CN107928788B - 一种半导体激光手术系统 - Google Patents
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Abstract
本发明公开了一种半导体激光手术系统,属于激光医疗技术领域,包括一组或多组405nm半导体激光模块、驱动电源、635nm半导体激光器、光纤合束器、透镜组激光耦合装置、手术光纤、控制系统和脚踏开关;所述405nm半导体激光模块的激光输出光纤、所述635nm半导体激光器的激光输出光纤均与光纤合束器输入端光纤连接,所述光纤合束器输出端光纤和手术光纤之间设置透镜组激光耦合装置,所述控制系统分别与驱动电源和635nm半导体激光器连接,所述脚踏开关与控制系统连接。通过本发明所公开的技术方案可显著提高激光手术设备的手术精度和使用范围,同时又具有小型化、模块化特点,方便激光手术应用。
Description
技术领域
本发明涉及激光医疗技术领域,尤其涉及一种高精度组织切除的半导体激光手术系统,具体为一种通过石英光纤传输,由405nm波长的半导体激光实现含血病变组织精确切除的激光手术系统。
背景技术
激光可通过光纤传输对腔内病变组织进行切除,因此随着内窥镜技术的发展,激光手术系统在微创手术中具有明显优势。半导体激光器具有体积小、效率高、容易控制、可靠性高等优点,相应的半导体激光手术系统便于携带,使用方便。组织对不同波长激光的吸收存在巨大的差异,有些达到上百万倍,因此激光手术的效果取决于激光波长。目前808nm和980nm波长的半导体激光依靠水对其吸收实现病变组织切除,在激光手术中已经广泛应用,但水对其吸收系数不高,热损伤大,无法应用于高精度手术。目前波长为405nm的紫光半导体激光器逐步发展成熟,单个光纤耦合模块输出功率已经达到10W。405nm波长激光位于血红蛋白最强吸收峰值附近,此波长激光照射含血组织时,激光能量集中在10微米左右的薄层内,因此高功率激光作用于组织时,可对含血组织进行切除;降低功率密度时,其照射过的血红蛋白生成水合物而对组织实现“漂白”,可用于止血。中国发明专利申请CN105167846 A公布一种半导体蓝激光手术系统,将440-460nm的蓝光半导体激光用于手术,但含血组织对其吸收强度与405nm的紫光相比还是有几倍的差距,手术精度有一定差距。
发明内容
本发明的目的就是针对背景技术所述的问题,提供一种405nm波长的半导体激光手术系统,将最新发展的405nm半导体激光技术用于激光外科手术,利用血红蛋白对405nm半导体激光强吸收的特点,通过对激光功率密度的调节控制,同时解决含血病变组织的切除和止血问题,其高精度组织切除和良好止血功能会大大提高手术效果。
为达此目的,本发明采用以下技术方案:
一种半导体激光手术系统,包括一组或多组405nm半导体激光模块、驱动电源、635nm半导体激光器、光纤合束器、透镜组激光耦合装置、手术光纤、控制系统和脚踏开关;
所述405nm半导体激光模块的激光输出光纤、所述635nm半导体激光器的激光输出光纤均与光纤合束器输入端光纤连接,所述光纤合束器输出端光纤和手术光纤之间设置透镜组激光耦合装置,所述控制系统分别与驱动电源和635nm半导体激光器连接,所述脚踏开关与控制系统连接。
其中,所述驱动电源为IGBT斩波电源,可连续或脉冲输出,电流大小、脉冲宽度参数可由控制系统输入信号控制。
其中,所述光纤合束器为石英光纤合束器,所述光纤合束器的输入光纤纤芯直径为200微米,所述光纤合束器的输出光纤纤芯直径为400微米。
其中,所述脚踏开关为双脚踏开关,包括切除脚踏开关和止血脚踏开关。
本发明的工作原理是: 通过光纤合束器将用于组织切除和止血的405nm波长激光和用于位置指示的635nm波长的激光合束,然后通过透镜组激光耦合装置将两种波长的激光耦合到手术光纤用于激光手术。进行激光手术时,635nm波长的指示激光用来指示切除位置,405nm波长的半导体激光对病变组织进行切除或止血,其过程为:控制系统通过控制驱动电源的电流大小和脉冲宽度等参数,实现对405nm波长激光的输出功率大小和脉冲特性进行控制,启动切除脚踏开关时,激光输出为高峰值功率脉冲激光,被照射的含血组织层温度急剧升高而产生汽化等物理过程实现组织切除;启动止血脚踏开关时,激光输出为低功率脉冲或连续激光,其照射过的血红蛋白生成水合物而对组织实现“漂白”,实现止血功能。
本发明的有益效果是:
1)405nm波长的半导体激光处于血红蛋白最高吸收峰附近,组织切除时热影响极小,手术精度高;
2)低功率密度照射组织时将血红蛋白生成水合物,可进行止血,通过控制驱动电源的电流参数对激光功率密度进行调节控制,同时解决了含血病变组织的切除和止血问题;
