CN107888292A - Optical transceiver module with integral structure - Google Patents
Optical transceiver module with integral structure Download PDFInfo
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- CN107888292A CN107888292A CN201610866280.3A CN201610866280A CN107888292A CN 107888292 A CN107888292 A CN 107888292A CN 201610866280 A CN201610866280 A CN 201610866280A CN 107888292 A CN107888292 A CN 107888292A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 239000012788 optical film Substances 0.000 claims description 61
- 239000013307 optical fiber Substances 0.000 claims description 33
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000010287 polarization Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004446 light reflex Effects 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- GBYFRWZNEYJWAD-VTWSTLNFSA-N (3S,6S,12S,15S,21S,24S,30S,33S)-3,12,21,30-tetrabenzyl-1,4,10,13,19,22,28,31-octazapentacyclo[31.3.0.06,10.015,19.024,28]hexatriacontane-2,5,11,14,20,23,29,32-octone Chemical compound O=C1N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@H]2C(=O)N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@H]2C(=O)N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@H]2C(=O)N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@@H]12 GBYFRWZNEYJWAD-VTWSTLNFSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Disclose a kind of optical transceiver module with integral structure.The integral structure includes single substrate, optical interface and light engine.The component of the component of the optical interface and the light engine is attached directly to the single substrate.
Description
The cross reference of related application
This application claims the rights and interests of U.S. Provisional Application No.62/071,858 filed in 6 days October in 2014.
Technical field
The present invention relates to optical transceiver module, more particularly, to the optical transceiver with integral type (unibody) structure
Module.
Background technology
The world's just experience is changed by the information explosion of media stream, cloud computing, big data and artificial intelligence driving.Internet
Flow increase by 30% every year.For more highdensity optical port and Geng Gao data exchange rate, Metropolitan Area Network (MAN) and access network
Market is most strong demand field.Industry is just migrated to much smaller from the previous standard CFP form factors of light multiplexing/demultiplexing module
Form factor, such as CFP4 and QSFP28.
Existing optical transceiver module design generally includes three elements:Optical interface, light engine and encapsulation.Optical interface is to use
In the light input/output device for being connected to external network.People can be used optical fiber that signal is routed into external connection.People also may be used
Outside optical connector is received using pluggable socket.
Light engine is the primary clustering of optical transceiver module.Light engine can be multiplex/demultiplex module.Light engine includes
It is one or more of following:Free Space Optics component (free-space-optics assembly);Planar-light guide circuit;
Semiconductor light sub-circuit;Light launches and/or light receiving unit;And light amplitude, phase, pattern and/or polarization actuation means.
Encapsulation is the shell for optical interface and light engine.Optical interface is attached to encapsulation.Light engine is also attached to encapsulation.But
It is that optical interface and light engine are the units separated, and optical interface and light engine are built separatedly.Afterwards by the optical interface of completion and
Light engine is attached to encapsulation.Being coupled and aligned between optical interface and light engine can be all influenceed on encapsulating any substantive shock.
Therefore it is necessary to have have higher resistance for encapsulation deterioration to realize the more preferably firm alignment of reliability
Optical transceiver module.These transceiver modules should also be as with form factor and low manufacturing cost.
The content of the invention
The present invention is proposed in view of the above problems.
The present invention proposes a kind of optical transceiver module, and the optical transceiver module includes integral structure, wherein described one
Body formula structure includes:Single substrate;Optical interface;And light engine, wherein the component of the component of the optical interface and the light engine
It is attached directly to the single substrate.
The optical transceiver module of the present invention can be more preferably reliable with being realized for encapsulation deterioration with higher resistance
The firm alignment of property.And the transceiver module of the present invention can have form factor and low manufacturing cost.
Brief description of the drawings
With reference to the non-limiting and embodiment of nonexhaustive of the following drawings description present invention, wherein being adopted through each accompanying drawing
Similar part is referred to similar reference, unless otherwise noted.
