CN107891588A - A kind of leak adhesive monitor - Google Patents

A kind of leak adhesive monitor Download PDF

Info

Publication number
CN107891588A
CN107891588A CN201711360087.3A CN201711360087A CN107891588A CN 107891588 A CN107891588 A CN 107891588A CN 201711360087 A CN201711360087 A CN 201711360087A CN 107891588 A CN107891588 A CN 107891588A
Authority
CN
China
Prior art keywords
temperature
electric connection
leak adhesive
chip microcomputer
connection mode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711360087.3A
Other languages
Chinese (zh)
Inventor
李象烈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGDONG YUDO HOT RUNNER SYSTEM Co.,Ltd.
Original Assignee
Abido Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abido Automation Co Ltd filed Critical Abido Automation Co Ltd
Priority to CN201711360087.3A priority Critical patent/CN107891588A/en
Publication of CN107891588A publication Critical patent/CN107891588A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/76163Errors, malfunctioning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76177Location of measurement
    • B29C2945/76254Mould
    • B29C2945/76274Mould runners, nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Examining Or Testing Airtightness (AREA)

Abstract

The present invention relates to a kind of leak adhesive monitor, controlled including detector body and single-chip microcomputer, temp.-sensing wire is provided with the right side of the metal hanger, its temp.-sensing wire bottom is fixedly connected with temperature-sensitive wire terminal, and it is provided with link slot on the outside of temperature-sensitive wire terminal, the single-chip microcomputer control output end is connected using electric connection mode with alarm sounds module, and single-chip microcomputer control output end is connected using electric connection mode with touch-screen display module, the single-chip microcomputer control receiving terminal is connected using electric connection mode with data acquisition unit, its data acquisition unit receiving terminal is connected using electric connection mode with temperature-sensing probe, and temperature-sensing probe output end is connected using electric connection mode with die shunting plate.The leak adhesive monitor, by the monitoring of the temperature-sensing probe that is arranged in mold hot flow to temperature, so as to more accurate, more it be directed to, more timely detect leak adhesive phenomenon, so as to send alarm, and whole-course automation, using more convenient.

