CN107907767A - A kind of chip capacitor multistage aging technique - Google Patents
A kind of chip capacitor multistage aging technique Download PDFInfo
- Publication number
- CN107907767A CN107907767A CN201711233128.2A CN201711233128A CN107907767A CN 107907767 A CN107907767 A CN 107907767A CN 201711233128 A CN201711233128 A CN 201711233128A CN 107907767 A CN107907767 A CN 107907767A
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- China
- Prior art keywords
- chip capacitor
- control device
- hearth electrode
- temperature
- electrode
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a kind of chip capacitor multistage aging technique, comprise the following steps：S1：Get out the required burn-in test fixture of chip capacitor, burn-in test fixture includes insulated substrate, a hearth electrode, multiple top electrodes, multiple temperature-detecting devices and multiple driving devices, hearth electrode is installed on insulated substrate by hearth electrode connection bolt, each top electrode is installed on insulated substrate by corresponding driving device, multiple temperature sensors are electrically connected with control device by one with door module, and control device is also electrically connected timer and counter, S2：Chip capacitor is placed on the hearth electrode described in S1, multiple top electrodes described in S1 are contacted with chip capacitor at this time.The present invention can carry out burn-in test next time automatically, it is no longer necessary to which staff is intervened in the aging number of setting so that the ageing efficiency of chip capacitor is high.
Description
Technical field
The present invention relates to the aging technical field of chip capacitor, more particularly to a kind of chip capacitor multistage aging work
Skill.
Background technology
With development of the electronic equipment to miniaturization, integrated, intelligent, high frequency and High Density Packaging direction, market
It it is also proposed the requirement of patch installation, large ripple current-resistant and ripple voltage impact, high stable reliability etc. to capacitor,
Therefore chip capacitor comes into being, and chip capacitor also needs to carry out multiple burn-in test after the completion of production, but existing
Chip capacitor multistage aging technique after each aging, be required for staff started manually, just can be into
The burn-in test of row next time so that the ageing efficiency of chip capacitor is low.
The content of the invention
Based on technical problem existing for background technology, the present invention proposes a kind of chip capacitor multistage aging technique.
A kind of chip capacitor multistage aging technique proposed by the present invention, comprises the following steps：
S1：Get out the required burn-in test fixture of chip capacitor, burn-in test fixture include insulated substrate, one
Hearth electrode, multiple top electrodes, multiple temperature-detecting devices and multiple driving devices, hearth electrode are installed by hearth electrode connection bolt
On insulated substrate, each top electrode is installed on insulated substrate by corresponding driving device, and multiple temperature sensors pass through
One is electrically connected with control device with door module, and control device is also electrically connected timer and counter；
S2：Chip capacitor is placed on the hearth electrode described in S1, at this time multiple top electrodes described in S1 with
Chip capacitor is contacted, and is then closely connect multiple temperature-detecting devices described in S1 with chip capacitor
Touch, finally allow hearth electrode to be turned on multiple top electrodes, while timer starts timing, between hearth electrode and each top electrode
Electric current pass through the corresponding region of chip capacitor；
S3：When complete during timer described in S2, rotating forward control of the control device to multiple driving devices described in S1
End processed synchronizes control, and driving device drives corresponding top electrode to rotate 45 °, while the counting of control device control counter
Number adds 1, when temperature sensor detects that the junction temperature temperature of chip capacitor corresponding region drops to setting value, and multiple temperature pass
Sensor by with door module to control device send a high level, reversion control terminal of the control device to multiple driving devices into
Row Synchronization Control, driving device drives corresponding top electrode to rotate 45 °, while control device also controls timer to start timing,
Until multiple top electrodes are in contact with chip capacitor, chip capacitor carries out burnin operation next time；
S4：When the counting of counter described in S3 reaches setting value, counter by control device control alarm into
Row alarm.
Preferably, in the S1, extension spring is mounted between each top electrode and insulated substrate.
Preferably, in the S1, multiple top electrodes and hearth electrode are electrically connected with same power supply, hearth electrode and confession
A controlling switch is also electrically connected between power supply, and controlling switch is also electrically connected with control device.
Preferably, in the S2, temperature-detecting device is used to carry out the junction temperature temperature of chip capacitor corresponding region real
When detect.
