CN107918569A - Monitor RTC chip power down, the method and apparatus of crystal oscillator failure of oscillation - Google Patents
Monitor RTC chip power down, the method and apparatus of crystal oscillator failure of oscillation Download PDFInfo
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- CN107918569A CN107918569A CN201711171235.7A CN201711171235A CN107918569A CN 107918569 A CN107918569 A CN 107918569A CN 201711171235 A CN201711171235 A CN 201711171235A CN 107918569 A CN107918569 A CN 107918569A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/14—Error detection or correction of the data by redundancy in operation
- G06F11/1402—Saving, restoring, recovering or retrying
- G06F11/1415—Saving, restoring, recovering or retrying at system level
- G06F11/1441—Resetting or repowering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/04—Generating or distributing clock signals or signals derived directly therefrom
- G06F1/06—Clock generators producing several clock signals
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Abstract
The invention discloses monitoring RTC chip power down, the method and apparatus of crystal oscillator failure of oscillation, it is related to clock circuit detection technique field, improves the work efficiency of maintained equipment, main technical schemes of the invention are：A kind of device for recording power down time data, including：MCU chip, RTC chip, supplying cell, the first capacitance, the second capacitance and for power conversion circuit；The MCU chip is connected with the RTC chip；The supplying cell and first capacitance are parallel between the standby electric pin and ground of the RTC chip；It is described to include switch control terminal, first switch switch terminal and second switch switch terminal for power conversion circuit；The switch control terminal is connected with the cathode and divider resistance of the supplying cell respectively, the other end ground connection of the divider resistance；The first switch switch terminal is connected with the main electric pin of the MCU chip and the RTC chip respectively, the second switch switch terminal and second capacitance and connect.The present invention is used to monitor RTC chip power down, crystal oscillator failure of oscillation.
Description
Technical field
The present invention relates to clock circuit detection technique field, more particularly to a kind of monitor RTC chip power down, crystal oscillator failure of oscillation
Method and apparatus.
Background technology
Real-time clock (Real Time Clock, RTC) is commonly referred to as clock chip, it can be provided accurately for people
Real-time time, can carry out timing, and have the multiple functions such as leap year compensation to year, month, day, hour, min, second, or can also
Accurate time reference is provided for electronic system.
At present, RTC chip is mostly using the higher crystal oscillator of precision as clock source, in order to realize in main electric power down
When, can realize power down protection so that RTC chip continues to work normally, it is also necessary in integrated circuits external reserve battery with
Ensure to RTC chip continued power.
However, fall or since other external causes cause backup battery voltage rapid drawdown when backup battery voltage occurs
When, correspondingly, crystal oscillation condition can also change correspondingly, and then can not meet that RTC chip works normally, RTC chip stops meter
When, while either backup battery voltage is fallen or since other external causes causes backup battery voltage rapid drawdown, finally all
It can cause crystal oscillator failure of oscillation so that the time data of record is all lost in RTC chip, then when again to RTC
The data read during the device power of chip out of RTC chip are the initial values of acquiescence, i.e., record time data hair in RTC chip
Raw time playback, often the equipment with RTC chip is returned factory resets the time to existing processing method, particularly with envelope
The equipment of time function of reset has been closed, can only even more take such counter-measure, it not only expends the maintenance cost of large number of equipment,
Simultaneously because the life cycle that time frequent playback also results in equipment terminates too early, the service life of equipment is reduced.
The content of the invention
In view of this, the present invention provides a kind of monitoring RTC chip power down, the method and apparatus of crystal oscillator failure of oscillation, main purpose
It is RTC chip can be recovered to the moment is used recently according to the power down time data of record, improves the work of maintained equipment
Make efficiency, and power down time data is recorded by success when abnormal electrical power supply occurs, and then crystal oscillator can be analyzed and stopped
The reason for shaking.
To reach above-mentioned purpose, present invention generally provides following technical solution：
In a first aspect, the present invention provides a kind of device for recording RTC chip power down time data, which includes：
MCU chip, RTC chip, supplying cell, the first capacitance, the second capacitance and for power conversion circuit；
The MCU chip is connected with the RTC chip；
The supplying cell and first capacitance are parallel between the standby electric pin and ground of the RTC chip；
It is described to include switch control terminal, first switch switch terminal and second switch switch terminal for power conversion circuit；It is described to open
Close control terminal to be connected with the cathode and divider resistance of the supplying cell respectively, the other end ground connection of the divider resistance；It is described
Main electric pin of the first switch switch terminal respectively with the MCU chip and the RTC chip is connected, the second switch switch terminal
With second capacitance and connect；
Wherein, when supplying cell power supply is normal, the first switch switch terminal and the second switch switch terminal
Between open a way；When the supplying cell abnormal electrical power supply, between the first switch switch terminal and the second switch switch terminal
Connection, second capacitance are powered for the MCU chip and the RTC chip.
Preferential, described device further includes：Cathode is connected with the supplying cell cathode, anode and the RTC chip
The diode of standby electricity pin connection.
Preferably, described device further includes：Cathode is connected with the first switch switch terminal, anode and the second switch
The diode of switch terminal connection.
Second aspect, present invention also offers a kind of method for recording RTC chip power down time data, this method is applied to
The device of foregoing record RTC chip power down time data, this method include：
When MCU chip determines supplying cell to RTC chip abnormal electrical power supply, the MCU chip is inquired about in the RTC chip
Time data；
If the time data in the RTC chip is not the default initial values of the RTC chip, the MCU chip is from institute
State and the time data is read in RTC chip and is stored as power down time data；
If the time data in the RTC chip is the default initial values of the RTC chip, the MCU chip determines it
Whether itself is stored with power down time data, if so, the MCU chip power down time data that itself is stored is written to it is described
In RTC chip.
Preferably, the MCU chip determines supplying cell to RTC chip abnormal electrical power supply, including：
When the MCU chip receives the power supply signal of the second capacitance, determine supplying cell to RTC chip abnormal electrical power supply；
Alternatively,
The MCU chip receives the power supply signal of the second capacitance and detects that the crystal oscillator vibration of the RTC chip stops
During the position of position, determine supplying cell to RTC chip abnormal electrical power supply.