3)目前单组450nm半导体激光模块的输出功率可达到10W,通过光纤合束器可根据医疗的需要采用一组或多组450nm半导体激光模块进行组合,满足不同手术对405nm波长激光的功率要求。
4)合束后的激光通过透镜组激光耦合装置耦合到手术光纤,这样外接的手术光纤方便更换,方便手术应用。
综上所述,通过本发明所公开的技术方案可显著提高激光手术设备的手术精度和使用范围,同时又具有小型化、模块化特点,方便激光手术应用。
附图说明
图1是本发明提供的一种半导体激光手术系统结构示意图。
图中:
1—驱动电源;21、22— 405nm半导体激光模块;3—635nm半导体激光器;4—光纤合束器;5—透镜组激光耦合装置;6—手术光纤;7—控制系统;8—脚踏开关。
具体实施方式
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
如图1所示,本发明所述的一种半导体激光手术系统,由两组405nm半导体激光模块21、22,驱动电源1,635nm半导体激光器3,光纤合束器4,透镜组激光耦合装置5,手术光纤6,控制系统7和脚踏开关8构成。
405nm半导体激光模块21、22的激光输出光纤的纤芯直径为200微米,输出功率10W; 635nm半导体激光器3的输出功率为50mW。石英材质的光纤合束器4输入光纤纤芯直径为200微米,输出光纤纤芯直径为400微米。两组405nm半导体激光模块21、22的激光输出光纤和一个635nm半导体激光器3的激光输出光纤均与光纤合束器4输入端光纤熔接,光纤合束器4输出端光纤和手术光纤6之间设置透镜组激光耦合装置5,控制系统7分别与驱动电源1和635nm半导体激光器3连接,脚踏开关8与控制系统7相连。驱动电源1为IGBT斩波电源,可连续或脉冲输出,电流大小、脉冲宽度等参数可由控制系统7输入信号控制。其中,所述脚踏开关8为双脚踏开关,包括切除脚踏开关和止血脚踏开关。
本实施方式的工作原理是:通过光纤合束器4将405nm波长的激光和635nm波长的激光合束,然后通过透镜组激光耦合装置5将两种波长的激光耦合到手术光纤6中。进行激光手术时,635nm波长的激光用来指示切除位置,405nm波长的激光对病变组织进行切除或止血。通过控制驱动电源1的电流大小和脉冲宽度等参数,实现对405nm波长激光的输出功率大小和脉冲特性进行控制,脚踏开关8为双脚踏开关,启动切除脚踏开关时,激光输出为高峰值功率脉冲激光,被照射的含血组织层温度急剧升高而产生汽化等物理过程实现组织切除;启动止血脚踏开关时,激光输出为低功率脉冲或连续激光,其照射过的血红蛋白生成水合物而对组织实现“漂白”,实现止血功能。
虽然本发明已经详细示例并描述了相关的特定实施例做参考,但对本领域的技术人员来说,在阅读和理解了该说明书和附图后,在不背离本发明的思想和范围上,可以在耦合对准装置的结构和制作细节上作出各种改变。这些改变都将落入本发明的权利要求所要求的保护范围。
Claims (3)
1.一种半导体激光手术系统,其特征在于,包括一组或多组405nm半导体激光模块、驱动电源、635nm半导体激光器、光纤合束器、透镜组激光耦合装置、手术光纤、控制系统和脚踏开关;
所述405nm半导体激光模块的激光输出光纤、所述635nm半导体激光器的激光输出光纤均与光纤合束器输入端光纤连接,所述光纤合束器输出端光纤和手术光纤之间设置透镜组激光耦合装置,所述控制系统分别与驱动电源和635nm半导体激光器连接,所述驱动电源与所述405nm半导体激光模块连接,所述脚踏开关与控制系统连接;
所述635nm半导体激光器用于指示切除位置,所述405nm半导体激光模块用于对病变组织进行切除或止血;
所述驱动电源用于对所述405nm半导体激光模块的输出功率大小和脉冲特性进行控制;
所述脚踏开关为双脚踏开关,包括切除脚踏开关和止血脚踏开关;启动所述切除脚踏开关时,所述405nm半导体激光模块实现组织切除;启动所述止血脚踏开关时,所述405nm半导体激光模块实现止血功能。
2.根据权利要求1所述的一种半导体激光手术系统,其特征在于,所述驱动电源为IGBT斩波电源,可连续或脉冲输出,电流大小、脉冲宽度参数可由控制系统输入信号控制。
3.根据权利要求1所述的一种半导体激光手术系统,其特征在于,所述光纤合束器为石英光纤合束器,所述光纤合束器的输入光纤纤芯直径为200微米,所述光纤合束器的输出光纤纤芯直径为400微米。
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