Fig. 1 diagrammatically illustrates the perspective view of exemplary integral structure.
Fig. 2 diagrammatically illustrates the perspective view of exemplary integral structure.
Fig. 3 A diagrammatically illustrate the horizontal cross of the exemplary integral structure including LC sockets.
Fig. 3 B diagrammatically illustrate the horizontal cross of the exemplary integral structure including optical fiber collimator.
Fig. 4 diagrammatically illustrates the vertical sectional view of Fig. 1 exemplary integral structure.
Fig. 5 diagrammatically illustrates the vertical sectional view of Fig. 2 exemplary integral structure.
Fig. 6 diagrammatically illustrates the lid for the exemplary integral structure that Fig. 1 is encapsulated together with single substrate.
Fig. 7 diagrammatically illustrates the lid for the exemplary integral structure that Fig. 2 is encapsulated together with single substrate.
Corresponding assembly is represented using corresponding reference symbol through several views of the drawings.One of ordinary skill in the art are it will be recognized that be
Simplify and element in the accompanying drawings is shown for the sake of clear, element is not necessarily drawn to scale.For example, some elements in accompanying drawing
Size may be exaggerated relative to other elements, to help to improve the understanding to each embodiment of the present invention.
Embodiment
In the following description, a large amount of details are illustrated to provide thorough understanding of the present invention.But to art
Those of ordinary skill is it is readily apparent that need not use detail to be used to put into practice the present invention.In other cases, not specifically
Material known to description or method are fuzzy of the invention to avoid.
" embodiment " or " embodiment " mentioned through this specification is meant that:With the embodiment phase
Specific features, structure or the characteristic for closing ground description are included at least one embodiment of the present invention.Thus, through this explanation
The phrase " in one embodiment " or " in embodiments " that book occurs in each position need not all refer to identical implementation
Mode.In addition, specific features, structure or characteristic can in one or more embodiments with any appropriate combination and/
Or sub-portfolio is combined.
Disclose a kind of optical transceiver module, its have less form factor and between optical interface and light engine it is steady
Solid be coupled and aligned.Optical transceiver module includes optical interface and light engine, is integrated optical interface and light engine using single substrate
Together.This simplifies overall optical module by the singly component of alignment modules from start to end in a package
Manufacture.This will also reduce the influence brought by potential encapsulation deterioration to reliability.Generally, optical interface and light engine are separation
Unit.Optical interface and light engine are built separatedly.Then the optical interface of completion and light engine are attached to encapsulation.
Optical interface includes but is not limited to:Industrial standard optical receptacle with form factor LC, SC, FC, MPO;And its
He customizes Optical Interface Structure.Light engine includes but is not limited to:It is public in the United States Patent (USP) 8,537,468 being expressly incorporated herein by reference
The free space multiplex/demultiplex component opened;And other multiplex/demultiplex modules, including PLC, Si photonic element
(photonics), light transmitting and light receiving unit (i.e. laser and detector) and light amplitude, phase, pattern, and/or inclined
Manipulation component of shaking (polarization manipulating components).
In order to demonstrate the invention, exemplary optical transceiver module includes drawing as the LC sockets of optical interface and as light
The free space multiplex/demultiplex component held up.It will be recognized that shown example is not intended to limit the scope of the present invention.For example, light
Interface may include the optical fiber collimator with optical fiber or the socket with SC, FC and MPO form factor.Light engine can be multiple
With/demultiplexing module, multiplex/demultiplex module includes:Planar-light guide circuit;Semiconductor light sub-circuit;Light is launched and/or light connects
Receive unit;And light amplitude, phase, pattern and/or polarization manipulation device.
Fig. 1 diagrammatically illustrates the perspective view of exemplary integral structure 100, and integral structure 100 uses single substrate
118 integrate LC sockets and free space multiplex/demultiplex component.This device can be used for multiplexing and/or demultiplexing.
