CN107910350B - Display substrate and display device - Google Patents
Display substrate and display device Download PDFInfo
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- CN107910350B CN107910350B CN201711121318.5A CN201711121318A CN107910350B CN 107910350 B CN107910350 B CN 107910350B CN 201711121318 A CN201711121318 A CN 201711121318A CN 107910350 B CN107910350 B CN 107910350B
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- display
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- display substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
Abstract
The invention discloses a display substrate and a display device, relates to the technical field of display, and aims to solve the problem that in the prior art, when a mother board of the display substrate is cut, the display substrate is easy to crack due to stress generated by cutting, and the display of the display substrate is poor. The display substrate comprises a display area and a peripheral area surrounding the display area, wherein the peripheral area of the display substrate is provided with a first organic component capable of absorbing stress, and the first organic component is completely embedded in a film layer of the peripheral area. The display substrate provided by the invention is used for displaying pictures.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate and a display device.
Background
With the continuous development of display technology, new display substrates such as Organic Light-emitting diode (OLED) display substrates, Quantum Dot Light-emitting diodes (QLED) display substrates, and the like, have attracted attention by people due to their characteristics of impact resistance, strong shock resistance, Light weight, small size, and convenience in carrying.
In actual production, in order to improve the production efficiency of the OLED display substrate or the QLED display substrate, a corresponding OLED display substrate motherboard or a corresponding QLED display substrate motherboard is generally formed, and then the prepared display substrate motherboard is cut to form a corresponding display substrate. However, when the cutting process is performed, the display substrate is likely to crack due to stress generated by cutting, and the crack may further propagate to the display area of the display substrate, resulting in a problem of poor display of the display substrate.
Disclosure of Invention
The invention aims to provide a display substrate and a display device, which are used for solving the problems that when a display substrate mother board is cut, the display substrate is easy to crack due to stress generated by cutting, and the display of the display substrate is poor in the prior art.
In order to achieve the above purpose, the invention provides the following technical scheme:
a first aspect of the present invention provides a display substrate comprising a display area and a peripheral area surrounding the display area, the peripheral area of the display substrate being provided with a first organic component capable of absorbing stress, the first organic component being fully embedded in a film layer of the peripheral area.
Further, the first organic member surrounds a display area of the display substrate.
Further, the display substrate comprises a substrate base plate, and a thin film transistor and a light emitting element which are arranged on the substrate base plate, wherein a groove is arranged on the surface of the first organic component, which is far away from the substrate base plate, and the extending direction of the groove is approximately parallel to the edge of the display area.
Further, the display substrate further comprises a stress absorption layer, and the stress absorption layer is located between the thin film transistor and the substrate.
Further, the stress absorption layer is made of an organic material.
Further, the display substrate further comprises a second organic component capable of absorbing stress, which is disposed at an edge of the display area of the display substrate.
Further, the second organic component is located between a pixel defining layer disposed at an edge of the display area and a base substrate included in the display substrate, and an orthogonal projection of the second organic component on the base substrate at least partially coincides with an orthogonal projection of the pixel defining layer on the base substrate.
Further, the second organic member surrounds a central region of the display region.
Further, the first organic component and the second organic component are both made of organic materials.
Based on the technical solution of the display substrate, a second aspect of the invention provides a display device, which includes the display substrate.
In the technical scheme provided by the invention, the first organic component is arranged in the peripheral area of the display substrate, so that when the display substrate mother board is cut to form the display substrate, the first organic component can effectively absorb stress generated in the cutting process, the display substrate is prevented from generating cracks due to the stress generated by cutting, and the display quality of the display substrate in actual application is ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a first structure of a display substrate according to an embodiment of the invention;
fig. 2 is a schematic view of a second structure of a display substrate according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a third structure of a display substrate according to an embodiment of the invention;
fig. 4 is a schematic diagram of a fourth structure of the display substrate according to the embodiment of the invention.
Reference numerals:
1-substrate base plate, 20-display area,
21-a gate insulating layer, 22-an interlayer insulating layer,
23-a passivation layer, 24-an anode,
25-an organic light-emitting layer, 26-a cathode,
27-pixel definition layer, 28-thin film transistor,
3-first organic part, 31-groove,
4-a planarization layer, 5-a stress absorbing layer,
6-second organic component.
Detailed Description
In order to further explain the display substrate and the display device provided by the embodiment of the invention, the following detailed description is made with reference to the drawings of the specification.
Referring to fig. 1, a display substrate according to an embodiment of the present invention includes: a display area 20 and a peripheral area surrounding the display area 20, the peripheral area of the display substrate being provided with a first organic component 3 capable of absorbing stress, the first organic component 3 being completely embedded in a film layer in the peripheral area.
