CN107880822A - A kind of thermal conductive adhesive and its making without base material high-termal conductivity double faced adhesive tape - Google Patents
A kind of thermal conductive adhesive and its making without base material high-termal conductivity double faced adhesive tape Download PDFInfo
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- CN107880822A CN107880822A CN201711374486.5A CN201711374486A CN107880822A CN 107880822 A CN107880822 A CN 107880822A CN 201711374486 A CN201711374486 A CN 201711374486A CN 107880822 A CN107880822 A CN 107880822A
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- thermal conductive
- acrylate
- conductive adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/02—Homopolymers or copolymers of monomers containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
Abstract
The present invention relates to field of adhesive technology, specifically a kind of thermal conductive adhesive and its making without base material high-termal conductivity double faced adhesive tape, be prepared by the raw material of following portions by weight component：Acrylate：80 120 parts；Heat conduction dispersion liquid：20~50 parts；Isocyanate crosslinking：1~5 part；Wherein acrylate includes acrylate monomer, initiator, solvent, pentalyn and rosin sorbitol ester, acrylate monomer includes butyl acrylate, acrylic acid diethyl ester, hydroxy-ethyl acrylate, methyl methacrylate and acrylated phosphate, solvent is ethyl acetate, and initiator is azodiisobutyronitrile or cumyl peroxide.Include above-mentioned thermal conductive adhesive without base material high-termal conductivity double faced adhesive tape and be separately positioned on first mould release membrance and the second mould release membrance on thermal conductive adhesive two sides.For thermal conductive adhesive of the present invention after heat filling is added, viscosity is high, and is bonded firm under high temperature, moreover, in the case where adding same ratio heat filling, has higher thermal conductivity factor.
Description
Technical field
The present invention relates to field of adhesive technology, specifically a kind of thermal conductive adhesive and its making without base material high-termal conductivity
Double faced adhesive tape.
Background technology
With the densification of integrated circuit, miniaturization degree more and more higher, electronic building brick becomes smaller and more transported at a high speed
Make, cooling requirements also more and more higher, in order to which heat is distributed from pyrotoxin as early as possible, we by using high heat conduction radiating material
Material is transferred heat in air or other materials, so as to reach the effect of radiating.At present, lamp source is gradually converted into by incandescent lamp
LED electricity-saving lamps, LED are a kind of semiconductor subassemblies of solid-state, different types of LED can send between infrared ray to blue light,
With purple light to the light that different wave length is waited between ultraviolet, LED produces amount of heat in use, for high-power
LED product is especially prominent, and chip temperature is very big to LED luminous efficiency and stability influence, has data to show, temperature often raises
20 DEG C, LED luminous efficiencies decline 15~20%, and when temperature is higher than 8 DEG C of its operating temperature ratings, working life will reduce by 50%.
LED daylight lamp, it is included fluorescent tube, installs lamp plate, lamp bead, power supply in fluorescent tube, can be fixed using many adhesive tapes, therefore research and develop
High-performance thermal conductive band is for promoting the quick sustainable development of LED industry to have great importance.
In the prior art, the two-sided tape for LED mainly has cotton paper two-sided tape, PET two-sided tapes, two-sided without base material
Adhesive tape, the adhesive type for LED two-sided tape have epoxyn, polyurethane adhesive, acrylate gluing
Agent, organic silicon resin adhesive, the heat filling for double faced adhesive tape have following several：1. inorganic filler, such as nitridation roc, oxidation
Aluminium, silicon nitride etc.；2. graphite-like filler, such as conductive graphite, carbon nanometer tube, conductive graphite powder, graphite flake；3. metal packing,
Such as the metal dust such as silver, aluminium, copper, also liquid metal.
But, there is problems with the adhesive used in the prior art：1. thermal conductivity factor is not high, radiating effect is bad, micro-
Meter level heat filling specific surface area is not big enough, and ensures adhesive tape viscosity again, it is impossible to excessive heat filling is added, in the case of this
Good passage of heat will not be formed, in addition, and nanometer conductive filling is easily reunited, disperse it is uneven, it is same it cannot be guaranteed that having
Good passage of heat；2. adhesive tape viscosity can be greatly reduced by adding heat filling, viscosity is lower at high temperature, has degumming wind
It is dangerous, to reach preferable heat-conducting effect, it is necessary to add the heat filling of higher proportion in adhesive, filler will dilute adhesive ratio
Example, and heat filling is largely polar substances, can be combined with adhesive polar functional group, there is provided sticky polar functional group loses
Effect, the adhesive property of adhesive is greatly lowered.Under high temperature, the mobility increase of adhesive, viscosity can further be reduced, had
The risk of bonding loosely.