Preferably, in the S3, the timing time of timer is arranged to 40-50min.
Preferably, in the S4, alarm is audible-visual annunciator, and the time of fire alarming of alarm is arranged to 1-2min.
Preferably, in the S4, the counts of counter are arranged to 20-30.
Beneficial effects of the present invention are in the aging number of setting, can carry out burn-in test next time automatically, no
Staff is needed to be intervened again so that the ageing efficiency of chip capacitor is high.
Embodiment
The present invention is made with reference to specific embodiment further to explain.
Embodiment
A kind of chip capacitor multistage aging technique is proposed in the present embodiment, is comprised the following steps：
S1：Get out the required burn-in test fixture of chip capacitor, burn-in test fixture include insulated substrate, one
Hearth electrode, multiple top electrodes, multiple temperature-detecting devices and multiple driving devices, hearth electrode are installed by hearth electrode connection bolt
On insulated substrate, each top electrode is installed on insulated substrate by corresponding driving device, each top electrode and insulation base
Extension spring is mounted between plate, multiple top electrodes and hearth electrode are electrically connected with same power supply, hearth electrode and confession
A controlling switch is also electrically connected between power supply, multiple temperature sensors are electrically connected with control by one with door module
Device processed, and control device is also electrically connected timer and counter；
S2：Chip capacitor is placed on the hearth electrode described in S1, at this time multiple top electrodes described in S1 with
Chip capacitor is contacted, and is then closely connect multiple temperature-detecting devices described in S1 with chip capacitor
Touch, temperature-detecting device is used to detect the junction temperature temperature of chip capacitor corresponding region in real time, finally allow hearth electrode and
Multiple top electrodes are turned on, while timer starts timing, and the electric current between hearth electrode and each top electrode passes through sheet electricity
The corresponding region of container；
S3：The timing time of timer described in S2 is arranged to 40-50min, when complete when timer, described in S1
Rotating forward control terminal of the control device to multiple driving devices synchronize control, driving device drives corresponding top electrode rotation
45 °, while the counts of control device control counter add 1, temperature sensor detects chip capacitor corresponding region
When junction temperature temperature drops to setting value, multiple temperature sensors to control device with door module by sending a high level, control
Reversion control terminal of the device processed to multiple driving devices synchronizes control, and driving device drives corresponding top electrode to rotate 45 °,
Control device also controls timer to start timing at the same time, until multiple top electrodes are in contact with chip capacitor, flaky electric capacity
Device carries out burnin operation next time；
S4：The counts of counter described in S3 are arranged to 20-30, when the counting of counter reaches setting value,
Counter controls alarm to alarm by control device, and alarm is audible-visual annunciator, and the time of fire alarming of alarm is set
1-2min is set to, unison counter also controls controlling switch to turn off by control device.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of chip capacitor multistage aging technique, it is characterised in that comprise the following steps：
S1：The required burn-in test fixture of chip capacitor is got out, burn-in test fixture includes insulated substrate, a bottom electricity
Pole, multiple top electrodes, multiple temperature-detecting devices and multiple driving devices, hearth electrode are installed on exhausted by hearth electrode connection bolt
On edge substrate, each top electrode is installed on insulated substrate by corresponding driving device, and multiple temperature sensors pass through one
Control device is electrically connected with door module, and control device is also electrically connected timer and counter；
S2：Chip capacitor is placed on the hearth electrode described in S1, multiple top electrodes described in S1 are and sheet at this time
Capacitor is contacted, and is then in close contact multiple temperature-detecting devices described in S1 with chip capacitor, most
After allow hearth electrode to be turned on multiple top electrodes, while timer starts timing, the electricity between hearth electrode and each top electrode
Stream passes through the corresponding region of chip capacitor；
S3：When complete during timer described in S2, rotating forward control terminal of the control device to multiple driving devices described in S1
Control is synchronized, driving device drives corresponding top electrode to rotate 45 °, while the counts of control device control counter
Add 1, when temperature sensor detects that the junction temperature temperature of chip capacitor corresponding region drops to setting value, multiple temperature sensors
By sending a high level to control device with door module, reversion control terminal of the control device to multiple driving devices carries out same
Step control, driving device drives corresponding top electrode to rotate 45 °, while control device also controls timer to start timing, until
Multiple top electrodes are in contact with chip capacitor, and chip capacitor carries out burnin operation next time；
S4：When the counting of counter described in S3 reaches setting value, counter controls alarm to be reported by control device
It is alert.