Preferably, the power down time data that itself is stored is written in the RTC chip by the MCU chip, including：
The MCU chip will record the immediate power down of time and current time in the power down time data itself stored when
Data are carved to be written in the RTC chip.
Preferably, second capacitance is not less than first capacitance to the RTC to the power-on time of the MCU chip
The power-on time of chip.
The third aspect, present invention also offers a kind of method of definite RTC chip crystal oscillator failure of oscillation reason, the method application
In the main electricity of MCU chip after the power is turned on, this method includes：
MCU chip determines that the crystal oscillator of RTC chip stops oscillation, the time data in the MCU chip inquiry RTC chip；
If the time data in the RTC chip is the default initial values of the RTC chip, the MCU chip by itself
The power down time data of storage is written in the RTC chip；
If the time data in the RTC chip is not the default initial values of the RTC chip, the MCU chip determines
Its own whether be stored with the RTC chip this time the associated power down time data of crystal oscillator failure of oscillation, if so, the MCU chip
The reason for determining this crystal oscillator failure of oscillation of the RTC chip is Voltage Drop, otherwise determines this crystal oscillator failure of oscillation of the RTC chip
Reason is external disturbance.
Preferably, the power down time data that itself is stored is written in the RTC chip by the MCU chip, including：
MCU chip searches the power down time data of its own storage, and the power down time data is at least one；
According to recording the time in the power down time data, the MCU chip will power down immediate with current time when
Data are carved to be written in the RTC chip；
After the power down time data is write in the RTC chip, the RTC chip crystal oscillator vibration stop position is removed
Set.
Preferably, the MCU chip determines that the crystal oscillator of RTC chip stops oscillation, including：
When the crystal oscillator that the MCU chip reads RTC chip vibrates stop position set, the MCU chip determines RTC cores
The crystal oscillator of piece stops oscillation.
Preferably, the method further includes：
MCU chip counts the reason for crystal oscillator failure of oscillation number and crystal oscillator failure of oscillation associated by each crystal oscillator failure of oscillation.
By above-mentioned technical proposal, technical solution provided by the invention at least has following advantages：
It is provided by the invention to monitor RTC chip power down, the method and apparatus of crystal oscillator failure of oscillation, when spare supplying cell voltage
When falling and then causing to occur crystal oscillator failure of oscillation, the present invention can use the first capacitance and power in time for RTC chip, so that temporarily
Time data in RTC chip is kept, while uses and powers for power conversion circuit and the second capacitance for MCU chip, so that MCU core
Piece can record the power down time data temporarily kept in RTC chip in time.Compared in the prior art, when crystal oscillator failure of oscillation occurs
When, it is impossible to any measure record power down time data is taken in time, so that data are all lost in RTC chip, thus it is past
The time is reset toward that the equipment with RTC chip can only be returned factory, in this way, both having expended the maintenance cost of large number of equipment, at the same time
So that maintained equipment efficiency is very low, and reduce the service life of equipment.The power down moment that the present invention can record MCU chip
Data are re-write in RTC chip, so that use state when RTC chip recovers to generation crystal oscillator failure of oscillation, avoiding to have
The equipment for having RTC chip is returned factory and is reset, so as to reduce the maintenance cost of equipment, improves plant maintenance work effect
Rate, while also increase the service life of equipment, in addition, can also be according to whether can successfully recording when crystal oscillator failure of oscillation occurs
Power down time data, to determine caused by the reason for secondary crystal oscillator failure of oscillation is Voltage Drop or external disturbance, to test people
Member further analyzes disturbed condition of the experimental situation to equipment according to the reason for crystal oscillator failure of oscillation, and can in time make and change accordingly
It is kind.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, and in order to allow above and other objects of the present invention, feature and advantage can
Become apparent, below especially exemplified by the embodiment of the present invention.
Brief description of the drawings
By reading the detailed description of hereafter preferred embodiment, it is various other the advantages of and benefit it is common for this area
Technical staff will be clear understanding.Attached drawing is only used for showing the purpose of preferred embodiment, and is not considered as to the present invention
Limitation.And in whole attached drawing, identical component is denoted by the same reference numerals.In the accompanying drawings：
Fig. 1 is a kind of composition frame chart of device for recording RTC chip power down time data provided in an embodiment of the present invention；
Fig. 2 is the circuit diagram of the record RTC chip power down time data provided in an embodiment of the present invention enumerated；
Fig. 3 is RTC chip supplying cell Voltage Drop operation principle flow chart provided in an embodiment of the present invention；
Fig. 4 is a kind of method flow diagram for recording RTC chip power down time data provided in an embodiment of the present invention；
Fig. 5 is the equipment routine work principle flow chart of RTC chip provided in an embodiment of the present invention；
Fig. 6 is a kind of method flow diagram of definite RTC chip crystal oscillator failure of oscillation reason provided in an embodiment of the present invention.
Embodiment
The exemplary embodiment of the present invention is more fully described below with reference to accompanying drawings.Although the present invention is shown in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the present invention without should be by embodiments set forth here
Limited.Conversely, there is provided these embodiments are to be able to be best understood from the present invention, and can be by the scope of the present invention
Completely it is communicated to those skilled in the art.
An embodiment of the present invention provides a kind of device for recording RTC chip power down time data, as shown in Figure 1, the device
Including：MCU chip 1, RTC chip 2, supplying cell 3, the first capacitance 4, the second capacitance 5 and confession power conversion circuit 6；MCU chip 1
It is connected with RTC chip 2；3 and first capacitance 4 of supplying cell is parallel between the standby electric pin and ground of RTC chip 2；Power supply conversion
Circuit 6 includes switch control terminal, first switch switch terminal and second switch switch terminal；Switch control terminal respectively with supplying cell 3
Cathode and divider resistance 7 connect, the other end of divider resistance 7 ground connection；First switch switch terminal respectively with MCU chip 1 and RTC
The main electric pin connection of chip 2, second switch switch terminal and the second capacitance 5 and connect；Wherein, when supplying cell 3 is powered just
Chang Shi, opens a way between first switch switch terminal and second switch switch terminal；When 3 abnormal electrical power supply of supplying cell, first switch is cut
Change between end and second switch switch terminal and connect, the second capacitance 5 is powered for MCU chip 1 and RTC chip 2.