Integral structure 100 includes single substrate 118.LC sockets 116 are arranged in substrate 118.Lens 102 are arranged on substrate
On 118.Light from LC sockets 116 is calibrated by lens 102.Dielectric optical film filter array 104 and mirror array 106
It is arranged on substrate 118.Dielectric optical film filter array 104 optionally transmitted light and optionally reflected light.Mirror
Face array 106 is directed the light to or guided to dielectric optical film filter array 104.It will be recognized that LC sockets 116 can by with
The optical fiber collimator of optical fiber substitutes.
The light calibrated by lens 102 is directed to the first element of dielectric optical film filter array 104.With wavelength
λ 1 light transmits via the first element of dielectric optical film filter array 104.Pass through dielectric optical film filter array
104 the first element, remaining incident light is reflexed to the first element of mirror array 106.Incide the of mirror array 106
The light of one element is reflected to the second element of dielectric optical film filter array 104.Light with wavelength X 2 is via dielectric
The second element transmission of optical thin film filter array 104.Will by the second element of dielectric optical film filter array 104
Remaining incident light reflexes to the second element of mirror array 106.And so on.
Prism 108 is arranged on substrate 118.The light transmitted via dielectric optical film filter array 104 is by prism
108 are reflected down to microlens array 110.Microlens array 110 is arranged in the substrate 118 of the lower section of prism 108.By prism
The light of 108 reflections by microlens array 110 and is focused onto in detector array 112.Detector array 112 is arranged on small
On substrate 114.Small substrate 114 is arranged on substrate 118.Alternatively, small substrate 114 can be removed and detector array 112
It is set directly on substrate 118.By this way, each element of detector array 112 will detect has different ripples respectively
Long λ 1, λ 2, λ 3 light, and so on.
Therefore, by using single substrate 118, integral structure 100 be integrated with LC sockets 116 and free space multiplexing/
Component is demultiplexed, free space multiplex/demultiplex component includes lens 102, dielectric optical film filter array 104, minute surface
Array 106, prism 108, lens array 110 and detector array 112.It will be recognized that free space multiplex/demultiplex component can
By including planar-light guide circuit;Semiconductor light sub-circuit;Light launches and/or light receiving unit;And light amplitude, phase, pattern
Or the multiplex/demultiplex module of polarization actuation means replaces.
In another embodiment, detector array 112 is replaced by laser array 112A.Laser array 112A's is every
Individual element send respectively with different wave length λ 1, λ 2, λ 3 light, and so on.The light sent by laser array 112A is by micro-
Lens array 110 is calibrated.Light after calibration is guided by prism 108 towards dielectric optical film filter array 104.Dielectric optical
Film filter optionally transmitted light and optionally reflected light.Minute surface is directed the light to dielectric optical film filter.Cause
This, is combined with the laser with different wave length λ 1, λ 2, λ 3 etc..The laser of combination is focused on LC sockets 116 by lens 102.
Therefore, by using single substrate 118, integral structure 100 be integrated with LC sockets 116 and free space multiplexing/
Component is demultiplexed, free space multiplex/demultiplex component includes lens 102, dielectric optical film filter array 104, minute surface
Array 106, prism 108, lens array 110 and laser array 112A.
Fig. 2 diagrammatically illustrates the perspective view of the example of integral structure 200.Integral structure 200 and Fig. 1 integral type
Structure 100 is similar, except being shaped as practice and aesthetic reasons, a part for the single substrate 118 of package LC socket 116
Outside cylindric.
Fig. 3 A schematically show the horizontal cross of exemplary integral structure 100 and 200.Layer 300 is the upper of substrate 118
Layer.Layer 330 is the layer of the lower section of layer 300 in substrate 118.Layer 340 is the lower floor of substrate 118 (referring also to Fig. 4 and Fig. 5).