Specifically, when the display substrate is manufactured, a display substrate motherboard is formed firstly, the display substrate motherboard comprises a plurality of display substrates, each display substrate comprises a display area 20 and a peripheral area surrounding the display area 20, and the first organic component 3 is manufactured in the peripheral area of each display substrate, so that the first organic component 3 is positioned between the display area 20 of each display substrate and a cutting line of the display substrate motherboard, and thus when the display substrate motherboard is cut, the first organic component 3 can well absorb stress generated by cutting operation, and the stress is prevented from extending to the display area 20 of the display substrate.
In the display substrate provided by the embodiment of the invention, the first organic component 3 is arranged in the peripheral area of the display substrate, so that when the display substrate mother board is cut to form the display substrate, the first organic component 3 can effectively absorb stress generated in the cutting process, the display substrate is prevented from generating cracks due to the stress generated by cutting, and the display quality of the display substrate in actual application is ensured. In addition, since the first organic component 3 is completely embedded in the film layer in the peripheral region, the cutting stress is ensured to be absorbed, and meanwhile, the first organic component 3 is prevented from influencing the formation of other film layers in the display substrate.
The display substrate formed generally includes: the present invention relates to a display device including a substrate 1, and a planarization layer 4, a gate insulating layer 21, an interlayer insulating layer 22, a passivation layer 23, a thin film transistor 28, an anode 24, an organic light emitting layer 25, a cathode 26, a pixel defining layer 27, and the like formed on the substrate 1, and in order to simplify a manufacturing process when a display substrate is actually manufactured, the planarization layer 4, the gate insulating layer 21, the interlayer insulating layer 22, the passivation layer 23, and the like are directly covered over the entire region (including a display region and a peripheral region) of the substrate 1. Based on the display substrate having the above-described structure, the first organic member 3 may be formed on the base substrate 1, the planarization layer 4, the gate insulating layer 21, or the interlayer insulating layer 22 or the passivation layer 23 located in the peripheral region, and may penetrate any one or more of the planarization layer 4, the gate insulating layer 21, the interlayer insulating layer 22, the passivation layer 23, and the like. When the first organic component 3 is formed to penetrate the planarization layer 4, the gate insulating layer 21, the interlayer insulating layer 22, and the passivation layer 23, a groove may be directly formed in a peripheral region of the substrate base 1 and allowed to penetrate the planarization layer 4, the gate insulating layer 21, the interlayer insulating layer 22, and the passivation layer 23, and then the first organic component 3 is formed in the groove.
In addition, the display substrate provided by the embodiment of the invention can be selected from an OLED display substrate or a QLED display substrate, but is not limited thereto. Moreover, the display substrate may be a flexible display substrate or a non-flexible display substrate.
The above-described embodiment provides various structures of the first organic member 3 as long as the stress generated by the cutting operation can be effectively absorbed, for example, the first organic member 3 is disposed to surround the display area 20 of the display substrate, and the first organic member 3 is disposed to have a certain thickness, so that the first organic member 3 is formed into a fence-like structure that can surround the display area 20 of the display substrate. It is of course also possible to provide segmented first organic components 3, for example three segments of first organic components 30 on three sides of the display area 20 of the display substrate, and the side not provided with first organic components 30 may be used for bonding the driver chips.
Specifically, the first organic component 3 is configured to be in a wall-like structure, so that the display area 20 of the display substrate can be completely surrounded by the first organic component 3, and thus when the display substrate motherboard is cut to form the display substrate, the first organic component 3 can better absorb stress generated by cutting, and the influence of the stress generated by cutting extending to the display area 20 on the display effect of the display substrate is avoided.
Referring to fig. 2, the display substrate includes a substrate 1, and a thin film transistor 28 and a light emitting device (the light emitting device may include an anode 24, an organic light emitting layer 25, and a cathode 26) disposed on the substrate 1, and in order to further improve the capability of the first organic component 3 to absorb stress, it is preferable that a groove 31 is disposed on a surface of the first organic component 3 away from the substrate 1, and an extending direction of the groove 31 is substantially parallel to an edge of the display area. In more detail, the surface of the first organic component 3 facing away from the substrate base plate 1 may be patterned to form a plurality of sets of grooves 31, the groove extending direction of each set of grooves 31 is substantially parallel to the edge of the display area, and the plurality of sets of grooves 31 may be sequentially disposed around the display area 20 in a manner of zigzag nesting.
The groove 31 is formed in the surface, deviating from the substrate base plate 1, of the first organic component 3, so that the stress absorption capacity of the first organic component 3 is improved, the stress can be better absorbed by the first organic component 3, the display quality of the display base plate is guaranteed, and when the display base plate is a flexible display base plate, the flexibility of the flexible display base plate can be better improved through the patterned first organic component 3.
It is noted that the depth of the groove 31 formed on the first organic member 3 may be set according to actual requirements, as long as the depth of the groove 31 is less than the thickness of the first organic member 3.