Specifically, the embodiment of the present invention illustrates the record in the embodiment of the present invention by the process and principle of implementation
The device of RTC chip power down time data：
The device for the record 2 power down time data of RTC chip that the embodiment of the present invention is provided, for departing from RTC chip 2
In the case of main electricity, when supplying cell 3 causes crystal oscillator failure of oscillation to 2 abnormal electrical power supply of RTC chip, realization records this crystal oscillator and stops
The power down time data to shake when occurring in RTC chip 2., wherein it is desired to explanation, supplying cell 3 powers RTC chip 2 different
3 Voltage Drop of supplying cell or the short circuit of supplying cell 3 are referred to, it can cause crystal oscillator vibration environment to change, so that RTC
2 crystal oscillator failure of oscillation of chip, RTC chip 2 stop timework.Although based on above-mentioned 3 abnormal electrical power supply of supplying cell either way
It can cause 2 crystal oscillator failure of oscillation of RTC chip, but when the short circuit of supplying cell 3 occurs due to 3 voltage dip of supplying cell, so as to come
It is too late to take RTC chip 2 any respective handling measure so that the time data of record is all lost in RTC chip 2, thus
Power down time data in RTC chip when can not record this crystal oscillator failure of oscillation in time, thus, for the embodiment of the present invention, lead to
Cross the confession that the power down time data that device provided in this embodiment is able to record refers to occur in 3 Voltage Drop of supplying cell
Power down time data in RTC chip 2 is recorded during electrical anomaly.
It is able to record in RTC chip 2 when 3 Voltage Drop of supplying cell causes 2 crystal oscillator failure of oscillation of RTC chip to realize
Electric time data, specifically, the embodiment of the present invention is connected by MCU chip 1 with RTC chip 2, and by supplying cell 3 and
One capacitance 4 is parallel between the standby electric pin and ground of RTC chip 2, wherein, MCU chip 1 has the main electric pins of VCC, RTC chip 2
With the main electric pins of VCC and the standby electric pins of Vbat, when 3 Voltage Drop of supplying cell, the first capacitance 4 can be in time to RTC cores
Piece 2 is powered, temporarily to keep the time data of record in RTC chip 2, so that MCU chip 1 can be read in RTC chip 2 temporarily
The time data of holding, and power down time data during as this crystal oscillator failure of oscillation is stored in MCU chip.
Further, the embodiment of the present invention also using the second capacitance 5 and supplies power conversion circuit 6, in order to when supplying cell 3
It can be powered during to 2 abnormal electrical power supply of RTC chip using the second capacitance 5 to MCU chip 1 and RTC chip 2, specifically, power supply conversion
Circuit 6 includes switch control terminal, first switch switch terminal and second switch switch terminal, switch control terminal respectively with supplying cell
3 cathode and divider resistance 7 connects, the other end of divider resistance 7 ground connection, first switch switch terminal respectively with MCU chip 1 and
The main electric pin connection of RTC chip 2, second switch switch terminal and the second capacitance 5 and connect, for powering when supplying cell 3
When normal, open a way between first switch switch terminal and second switch switch terminal, the second capacitance 5 will not be filled to MCU chip 1 at this time
Electricity, MCU chip 1 are not started to work, and may be at resting state, when 3 abnormal electrical power supply of supplying cell, first switch switch terminal
Being connected between second switch switch terminal, the second capacitance 5 is powered for MCU chip 1 and RTC chip 2, and MCU chip 1 is started to work,
For reading the time data temporarily kept in RTC chip 2, power, make simultaneously because the second capacitance 5 can also be RTC chip 2
In RTC chip 2 time data can keep more long, so that time data that MCU chip 1 can be read is more complete.
A kind of device for recording RTC chip power down time data provided in an embodiment of the present invention in summary, the device
Including MCU chip, RTC chip, supplying cell, the first capacitance, the second capacitance and for power conversion circuit, when supplying cell voltage falls
When falling and causing to RTC chip abnormal electrical power supply, the embodiment of the present invention can use the first capacitance and power in time for RTC chip, with
So that temporarily keeping time data in RTC chip, while use and power for power conversion circuit and the second capacitance for MCU chip, with
Enable MCU chip to read power down time data in temporary transient retention time data out of RTC chip in time, and can incite somebody to action
The power down time data of MCU chip storage is re-write in RTC chip, so that RTC chip recovers to when crystal oscillator failure of oscillation occurs
Use state, avoid and the equipment with RTC chip is returned into factory reset, thus reduce the maintenance of equipment into
This, improves plant maintenance work efficiency, while also increases the service life of equipment.
Further, in order to describe the 2 power down moment of record RTC chip provided in an embodiment of the present invention shown in Fig. 1 in detail
The device of data, makes it at this and specifically enumerating, circuit diagram as shown in Figure 2, wherein, RTC chip 2 is drawn by I2C
Foot is connected with MCU chip 1, so that MCU chip 1 reads the time data temporarily kept in RTC chip 2 by I2C interface；For
Battery 3 can be lithium battery, and the first capacitance can be 1uF ceramic condensers, since time data keeps electric current in RTC chip 2
Professional standard is no more than 0.3uA, thus in the case where lithium battery voltage is fallen and causes to RTC chip abnormal electrical power supply, uses one
The duration of power supply of 1uF ceramic condensers to RTC chip 2 is sufficient so that MCU chip 1 and is waken up within the duration and complete
Into the operation for reading time data in RTC chip 2；Second capacitance 5 can use 2.2F farad capacitors, and divider resistance can be 1M
Ω resistance, PMOS transistor can be used for power conversion circuit 6, wherein, grid of the switch control terminal equivalent to PMOS transistor
(Gate, G), first switch switch terminal equivalent to PMOS transistor drain electrode (Drain, D), second switch switch terminal equivalent to
The source electrode (Source, S) of PMOS transistor, in this way, PMOS transistor G poles are connected with the cathode and 1M Ω resistance of lithium battery respectively
And be grounded the other end of 1M Ω resistance, the main electric pin of the D poles of PMOS transistor respectively with MCU chip 1 and RTC chip 2 connects
Connect, the S poles of PMOS transistor and the second capacitance 5 and connect, accordingly, according to the operation principle of PMOS transistor, work as lithium battery
When powering normal to RTC chip 2, cut-off state is between the D poles and S poles of PMOS transistor, when lithium battery voltage drops to
During certain threshold value, so that the voltage difference of lithium battery and 2.2F farad capacitors exceedes the turn-on threshold electricity of PMOS transistor
In the conduction state between the D poles and S poles of PMOS transistor during pressure, 2.2F farad capacitors will be MCU chip 1 and RTC cores at this time
Piece 2 is powered.In addition, for the structure of circuit shown in Fig. 2 for enumerating, since the I2C communication power consumption of MCU chip 1 itself is most
At mA grades, thus try one's best in board space and select the second capacitance 5 of small size, large capacity, so as to MCU chip 2 and RTC
It is more lasting that chip 1 is powered.