Description

A kind of leak adhesive monitor
Technical field
The present invention relates to monitoring device technical field, specially a kind of leak adhesive monitor.
Background technology
Need to use colloid progress gluing during mold injection, and at this moment may go out in the environment of high-temperature injection The situation of existing leak adhesive, at this moment just needs to use leak adhesive monitor, its leak adhesive situation is monitored.
Traditional technology is that injection mold hot runner is installed between mould backboard and a plates, after leak adhesive, is not easy to find, with The increase of leak adhesive, material leakage is cumulative in hot flow path, causes hot flow path large area to damage, it is other to hot flow path to increase leak adhesive The damage of parts, adds economic loss.
The content of the invention
It is an object of the invention to provide a kind of leak adhesive monitor, to solve the traditional skill proposed in above-mentioned background technology Art is that injection mold hot runner is installed between mould backboard and a plates, after leak adhesive, is not easy to find, with the increase of leak adhesive, hot-fluid Material leakage is cumulative in road, causes hot flow path large area to damage, increases damage of the leak adhesive to the other parts of hot flow path, increases The problem of economic loss.
To achieve the above object, the present invention provides following technical scheme:A kind of leak adhesive monitor, including detector body and Single-chip microcomputer controls, and the preceding surface of detector body is fixedly connected with display screen, and is provided with power switch on the left of display screen, institute State and electric power connection line is fixedly connected with the top of detector body, and fixed plate, the fixed plate are provided with the right side of electric power connection line Surface is fixedly connected with connection chute, and fixed prelaminar part is provided with metal hanger, and temperature-sensitive is provided with the right side of the metal hanger Line, its temp.-sensing wire bottom is fixedly connected with temperature-sensitive wire terminal, and is provided with link slot, the single-chip microcomputer control on the outside of temperature-sensitive wire terminal Output end processed is connected using electric connection mode with alarm sounds module, and single-chip microcomputer control output end uses electric connection side Formula is connected with touch-screen display module, and the single-chip microcomputer control receiving terminal is connected using electric connection mode with data acquisition unit Connect, its data acquisition unit receiving terminal is connected using electric connection mode with temperature-sensing probe, and temperature-sensing probe output end is using electricity Property connected mode is connected with die shunting plate.
Preferably, the detector body forms sliding connection structure by connecting chute with fixed plate.
Preferably, the size of the display screen is very little, and display screen is touch screen structure.
Preferably, the alarm sounds module forms combined launch module with touch-screen display module.
Preferably, the touch-screen display module forms two-way electric connection structure with single-chip microcomputer control.
Compared with prior art, the beneficial effects of the invention are as follows:The leak adhesive monitor, by being arranged in mold hot flow Monitoring of the temperature-sensing probe to temperature, so as to more accurate, be more directed to, more timely detect leak adhesive phenomenon, so as to send Alarm, and whole-course automation, using more convenient.The detector body of the device forms the company of slip by connecting chute with fixed plate Binding structure, so installation preferably can be fixed in the device and disassembled, use more convenient, the chi of the display screen of the device Very little is very little, and display screen is touch screen structure, can so make it that device operation is more succinct convenient, and display is more directly perceived, Effect is more preferable, and alarm sounds module and the touch-screen display module of the device form combined launch module, and this allows to listening To display data result is checked while alarm, so as to preferably be monitored, the touch-screen display module and monolithic of the device Machine control forms two-way electric connection structure, and this causes the device not only to check result by display screen, and can lead to Cross display screen and control the device, it is easy to use.
Brief description of the drawings
Fig. 1 is a kind of main structure diagram of leak adhesive monitor of the present invention;
Fig. 2 is a kind of system architecture schematic diagram of leak adhesive monitor of the present invention;
Fig. 3 is a kind of control flow chart of leak adhesive monitor of the present invention,
Fig. 4 is a kind of electric operation control circuit figure of leak adhesive monitor of the present invention.
In figure:1st, detector body, 2, electric power connection line, 3, fixed plate, 4, connection chute, 5, temp.-sensing wire, 6, temp.-sensing wire Joint, 7, link slot, 8, display screen, 9, metal hanger, 10, power switch, 11, single-chip microcomputer control, 12, alarm sounds module, 13rd, touch-screen display module, 14, data acquisition unit, 15, temperature-sensing probe, 16, die shunting plate.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made Embodiment, belong to the scope of protection of the invention.
Fig. 1-4 are referred to, the present invention provides a kind of technical scheme:A kind of leak adhesive monitor, including detector body 1 and list Piece machine control 11,1 preceding surface of detector body is fixedly connected with display screen 8, and the left side of display screen 8 is provided with power switch 10, Detector body 1 forms sliding connection structure by connecting chute 4 and fixed plate 3, and the size of display screen 8 is 7 cun, and display screen 8 be touch screen structure, so the device preferably can be fixed into installation and disassembled, and using more convenient, so can also So that device operation is more succinct convenient, and display is more directly perceived, and effect is more preferable, and the top of detector body 1 is fixedly connected with electricity Source connecting line 2, and the right side of electric power connection line 2 is provided with fixed plate 3, the surface of fixed plate 3 is fixedly connected with connection chute 4, and solid The front portion of fixed board 3 is provided with metal hanger 9, and the right side of metal hanger 9 is provided with temp.-sensing wire 5, and its bottom of temp.-sensing wire 5 is fixedly connected with thoughts Warm wire terminal 6, and the outside of temperature-sensitive wire terminal 6 is provided with link slot 7, single-chip microcomputer control 11 output ends using electric connection mode with Alarm sounds module 12 is connected, and single-chip microcomputer controls 11 output ends to use electric connection mode and the phase of touch-screen display module 13 Connection, alarm sounds module 12 form combined launch module, touch-screen display module 13 and monolithic with touch-screen display module 13 Machine control 11 forms two-way electric connection structure, and this allows to check display data result while alarm is heard, so as to Preferably it is monitored, this also causes the device not only to check result by display screen 8, and can pass through display screen 8 The device is controlled, easy to use, single-chip microcomputer controls 11 receiving terminals to be connected using electric connection mode with data acquisition unit 14, its The receiving terminal of data acquisition unit 14 is connected using electric connection mode with temperature-sensing probe 15, and the output end of temperature-sensing probe 15 is using electricity Property connected mode is connected with die shunting plate 16.
The operation principle of the present embodiment:The leak adhesive monitor, is checked the device first, can be made after confirmation is errorless With by being provided with special temperature measuring probe in mold hot flow, lead is connected to the terminal box of outside, and then temperature-sensitive is visited First 15 are connected by temp.-sensing wire 5 with controller, then after the temperature stabilization of hot flow path, are opened leak adhesive monitor, are passed through display The touch-screen display module 13 of screen 8 sets the temperature value of reasonable bound, and when there is leak adhesive, corresponding temperature-sensing probe 15 detects There is the fluctuation substantially shown in temperature, and during more than up or down limit value, signal feeds back controls 11 in single-chip microcomputer, and police is transmitted to by processing Reminding module 12 is reported, then sends alarm, and every equipment there are 8 control points, can control eight devices, temperature letter simultaneously Number it is low pressure, connects input signal discharge circuit, after enhanced processing, connection single-chip microcomputer control 11, there is expanded circuit, piece machine Control 11 forms output control circuits, and output end is connected with mode-locked signal, connected with manipulator signal, can be with after there is leak adhesive Realize and stop with injection machine linkage, here it is the operation principle of the leak adhesive monitor.
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, It can still modify to the technical scheme described in foregoing embodiments, or which part technical characteristic is carried out etc. With replacing, within the spirit and principles of the invention, any modification, equivalent substitution and improvements made etc., this should be included in Within the protection domain of invention.