The content of the invention
In order to overcome above the deficiencies in the prior art, task of the invention be to provide a kind of thermal conductive adhesive and its making and
Its make without base material high-termal conductivity double faced adhesive tape, the thermal conductive adhesive viscosity height, and is bonded after heat filling is added under high temperature
It is firm, moreover, in the case where adding same ratio heat filling, there is higher thermal conductivity factor.
A kind of thermal conductive adhesive of task of the present invention is achieved through the following technical solutions：
A kind of thermal conductive adhesive, including acrylate, isocyanate crosslinking and heat conduction dispersion liquid, by following weight
Weighbf component forms：
It is preferred that the acrylate includes acrylate monomer, initiator, solvent, pentalyn and pine
Fragrant sorbitol ester, the acrylate monomer include butyl acrylate, acrylic acid diethyl ester, hydroxy-ethyl acrylate, methyl
Methyl acrylate and acrylated phosphate, the solvent are ethyl acetate, and the initiator is azodiisobutyronitrile or peroxidating
Diisopropylbenzene (DIPB), formed by following parts by weighbf component：
It is preferred that the preparation technology of the acrylate is：By the acrylate monomer, solvent and initiator in temperature
It is synthesis 5-30 hours under 200-400r/min to spend for 60-100 DEG C, mixing speed, then adds pentalyn and pine
Fragrant sorbitol ester, and stir.
It is preferred that the heat conduction dispersion liquid includes heat filling, solvent, coupling agent and surfactant, wherein heat filling
For nanometer high heat conduction graphite and nano ceramic powder, coupling agent KH560, KH550 and KH570, solvent is ethyl acetate, surface
Activating agent is betaine type amphoteric surfactant and polyoxyethylene ether surface active agent, is formed by following parts by weighbf component：
It is preferred that the preparation technology of the heat conduction dispersion liquid is：Heat filling, coupling agent, solvent and surfactant are put
It is stirred scattered under low whipping speed 1000-3000R/min, is then further disperseed by high pressure homogenizer again together
Heat filling.
Present invention also offers it is a kind of using foregoing thermal conductive adhesive make without base material high-termal conductivity double faced adhesive tape, including
Foregoing thermal conductive adhesive, and first mould release membrance and the second mould release membrance on thermal conductive adhesive two sides are separately positioned on, described
The thickness of one mould release membrance is 25-50um, and the thickness of the second mould release membrance is 50-75um, and the thickness of thermal conductive adhesive is 10-50um.
Present invention also offers a kind of preparation method based on foregoing no base material high-termal conductivity double faced adhesive tape, including following step
Suddenly：
A, the adhesive is stirred into 30~60min with 500~2000r/min speed；
B, the adhesive to be stirred in step A is coated on the described second release film surface, coating speed 5-30m/
Min, and dried in the environment of 50-100 DEG C；
C, first mould release membrance is bonded on expandable adhesive dried in stepb；
D, the adhesive tape posted in step C is wound；
E, the adhesive tape wound in step D is subjected to curing 2-4 days at a temperature of 30-50 DEG C, that is, the nothing is made
Base material high-termal conductivity double faced adhesive tape.
Compared with prior art, the beneficial effect of thermal conductive adhesive of the invention is：1. in acrylic ester synthesizing resin, add
Enter acrylated phosphate monomer, adhesive viscosity can be improved；2. acrylate synthesis after, add pentalyn and
Rosin sorbitol ester, it can further improve the peel strength of adhesive；3. in heat conduction dispersion liquid dispersion process, add betaine type
Surfactant, polyoxyethylene ether surface active agent and coupling agent, nanoscale homogeneous dispersion can be scattered in acrylic resin
In；4. dispersion liquid disperses in high pressure homogenizer, the specific surface area of conductive particle is further improved, improves thermal conductivity factor, and disperse
It is more uniform.
