CN107919436A - Flexible display panels and its manufacture method, flexible display device - Google Patents
Flexible display panels and its manufacture method, flexible display device Download PDFInfo
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- CN107919436A CN107919436A CN201610878341.8A CN201610878341A CN107919436A CN 107919436 A CN107919436 A CN 107919436A CN 201610878341 A CN201610878341 A CN 201610878341A CN 107919436 A CN107919436 A CN 107919436A
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- flexible display
- base board
- display panels
- flexible
- layer
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 83
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 74
- 239000010703 silicon Substances 0.000 claims abstract description 74
- 239000000463 material Substances 0.000 claims abstract description 33
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 23
- 229910003978 SiClx Inorganic materials 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 claims abstract description 9
- -1 polyoxy Polymers 0.000 claims abstract description 9
- 238000004528 spin coating Methods 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 24
- 238000000151 deposition Methods 0.000 claims description 15
- 230000008021 deposition Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 238000000231 atomic layer deposition Methods 0.000 claims description 6
- 238000001723 curing Methods 0.000 claims description 5
- 238000005566 electron beam evaporation Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000001771 vacuum deposition Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 claims description 4
- 238000013007 heat curing Methods 0.000 claims description 4
- 238000009616 inductively coupled plasma Methods 0.000 claims description 4
- 238000010884 ion-beam technique Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000010422 painting Methods 0.000 claims 3
- 239000007792 gaseous phase Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000007641 inkjet printing Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 53
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 229930002839 ionone Natural products 0.000 description 1
- 150000002499 ionone derivatives Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides flexible display panels and its manufacture method, flexible display device, wherein, flexible display panels include：First flexible base board, organic luminescent device layer and the second flexible base board, organic luminescent device layer are packaged between the first flexible base board and the second flexible base board, and the second flexible base board includes at least an inorganic polymeric silicon layer and at least a hardcoat film for stacking；The material of inorganic polymeric silicon layer includes at least one of polyoxy SiClx, poly- silicon nitride, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride.The present invention utilizes spin coating, spraying, wire mark, the modes such as inkjet printing obtain inorganic polymeric silicon layer on flexible OLED, reduce the use of base material, reduce the thickness of base material, there is preferable hardness, wearability, the flexible function and packaging effect of flexible OLED can also be strengthened at the same time, and have the effect of flatness layer concurrently.
Description
Technical field
The present invention relates to display device field, more particularly to flexible display panels and its manufacture method, flexible display device.
Background technology
The cover-plate glass of the relative stiffness OLED the superiors, the euphotic cover plate (being used to substitute cover-plate glass) of flexible OLED have
The challenge of bigger, should have the high rigidity and the performance such as anti-wear of cover-plate glass, have again can soft bendable performance.Figure
1 is the diagrammatic cross-section of the flexible display panels of the prior art.As shown in Figure 1, existing flexible display panels include：First is soft
Property substrate 100 ', 200 ' and second flexible base board 300 ' of organic luminescent device layer, the organic luminescent device layer 200 ' are sealed
Loaded between first flexible base board 100 ' and second flexible base board 300 '.First flexible base board 100 ' is Flexible Displays
The substrate of panel.Second flexible base board 300 ' is the cover board of flexible display panels, and the second flexible base board 300 ' is to be used for flexibility
The soft light cover board of OLED, also commonly referred to as hardcoat film (hard coating film).Usual common hard conating is thin
Film is acrylic based material or epoxy types, and when reaching certain high rigidity, its thickness also tends to thicker, limits flexibility
OLED can soft bendable performance.
In view of this, flexible display panels and its manufacture method, flexible display device are inventor provided.
The content of the invention
For in the prior art the defects of, it is an object of the invention to provide flexible display panels and its manufacture method, soft
Property display device, the shortcomings that overcoming the prior art, using modes such as spin coating, spraying, wire mark, inkjet printings on flexible OLED
Inorganic polymeric silicon layer is obtained, reduces the use of base material, reduces the thickness of base material, there is preferable hardness, wearability, at the same time
The flexible function and packaging effect of flexible OLED can also be strengthened, and have the effect of flatness layer concurrently.