Claims (5)

1. a kind of leak adhesive monitor, including detector body(1)Controlled with single-chip microcomputer(11), it is characterised in that:The detector Main body(1)Preceding surface is fixedly connected with display screen(8), and display screen(8)Left side is provided with power switch(10), the detector Main body(1)Top is fixedly connected with electric power connection line(2), and electric power connection line(2)Right side is provided with fixed plate(3), it is described solid Fixed board(3)Surface is fixedly connected with connection chute(4), and fixed plate(3)Front portion is provided with metal hanger(9), the metal hanging Hook(9)Right side is provided with temp.-sensing wire(5), its temp.-sensing wire(5)Bottom is fixedly connected with temperature-sensitive wire terminal(6), and temperature-sensitive wire terminal (6)Outside is provided with link slot(7), the single-chip microcomputer control(11)Output end is using electric connection mode and alarm sounds module (12)It is connected, and single-chip microcomputer controls(11)Output end uses electric connection mode and touch-screen display module(13)It is connected, The single-chip microcomputer control(11)Receiving terminal uses electric connection mode and data acquisition unit(14)It is connected, its data acquisition unit (14)Receiving terminal uses electric connection mode and temperature-sensing probe(15)It is connected, and temperature-sensing probe(15)Output end, which uses, electrically to be connected Connect mode and die shunting plate(16)It is connected.
A kind of 2. leak adhesive monitor according to claim 1, it is characterised in that:The detector body(1)Pass through connection Chute(4)With fixed plate(3)Form sliding connection structure.
A kind of 3. leak adhesive monitor according to claim 1, it is characterised in that:The display screen(8)Size be 7 cun, And display screen(8)For touch screen structure.
A kind of 4. leak adhesive monitor according to claim 1, it is characterised in that:The alarm sounds module(12)With touch Shield display module(13)Form combined launch module.
A kind of 5. leak adhesive monitor according to claim 1, it is characterised in that:The touch-screen display module(13)With list Piece machine controls(11)Form two-way electric connection structure.
CN201711360087.3A 2017-12-18 2017-12-18 A kind of leak adhesive monitor Pending CN107891588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711360087.3A CN107891588A (en) 2017-12-18 2017-12-18 A kind of leak adhesive monitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711360087.3A CN107891588A (en) 2017-12-18 2017-12-18 A kind of leak adhesive monitor

Publications (1)

Publication Number Publication Date
CN107891588A true CN107891588A (en) 2018-04-10

Family

ID=61807572

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711360087.3A Pending CN107891588A (en) 2017-12-18 2017-12-18 A kind of leak adhesive monitor