Further, in circuit as shown in Figure 2, further include：Cathode is connected with lithium battery anode, anode and RTC chip 2
The diode of standby electricity pin connection, for when the voltage of 1uF ceramic condensers pours in down a chimney to the D poles of PMOS transistor so that although
In the case where lithium battery voltage is fallen, the extremely upper voltages of G of PMOS transistor can also be postponed declining；Circuit as shown in Figure 2
In, further include：The diode of the S poles connection of the connection of the D poles of cathode and PMOS transistor, anode and PMOS transistor, for working as
It in main electricity power supply, can charge to 2.2F farad capacitors, lithium battery pair can only be relied on to depart from main electricity when RTC chip 2
If abnormal electrical power supply caused by falling when RTC chip 2 is powered there is a situation where lithium battery voltage, 2.2F farad capacitors can be to MCU
Chip power supply so that MCU chip 1 reads in RTC chip 2 time data and as power down time data in time, to meet
Power down time data during to this crystal oscillator failure of oscillation completes the demand of backup.
In practical applications, for the device that the embodiment of the present invention more clearly shown in statement Fig. 1 is provided, this hair
Bright embodiment also provides two application scenarios, as follows：
The embodiment of the present invention provides application scenarios 1：USB forms encryption clock lock in data security arts, it is to body
Product and price are more sensitive, should behind ML1220 supplying cells 3, RTC chip 2 and MCU chip 1 in equipment mounted inside
Clock locks remaining space will be very narrow and small, then is referred to the dress of record power down time data provided in an embodiment of the present invention
Put, power conversion circuit is supplied using 3225 encapsulation patch farad capacitors, SOT23 encapsulation PMOS tube, SOD323 encapsulation diode compositions
6, to realize when supplying cell 3 is to 2 abnormal electrical power supply of RTC chip, farad capacitor can be used in time to MCU chip 1 and RTC cores
Piece 2 is powered, and then records power down time data in RTC chip 2.
The embodiment of the present invention provides application scenarios 2:Bluetooth equipment generally requires its own volume more compact, thus itself
System is made of the SOC chip of a piece of integrated bluetooth low energy consumption more, since MCU chip 1 is generally located in not operation in equipment
In resting state, thus power down whether can not may occur by supplying cell in real-time watch device, then be referred to the present invention
The device for the record power down time data that embodiment provides, using 3225 encapsulation patch farad capacitors, SOT23 encapsulation PMOS tube,
SOD323 encapsulation diodes, which are realized, powers MCU chip 1, is worked normally with waking up MCU chip 1.
Dress based on foregoing 2 power down time data of record RTC chip provided in an embodiment of the present invention as shown in Figure 1
Put, for when RTC chip 2 departs from main electricity, summarizing 2 supplying cell of RTC chip, 3 Voltage Drop operation principle flow chart, such as Fig. 3
It is shown, it is described in detail below：
When 3 Voltage Drop of supplying cell occurs but does not drop to threshold value, Voltage Drop does not influence RTC chip 2 at this time
Work, for being open circuit between first switch switch terminal and second switch switch terminal in power conversion circuit 6, i.e., the is not required at this time
Two capacitances 5 power MCU chip 1, when 3 Voltage Drop of supplying cell occurs and Voltage Drop is extremely less than threshold value, due to electricity
Pressure, which is fallen, causes 2 crystal oscillator failure of oscillation of RTC chip so that 2 cisco unity malfunction of RTC chip, the first capacitance 4 is to RTC cores at this time
Piece 2 is powered, temporarily to keep time data in RTC chip 2, while for first switch switch terminal and second in power conversion circuit 6
Switching connects between end so that the second capacitance 5 powers MCU chip 1, and MCU chip 1 can be read in RTC chip 2 temporarily
The time data of holding, so as to as power down time data and be stored in MCU chip 1, when MCU chip 1 has read RTC
, can be with dormancy, to wait voltage in circuit to recover, such as when main electricity powers on, when voltage is extensive in circuit in chip 2 after time data
To open a way when multiple between first switch switch terminal and second switch switch terminal so that the second capacitance 5 need not power to MCU chip 1,
2 timing of RTC chip starts, and starts again at normal work.
Based on 2 supplying cell of RTC chip, 3 Voltage Drop operation principle flow chart as shown in Figure 3, in RTC chip 2
When departing from main electricity, an embodiment of the present invention provides a kind of method for recording RTC chip power down time data, as shown in figure 4, the party
Method is applied to the device of the record RTC chip power down time data shown in foregoing Fig. 1, this embodiment of the present invention is provided following
Specific steps：
101st, when MCU chip determines supplying cell to RTC chip abnormal electrical power supply, the time in MCU chip inquiry RTC chip
Data.