According to an aspect of the present invention, there is provided a kind of flexible display panels, including：First flexible base board, organic light emission
Device layer and the second flexible base board, the organic luminescent device layer are packaged in first flexible base board and described second soft
Property substrate between, second flexible base board include stacking at least an inorganic polymeric silicon layer and at least a hardcoat film；
The material of the inorganic polymeric silicon layer include polyoxy SiClx, poly- silicon nitride, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide,
At least one of poly- carbon silicon oxynitride.
Preferably, the inorganic polymeric silicon layer is formed at the hardcoat film away from the one of the organic luminescent device layer
Side.
Preferably, the inorganic polymeric silicon layer is formed between the hardcoat film and the organic luminescent device layer.
Preferably, second flexible base board includes one first hardcoat film and one second hardcoat film, the nothing
Machine polymerization silicon layer is formed between first hardcoat film and second hardcoat film.
Preferably, the thickness range of the inorganic polymeric silicon layer is 50nm to 500um.
Preferably, the hardcoat film includes acrylic based material or epoxy types.
Preferably, first flexible base board is the substrate of flexible display panels, and second flexible base board is flexible aobvious
Show the cover board of panel.
According to another aspect of the present invention, a kind of flexible display device, including Flexible Displays face described above are also provided
Plate.
According to another aspect of the present invention, a kind of manufacture method of flexible display panels is also provided, is comprised the following steps：
S100, form one first flexible base board；
S200, in the side of first flexible base board form organic light emitting device layer；And
S300, in the organic luminescent device layer form one second flexible base away from the side of first flexible base board
Plate, second flexible base board include at least an inorganic polymeric silicon layer and at least a hardcoat film for stacking；Described in formation
The mode of inorganic polymeric silicon layer includes first plated film and then cures, and the material of the inorganic polymeric silicon layer includes polyoxy SiClx, poly- nitrogen
At least one of SiClx, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride.
Preferably, the step S300 includes：Deviate from the one of first flexible base board in the organic luminescent device layer
Side forms a hardcoat film；And
In the hardcoat film inorganic polymeric silicon layer is formed away from the side of the organic luminescent device layer.
Preferably, the step S300 includes：Deviate from the one of first flexible base board in the organic luminescent device layer
Side forms the inorganic polymeric silicon layer；And
In the inorganic polymeric silicon layer hardcoat film is formed away from the side of the organic luminescent device layer.
Preferably, the step S300 includes：Deviate from the one of first flexible base board in the organic luminescent device layer
Side forms one first hardcoat film；
In first hardcoat film inorganic polymeric silicon layer is formed away from the side of the organic luminescent device layer；With
And
In the inorganic polymeric silicon layer one second hardcoat film is formed away from the thin side of first hard conating.
Preferably, the thickness range of the inorganic polymeric silicon layer is 50nm to 500um.
Preferably, the plated film mode of the inorganic polymeric silicon layer includes：Heat deposition, spin coating, spraying, silk-screen printing, ink-jet,
One in dispensing, sputtering, vacuum coating, electron beam evaporation, atomic layer deposition, ion beam assisted depositing, chemical vapor deposition
Kind.
Preferably, the chemical vapor deposition is plasma enhanced chemical vapor deposition, high-density plasma chemical
Vapor deposition, inductively coupled plasma chemical vapor deposition, capacitance coupling plasma enhancing chemical vapor deposition and table
One kind in surface wave plasma activated chemical vapour deposition.
Preferably, the curing mode of the inorganic polymeric silicon layer includes：Ultraviolet curing or heat cure.
In patent content, if selection heat deposition, spin coating, spraying, silk-screen printing, ink-jet, then through UV curings or heat cure
Film forming, if selection sputtering, vacuum coating, electron beam evaporation, atomic layer deposition, ion beam assisted depositing, chemical vapor deposition
Accumulate, then direct formation of film at surface.
In view of this, flexible display panels of the invention and its manufacture method, flexible display device utilize spin coating, spraying,
The modes such as wire mark, inkjet printing obtain inorganic polymeric silicon layer on flexible OLED, reduce the use of base material, reduce base material
Thickness, has preferable hardness, wearability, while can also strengthen the flexible function and packaging effect of flexible OLED, and simultaneous
Has the effect of flatness layer.