2. a kind of chip capacitor multistage aging technique according to claim 1, it is characterised in that in the S1, each
Extension spring is mounted between top electrode and insulated substrate.
3. a kind of chip capacitor multistage aging technique according to claim 1, it is characterised in that multiple in the S1
Top electrode and hearth electrode are electrically connected with same power supply, and a control is also electrically connected between hearth electrode and power supply
System switch, and controlling switch is also electrically connected with control device.
A kind of 4. chip capacitor multistage aging technique according to claim 1, it is characterised in that in the S2, temperature
Detection device is used to detect the junction temperature temperature of chip capacitor corresponding region in real time.
A kind of 5. chip capacitor multistage aging technique according to claim 1, it is characterised in that in the S3, timing
The timing time of device is arranged to 40-50min.
A kind of 6. chip capacitor multistage aging technique according to claim 1, it is characterised in that in the S4, alarm
Device is audible-visual annunciator, and the time of fire alarming of alarm is arranged to 1-2min.
7. a kind of chip capacitor multistage aging technique according to claim 1, it is characterised in that in the S4, count
The counts of device are arranged to 20-30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711233128.2A CN107907767A (en) | 2017-11-30 | 2017-11-30 | A kind of chip capacitor multistage aging technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711233128.2A CN107907767A (en) | 2017-11-30 | 2017-11-30 | A kind of chip capacitor multistage aging technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107907767A true CN107907767A (en) | 2018-04-13 |
Family
ID=61848123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711233128.2A Pending CN107907767A (en) | 2017-11-30 | 2017-11-30 | A kind of chip capacitor multistage aging technique |
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| Country | Link |
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| CN (1) | CN107907767A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113548766A (en) * | 2021-08-30 | 2021-10-26 | 广东兴艺数字印刷股份有限公司 | Printing waste liquid curing treatment system and waste liquid curing process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201681094U (en) * | 2009-12-14 | 2010-12-22 | 西安东风仪表厂 | Adjustable sheet-type capacitor aging jig |
| CN201716330U (en) * | 2010-05-27 | 2011-01-19 | 北京新润泰思特测控技术有限公司 | Aging test box |
| CN103399178A (en) * | 2013-08-06 | 2013-11-20 | 天津大学 | High temperature testing fixture of chip capacitor |
| CN103529329A (en) * | 2013-10-24 | 2014-01-22 | 华东光电集成器件研究所 | Multi-position aging device for chip capacitors |
| CN205120763U (en) * | 2015-11-04 | 2016-03-30 | 中国振华（集团）新云电子元器件有限责任公司 | Anchor clamps are measured to high temperature of sheet -type capacitor ware |
-
2017
- 2017-11-30 CN CN201711233128.2A patent/CN107907767A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201681094U (en) * | 2009-12-14 | 2010-12-22 | 西安东风仪表厂 | Adjustable sheet-type capacitor aging jig |
| CN201716330U (en) * | 2010-05-27 | 2011-01-19 | 北京新润泰思特测控技术有限公司 | Aging test box |
| CN103399178A (en) * | 2013-08-06 | 2013-11-20 | 天津大学 | High temperature testing fixture of chip capacitor |
| CN103529329A (en) * | 2013-10-24 | 2014-01-22 | 华东光电集成器件研究所 | Multi-position aging device for chip capacitors |
| CN205120763U (en) * | 2015-11-04 | 2016-03-30 | 中国振华（集团）新云电子元器件有限责任公司 | Anchor clamps are measured to high temperature of sheet -type capacitor ware |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113548766A (en) * | 2021-08-30 | 2021-10-26 | 广东兴艺数字印刷股份有限公司 | Printing waste liquid curing treatment system and waste liquid curing process |
| CN113548766B (en) * | 2021-08-30 | 2023-11-03 | 广东兴艺数字印刷股份有限公司 | Printing waste liquid solidification treatment system and waste liquid solidification process |
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Application publication date: 20180413 |
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