Wherein, supplying cell is to that can cause RTC chip working environment to change during RTC chip abnormal electrical power supply, so that RTC
Chip crystal oscillator failure of oscillation, wherein, supplying cell Voltage Drop or supplying cell short circuit can all cause supplying cell to supply RTC chip
Electrical anomaly, but have little time to take any treatment measures, recorded in RTC chip due to voltage dip during supplying cell short circuit
Time data all lose, and time of origin playback recover to default initial values, and when supplying cell Voltage Drop can and
The first capacitances of Shi Caiyong power RTC chip so that time data in RTC chip is temporarily kept, thus, though cause power supply electricity
To two kinds of situations of RTC chip abnormal electrical power supply, it make it that time data is different in RTC chip when crystal oscillator failure of oscillation occurs in pond
's.
In embodiments of the present invention, when MCU chip determines supplying cell to RTC chip abnormal electrical power supply, MCU chip is passed through
Time data in RTC chip is inquired about, to judge whether recorded this crystal oscillator failure of oscillation in RTC chip when crystal oscillator failure of oscillation occurs
Corresponding time data.
102nd, MCU chip judge time data in RTC chip whether be RTC chip default initial values.
If the time data in 103a, RTC chip is not the default initial values of RTC chip, MCU chip is out of RTC chip
Read access time data and stored as power down time data.
Wherein, power down time data refers to when supplying cell Voltage Drop so that abnormal electrical power supply and then causing RTC chip brilliant
Shake failure of oscillation when RTC chip in the time data that records at this time.
In embodiments of the present invention, when the time data that MCU chip is read out of RTC chip is not the acquiescence of RTC chip
During initial value, then using the read access time data out of RTC chip and as the power down time data of this generation crystal oscillator failure of oscillation, deposit
Storage is in MCU chip.In addition, MCU chip memory space can open up 3 moment recording units, for distinguishing recording equipment
Access main electric moment, supplying cell power down moment and equipment and depart from the main electric moment, do not do specific limit in embodiments of the present invention
System.
If the time data in 103b, RTC chip is the default initial values of RTC chip, whether MCU chip determines its own
It is stored with power down time data.
In embodiments of the present invention, at the beginning of the time data that MCU chip is read out of RTC chip is the acquiescence of RTC chip
During initial value, i.e., the time data of record in RTC chip when crystal oscillator failure of oscillation this time occurs is not read, it is likely to supplying cell
Abnormal electrical power supply caused by short circuit, in this case, supplying cell voltage dip, has little time to take any treatment measures, RTC cores
The time data of record is all lost in piece, and time of origin playback recovers to default initial values.For the embodiment of the present invention
Speech, may further determine that power down time data whether is stored with MCU chip, so as to be incited somebody to action according to power down time data
RTC chip recovers to use state during generation crystal oscillator failure of oscillation.
If 104b, MCU chip determine that its own is stored with power down time data, during the power down that MCU chip stores itself
Data are carved to be written in RTC chip.
In embodiments of the present invention, due to that when RTC chip crystal oscillator failure of oscillation, MCU chip can be utilized to read in RTC chip
Time data, and be determined as power down time data and be stored in MCU chip, so more para-crystals can be stored in MCU chip
Shake failure of oscillation when corresponding power down time data.Accordingly, for working as time RTC chip crystal oscillator failure of oscillation, even if since supplying cell is rapid
Drop fails to record time data in RTC chip in time, crystal oscillator failure of oscillation when institute can also occur according to the conventional of MCU chip memory storage
The power down time data of record, by the way that the power down time data of MCU chip memory storage is write RTC chip, RTC chip is recovered
Use state during crystal oscillator failure of oscillation once occurs to certain.
A kind of method for recording RTC chip power down time data provided in an embodiment of the present invention in summary, before being based on
The device at the record power down moment of embodiment offer is provided, when MCU chip determines supplying cell to RTC chip abnormal electrical power supply, this
Inventive embodiments can use MCU chip read access time data out of RTC chip, and be stored in as power down time data
In MCU chip, and then realize when multiple crystal oscillator failure of oscillation and the associated power down of each crystal oscillator failure of oscillation can be stored in MCU chip
Data are carved, so as to be recovered RTC chip to use state during crystal oscillator failure of oscillation according to the power down time data of storage, are avoided
Equipment with RTC chip is returned factory to be reset, so as to reduce the maintenance cost of equipment, improves plant maintenance work
Efficiency, while also increase the service life of equipment.
The method of record RTC chip power down time data provided in an embodiment of the present invention is done further specifically below
It is bright：
Further, foregoing MCU chip determines specific steps of the supplying cell to RTC chip abnormal electrical power supply, as follows：
A kind of mode is, when MCU chip receives the power supply signal of the second capacitance, determines that supplying cell supplies RTC chip
Electrical anomaly.
In embodiments of the present invention, due to when supplying cell power supply it is normal when, MCU chip be in a dormant state, and
When supplying cell abnormal electrical power supply, connected between first switch switch terminal and second switch switch terminal, the second capacitance will be MCU core
Piece and RTC chip power supply, that is, wake up MCU chip and start to work, thus when MCU chip receives the power supply signal of the second capacitance
When, determine supplying cell to RTC chip abnormal electrical power supply.
Another way is that MCU chip receives the power supply signal of the second capacitance and detects the crystal oscillator vibration of RTC chip
During stop position one, determine supplying cell to RTC chip abnormal electrical power supply.Shake since supplying cell abnormal electrical power supply can change crystal oscillator
Swing environment, and the clocking capability of RTC chip by external crystal oscillator as clock source, thus crystal oscillator vibration environment changes
Change may cannot meet the needs of RTC chip normal work so that RTC is stopped, the stop position one of crystal oscillator vibration at this time
Position, so when MCU chip detects the crystal oscillator vibration stop position one of RTC chip, it may be determined that supplying cell is to RTC cores
Piece abnormal electrical power supply.
Further, the power down time data that itself is stored is written in RTC chip by foregoing MCU chip and done into one
Step analysis, when MCU chip does not read power down time data and MCU chip determines that its own is stored with from RTC chip
During electric time data, MCU chip can record the time from the power down time data of itself storage and current time is immediate
Power down time data is written in RTC chip, and so as to the power down time data recorded according to MCU chip, RTC chip is use up can
Can recover to the immediate use state of current time.