Brief description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, further feature of the invention,
Objects and advantages will become more apparent upon：
Fig. 1 is the diagrammatic cross-section of the flexible display panels of the prior art；
Fig. 2 is the diagrammatic cross-section of the first flexible display panels of the present invention；
Fig. 3 is the diagrammatic cross-section of second of flexible display panels of the present invention；
Fig. 4 is the diagrammatic cross-section of the third flexible display panels of the present invention；And
Fig. 5 is the diagrammatic cross-section of the flexible display device of the present invention.
Reference numeral
100 ' first flexible base boards
200 ' organic luminescent device layers
300 ' second flexible base boards
100 first flexible base boards
200 organic luminescent device layers
300 hardcoat films
310 first hardcoat films
320 second hardcoat films
400 inorganic polymeric silicon layers
510 first flexible display panels
520 second flexible display panels
530 the 3rd flexible display panels
600 flexible display devices
Embodiment
Example embodiment is described more fully with referring now to attached drawing.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, these embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.It is identical attached in figure
Icon note represents same or similar structure, thus will omit repetition thereof.
Described feature, structure or characteristic can be incorporated in one or more embodiments in any suitable manner
In.In the following description, there is provided many details fully understand embodiments of the present invention so as to provide.However,
One of ordinary skill in the art would recognize that without one or more in specific detail, or using other methods, constituent element, material
Material etc., can also put into practice technical scheme.In some cases, be not shown in detail or describe known features, material or
Person is operated to avoid the fuzzy present invention.
As used herein, term "comprising", " comprising ", " having " or their any other variant are intended to non-exclusive
Property includes.E.g., including the method for series of features, product or device are not necessarily limited to those features, but may include not
Being expressly recited or these methods, product or device other intrinsic features.Non-clearly conversely pointed out in addition, removing, otherwise
"or" refer to it is inclusive or, rather than it is exclusive or.For example, condition A or B is by any one following satisfaction：A be true (or presence) and
B is false (or there is no), and A is false (or there is no) and B is true (or presence), and A and B are true (or presence).
Moreover, the use of " one kind " is used to describe element and component described herein.Facility has been only for, and this hair is provided
The general sense of bright scope.The description is understood to include a kind of or at least one, and odd number also includes plural number, otherwise also
So, unless it substantially has contrary.For example, when Individual Items are being described herein, more than one article may replace single
Article uses.Similarly, when more than one article is being described herein, Individual Items can replace more than one article.
Unless otherwise defined, all technical and scientific terms used herein and the ordinary skill in fields of the present invention
Personnel normally understood there is identical implication.Material, method and example are only illustrative, and are not intended to be limiting
's.For degree not described here, many details in relation to specific material and processing behavior are conventional, and can be in inorganic layer
Found in textbook and other sources in deposition field and corresponding manufacturing field.
Fig. 2 is the diagrammatic cross-section of the first flexible display panels of the present invention.As shown in Fig. 2, the first of the present invention
Flexible display panels 510 include：First flexible base board 100,200 and second flexible base board of organic luminescent device layer, You Jifa
Optical device layer 200 is packaged between the first flexible base board 100 and the second flexible base board wherein, and the first flexible base board 100 is soft
The substrate of property display panel, the second flexible base board is the cover board of flexible display panels.Second flexible base board includes stacking at least
One inorganic polymeric silicon layer 400 and at least a hardcoat film 300.Inorganic polymeric silicon layer 400 is formed at hardcoat film 300 and carries on the back
From the side of organic luminescent device layer 200, but it is not limited.The material of inorganic polymeric silicon layer 400 includes polyoxy SiClx, poly- nitrogen
At least one of SiClx, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride.Inorganic polymeric silicon layer
400 thickness range is 50nm (nanometer) to 500um (micron), but is not limited.Such as：The thickness of inorganic polymeric silicon layer 400
Degree can be 60nm, 100nm, 200nm, 500nm, 1um etc..Hardcoat film 300 includes acrylic based material or epoxies thing
Matter, but be not limited.Inorganic polymeric silicon layer 400 can be formed at hardcoat film by first plated film and then cured mode
300 deviate from the side of organic luminescent device layer 200.The mode of plated film inorganic polymeric silicon layer 400 includes：Heat deposition, spin coating, spray
Painting, silk-screen printing, ink-jet, dispensing, sputtering, vacuum coating, electron beam evaporation, atomic layer deposition, ion beam assisted depositing, change
Learn one kind in vapour deposition.Chemical vapor deposition is plasma enhanced chemical vapor deposition, high-density plasma chemical
Vapor deposition, inductively coupled plasma chemical vapor deposition, capacitance coupling plasma enhancing chemical vapor deposition and table
One kind in surface wave plasma activated chemical vapour deposition.The mode of plated film inorganic polymeric silicon layer 400 includes：Ultraviolet curing or
Heat cure.Inorganic polymeric silicon layer 400 in the first flexible display panels of the present invention has than acrylic based material or epoxy
The more preferable hardness of class material and wearability, after being combined with each other by inorganic polymeric silicon layer 400 and hardcoat film 300 so that
The first flexible display panels 510 can reduce thickness, moreover it is possible to which guarantee has preferable hardness and bending degree.