As shown in fig. 3, the display substrate further includes a stress absorption layer 5, the stress absorption layer 5 is located between the thin film transistor 28 and the substrate 1, and the stress absorption layer 5 may cover the whole area or a part of the area of the substrate 1.
In more detail, the stress absorbing layer 5 is arranged between the substrate base plate 1 and the thin film transistor 28, so that when the mother board of the display base plate is cut, the stress absorbing layer 5 can further absorb stress generated by cutting operation, the influence of the stress on the display base plate is better avoided, and the display quality of the display base plate is ensured. In addition, in order to ensure that the formation of the thin film transistor 28 is not affected, a planarization layer 4 may be provided between the stress absorbing layer 5 and the gate insulating layer 21.
It should be noted that the stress absorbing layer 5 may be made of various materials, and preferably, the stress absorbing layer 5 is made of an organic material. When the stress absorbing layer 5 is made of an organic material, the stress absorbing layer 5 can be made of a resin material, and the resin material has good flexibility, so that the stress absorbing layer 5 made of the resin material can well absorb stress generated when the flexible display substrate is bent, and the flexibility of the flexible display substrate is improved; and the stress generated in the cutting process can be absorbed, so that the problem of generating cracks on the film layer of the display substrate caused by cutting is avoided.
As shown in fig. 4, the display substrate provided in the above embodiment further includes a second organic member 6 capable of absorbing stress, which is disposed at an edge of the display area of the display substrate. Specifically, the second organic component 6 is arranged at the edge of the display area 20 of the display substrate, so that stress generated by bending or cutting can be further absorbed, cracks generated by the stress can be effectively prevented from being spread to the display area, the risk of cracks on a film included in the display substrate is well reduced, and the protective effect on the display substrate is realized.
The specific arrangement position of the second organic component 6 is various, and optionally, the second organic component 6 is located between the pixel defining layer 27 arranged at the edge of the display area and the substrate base plate 1, and the orthographic projection of the second organic component 6 on the substrate base plate 1 is at least partially overlapped with the orthographic projection of the pixel defining layer 27 on the substrate base plate 1.
Since the pixel defining layer 27 is generally disposed at the edge of the display area of the display substrate, and the material used for the pixel defining layer 27 can be selected as a resin material, when the second organic component 6 is disposed between the pixel defining layer 27 and the substrate 1, and the orthographic projection of the second organic component 6 on the substrate 1 and the orthographic projection of the pixel defining layer 27 on the substrate 1 at least partially overlap, the same kind of resin material can be used, the second organic component 6 and the pixel defining layer 27 are simultaneously formed in a single patterning process, an additional manufacturing process is avoided to form the second organic component 6, and the production cost is saved.
The second organic part 6 described above also has a variety of structures, alternatively the second organic part 6 is the same fence-like structure as the first organic part, i.e. the second organic part 6 surrounds a central region of the display area, which is the region of the display area other than the edges of the display area. The second organic component 6 may be disposed in the same manner as the first organic component 3, and may also be disposed on the base substrate 1, the planarization layer 4, the gate insulating layer 21, the interlayer insulating layer 22, or the passivation layer 23, and may penetrate through one or more of the planarization layer 4, the gate insulating layer 21, the interlayer insulating layer 22, the passivation layer 23, and the like.
Specifically, the second organic member 6 is configured in a fence-like structure, so that the second organic member 6 can better absorb stress, and the stress is prevented from extending to the display area 20 of the display substrate and affecting the display of the display substrate. Further, the provision of the second organic member 6 surrounding a central region of the display area other than the edges of the display area enables the second organic member 6 to absorb stress generated by cutting in all directions of the display area, further reducing the risk of cracks appearing in the display area due to stress extending into the display area. Further, the number of the second organic members 6 may be provided in plural to better ensure the effect of absorbing stress.
It should be noted that, in order to better improve the stress absorption effect of the second organic component 6, a plurality of second organic components 6 may be disposed at the edge of the display area, and the plurality of second organic components 6 may be formed at the edge of the display area in a zigzag nesting manner, which is equivalent to that a multilayer barrier is established at the edge of the display area to form a multilayer protection for the display area 20 of the display substrate, so as to minimize the risk of cracks occurring in the display area 20 of the display substrate.
