CN107881453A - A kind of method in copper bar surface immersion plating aluminium lamination - Google Patents
A kind of method in copper bar surface immersion plating aluminium lamination Download PDFInfo
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- CN107881453A CN107881453A CN201711158925.9A CN201711158925A CN107881453A CN 107881453 A CN107881453 A CN 107881453A CN 201711158925 A CN201711158925 A CN 201711158925A CN 107881453 A CN107881453 A CN 107881453A
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- China
- Prior art keywords
- copper bar
- steam treatment
- immersion plating
- processing
- clear water
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/12—Aluminium or alloys based thereon
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of method in copper bar surface immersion plating aluminium lamination, comprise the following steps：1）Grinding process is carried out to copper bar surface with sand paper, and with 140 150 DEG C of 20min of steam treatment 10；2）Copper bar after steam treatment is placed in the 40min of alkali cleaning 30 in 70 75 DEG C of alkali lye, takes out again with 140 150 DEG C of 5min of steam treatment 3, is finally rinsed with clear water；3）Copper bar after alkali cleaning is placed in the 15min of pickling 10 in 30 35 DEG C of acid solutions, takes out again with 140 150 DEG C of 2min of steam treatment 1, is finally rinsed with clear water；4）By step 3）The copper bar of processing uniformly sprays a thin layer bonding agent, and controls thickness then to carry out drying and processing in 0.5 0.6mm；5）By step 4）The copper bar of processing is placed in 680 700 DEG C of aluminium liquid, soaks 20 25s, natural cooling after taking-up；6）By the good copper bar of immersion plating in 800 900 DEG C of oxidation processes, get product.The tin plating efficiency high of the present invention, quality is good, and the tin coating surface brightness of copper bar is bright, smooth, and coating crystallization is uniform, careful, and decay resistance is strong, and consistency is high and does not fall off.
Description
Technical field
The invention belongs to copper bar technical field, and in particular to a kind of method in copper bar surface immersion plating aluminium lamination.
Background technology
In electric power, electrician, electric essential industry field, copper bar conduct is conductively connected carrier and largely opened extensively for electrical equipment
Engineering (such as power distribution cabinet, transformer, power transmission and transformation) is closed, for anti-oxidation, improves conductive capability, the especially overlapping part in copper bar
Coating need to be carried out, prevents oxidation processes.Prior art generally first aluminized in copper bar outer surface again using dust technology to aluminium coated outside
Surface handle, although having certain effect, treatment effect is not notable enough, and some compositions to aluminium coated are difficult clear
Remove, aluminium coated outer surface is not smooth enough after processing, is faint in color, and post processing effect qualification rate is low.
The content of the invention
A kind of method in copper bar surface immersion plating aluminium lamination that the present invention provides for prior art weak point.
To achieve the above object, the technical solution adopted for the present invention to solve the technical problems is：
A kind of method in copper bar surface immersion plating aluminium lamination, comprise the following steps：
1）Grinding process is carried out to copper bar surface with sand paper, and with 140-150 DEG C of steam treatment 10-20min；
2）Copper bar after steam treatment is placed in alkali cleaning 30-40min in 70-75 DEG C of alkali lye, taken out again with 140-150 DEG C of steam
3-5min is managed, is finally rinsed with clear water；
3）Copper bar after alkali cleaning is placed in pickling 10-15min in 30-35 DEG C of acid solution, 140-150 DEG C of steam treatment 1- is used in taking-up again
2min, finally rinsed with clear water；
4）By step 3）The copper bar of processing uniformly sprays a thin layer bonding agent, and controls thickness then to be dried in 0.5-0.6mm
Dry-cure；
5）By step 4）The copper bar of processing is placed in 680-700 DEG C of aluminium liquid, soaks 20-25s, natural cooling after taking-up；
6）By the good copper bar of immersion plating in 800-900 DEG C of oxidation processes, get product.