Fig. 3 is the diagrammatic cross-section of second of flexible display panels of the present invention.As shown in figure 3, second of the present invention
Flexible display panels 520 include：First flexible base board 100,200 and second flexible base board of organic luminescent device layer, You Jifa
Optical device layer 200 is packaged between the first flexible base board 100 and the second flexible base board wherein, and the first flexible base board 100 is soft
The substrate of property display panel, the second flexible base board is the cover board of flexible display panels.Second flexible base board includes stacking at least
One inorganic polymeric silicon layer 400 and at least a hardcoat film 300.Inorganic polymeric silicon layer 400 be formed at hardcoat film 300 with
Between organic luminescent device layer 200, but it is not limited.The material of inorganic polymeric silicon layer 400 includes polyoxy SiClx, poly- nitridation
At least one of silicon, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride.Inorganic polymeric silicon layer 400
Thickness range be 50nm to 500um, but be not limited.Hardcoat film 300 includes acrylic based material or epoxies thing
Matter, but be not limited.Similarly, the inorganic polymeric silicon layer 400 in second of flexible display panels 520 of the invention have than
Acrylic based material or the more preferable hardness of epoxy types and wearability, pass through inorganic polymeric silicon layer 400 and hardcoat film 300
After being combined with each other so that the second flexible base board 520 can reduce thickness, moreover it is possible to which guarantee has preferable hardness and bending degree.
Fig. 4 is the diagrammatic cross-section of the third flexible display panels of the present invention.As shown in figure 4, the third of the present invention
Flexible display panels 530 include：First flexible base board 100,200 and second flexible base board of organic luminescent device layer, You Jifa
Optical device layer 200 is packaged between the first flexible base board 100 and the second flexible base board wherein, and the first flexible base board 100 is soft
The substrate of property display panel, the second flexible base board is the cover board of flexible display panels.Second flexible base board includes a nothing of stacking
Machine polymerization silicon layer 400, one first hardcoat film 310 and one second hardcoat film 320, inorganic polymer layers 400 are formed at
Between first hardcoat film 310 and the second hardcoat film 320, but it is not limited.The material bag of inorganic polymeric silicon layer 400
Include at least one in polyoxy SiClx, poly- silicon nitride, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride
Kind.The thickness range of inorganic polymeric silicon layer 400 be 50nm to 500um, but be not limited.Hardcoat film 300 includes sub- gram
Power based material or epoxy types, but be not limited.Similarly, the nothing in the third flexible display panels 530 of the invention
Machine polymerization silicon layer 400 has than acrylic based material or the more preferable hardness of epoxy types and wearability, passes through inorganic polymeric silicon
After 400 and first, second hardcoat film of layer is combined with each other so that the third flexible display panels 530 can reduce thickness,
Also ensure with preferable hardness and bending degree.
The present invention also provides a kind of flexible display device with above-mentioned flexible display panels.Fig. 5 is the flexibility of the present invention
The diagrammatic cross-section of display device.The flexible display device 600 of the present invention can include：As any one in Fig. 2,3,4 is flexible
Display panel, in Fig. 5 by taking the first flexible display panels of Fig. 2 as an example, but is not limited.The flexible display device of the present invention
Thickness can be reduced, moreover it is possible to which guarantee has preferable hardness and bending degree.Correlation technique feature is as it was previously stated, no longer superfluous herein
State.