Can be that the optical interfaces of LC sockets 316 is arranged on layer 300.LC sockets 316 include the He of sleeve (sleeve) 324
Lasso (ferrule) 320.Sleeve 324 is used for the lasso 336 for receiving input unit (not shown).Lasso 320 is coupled to lasso
336.Lasso 320 includes optical fiber 322.The optical fiber 322 of lasso 320 connects from the optical fiber 338 being included in the lasso 336 of input unit
Receive light.Calibrated from optical fiber 322 towards the light of lens 302 by lens 302.Lens 302 can be the lens of optical fiber collimator.From light
The light of fibre 322 towards lens 302 has multiple wavelength, such as λ 1, λ 2, λ 3 and λ 4.It will be recognized that it is more or less than four wavelength
It is and possible.
Fig. 3 B diagrammatically illustrate the horizontal cross of exemplary integral structure, and Fig. 3 B are similar to Fig. 3 A, except with
The optical fiber collimator 350 of optical fiber 352 is replaced outside lens 302 and LC sockets 316.Optical fiber collimator 350 includes lens 354 and protected
Hold the lasso 356 of optical fiber 352.In this embodiment, calibrated from optical fiber 352 towards the light of lens 354 by lens 354.
Referring back to Fig. 3 A, the light calibrated by lens 302 is directed to the first dielectric optical film filter 304A.Have
The light of wavelength X 1 transmits via the first dielectric optical film filter 304A.Will by the first dielectric optical film filter 304A
Remaining incident light reflexes to the first minute surface 306A.The light for inciding the first mirror 306A is reflected to the filter of the second dielectric optical film
Ripple device 304B.Light with wavelength X 2 is transmitted by the second dielectric optical film filter 304B.It is thin by the second dielectric optical
Remaining incident light is reflexed to the second minute surface 106B by film filter 304B.Dielectric optical film filter optionally transmitted light
And optionally reflected light.Minute surface is directed the light to dielectric optical film filter.
This process is repeated, until there is wavelength X 1 towards prism 308, the first dielectric optical film filter 304A transmissions
Light, the second dielectric optical film filter 304B transmission with wavelength X 2 light, the 3rd dielectric optical film filter 304C
Untill light of the transmission with wavelength X 3, and light of the 4th dielectric optical film filter 304D transmissions with wavelength X 4.Prism
308 are directed to the light with wavelength X 1, λ 2, λ 3 and λ 4 the first lenticule 310A on layer 330, second micro- separately down
Lens 310B, the 3rd lenticule 310C and the 4th lenticule 310D.
First lenticule 310A focuses on the light with wavelength X 1 on first detector 312A.Second lenticule 310B will
Light with wavelength X 2 is focused on the second detector 312B.Light with wavelength X 3 is focused on the 3rd by the 3rd lenticule 310C
On detector 312C.4th lenticule 310D focuses on the light with wavelength X 4 on the 4th detector 312D.First detector
312A, the second detector 312B, the 3rd detector 312C, the 4th detector 312D are arranged on small substrate 314, and small substrate
314 on layer 340.
As it was previously stated, detector 312A-312D can be replaced by laser 313A-313D.Each laser sends tool respectively
There are different wave length λ 1, λ 2, λ 3 and λ 4 light.It will be recognized that it is more or less than four lasers and more or less than four ripples
Length is all possible.There is different wave length λ 1, λ 2, λ 3 and λ 4 light respectively by lenticule 310A- by what each laser was sent
310D is calibrated.Light directing with wavelength X 1 to the first dielectric optical film filter 304A will be had wavelength X 2 by prism 308
Light directing to the second dielectric optical film filter 304B, the light directing with wavelength X 3 to the 3rd dielectric optical film is filtered
Ripple device 304C, and by the light directing with wavelength X 4 to the 4th dielectric optical film filter 304D.
4th dielectric optical film filter 304D has the light of wavelength X 4 towards the 3rd minute surface 306C transmissions.3rd minute surface
306C has the light of wavelength X 4 towards the 3rd dielectric optical film filter 304C reflections.3rd dielectric optical film filter
304C reflects the light with wavelength X 4 towards light of the second minute surface 306B transmissions with wavelength X 3 towards the second minute surface 306B.