Further, a kind of method in copper bar surface immersion plating aluminium lamination, comprises the following steps：
1）Grinding process is carried out to copper bar surface with sand paper, and with 140 DEG C of steam treatment 15min；
2）Copper bar after steam treatment is placed in alkali cleaning 35min in 70 DEG C of alkali lye, taken out again with 130 DEG C of steam treatment 4min, most
Rinsed afterwards with clear water；
3）Copper bar after alkali cleaning is placed in pickling 15min in 35 DEG C of acid solutions, 140-150 DEG C of steam treatment 1-2min is used in taking-up again,
Finally rinsed with clear water；
4）By step 3）Processing copper bar uniformly sprays a thin layer bonding agent, and controls thickness then to carry out at drying in 0.5mm
Reason；
5）By step 4）The copper bar of processing is placed in 700 DEG C of aluminium liquid, soaks 20s, natural cooling after taking-up；
6）By the good copper bar of immersion plating in 850 DEG C of oxidation processes, get product.
Further, the alkali lye is by NaHCO340g/L, NaOH80g/L are formed.
Further, the acid solution is made up of hydrochloric acid 40g/L, sulfuric acid 10g/L.
Further, the bonding agent be by mass ratio be 1:30-40 nano silicon and epoxy resin mixing system
.
Beneficial effect of the present invention：
The present invention can improve alkali cleaning, pickling effect, and then lift immersion plating effect by first carrying out steam treatment to copper bar surface
Fruit.The tin plating efficiency high of the present invention, quality is good, and the tin coating surface brightness of copper bar is bright, smooth, and coating crystallization is uniform, careful,
Decay resistance is strong, and consistency is high and does not fall off.
Embodiment
The present invention is further detailed explanation for example below：
Embodiment 1
A kind of method in copper bar surface immersion plating aluminium lamination, comprise the following steps：
1）Grinding process is carried out to copper bar surface with sand paper, and with 140 DEG C of steam treatment 10min；
2）Copper bar after steam treatment is placed in alkali cleaning 30min in 70 DEG C of alkali lye, taken out again with 140 DEG C of steam treatment 3min, most
Rinsed afterwards with clear water；
3）Copper bar after alkali cleaning is placed in pickling 10min in 30 DEG C of acid solutions, takes out again with 140 DEG C of steam treatment 1min, finally uses
Clear water rinses；
4）By step 3）The copper bar of processing uniformly sprays a thin layer bonding agent, and controls thickness then to carry out at drying in 0.5mm
Reason；
5）By step 4）The copper bar of processing is placed in 680 DEG C of aluminium liquid, soaks 20s, natural cooling after taking-up；
6）By the good copper bar of immersion plating in 800 DEG C of oxidation processes, get product.
Embodiment 2
A kind of method in copper bar surface immersion plating aluminium lamination, comprise the following steps：
1）Grinding process is carried out to copper bar surface with sand paper, and with 140 DEG C of steam treatment 15min；
2）Copper bar after steam treatment is placed in alkali cleaning 35min in 70 DEG C of alkali lye, taken out again with 130 DEG C of steam treatment 4min, most
Rinsed afterwards with clear water；
3）Copper bar after alkali cleaning is placed in pickling 15min in 35 DEG C of acid solutions, 140-150 DEG C of steam treatment 1-2min is used in taking-up again,
Finally rinsed with clear water；
4）By step 3）Processing copper bar uniformly sprays a thin layer bonding agent, and controls thickness then to carry out at drying in 0.5mm
Reason；
5）By step 4）The copper bar of processing is placed in 700 DEG C of aluminium liquid, soaks 20s, natural cooling after taking-up；
6）By the good copper bar of immersion plating in 850 DEG C of oxidation processes, get product.
Embodiment 3
A kind of method in copper bar surface immersion plating aluminium lamination, comprise the following steps：
1）Grinding process is carried out to copper bar surface with sand paper, and with 150 DEG C of steam treatment 20min；
2）Copper bar after steam treatment is placed in alkali cleaning 40min in 75 DEG C of alkali lye, taken out again with 150 DEG C of steam treatment 5min, most
Rinsed afterwards with clear water；
3）Copper bar after alkali cleaning is placed in pickling 15min in 35 DEG C of acid solutions, takes out again with 150 DEG C of steam treatment 2min, finally uses
Clear water rinses；
4）By step 3）The copper bar of processing uniformly sprays a thin layer bonding agent, and controls thickness then to carry out at drying in 0.6mm
Reason；
5）By step 4）The copper bar of processing is placed in 700 DEG C of aluminium liquid, soaks 25s, natural cooling after taking-up；
6）By the good copper bar of immersion plating in 900 DEG C of oxidation processes, get product.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those skilled in the art disclosed herein technical scope in, can without the change that creative work is expected or
Replace, should all be included within the scope of the present invention.