The present invention also provides a kind of manufacture method of flexible display panels, for manufacturing above-mentioned flexible display panels, including
Following steps：
S100, form one first flexible base board 100.
S200, in the side of the first flexible base board 100 form organic light emitting device layer 200.And
S300, organic luminescent device layer 200 away from the first flexible base board 100 side formed one second flexible base board,
Second flexible base board includes an at least inorganic polymeric silicon layer 400 and an at least hardcoat film 300 for stacking；Formed inorganic poly-
Closing the mode of silicon layer 400 includes first plated film and then cures, the material of inorganic polymeric silicon layer 400 include polyoxy SiClx, poly- silicon nitride,
At least one of poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride.The thickness of inorganic polymeric silicon layer 400
Degree scope be 50nm to 500um, but be not limited.
Wherein, step S300 includes：In organic luminescent device layer 200 one is formed away from the side of the first flexible base board 100
Hardcoat film 300；And an inorganic polymeric silicon is formed away from the side of organic luminescent device layer 200 in hardcoat film 300
Layer 400 (can be used for the first flexible display panels 510 in manufacture Fig. 2).
Alternatively, step S300 can include：Deviate from the side shape of the first flexible base board 100 in organic luminescent device layer 200
Into an inorganic polymeric silicon layer 400；It is and hard away from the formation one of the side of organic luminescent device layer 200 in inorganic polymeric silicon layer 400
Coated film 300 (can be used for second of flexible display panels 520 in manufacture Fig. 3).
Alternatively, step S300 can include：Deviate from the side shape of the first flexible base board 100 in organic luminescent device layer 200
Into one first hardcoat film 310；In the first hardcoat film 310 nothing is formed away from the side of organic luminescent device layer 200
Machine polymerize silicon layer 400；And one second hardcoat film is formed away from the thin side of the first hard conating in inorganic polymeric silicon layer 400
320 (can be used for the third flexible display panels 530 in manufacture Fig. 4).
The mode of plated film inorganic polymeric silicon layer 400 in the present embodiment includes：Heat deposition, spin coating, spraying, silk-screen printing,
Ink-jet, dispensing, sputtering, vacuum coating, electron beam evaporation, atomic layer deposition (Atomic layer deposition), ion
One kind in beam assistant depositing (IBAD), chemical vapor deposition (CVD).Chemical vapor deposition is Chemical Vapor
The abbreviation of Deposition, refers to the gas phase reaction under high temperature, for example, metal halide, organic metal, hydrocarbon etc.
Thermal decomposition, hydrogen reduction or make its mixed gas occur at high temperature chemical reaction with nothings such as precipitating metal, oxide, carbide
The method of machine material.
Chemical vapor deposition in the present embodiment is plasma enhanced chemical vapor deposition (Plasma Enhanced
Chemical Vapor Deposition), high-density plasma chemical vapor deposition (HDP-CVD), inductively coupled plasma
Body chemical vapor phase growing (ICP-CVD), capacitance coupling plasma enhancing chemical vapor deposition (CCP-CVD) and surface wave etc.
One kind in ion body chemical vapor phase growing (SWP-CVD).Such as：Plasma enhanced chemical vapor deposition (Plasma
Enhanced Chemical Vapor Deposition) it is to make the gas containing film composed atom by microwave or radio frequency etc.
Ionization, is being partially formed plasma, and plasma chemistry activity is very strong, it is easy to reacts, goes out in deposition on substrate
Desired film.In order to enable chemical reaction to carry out at a lower temperature, it make use of the activity of plasma anti-to promote
Should, thus this CVD is known as plasma enhanced chemical vapor deposition (PECVD).
In summary, flexible display panels of the invention and its manufacture method, flexible display device utilize spin coating, spraying,
The modes such as wire mark, inkjet printing obtain inorganic polymeric silicon layer on flexible OLED, reduce the use of base material, reduce base material
Thickness, has preferable hardness, wearability, while can also strengthen the flexible function and packaging effect of flexible OLED, and simultaneous
Has the effect of flatness layer.