Light with wavelength X 3 and the light with wavelength X 4 are combined into the single light beam towards the second minute surface 306B now.Repeat this
Process, untill all laser all combine and are focused on by lens 302 on the optical fiber 322 of lasso 320.
Fig. 4 diagrammatically illustrates the vertical sectional view of Fig. 1 exemplary integral structure 100, exemplary integral structure
100 are integrated with LC sockets and free space multiplex/demultiplex component using single substrate 118.This device can be used for multiplexing
And/or demultiplexing.Integral structure 100 includes single substrate 118.
Can be that the optical interfaces of LC sockets is arranged in substrate 118.LC sockets include the sleeve 124 of package cavity 126
With lasso 120.Sleeve 124 is used for the lasso that input unit (not shown) is received in cavity 126.Lasso 120 includes optical fiber
122.The optical fiber 122 of lasso 120 receives light from the optical fiber in the lasso of input unit.From optical fiber 122 towards being arranged on substrate
The light of lens 102 on 118 is calibrated by lens 102.Lens 102 can be the lens of optical fiber collimator.From optical fiber 122 towards saturating
The light of mirror 102 has multiple wavelength, such as λ 1, λ 2, λ 3 etc..
Dielectric optical film filter array 104 and mirror array 106 are arranged on substrate 118.Dielectric optical film
Filter array 104 optionally transmitted light and optionally reflected light.Mirror array 106 directs the light to dielectric optical film
Filter array 104.The light calibrated by lens 102 is directed to the first element of dielectric optical film filter array 104.Tool
The light for having wavelength X 1 is transmitted via the first element of dielectric optical film filter array 104.Filtered by dielectric optical film
First element of ripple device array 104 reflexes to remaining incident light the first element of mirror array 106.Incide mirror array
The light of 106 the first element is reflected to the second element of dielectric optical film filter array 104.Light warp with wavelength X 2
It is transmitted by the second element of dielectric optical film filter array 104.Pass through the of dielectric optical film filter array 104
Two element reflexes to remaining incident light the second element of mirror array 106.And so on.
Prism 108 is arranged on substrate 118.The light transmitted by dielectric optical film filter array 104 is by prism 108
It is reflected down to microlens array 110.Microlens array 110 is arranged in the substrate 118 of the lower section of prism 108.By prism 108
The light of reflection is by lens array 110 and is focused onto in detector array 112.From prism 108 to microlens array 110, simultaneously
And it is located at further to the light of detector array 112 in the light path 128 in substrate 118.Light path 128 can be substrate 118
In hole.
Detector array 112 is arranged on small substrate 114.Small substrate 114 is arranged on substrate 118.Alternatively, it is small
Substrate 114 can be removed and detector array 112 is set directly on substrate 118.By this way, detector array 112
Each element will respectively detection with different wave length λ 1, λ 2, λ 3 light, and so on.
Therefore, the sleeve 124 of LC sockets and lasso 120, lens 102, dielectric optical film filter array 104, minute surface
Array 106, prism 108, lens array 110 and detector array 112 are directly attached to single substrate 118.
As it was previously stated, in embodiments, lasso and lens, the dielectric optical film filter array of optical fiber collimator
104th, mirror array 106, prism 108, lens array 110 and detector array 112 can be attached directly to single substrate
118。
Reference picture 3A, lens 102, dielectric optical film filter array 104, mirror array 106 and prism 108 are in layer
On 300.Microlens array 110 is on layer 330.Detector array 112 is arranged on small substrate 114, and small substrate 114 is in layer
On 340.
As it was previously stated, detector array 112 can be replaced by laser array 112A.Each laser is sent with not respectively
Co-wavelength λ 1, λ 2, λ 3 light, and so on.The light sent by laser will be calibrated by microlens array 110, and cross backward
(traverse) untill on the optical fiber 122 that lasso 120 is focused on by lens 102.