Further, when the second capacitance is not less than power supply of first capacitance to RTC chip to the power-on time of MCU chip
Between, for the embodiment of the present invention, if supplying cell Voltage Drop, the first capacitance powers RTC chip, and when cell voltage falls
To when being connected between first switch switch terminal and second switch switch terminal, the second capacitance is powered for MCU chip and RTC chip, this
Outside, if supplying cell is short-circuit, the second capacitance is powered for MCU chip and RTC chip, it is then desired in the first capacitance to RTC cores
Before piece duration of power supply stops, the second capacitance in time can power MCU chip and RTC chip, and need the second electricity
The continued power time of appearance is longer preferably, so that MCU chip can completely read and store the time number recorded in RTC chip
According to.
The device of record RTC chip power down time data provided in an embodiment of the present invention shown in based on foregoing Fig. 1, it is right
In when the main electricity of RTC chip powers on, need not then consider power supply influence of the supplying cell on RTC chip at this time, RTC chip is summarized
Equipment routine work principle flow chart, wherein, the operation principle for judging RTC chip crystal oscillator failure of oscillation reason is also realized, such as Fig. 5 institutes
Show, be described in detail below：
When being powered on to the main electricity of RTC chip, MCU chip reads crystal oscillator vibration stop position in RTC chip, judges that the crystal oscillator shakes
Swing whether stop position puts one, if, it is determined that there is RTC chip crystal oscillator failure of oscillation, then read time data in RTC chip,
If default initial values, RTC chip is occurred by the multiple crystal oscillator failure of oscillation and each crystal oscillator failure of oscillation for reading MCU chip memory storage
When power down time data, from wherein determine with the immediate power down time data of current time, and by the nearest power down moment number
According to re-writing in RTC chip and removing the set of crystal oscillator vibration stop position, so that when RTC chip recovers to nearest use
Carve；When read RTC chip in time data and determine be not default initial values when, then fallen by reading MCU chip memory storage
Electric time data, further determines whether with the presence of the power down time data corresponding to this crystal oscillator failure of oscillation, if in the presence of, it is determined that
That power jitter causes crystal oscillator failure of oscillation, be because power jitter causes Voltage Drop, and then come and take measures to record in time
Time data in RTC chip, then can be in time using the time data of RTC chip record as power down moment number in MCU chip
According to storage, if judging, there is no during the power down time data corresponding to this crystal oscillator failure of oscillation in MCU chip, it is determined that is exterior dry
Disturbing causes crystal oscillator failure of oscillation, is because external disturbance causes voltage dip, and then has little time to take in any measure record RTC chip
Time data, so that power down time data when this crystal oscillator failure of oscillation can not be stored in MCU chip.
Equipment routine work principle flow chart based on RTC chip as shown in Figure 5, for more detailed explanation,
When being powered on to the main electricity of RTC chip, the method that determines RTC chip crystal oscillator failure of oscillation, as shown in fig. 6, the embodiment of the present invention additionally provides
A kind of method of definite RTC chip crystal oscillator failure of oscillation reason, as shown in fig. 6, providing step in detail below to this embodiment of the present invention：
201st, MCU chip determines that the crystal oscillator of RTC chip stops oscillation, the time data in MCU chip inquiry RTC chip.
In embodiments of the present invention, when the main electricity of the equipment access with RTC chip, then powered by main electricity to RTC chip,
Electric power thus supplied of the supplying cell to RTC chip need not be then considered at this time.When MCU chip determines that the crystal oscillator of RTC chip stops oscillation
When, then using time data in MCU chip inquiry RTC chip, time number during to record RTC chip crystal oscillator failure of oscillation in it
According to.
202nd, MCU chip judge time data in RTC chip whether be RTC chip default initial values.
If the time data in 203a, RTC chip is the default initial values of RTC chip, MCU chip by what itself was stored
Electric time data is written in the RTC chip.
Wherein, power down time data associated when multiple crystal oscillator failure of oscillation and each crystal oscillator failure of oscillation is stored in MCU chip.
In embodiments of the present invention, when MCU chip inquires time data in RTC chip, the acquiescence of RTC chip is initial
During value, time-triggered protocol is reset to avoid RTC chip returning factory, MCU chip should be in time by the power down moment of its own storage
In data write-in RTC chip, to recover RTC chip to use state during crystal oscillator failure of oscillation.
If the time data in 203b, RTC chip is not the default initial values of RTC chip, MCU chip determines that its own is
It is no to be stored with and this associated power down time data of crystal oscillator failure of oscillation of RTC chip.
In embodiments of the present invention, when time data is not the default initial values of RTC chip in RTC chip, MCU chip
Search its own storage whether have with RTC chip this time associated power down time data of crystal oscillator failure of oscillation, to be according to MCU chip
It is no successfully to have recorded power down time data in RTC chip crystal oscillator failure of oscillation, determine whether the original of RTC chip crystal oscillator failure of oscillation
Cause.
Further, MCU chip determines itself whether be stored with and this crystal oscillator failure of oscillation associated power down moment of RTC chip
Data, can access the main electric time by reference to the equipment of MCU chip memory storage and equipment departs from the main electric time to determine this
Power down time during crystal oscillator failure of oscillation, such as when the nearest equipment access main electric time of MCU chip memory storage is at 13 points in afternoon, and MCU
The newest power down time data of chip memory storage are noons 12:50 points, then the power down time data with this generation crystal oscillator failure of oscillation
It is unrelated, then the power down time data corresponding to less than this crystal oscillator failure of oscillation is searched in MCU chip.
If 204b, MCU chip determine that its own is stored with and this associated power down moment number of crystal oscillator failure of oscillation of RTC chip
According to, MCU chip determine RTC chip this time crystal oscillator failure of oscillation the reason for be Voltage Drop, if MCU chip determines that its own is not stored with
With RTC chip this time associated power down time data of crystal oscillator failure of oscillation, determine RTC chip this time crystal oscillator failure of oscillation the reason for be exterior dry
Disturb.
