CN107936687A - A kind of low temperature cured ceramic ink and its preparation, application process - Google Patents
A kind of low temperature cured ceramic ink and its preparation, application process Download PDFInfo
- Publication number
- CN107936687A CN107936687A CN201711339823.7A CN201711339823A CN107936687A CN 107936687 A CN107936687 A CN 107936687A CN 201711339823 A CN201711339823 A CN 201711339823A CN 107936687 A CN107936687 A CN 107936687A
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- China
- Prior art keywords
- ceramic ink
- low temperature
- epoxy resin
- ink
- solution
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention discloses a kind of low temperature cured ceramic ink, and by mass fraction, its material component includes：80-90 parts of epoxy resin, 16-19 parts of dicyan diamino, 3-4 parts of accelerating agent, 60-68 parts of solvent, 4-6 parts of auxiliary agent, 5-8 parts of bonding agent.The present invention provides a kind of low temperature cured ceramic ink and its preparation, application process, this ceramic ink has no pollution, and solidification temperature is very low, greatly reduces energy consumption.
Description
Technical field
The present invention relates to technical field of ink, more particularly to a kind of low temperature cured ceramic ink and its preparation, application process.
Background technology
Traditional ceramic ink is generally by rare earth oxide, solvent, dispersant, bonding agent, surface-active
Made of agent and other auxiliary materials, but this ceramic ink in curing molding, it is necessary to extra high temperature, generally will 900-
1300 DEG C, need the substantial amounts of energy in curing molding, and operating personnel need to endure high-temperature operation, substantial amounts of heat radiation,
Damage to its body is very big.Moreover, there are heavy metal element in traditional ceramic ink, once ceramic ink leak or
Ceramics cancel, and very big pollution can be produced to environment.
The content of the invention
In view of this, the present invention provides a kind of low temperature cured ceramic ink and its preparation, application process, this ceramic ink
With no pollution, solidification temperature is very low, greatly reduces energy consumption.
A kind of low-temperature setting low temperature cured ceramic ink, by mass fraction, its material component includes：
Preferably, by mass fraction, its material component is：
Preferably, by mass fraction, its material component is：
Preferably, the epoxy resin is middle-molecular-weihydroxyethyl solid bisphenol A type epoxy resin.
Preferably, the accelerating agent is curing accelerator FXR-1081.
Preferably, the solvent is hydro carbons.
Preferably, the auxiliary agent is Tissuemat E.
A kind of preparation method of low temperature cured ceramic ink, method include：
Accurately weigh epoxy resin, dicyan diamino, accelerating agent, solvent, auxiliary agent and bonding agent；
Epoxy resin is added into solvent, mixing speed 110-150r/min, stir 5-8min, to being completely dissolved, obtain
To solution a；
Dicyan diamino, accelerating agent, auxiliary agent and bonding agent are added into solution a, handled with disperse mill, is handled
30-40min, stands 1-2h, obtains solution b；
Solution b carries out 200-250 mesh filterings after standing, and obtains ceramic ink.
A kind of application process of low temperature cured ceramic ink, it is characterised in that method includes：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 165-175 DEG C, and ceramic ink is solidified into
Type.
It is provided by the invention that the present invention provides a kind of low temperature cured ceramic ink and its preparation, application process, this ceramics
Ink is very low compared with traditional ceramics ink cured temperature by using epoxy polyester as material of main part, having no pollution, substantially reduces
Energy consumption, has saved cost and the energy, protects environment.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical solution in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is part of the embodiment of the present invention, instead of all the embodiments.Based on the implementation in the present invention
Example, those of ordinary skill in the art's all other embodiments obtained without making creative work, belongs to
The scope of protection of the invention.
It should be appreciated that ought use in this specification and in the appended claims, term " comprising " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but it is not precluded from one or more of the other feature, whole
Body, step, operation, element, component and/or its presence or addition for gathering.
It will be further appreciated that the term "and/or" used in description of the invention and the appended claims is
Refer to any combinations and all possible combinations of one or more of the associated item listed, and including these combinations.
Epoxy resin has good physics, chemical property, its surface to metal and nonmetallic materials has excellent
Adhesive strength, dielectric properties are good, and set shrinking percentage is small, and product size stability is good, and hardness is high, and pliability is preferable.When it is solid
It is very strong with ceramic bonding after change.Certainly, if being not added with any pigment, it is water white transparency after epoxy resin cure, works as addition
During different color pigments, by the effect as reaching with traditional ceramic ink.In the following, according to embodiment, to low-temperature solid
Change ceramic ink to be described in detail.
Embodiment 1
Low temperature cured ceramic ink, by mass fraction, its material component includes：
Its production method is：
Accurately weigh bisphenol A type epoxy resin, dicyan diamino, 2-methylimidazole, hydro carbons, Tissuemat E and bonding agent；
Bisphenol A type epoxy resin is added into hydro carbons, mixing speed 110r/min, stir 8min, to being completely dissolved, obtain
To solution a；
Dicyan diamino, 2-methylimidazole, Tissuemat E and bonding agent are added into solution a, at disperse mill
Reason, handles 40min, stands 2h, obtains solution b；
Solution b carries out 200 mesh filterings after standing, and obtains ceramic ink.