Country Status (1)

Country Link
CN (1) CN107891588A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103496129A (en) * 2013-09-29 2014-01-08 天津博信汽车零部件有限公司 Mold hot runner gum leakage automatic detection system
CN106426840A (en) * 2016-09-26 2017-02-22 广东柳道热流道系统有限公司 Temperature control cabinet detection system for adhesive leakage of hot runner
CN206208307U (en) * 2016-11-18 2017-05-31 安徽亿纵电子科技有限公司 A kind of comprehensive indoor air chemical pollution equipment
CN206598502U (en) * 2017-03-28 2017-10-31 亿和塑胶电子制品(深圳)有限公司 A kind of mold temperature detection means
CN107328532A (en) * 2017-08-30 2017-11-07 艾克森(江苏)节能电热科技有限公司 A kind of leak adhesive detection means
CN207711315U (en) * 2017-12-18 2018-08-10 东莞毅比道自动化设备有限公司 A kind of leak adhesive monitor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103496129A (en) * 2013-09-29 2014-01-08 天津博信汽车零部件有限公司 Mold hot runner gum leakage automatic detection system
CN106426840A (en) * 2016-09-26 2017-02-22 广东柳道热流道系统有限公司 Temperature control cabinet detection system for adhesive leakage of hot runner
CN206208307U (en) * 2016-11-18 2017-05-31 安徽亿纵电子科技有限公司 A kind of comprehensive indoor air chemical pollution equipment
CN206598502U (en) * 2017-03-28 2017-10-31 亿和塑胶电子制品(深圳)有限公司 A kind of mold temperature detection means
CN107328532A (en) * 2017-08-30 2017-11-07 艾克森(江苏)节能电热科技有限公司 A kind of leak adhesive detection means
CN207711315U (en) * 2017-12-18 2018-08-10 东莞毅比道自动化设备有限公司 A kind of leak adhesive monitor

Similar Documents

Publication Publication Date Title
CN101576416B (en) System for monitoring contact temperature of high-voltage switch cabinet on line
CN201532590U (en) Temperature and humidity controller
CN202275146U (en) Running-state on-line monitoring system for on-load high-voltage distribution disconnecting switch
CN102931620A (en) Intelligent bus system device
CN204214565U (en) Coil winding temperature rise testing circuit, electromagnet control device, isolating switch
CN207711315U (en) A kind of leak adhesive monitor
CN107891588A (en) A kind of leak adhesive monitor
CN202231350U (en) Switch cabinet state indicator with function of measuring temperature of busbar
CN202149937U (en) Electric energy meter calibrating device and calibrating system
CN206099149U (en) Control device suitable for medium voltage switchgear
CN201812217U (en) Dry transformer temperature controller
CN203294597U (en) Ash bucket heating device
CN204719908U (en) Zigbee wireless alarmer
CN208399024U (en) A kind of wireless temperature measuring device
CN202330317U (en) Thermal insulation detecting device for protection slag
CN202678884U (en) Intelligent type bus system apparatus
CN204495472U (en) High voltage isolation switch contact infrared array temperature detection monitoring system
CN209524948U (en) EMU car top high-voltaghe compartment equipment condition monitoring device
CN208241126U (en) A kind of distribution box intelligence control system
CN102829827A (en) Monitoring device for bus duct
CN205942470U (en) On --spot heating control ware of intelligent cable joint operation
CN206726399U (en) A kind of guide tracked fire detector circuit
CN201708759U (en) Centralized operation control device for excitation system
CN205427142U (en) Temperature controller synchronization degree tester
CN203965050U (en) A kind of temperature collecting device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20200810

Address after: 357 Bubugao Road, Wusha community, Chang'an Town, Dongguan City, Guangdong Province

Applicant after: GUANGDONG YUDO HOT RUNNER SYSTEM Co.,Ltd.

Address before: 523000 Guangdong Province, Dongguan city Changan town usha community private industrial zone, Road No. 8 people third to four

Applicant before: ABIDO AUTOMATION Co.,Ltd.

TA01 Transfer of patent application right
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180410

WD01 Invention patent application deemed withdrawn after publication