In embodiments of the present invention, if MCU chip determine its own be stored with RTC chip this time crystal oscillator failure of oscillation it is associated
Power down time data, its show i.e. in RTC chip crystal oscillator failure of oscillation in RTC chip can temporary transient retention time data, so as to MCU
Chip can read and store the time data temporarily kept in time, and then be shown to be Voltage Drop and cause this crystal oscillator
Spread of voltage etc. caused by failure of oscillation, such as power jitter.
Further, if MCU chip determines that its own is not stored with RTC chip this time crystal oscillator failure of oscillation associated power down
Carve data, its show i.e. in RTC chip crystal oscillator failure of oscillation in RTC chip cannot temporary transient retention time data, cannot also cause
MCU chip reads and stores the time data temporarily kept in time, and then is shown to be voltage dip and causes this crystal oscillator
Failure of oscillation, because during voltage dip, has little time to take RTC chip any measure, so as to cause data in RTC chip all to lose
Lose, for example external disturbance changes voltage and ground direct short-circuit, crystal oscillator vibration environment moment, circuit has little time to process, so
Can not there be power down time data in time.
The method of definite crystal oscillator failure of oscillation provided in an embodiment of the present invention in summary, the embodiment of the present invention pass through MCU core
Piece determines whether its own is stored with and the RTC chip this time associated power down time data of crystal oscillator failure of oscillation, and then analysis causes crystalline substance
Shake failure of oscillation the reason for, if there is power down time data, MCU chip determine RTC chip this time crystal oscillator failure of oscillation the reason for be Voltage Drop,
Otherwise determine RTC chip this time crystal oscillator failure of oscillation the reason for be external disturbance, so as to experimenter according to the reason for crystal oscillator failure of oscillation into
One step analyzes disturbed condition of the experimental situation to equipment, and can make corresponding improvement in time.
The method of definite crystal oscillator failure of oscillation provided in an embodiment of the present invention is described in further detail below：
Further, the power down time data that itself is stored is written in RTC chip by foregoing MCU chip, specific step
Suddenly, it is as follows：
MCU chip searches the power down time data of its own storage, and power down time data is at least one.During according to power down
Carve in data and record the time, MCU chip will be written in the RTC chip with the immediate power down time data of current time.
After power down time data is write in RTC chip, the crystal oscillator vibration stop position zero-bit of RTC chip.
In embodiments of the present invention, the multiple crystal oscillator failure of oscillation of MCU chip memory storage and each associated power down of crystal oscillator failure of oscillation
Time data, can be extensive by RTC chip according to time and the immediate power down time data of current time is recorded in the power down moment
It is multiple to using the moment recently.In by MCU chip after power down time data write-in RTC chip so that RTC chip restarts to count
When work, so the crystal oscillator of RTC chip is vibrated stop position zero-bit.
Further, foregoing MCU chip determines that the crystal oscillator of RTC chip stops oscillation, and specific steps are as follows：
When MCU chip reads the crystal oscillator vibration stop position one of RTC chip, the MCU chip determines RTC chip
Crystal oscillator stop oscillation.
Since RTC chip is often because the reason such as collide with or disturb cause crystal to stop oscillation phenomenon, major RTC
Chip producer can all set RTC chip crystal oscillator to vibrate stop position when producing RTC chip, and set the crystal oscillator when crystal oscillator failure of oscillation
Stop position one is vibrated, thus, for the embodiment of the present invention, MCU chip can be utilized to read the crystal oscillator vibration of RTC chip
Whether stop position puts one, and then determines whether the crystal oscillator of RTC chip stops oscillation.
Further, in embodiments of the present invention, after the reason for definite RTC chip this time crystal oscillator failure of oscillation, can utilize
MCU chip counts the reason for crystal oscillator failure of oscillation number and crystal oscillator failure of oscillation associated by each crystal oscillator failure of oscillation, so as to experimenter's root
Disturbed condition of the experimental situation to equipment is further analyzed according to the reason for crystal oscillator failure of oscillation, and corresponding improvement can be made in time.
It should be understood by those skilled in the art that, embodiments herein can be provided as method, system or computer program
Product.Therefore, the application can use the reality in terms of complete hardware embodiment, complete software embodiment or combination software and hardware
Apply the form of example.Moreover, the application can use the computer for wherein including computer usable program code in one or more
The computer program production that usable storage medium is implemented on (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
The application is with reference to the flow according to the method for the embodiment of the present application, equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that it can be realized by computer program instructions every first-class in flowchart and/or the block diagram
The combination of flow and/or square frame in journey and/or square frame and flowchart and/or the block diagram.These computer programs can be provided
The processors of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices is instructed to produce
A raw machine so that the instruction performed by computer or the processor of other programmable data processing devices, which produces, to be used in fact
The device for the function of being specified in present one flow of flow chart or one square frame of multiple flows and/or block diagram or multiple square frames.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that the instruction being stored in the computer-readable memory, which produces, to be included referring to
Make the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one square frame of block diagram or
The function of being specified in multiple square frames.
These computer program instructions can be also loaded into computer or other programmable data processing devices so that counted
Series of operation steps is performed on calculation machine or other programmable devices to produce computer implemented processing, thus in computer or
The instruction performed on other programmable devices is provided and is used for realization in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in a square frame or multiple square frames.
In a typical configuration, computing device includes one or more processors (CPU), input/output interface, net
Network interface and memory.
Memory may include computer-readable medium in volatile memory, random access memory (RAM) and/
Or the form such as Nonvolatile memory, such as read-only storage (ROM) or flash memory (flashRAM).Memory is computer-readable medium
Example.
Computer-readable medium includes permanent and non-permanent, removable and non-removable media can be by any method
Or technology come realize information store.Information can be computer-readable instruction, data structure, the module of program or other data.
The example of the storage medium of computer includes, but are not limited to phase transition internal memory (PRAM), static RAM (SRAM), moves
State random access memory (DRAM), other kinds of random access memory (RAM), read-only storage (ROM), electric erasable
Programmable read only memory (EEPROM), fast flash memory bank or other memory techniques, read-only optical disc read-only storage (CD-ROM),
Digital versatile disc (DVD) or other optical storages, magnetic cassette tape, the storage of tape magnetic rigid disk or other magnetic storage apparatus
Or any other non-transmission medium, the information that can be accessed by a computing device available for storage.Define, calculate according to herein
Machine computer-readable recording medium does not include temporary computer readable media (transitory media), such as data-signal and carrier wave of modulation.