The specific embodiment of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (16)
- A kind of 1. flexible display panels, it is characterised in that including：First flexible base board, organic luminescent device layer and second are soft Property substrate, the organic luminescent device layer is packaged between first flexible base board and second flexible base board, described Second flexible base board includes at least an inorganic polymeric silicon layer and at least a hardcoat film for stacking；The inorganic polymeric silicon layer Material include polyoxy SiClx, poly- silicon nitride, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, in poly- carbon silicon oxynitride It is at least one.
- 2. flexible display panels as claimed in claim 1, it is characterised in that：The inorganic polymeric silicon layer is formed at the hard painting Layer film deviates from the side of the organic luminescent device layer.
- 3. flexible display panels as claimed in claim 1, it is characterised in that：The inorganic polymeric silicon layer is formed at the hard painting Between layer film and the organic luminescent device layer.
- 4. flexible display panels as claimed in claim 1, it is characterised in that：Second flexible base board includes one first hard painting Layer film and one second hardcoat film, the inorganic polymeric silicon layer are formed at first hardcoat film and described second hard Between coated film.
- 5. flexible display panels as claimed in claim 4, it is characterised in that：The thickness range of the inorganic polymeric silicon layer is 50nm to 500um.
- 6. flexible display panels as claimed in claim 1, it is characterised in that：The hardcoat film includes acrylic based material Or epoxy types.
- 7. flexible display panels as claimed in claim 1, it is characterised in that：First flexible base board is flexible display panels Substrate, second flexible base board is the cover board of flexible display panels.
- 8. a kind of flexible display device, including flexible display panels as claimed in any of claims 1 to 7 in one of claims.
- 9. a kind of manufacture method of flexible display panels, comprises the following steps：S100, form one first flexible base board；S200, in the side of first flexible base board form organic light emitting device layer；AndS300, the organic luminescent device layer away from first flexible base board side formed one second flexible base board, institute Stating the second flexible base board includes at least the inorganic polymeric silicon layer and at least a hardcoat film of stacking；Formed described inorganic poly- The mode of silicon layer is closed including first plated film and then is cured, the material of the inorganic polymeric silicon layer includes polyoxy SiClx, poly- silicon nitride, gathers At least one of silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride.
- 10. the manufacture method of flexible display panels as claimed in claim 9, it is characterised in that the step S300 includes： The organic luminescent device layer forms a hardcoat film away from the side of first flexible base board；AndIn the hardcoat film inorganic polymeric silicon layer is formed away from the side of the organic luminescent device layer.
- 11. the manufacture method of flexible display panels as claimed in claim 9, it is characterised in that the step S300 includes： The organic luminescent device layer forms the inorganic polymeric silicon layer away from the side of first flexible base board；AndIn the inorganic polymeric silicon layer hardcoat film is formed away from the side of the organic luminescent device layer.
- 12. the manufacture method of flexible display panels as claimed in claim 9, it is characterised in that the step S300 includes： The organic luminescent device layer forms one first hardcoat film away from the side of first flexible base board；In first hardcoat film inorganic polymeric silicon layer is formed away from the side of the organic luminescent device layer；AndIn the inorganic polymeric silicon layer one second hardcoat film is formed away from the thin side of first hard conating.
- 13. the manufacture method of the flexible display panels as described in any one in claim 9 to 12, it is characterised in that：It is described The thickness range of inorganic polymeric silicon layer is 50nm to 500um.
- 14. the manufacture method of flexible display panels as claimed in claim 13, it is characterised in that the inorganic polymeric silicon layer Plated film mode includes：Heat deposition, spin coating, spraying, silk-screen printing, ink-jet, dispensing, sputtering, vacuum coating, electron beam evaporation, One kind in atomic layer deposition, ion beam assisted depositing, chemical vapor deposition.
- 15. the manufacture method of flexible display panels as claimed in claim 14, it is characterised in that：The chemical vapor deposition is Plasma enhanced chemical vapor deposition, high-density plasma chemical vapor deposition, inductively coupled plasma chemical gaseous phase One kind in deposition, capacitance coupling plasma enhancing chemical vapor deposition and surface wave plasma chemical vapor deposition.
- 16. the manufacture method of flexible display panels as claimed in claim 13, it is characterised in that：The inorganic polymeric silicon layer Curing mode includes：Ultraviolet curing or heat cure.
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