermined mark data is the pallet
Drift angle.
The first state can only go out under such state that is, in the state that the described first predetermined mark data is greater than 180 °
An existing maximum convolution value, its process of convolution figure as shown in figure 11 read the first convolution maximum value, according to the first volume
Product maximum value forms the convolution extreme value；
In the state that the described first predetermined mark data is no more than 180 °, the second predetermined mark data is read；Judge institute
State whether the first predetermined mark data is less than the described second predetermined mark data；
Second of state, i.e., in the state that the described first predetermined mark data is less than the described second predetermined mark data,
It will appear three maximum convolution values under such state, as shown in figure 12, (the present embodiment is practical for the schematic diagram of process of convolution figure
It is greater than 180 ° using the first predetermined mark data, so in being not more than 180 °, and institute in the described first predetermined mark data
It is only schematic diagram that the first predetermined mark data, which is stated, less than waveform diagram in the state of the described second predetermined mark data, not practical quasi-
True process of convolution figure), it reads in the second convolution maximum value within the scope of the described first predetermined mark data, and according to described the
Two convolution maximum values form the convolution extreme value；
The third state is not less than the state of the described second predetermined mark data in the described first predetermined mark data
Under, it will appear two maximum convolution values, as shown in figure 13, schematic diagram (the present embodiment of process of convolution figure under such state
It is practical to be greater than 180 ° using the first predetermined mark data, so in being not more than 180 ° in the described first predetermined mark data,
And the first predetermined mark data is only schematic diagram less than waveform diagram in the state of the described second predetermined mark data, it is not real
The accurate process of convolution figure in border), read last detecting state last volume and be actively worth matched location data, with the positioning number
Third convolution maximum value is formed according to apart from nearest convolution maximum value, the convolution pole is formed according to the third convolution maximum value
Value.
Step S501, it is read in the normal data group according to the convolution extreme value and the matched mark of convolution extreme value
Quasi- data, normal data is as shown in waveform 300 in Figure 14.
Step S502, the location data for matching the wafer position is formed according to the normal data, as shown in figure 14.Root
The location data of each wafer position can be obtained according to normal data.
Real-time example two,
Based on a kind of above-mentioned wafer alignment system based on pallet, wherein the third pre-defined algorithm may be used also are as follows:
Wherein: i: for natural number, i ∈ [1, M]；
M: for the total amount for estimating collection point；
S (i): i-th estimates the detection data of collection point；
S (i+M): the i-th+M is estimated the detection data of collection point；
R (M): m-th estimates the revolving speed of collection point.
In the speed curves figure formed using above-mentioned formula five, as shown in figure 15, then institute is formed with revolving speed minimum value
State speed curves extreme value.
Embodiment three,
Present invention simultaneously provides a kind of wafer alignment systems based on pallet, wherein includes:
Normal data group forms unit: obtaining the groove location number of prefabricated tray position data and the receiving wafer
According to；Normal data group is formed according to the tray position data and the groove location data；
Detection unit: the detection signal for matching the pallet and the wafer current state is obtained, and forms a testing number
According to group；
Convolution processing unit: the detection data group is rolled up in conjunction with the normal data group according to the detection data group
Product handles and forms process of convolution figure；
Computing unit: it is obtained in the process of convolution figure according to the first predetermined mark data and the second predetermined mark data
Take a roll of actively value；
Positioning unit: the location data for matching the wafer position is formed according to the convolution extreme value；And according to described fixed
The position data of wafer described in the data acquisition of position.
Method provided by any embodiment of the invention can be performed in the said goods, has the corresponding functional module of execution method
And beneficial effect.Therefore the working principle of positioning system is repeated no more herein.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (8)
1. a kind of wafer positioning method based on pallet characterized by comprising
Obtain the groove location data of prefabricated tray position data and the receiving wafer；According to the tray position data and
The groove location data form normal data group；
The detection signal for matching the pallet and the wafer current state is obtained, calculates to form a ginseng according to the detection signal
Data are examined, collection point is estimated according to reference data formation one and estimate collection point total amount；
It obtains and each estimates the current detection data in collection point；
Each revolving speed for estimating collection point is calculated according to each current detection data combination pre-defined algorithm in collection point of estimating,
And according to it is each estimate collection point this revolving speed formed a speed curves；
Speed curves extreme value is read in the speed curves, and actual acquisition point, reality are formed according to the speed curves extreme value
Collection point total amount；
Speed curves maximum value, speed curves minimum value are obtained, shape is calculated according to speed curves maximum value, speed curves minimum value
At first nodal point, the second central point；
According to the first nodal point, the second central point to the speed curves do segmentation clustering processing formed the first dendrogram,
Second dendrogram；
Binary conversion treatment is done to first dendrogram, second dendrogram, it is poly- according to described first after binary conversion treatment
Class figure, second dendrogram form the detection data group；
Process of convolution is done to the detection data group in conjunction with the normal data group according to the detection data group and forms convolution
Processing figure；
A roll of actively value is obtained in the process of convolution figure according to the first predetermined mark data and the second predetermined mark data；Its
In, the first predetermined mark data is the rotational symmetry angle of the pallet；The second predetermined mark data is described
The drift angle of pallet；
The location data for matching the wafer position is formed according to the convolution extreme value, and according to location data acquisition
The position data of wafer；It specifically includes: being read in the normal data group according to the convolution extreme value and the convolution extreme value
Matched normal data；
The location data for matching the wafer position is formed according to the normal data.