It should also be noted that, term " comprising ", "comprising" or its any other variant are intended to nonexcludability
Comprising so that process, method, commodity or equipment including a series of elements not only include those key elements, but also wrapping
Include other elements that are not explicitly listed, or further include for this process, method, commodity or equipment it is intrinsic will
Element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that including key element
Also there are other identical element in process, method, commodity or equipment.
It will be understood by those skilled in the art that embodiments herein can be provided as method, system or computer program product.
Therefore, the application can be using the embodiment in terms of complete hardware embodiment, complete software embodiment or combination software and hardware
Form.Deposited moreover, the application can use to can use in one or more computers for wherein including computer usable program code
The shape for the computer program product that storage media is implemented on (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
Formula.
It these are only embodiments herein, be not limited to the application.To those skilled in the art,
The application can have various modifications and variations.All any modifications made within spirit herein and principle, equivalent substitution,
Improve etc., it should be included within the scope of claims hereof.
Claims (11)
- A kind of 1. device for recording RTC chip power down time data, it is characterised in that including：MCU chip, RTC chip, power supply Battery, the first capacitance, the second capacitance and for power conversion circuit；The MCU chip is connected with the RTC chip；The supplying cell and first capacitance are parallel between the standby electric pin and ground of the RTC chip；It is described to include switch control terminal, first switch switch terminal and second switch switch terminal for power conversion circuit；The switch control End processed is connected with the cathode and divider resistance of the supplying cell respectively, the other end ground connection of the divider resistance；Described first Main electric pin of the switching end respectively with the MCU chip and the RTC chip is connected, the second switch switch terminal and institute State the second capacitance and ground is connected；Wherein, when supplying cell power supply is normal, between the first switch switch terminal and the second switch switch terminal Open circuit；When the supplying cell abnormal electrical power supply, connected between the first switch switch terminal and the second switch switch terminal, Second capacitance is powered for the MCU chip and the RTC chip.
- 2. device according to claim 1, it is characterised in that further include：Cathode is connected with the supplying cell cathode, is negative The diode that pole is connected with the standby electric pin of the RTC chip.
- 3. device according to claim 1, it is characterised in that further include：Cathode is connected with the first switch switch terminal, The diode that anode is connected with the second switch switch terminal.
- A kind of 4. method for recording RTC chip power down time data, it is characterised in that the method is applied to such as claim 1 To the device any one of 3, the described method includes：When MCU chip determines supplying cell to RTC chip abnormal electrical power supply, the MCU chip inquires about the time in the RTC chip Data；If the time data in the RTC chip is not the default initial values of the RTC chip, the MCU chip is from the RTC The time data is read in chip and is stored as power down time data；If the time data in the RTC chip is the default initial values of the RTC chip, the MCU chip determines its own Whether power down time data is stored with, if so, the power down time data that itself is stored is written to the RTC by the MCU chip In chip.
- 5. according to the method described in claim 4, it is characterized in that, the MCU chip determines that supplying cell powers RTC chip It is abnormal, including：When the MCU chip receives the power supply signal of the second capacitance, determine supplying cell to RTC chip abnormal electrical power supply；Alternatively,The MCU chip receives the power supply signal of the second capacitance and detects the crystal oscillator vibration stop position of the RTC chip During position, determine supplying cell to RTC chip abnormal electrical power supply.
- 6. method according to claim 4 or 5, it is characterised in that the power down moment number that the MCU chip itself will store According to being written in the RTC chip, including：The MCU chip will record time and the immediate power down moment number of current time in the power down time data itself stored According to being written in the RTC chip.
- 7. according to the method described in claim 6, it is characterized in that, second capacitance is to the power-on time of the MCU chip Power-on time not less than first capacitance to the RTC chip.
- A kind of 8. method of definite RTC chip crystal oscillator failure of oscillation reason, it is characterised in that the method is applied to the main electricity of MCU chip After the power is turned on, the described method includes：MCU chip determines that the crystal oscillator of RTC chip stops oscillation, the time data in the MCU chip inquiry RTC chip；If the time data in the RTC chip is the default initial values of the RTC chip, the MCU chip stores itself Power down time data be written in the RTC chip；If the time data in the RTC chip is not the default initial values of the RTC chip, the MCU chip determines it certainly Body whether be stored with the RTC chip this time the associated power down time data of crystal oscillator failure of oscillation, if so, the MCU chip determines The reason for this crystal oscillator failure of oscillation of the RTC chip is Voltage Drop, otherwise the reason for definite this crystal oscillator failure of oscillation of the RTC chip For external disturbance.
- 9. the according to the method described in claim 8, it is characterized in that, power down time data that the MCU chip itself will store It is written in the RTC chip, including：MCU chip searches the power down time data of its own storage, and the power down time data is at least one；According to the time is recorded in the power down time data, the MCU chip will be with the immediate power down moment number of current time According to being written in the RTC chip；After the power down time data is write in the RTC chip, putting for the RTC chip crystal oscillator vibration stop position is removed Position.
- 10. according to the method described in claim 9, it is characterized in that, the MCU chip determines that the crystal oscillator of RTC chip stops shaking Swing, including：When the crystal oscillator that the MCU chip reads RTC chip vibrates stop position set, the MCU chip determines the RTC cores The crystal oscillator of piece stops oscillation.
- 11. according to the method any one of claim 8-10, it is characterised in that the method further includes：MCU chip counts the reason for crystal oscillator failure of oscillation number and crystal oscillator failure of oscillation associated by each crystal oscillator failure of oscillation.
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| CN201711171235.7A CN107918569B (en) | 2017-11-22 | 2017-11-22 | Method and device for monitoring RTC chip power-down and crystal oscillator vibration-stopping |
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| CN107918569B (en) | 2021-05-18 |
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