Therefore, it is used as the component of light engine of free space multiplex/demultiplex component and accurate as LC sockets or optical fiber
The component of the optical interface of straight instrument is attached directly to and is fixed on single substrate 118.With conventional optical transceiver module (in routine
In optical transceiver module, light engine is built on the platform of separation first, and afterwards by by light engine and also by advance structure
The optical interface building on another separation platform is fixed to an encapsulation, and light engine is coupled into optical interface) it is different, have in Fig. 4
The optical transceiver module of shown integral structure 100 can be in the technique of non-separation, by the component of light engine and optical interface
Component is directly attached to single substrate together.
Fig. 5 schematically shows the vertical sectional view of Fig. 2 exemplary integral structure 200, by using single substrate
118, exemplary integral structure 200 is integrated with LC sockets and free space multiplex/demultiplex component.This device can be used for multichannel
Multiplexing and/or demultiplexing.Fig. 5 is similar to Fig. 4, except for practice and aesthetic reasons, the single substrate of package LC D sockets
118 part be shaped as it is cylindric outside.
Fig. 6 shows the lid 602 for the integral structure 100 that Fig. 1 is encapsulated together with single substrate 118, Fig. 1 integral type
Structure 100 is integrated with LC sockets and free space multiplex/demultiplex component.Lid 602 and single substrate 118 form the present invention's
The encapsulation of optical transceiver module.
Fig. 7 shows the lid 702 for the integral structure 200 that Fig. 2 is encapsulated together with single substrate 118, Fig. 2 integral type
Structure 200 is integrated with LC sockets and free space multiplex/demultiplex component.Lid 702 and single substrate 118 form the present invention
Optical transceiver module encapsulation.
Although describing the present invention on exemplary embodiment and for putting into practice optimal mode of the invention herein,
But for one of ordinary skill in the art, without departing from the spirit and scope of the present invention, the present invention can be made
Many modifications, improvement and the sub-portfolio for going out each embodiment, Application Example and variation will be apparent.
It is not considered that the term used in appended claims limits the invention to present specification and claims
Disclosed in embodiment.But the scope of the present invention is determined entirely by by appended claims, will be according to for power
The explanation of sharp claim and the principle of legality established explain claims.Therefore will be considered to the specification and drawings is explanation
Property and it is nonrestrictive.
Claims (18)
1. a kind of optical transceiver module, the optical transceiver module includes integral structure, wherein the integral structure includes:
Single substrate;
Optical interface;With
Light engine,
The component of wherein described optical interface and the component of the light engine are attached directly to the single substrate.
2. optical transceiver module as claimed in claim 1, wherein the optical interface is LC sockets, the LC sockets include sleeve
With the lasso with optical fiber.
3. optical transceiver module as claimed in claim 2, wherein the light engine is free space multiplex/demultiplex component,
The free space multiplex/demultiplex component includes:
For calibrating the lens of incident light;
For the optionally transmitted light and optionally dielectric optical film filter array of reflected light;
For directing the light to the mirror array of the dielectric optical film filter array;
Prism;
Microlens array, wherein the light directing from the dielectric optical film filter array is by described by the prism
Microlens array;
Detector array, wherein the light for having passed through the microlens array is focused in the detector array.
4. optical transceiver module as claimed in claim 3, wherein the lens, the dielectric optical film filter array and
The mirror array and the prism are located on the upper strata of the single substrate, and the microlens array is located at the monolithic base
Plate on the layer of the lower section on the upper strata, and the detector array is located in the lower floor of the single substrate.
5. optical transceiver module as claimed in claim 4, wherein the detector array is arranged on small substrate, it is described small
Substrate is in the lower floor of the single substrate.
6. optical transceiver module as claimed in claim 1, wherein the optical interface is optical fiber collimator, the optical fiber collimator
Including:
Keep the lasso of optical fiber;With
Lens, the lens are used to calibrate the incident light from the optical fiber and by Laser Focusing to the optical fiber.