2. the wafer positioning method according to claim 1 based on pallet, which is characterized in that according to the detection signal meter
It calculates and forms a reference data, collection point is estimated according to reference data formation one and estimate collection point total amount, in which: institute
It states detection signal and includes at least the current revolving speed of sample frequency, the pallet；Including,
According to the sample frequency, the pallet, current revolving speed forms the reference data in conjunction with the first pre-defined algorithm；Wherein,
First pre-defined algorithm are as follows:
S: the reference data；
Sa: the sample frequency；
Ro: the current revolving speed of the pallet；
Collection point is estimated according to the second pre-defined algorithm formation one according to the reference data and estimates collection point total amount；Wherein
Second pre-defined algorithm are as follows:
M=a × S；
M: collection point total amount is estimated to be described；
A: design factor, a ∈ (0.48,2.2).
3. the wafer positioning method according to claim 2 based on pallet, which is characterized in that estimate collection point according to each
The current detection data combination third pre-defined algorithm calculates the revolving speed for each estimating collection point, estimates collection point according to each
This revolving speed forms a speed curves
The third pre-defined algorithm are as follows:
Wherein: i: for natural number, i ∈ [1, M]；
M: for the total amount for estimating collection point；
S (i): i-th estimates the detection data of collection point；
S (i+M): the i-th+M is estimated the detection data of collection point；
R (M): m-th estimates the revolving speed of collection point.
4. the wafer positioning method according to claim 2 based on pallet, which is characterized in that estimate collection point according to each
The current detection data combination third pre-defined algorithm calculates the revolving speed for each estimating collection point, estimates collection point according to each
This revolving speed forms a speed curves
The third pre-defined algorithm are as follows:
Wherein: i: for natural number, i ∈ [1, M]；
M: for the total amount for estimating collection point；
S (i): i-th estimates the detection data of collection point；
S (i+M): the i-th+M is estimated the detection data of collection point；
R (M): m-th estimates the revolving speed of collection point.
5. the wafer positioning method according to claim 1 based on pallet, which is characterized in that first dendrogram,
Second dendrogram does binary conversion treatment, according to first dendrogram, the second cluster figure after binary conversion treatment
At the detection data group, specifically include:
It is labeled as 1 according to the first dendrogram that the first nodal point is formed, is gathered according to second that second central point is formed
Class icon is denoted as 0；And the detection data group is formed according to first dendrogram, the second dendrogram.
6. the wafer positioning method according to claim 1 based on pallet, which is characterized in that according to the detection data group
Process of convolution is done to the detection data group in conjunction with the normal data group and forms process of convolution figure；Include:
Process of convolution is done to the detection data group, the normal data group using the 4th pre-defined algorithm；Wherein the described 4th is pre-
Determine algorithm are as follows:
Wherein:
N: actual acquisition point sum；
Y (k): convolution value；Wherein k is independent variable；
X [(j+k+N) %N]: [(j+k+N) %N] a detection data in the detection data group；
T (j): for j-th of detection data in the normal data group；
The process of convolution figure is formed according to the convolution value.
7. a kind of wafer positioning method based on pallet according to claim 1, which is characterized in that according to the first pre- calibration
Know data and the second predetermined mark data obtains the convolution extreme value in the process of convolution figure；
The described first predetermined mark data is read, judges whether the described first predetermined mark data is greater than 180 °；
In the state that the described first predetermined mark data is greater than 180 °, the first convolution maximum value is read, according to the first volume
Product maximum value forms the convolution extreme value；
In the state that the described first predetermined mark data is no more than 180 °, the second predetermined mark data is read；Judge described
Whether one predetermined mark data is less than the described second predetermined mark data；
In the state that the described first predetermined mark data is less than the described second predetermined mark data, read predetermined in described first
The second convolution maximum value within the scope of mark data, and the convolution extreme value is formed according to the second convolution maximum value；
Shape is detected not less than in the state of the described second predetermined mark data, reading is last in the described first predetermined mark data
A upper location data under state, to form third convolution most apart from nearest convolution maximum value with a upper location data
Big value, forms the convolution extreme value according to the third convolution maximum value.
8. a kind of wafer alignment system based on pallet characterized by comprising
Normal data group forms unit: obtaining the groove location data of prefabricated tray position data and the receiving wafer；Root
Normal data group is formed according to the tray position data and the groove location data；
Detection unit: the detection signal for matching the pallet and the wafer current state is obtained, according to the detection signal meter
It calculates and forms a reference data, collection point is estimated according to reference data formation one and estimate collection point total amount；It obtains each
Estimate the current detection data in collection point；
Each revolving speed for estimating collection point is calculated according to each current detection data combination pre-defined algorithm in collection point of estimating,
And according to it is each estimate collection point this revolving speed formed a speed curves；Speed curves extreme value is read in the speed curves,
Actual acquisition point, actual acquisition point total amount are formed according to the speed curves extreme value；Obtain speed curves maximum value, speed curves
Minimum value calculates to form first nodal point, the second central point according to speed curves maximum value, speed curves minimum value；According to institute
State first nodal point, the second central point does segmentation clustering processing to the speed curves and forms the first dendrogram, the second dendrogram；
Binary conversion treatment is done to first dendrogram, second dendrogram, according to after binary conversion treatment first dendrogram,
Second dendrogram forms the detection data group；
Convolution processing unit: the detection data group is done at convolution in conjunction with the normal data group according to the detection data group
It manages and forms process of convolution figure；
Computing unit: one is obtained in the process of convolution figure according to the first predetermined mark data and the second predetermined mark data
Convolution extreme value；Wherein, the described first predetermined mark data is the rotational symmetry angle of the pallet；Described second predetermined mark number
According to the drift angle for the pallet；
Positioning unit: the location data for matching the wafer position is formed according to the convolution extreme value；And according to the positioning number
It according to the position data for obtaining the wafer, specifically includes: being read in the normal data group according to the convolution extreme value and institute
State the matched normal data of convolution extreme value；The location data for matching the wafer position is formed according to the normal data.
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