Ceramic ink is applied to the application process of ceramics：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 175 DEG C, and ceramic ink carries out curing molding.
Embodiment 2
Low temperature cured ceramic ink, by mass fraction, its material component includes：
Its production method is：
It is accurate weigh bisphenol A type epoxy resin, dicyan diamino, curing accelerator FXR-1081, hydro carbons, Tissuemat E and
Bonding agent；
Bisphenol A type epoxy resin is added into hydro carbons, mixing speed 150r/min, stir 5min, to being completely dissolved, obtain
To solution a；
Dicyan diamino, curing accelerator FXR-1081, Tissuemat E and bonding agent are added into solution a, with scattered
Grinder processing, handles 30min, stands 1h, obtains solution b；
Solution b carries out 250 mesh filterings after standing, and obtains ceramic ink.
Ceramic ink is applied to the application process of ceramics：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 165 DEG C, and ceramic ink carries out curing molding.
Embodiment 3
Low temperature cured ceramic ink, by mass fraction, its material component includes：
Its production method is：
It is accurate weigh organophosphor epoxy resin, dicyan diamino, curing accelerator FXR-1081, hydro carbons, Tissuemat E and
Bonding agent；
Organophosphor epoxy resin is added into hydro carbons, mixing speed 120r/min, stir 7min, to being completely dissolved, obtain
To solution a；
Dicyan diamino, curing accelerator FXR-1081, Tissuemat E and bonding agent are added into solution a, with scattered
Grinder processing, handles 34min, stands 1h, obtains solution b；
Solution b carries out 240 mesh filterings after standing, and obtains ceramic ink.
Ceramic ink is applied to the application process of ceramics：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 170 DEG C, and ceramic ink carries out curing molding.
Embodiment 4
Low temperature cured ceramic ink, by mass fraction, its material component includes：
Its production method is：
Accurately weigh bisphenol A type epoxy resin, dicyan diamino, 2-methylimidazole, esters, Tissuemat E and bonding agent；
Bisphenol A type epoxy resin is added into esters, mixing speed 130r/min, stir 6min, to being completely dissolved, obtain
To solution a；
Dicyan diamino, 2-methylimidazole, Tissuemat E and bonding agent are added into solution a, at disperse mill
Reason, handles 38min, stands 1h, obtains solution b；
Solution b carries out 220 mesh filterings after standing, and obtains ceramic ink.
Ceramic ink is applied to the application process of ceramics：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 168 DEG C, and ceramic ink carries out curing molding.
Embodiment 5
Low temperature cured ceramic ink, by mass fraction, its material component includes：
Its production method is：
It is accurate weigh bisphenol A type epoxy resin, dicyan diamino, curing accelerator FXR-1081, hydro carbons, Tissuemat E and
Bonding agent；
Bisphenol A type epoxy resin is added into hydro carbons, mixing speed 140r/min, stir 7min, to being completely dissolved, obtain
To solution a；
Dicyan diamino, curing accelerator FXR-1081, Tissuemat E and bonding agent are added into solution a, with scattered
Grinder processing, handles 34min, stands 1h, obtains solution b；
Solution b carries out 210 mesh filterings after standing, and obtains ceramic ink.
Ceramic ink is applied to the application process of ceramics：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 173 DEG C, and ceramic ink carries out curing molding.
Embodiment 6
Low temperature cured ceramic ink, by mass fraction, its material component includes：
Its production method is：
It is accurate weigh organophosphor epoxy resin, dicyan diamino, curing accelerator FXR-1081, hydro carbons, Tissuemat E and
Bonding agent；
Organophosphor epoxy resin is added into hydro carbons, mixing speed 100r/min, stir 8min, to being completely dissolved, obtain
To solution a；
Dicyan diamino, curing accelerator FXR-1081, Tissuemat E and bonding agent are added into solution a, with scattered
Grinder processing, handles 41min, stands 1h, obtains solution b；
Solution b carries out 250 mesh filterings after standing, and obtains ceramic ink.
Ceramic ink is applied to the application process of ceramics：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 175 DEG C, and ceramic ink carries out curing molding.
The ceramic ink that embodiment 1 to 6 is produced, in the case where application temperature is 165-175 DEG C, is tested：
| The beds of precipitation (12h) | Stability | Abrasion resistance | |
| Embodiment 1 | On a small quantity | 0.08 | 85% |
| Embodiment 2 | On a small quantity | 0.07 | 82% |
| Embodiment 3 | Nothing | 0.11 | 78% |
| Embodiment 4 | Nothing | 0.13 | 89% |
| Embodiment 5 | Nothing | 0.12 | 87% |
| Embodiment 6 | Nothing | 0.14 | 84% |
According to the data in several tables, it can be seen that this ceramic ink has the characteristic of low-temperature setting, has no pollution, compared with
Traditional ceramics ink cured temperature is very low, greatly reduces energy consumption, has saved cost and the energy, has protected environment.Though
So there is shortcoming slightly in abrasion resistance, but it is very prominent on overall performance.