Claims (5)
- A kind of 1. method in copper bar surface immersion plating aluminium lamination, it is characterised in that comprise the following steps：1）Grinding process is carried out to copper bar surface with sand paper, and with 140-150 DEG C of steam treatment 10-20min；2）Copper bar after steam treatment is placed in alkali cleaning 30-40min in 70-75 DEG C of alkali lye, taken out again with 140-150 DEG C of steam 3-5min is managed, is finally rinsed with clear water；3）Copper bar after alkali cleaning is placed in pickling 10-15min in 30-35 DEG C of acid solution, 140-150 DEG C of steam treatment 1- is used in taking-up again 2min, finally rinsed with clear water；4）By step 3）The copper bar of processing uniformly sprays a thin layer bonding agent, and controls thickness then to be dried in 0.5-0.6mm Dry-cure；5）By step 4）The copper bar of processing is placed in 680-700 DEG C of aluminium liquid, soaks 20-25s, natural cooling after taking-up；6）By the good copper bar of immersion plating in 800-900 DEG C of oxidation processes, get product.
- 2. according to claim 1 in the method for copper bar surface immersion plating aluminium lamination, it is characterised in that comprise the following steps：1）Grinding process is carried out to copper bar surface with sand paper, and with 140 DEG C of steam treatment 15min；2）Copper bar after steam treatment is placed in alkali cleaning 35min in 70 DEG C of alkali lye, taken out again with 130 DEG C of steam treatment 4min, most Rinsed afterwards with clear water；3）Copper bar after alkali cleaning is placed in pickling 15min in 35 DEG C of acid solutions, 140-150 DEG C of steam treatment 1-2min is used in taking-up again, Finally rinsed with clear water；4）By step 3）Processing copper bar uniformly sprays a thin layer bonding agent, and controls thickness then to carry out at drying in 0.5mm Reason；5）By step 4）The copper bar of processing is placed in 700 DEG C of aluminium liquid, soaks 20s, natural cooling after taking-up；6）By the good copper bar of immersion plating in 850 DEG C of oxidation processes, get product.
- 3. according to claim 1 in the method for copper bar surface immersion plating aluminium lamination, it is characterised in that：The alkali lye by NaHCO340g/L, NaOH80g/L are formed.
- 4. according to claim 1 in the method for copper bar surface immersion plating aluminium lamination, it is characterised in that：The acid solution is by hydrochloric acid 40g/ L, sulfuric acid 10g/L is formed.
- 5. according to claim 1 in the method for copper bar surface immersion plating aluminium lamination, it is characterised in that：The bonding agent is by quality Than for 1:30-40 nano silicon and epoxy resin is mixed to prepare.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711158925.9A CN107881453A (en) | 2017-11-20 | 2017-11-20 | A kind of method in copper bar surface immersion plating aluminium lamination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711158925.9A CN107881453A (en) | 2017-11-20 | 2017-11-20 | A kind of method in copper bar surface immersion plating aluminium lamination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107881453A true CN107881453A (en) | 2018-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711158925.9A Withdrawn CN107881453A (en) | 2017-11-20 | 2017-11-20 | A kind of method in copper bar surface immersion plating aluminium lamination |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111763898A (en) * | 2020-06-01 | 2020-10-13 | 武汉大学 | Metal surface treatment for electrical insulation equipment for preventing C5F10O gas etching method |
-
2017
- 2017-11-20 CN CN201711158925.9A patent/CN107881453A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111763898A (en) * | 2020-06-01 | 2020-10-13 | 武汉大学 | Metal surface treatment for electrical insulation equipment for preventing C5F10O gas etching method |
| CN111763898B (en) * | 2020-06-01 | 2021-10-01 | 武汉大学 | Metal surface treatment for electrical insulation equipment for preventing C5F10O gas etching method |
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Application publication date: 20180406 |