The materials of the first organic component 3 and the second organic component 6 are various, and only the first organic component 3 and the second organic component 6 formed by the above materials have good stress absorption capacity, preferably, the first organic component 3 and the second organic component 6 are both made of organic materials, and when the first organic component 3 and the second organic component 6 are made of organic materials, photosensitive resins can be specifically selected to make the first organic component 3 and the second organic component 6. Specifically, the first organic component 3 and the second organic component 6 are prepared by using the photosensitive resin, so that the formed first organic component 3 and the second organic component 6 have better stress absorption capacity, and due to the characteristics of the photosensitive resin material, when the first organic component 3 and the second organic component 6 are formed, the corresponding first organic component 3 and the second organic component 6 can be formed only by forming photosensitive resin films at corresponding positions and patterning the formed photosensitive resin films in modes of exposure, development and the like without additionally coating a photoresist layer, so that the preparation processes of the first organic component 3 and the second organic component 6 are simplified, and the preparation efficiency of the display substrate is improved.
The embodiment of the invention also provides a display device which comprises the display substrate provided by the embodiment. Because the first organic component 3 is arranged in the peripheral area of the display substrate provided by the embodiment, when the display substrate mother board is cut to form the display substrate, the first organic component 3 can effectively absorb stress generated in the cutting process, so that the display substrate is prevented from generating cracks due to the stress generated by cutting, and the display quality of the display substrate in actual application is ensured. In addition, since the first organic component 3 is completely embedded in the film layer in the peripheral region, the cutting stress is ensured to be absorbed, and meanwhile, the first organic component 3 is prevented from influencing the formation of other film layers in the display substrate. Therefore, the display device provided by the embodiment of the invention has the same effects when the display substrate is included.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. A display substrate comprising a display area and a peripheral area surrounding the display area, wherein the peripheral area of the display substrate is provided with a first organic component capable of absorbing stress, the first organic component being fully embedded in a film layer of the peripheral area;
the display substrate further comprises a second organic component capable of absorbing stress, which is arranged at the edge of the display area of the display substrate;
the second organic component is positioned between a pixel defining layer arranged at the edge of the display area and a substrate included in the display substrate, and the orthographic projection of the second organic component on the substrate is at least partially overlapped with the orthographic projection of the pixel defining layer on the substrate.
2. The display substrate of claim 1, wherein the first organic component surrounds a display area of the display substrate.
3. The display substrate according to claim 2, wherein the display substrate comprises a substrate, and a thin film transistor and a light emitting element disposed on the substrate, and a surface of the first organic component facing away from the substrate is provided with a groove, and an extending direction of the groove is substantially parallel to an edge of the display area.
4. The display substrate of claim 3, further comprising a stress absorbing layer between the thin film transistor and the substrate.
5. The display substrate of claim 4, wherein the stress absorbing layer is made of an organic material.
6. The display substrate of claim 1, wherein the second organic component surrounds a central region of the display area.
7. The display substrate of claim 1, wherein the first organic component and the second organic component are both made of an organic material.
8. A display device comprising the display substrate according to any one of claims 1 to 7.
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| CN201711121318.5A CN107910350B (en) | 2017-11-14 | 2017-11-14 | Display substrate and display device |
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| CN201711121318.5A CN107910350B (en) | 2017-11-14 | 2017-11-14 | Display substrate and display device |
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| CN107910350B true CN107910350B (en) | 2020-05-08 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019218629A1 (en) * | 2018-05-14 | 2019-11-21 | 云谷（固安）科技有限公司 | Display panel, display terminal, and display motherboard |
| CN110429193B (en) * | 2018-08-07 | 2022-07-08 | 广东聚华印刷显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN109273515B (en) * | 2018-11-02 | 2020-12-11 | 京东方科技集团股份有限公司 | Pixel structure, flexible display substrate, manufacturing method of flexible display substrate and display device |
| CN109378339B (en) * | 2018-12-24 | 2021-09-24 | 武汉华星光电半导体显示技术有限公司 | Display panel with stress relieving structure and manufacturing method thereof |
| CN110071153B (en) | 2019-04-26 | 2021-02-19 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, display panel and display device |
| CN109979333B (en) * | 2019-05-17 | 2022-01-28 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN110335964B (en) * | 2019-06-26 | 2020-11-10 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN112038355B (en) * | 2020-08-28 | 2022-05-31 | 武汉华星光电半导体显示技术有限公司 | Array substrate and display device |
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| CN106653818A (en) * | 2017-01-23 | 2017-05-10 | 上海天马有机发光显示技术有限公司 | Display panel, display apparatus and preparation method for display panel |
| CN107180923A (en) * | 2017-07-20 | 2017-09-19 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof and display device |
| CN107275363A (en) * | 2016-04-05 | 2017-10-20 | 三星显示有限公司 | Display device |
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| KR102000043B1 (en) * | 2012-10-31 | 2019-07-15 | 엘지디스플레이 주식회사 | Organic light emitting display device and method of fabricating thereof |
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| CN107275363A (en) * | 2016-04-05 | 2017-10-20 | 三星显示有限公司 | Display device |
| CN106653818A (en) * | 2017-01-23 | 2017-05-10 | 上海天马有机发光显示技术有限公司 | Display panel, display apparatus and preparation method for display panel |
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