The steps in the embodiment of the present invention can be sequentially adjusted, merged and deleted according to actual needs.
It is described in detail herein, applies specific case and the principle of the present invention and embodiment are explained
State, above example is only intended to help the method and its core concept for understanding the present invention；Meanwhile for the general skill of this area
Art personnel, according to the thought of the present invention, there will be changes in specific embodiments and applications, in conclusion this
Description should not be construed as limiting the invention.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description
With the specific work process of unit, the corresponding process in preceding method embodiment is may be referred to, details are not described herein.
Claims (9)
1. a kind of low temperature cured ceramic ink, it is characterised in that its material component includes by mass fraction：
2. ceramic ink as claimed in claim 1, it is characterised in that its material component is by mass fraction：
3. ceramic ink as claimed in claim 1, it is characterised in that its material component is by mass fraction：
4. the ceramic ink as described in claim 1-3 is any, it is characterised in that：The epoxy resin is double for middle-molecular-weihydroxyethyl solid
Phenol A type epoxy resin.
5. the ceramic ink as described in claim 1-3 is any, it is characterised in that：The accelerating agent is curing accelerator FXR-
1081。
6. the ceramic ink as described in claim 1-3 is any, it is characterised in that：The solvent is hydro carbons.
7. the ceramic ink as described in claim 1-3 is any, it is characterised in that：The auxiliary agent is Tissuemat E.
8. the preparation method of a kind of low temperature cured ceramic ink as described in right 1-7 is any, it is characterised in that method includes：
Accurately weigh epoxy resin, dicyan diamino, accelerating agent, solvent, auxiliary agent and bonding agent；
Epoxy resin is added into solvent, mixing speed 110-150r/min, stir 5-8min, to being completely dissolved, obtain molten
Liquid a；
Dicyan diamino, accelerating agent, auxiliary agent and bonding agent are added into solution a, handled with disperse mill, handles 30-
40min, stands 1-2h, obtains solution b；
Solution b carries out 200-250 mesh filterings after standing, and obtains ceramic ink.
9. the application process of a kind of low temperature cured ceramic ink as described in right 1-7 is any, it is characterised in that method includes：
Ceramic ink is transferred to bique brick；
Ceramic tile transferred with ceramic ink is heated, heating-up temperature is 165-175 DEG C, and ceramic ink carries out curing molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711339823.7A CN107936687A (en) | 2017-12-14 | 2017-12-14 | A kind of low temperature cured ceramic ink and its preparation, application process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711339823.7A CN107936687A (en) | 2017-12-14 | 2017-12-14 | A kind of low temperature cured ceramic ink and its preparation, application process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107936687A true CN107936687A (en) | 2018-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711339823.7A Pending CN107936687A (en) | 2017-12-14 | 2017-12-14 | A kind of low temperature cured ceramic ink and its preparation, application process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101348700A (en) * | 2007-12-28 | 2009-01-21 | 陈燕心 | Adhesion agent, printing film containing the adhesion agent and use of the adhesion agent in direct transfer printing on glass, ceramic and metallic product surface |
| CN103183978A (en) * | 2011-12-27 | 2013-07-03 | 比亚迪股份有限公司 | Ink composition and application for same, as well as product with selectively-metallized surface and preparation method for same |
| CN105385396A (en) * | 2015-12-11 | 2016-03-09 | 深圳百丽春新材料科技有限公司 | Halogen-free thermosetting epoxy adhesive and application thereof |
| CN107325627A (en) * | 2017-08-28 | 2017-11-07 | 厦门大学 | Electrically conductive ink low-temperature setting composition and preparation method thereof |
-
2017
- 2017-12-14 CN CN201711339823.7A patent/CN107936687A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101348700A (en) * | 2007-12-28 | 2009-01-21 | 陈燕心 | Adhesion agent, printing film containing the adhesion agent and use of the adhesion agent in direct transfer printing on glass, ceramic and metallic product surface |
| CN103183978A (en) * | 2011-12-27 | 2013-07-03 | 比亚迪股份有限公司 | Ink composition and application for same, as well as product with selectively-metallized surface and preparation method for same |
| CN105385396A (en) * | 2015-12-11 | 2016-03-09 | 深圳百丽春新材料科技有限公司 | Halogen-free thermosetting epoxy adhesive and application thereof |
| CN107325627A (en) * | 2017-08-28 | 2017-11-07 | 厦门大学 | Electrically conductive ink low-temperature setting composition and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 王锡娇: "《涂料与颜料标准应用手册 上》", 30 April 2005 * |
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Application publication date: 20180420 |