7. optical transceiver module as claimed in claim 6, wherein the light engine is free space multiplex/demultiplex component,
The free space multiplex/demultiplex component includes:
For the optionally transmitted light and optionally dielectric optical film filter array of reflected light;
For directing the light to the mirror array of the dielectric optical film filter array;
Prism;
Microlens array, wherein the light directing from the dielectric optical film filter array is by described by the prism
Microlens array;
Detector array, wherein the light for having passed through the microlens array is focused in the detector array.
8. optical transceiver module as claimed in claim 7, wherein the dielectric optical film filter array and the minute surface
Array and the prism are located on the upper strata of the single substrate, the microlens array be located at the single substrate in institute
On the layer for stating the lower section on upper strata, and the detector array is located in the lower floor of the single substrate.
9. optical transceiver module as claimed in claim 8, wherein the detector array is arranged on small substrate, it is described small
Substrate is in the lower floor of the single substrate.
10. optical transceiver module as claimed in claim 1, wherein the optical interface is one of SC, FC and MPO socket.
11. optical transceiver module as claimed in claim 1, wherein the light engine is multiplex/demultiplex module, it is described multiple
Include planar-light guide circuit, semiconductor light sub-circuit, Optical Transmit Unit, light receiving unit, light amplitude with/demultiplexing module to manipulate
One of device, light phase actuation means, optical mode actuation means and light polarization actuation means.
12. optical transceiver module as claimed in claim 1, in addition to for encapsulating the lid of the integral structure.
13. optical transceiver module as claimed in claim 2, wherein the light engine is free space multiplex/demultiplex component,
The free space multiplex/demultiplex component includes:
For sending the laser array of laser;
For calibrating the microlens array of sent laser;
For guiding the prism of the laser after calibrating;
Dielectric optical film filter array, the dielectric optical film filter array be used for optionally transmission and it is selective
The laser that ground reflection is guided by the prism;
Mirror array, the mirror array be used for will the laser guide that be transmitted to the dielectric optical film filter array;
And
For by the lens on the Laser Focusing to the optical fiber.
14. optical transceiver module as claimed in claim 13, wherein the lens, the dielectric optical film filter array
It is located at the mirror array and the prism on the upper strata of the single substrate, the microlens array is located at the monolithic
Substrate on the layer of the lower section on the upper strata, and the laser array is located in the lower floor of the single substrate.
15. optical transceiver module as claimed in claim 14, wherein the laser array is arranged on small substrate, it is described
Small substrate is in the lower floor of the single substrate.
16. optical transceiver module as claimed in claim 6, wherein the light engine is free space multiplex/demultiplex component,
The free space multiplex/demultiplex component includes:
For sending the laser array of the laser;
For calibrating the microlens array of sent laser;
For guiding the prism of the laser after calibrating;
Dielectric optical film filter array, the dielectric optical film filter array be used for optionally transmission and it is selective
The laser that ground reflection is guided by the prism;
Mirror array, the mirror array be used for will the laser guide that be transmitted to the dielectric optical film filter array.
17. optical transceiver module as claimed in claim 16, wherein the dielectric optical film filter array and the mirror
Face array and the prism are located on the upper strata of the single substrate, the microlens array be located at the single substrate
On the layer of the lower section on the upper strata, and the laser array is located in the lower floor of the single substrate.
18. optical transceiver module as claimed in claim 17, wherein the laser array is arranged on small substrate, it is described
Small substrate is in the lower floor of the single substrate.
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CN110690923A (en) * | 2018-07-05 | 2020-01-14 | 上海瑞波电子科技有限公司 | Optical engine-based optical fiber communication system |
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CN110690923A (en) * | 2018-07-05 | 2020-01-14 | 上海瑞波电子科技有限公司 | Optical engine-based optical fiber communication system |
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