Brief description of the drawings
Fig. 1 is the structural representation without base material high-termal conductivity double faced adhesive tape in embodiment 2；
Fig. 2 is the production process figure without base material high-termal conductivity double faced adhesive tape in embodiment 2；
Wherein, 100- thermal conductive adhesives layer, the mould release membrances of 200- first, the mould release membrances of 300- second, 1- sizing materials configuring area, 2- are applied
Cloth machine, 3- the second mould release membrances to be coated unreel area, 4- baking ovens, and 5- the first mould release membrances to be fit unreel area, 6- doubling rollers area, 7- half
Finished product winds area, 8- curings area.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and examples
The present invention is further elaborated.It should be appreciated that say that the specific embodiment of description is used only for explaining the present invention herein, and
It is not used in the restriction present invention.
Embodiment 1：
A kind of thermal conductive adhesive, including acrylate, isocyanate crosslinking and heat conduction dispersion liquid, by following weight
Weighbf component forms：
Wherein acrylate includes acrylate monomer, initiator, solvent, pentalyn and rosin sorb
Alcohol ester, the acrylate monomer include butyl acrylate, acrylic acid diethyl ester, propylene
The preparation technology of acrylate is：In temperature it is 60- by the acrylate monomer, solvent and initiator
100 DEG C, mixing speed be that 5-30 hours are synthesized under 200-400r/min, then add pentalyn and rosin sorbierite
Ester, and stir.
Wherein heat conduction dispersion liquid includes heat filling, solvent, coupling agent and surfactant, and wherein heat filling is nanometer
High heat conduction graphite and nano ceramic powder, coupling agent KH560, KH550 and KH570, solvent are ethyl acetate, surfactant
For betaine type amphoteric surfactant and polyoxyethylene ether surface active agent, formed by following parts by weighbf component：
The preparation technology of heat conduction dispersion liquid is：Heat filling, coupling agent, solvent and surfactant are put together and stirred
Mix and be stirred scattered under speed 1000-3000R/min, then again by high pressure homogenizer, further disperse heat filling.
Embodiment 2：
As shown in figure 1, it is a kind of without base material high-termal conductivity double faced adhesive tape, including foregoing thermal conductive adhesive layer 100, and respectively
First mould release membrance 200 and the second mould release membrance 300 on the two sides of thermal conductive adhesive layer 100 are arranged on, the first mould release membrance 200 is light release
Film, the second mould release membrance 300 are attached most importance to mould release membrance, and the thickness of first mould release membrance 200 is 25-50um, off-type force 1-20g/
25mm；The thickness of second mould release membrance 300 is 50-75um, off-type force 20-50g/25mm；The thickness of thermal conductive adhesive layer 100 is
10-50um, peel strength 1000-2500g/25mm.
In a wherein specific embodiment, as shown in Fig. 2 a kind of preparation method of no base material high-termal conductivity double faced adhesive tape,
Produce on glue spreader without base material high-termal conductivity double faced adhesive tape, producing region can be divided into according to production process：Sizing material configuring area 1,
Coating machine 2 (transfer type scraper), the second mould release membrance to be coated unreel area 3, baking oven 4, the first mould release membrance to be fit unreel area 5, patch
He Gun areas 6, semi-finished product winding area 7, curing area 8.Production technology comprises the following steps：
A, adhesive is stirred into 30~more than 60min under homogenizer with 500~2000r/min speed；
B, by the temperature setting of baking oven 4 of coating machine 2 at 50-100 DEG C, the adhesive coating machine 2 to stir is coated with
On the face of the second mould release membrance 300, coating speed 5-30m/min, it is dried by baking oven 4；
C, dried dilatancy adhesive is conformed into the first mould release membrance 200 at the doubling roller area 6 of coating machine 2；
D, the adhesive tape posted is wound；
The adhesive tape wound is carried out to curing 2-4 days at a temperature of 30-50 DEG C, that is, the no base material height is made and leads E,
Hot double faced adhesive tape.
The benefit without base material high-termal conductivity double faced adhesive tape includes：
1st, economic benefit：This product can solve LED heat dissipation problems to client, and have very strong viscosity, reduce under high temperature
The risk of bonding loosely, with accreditation of the client to this adhesive tape, product can bring considerable economic benefit to company, it helps
Social promotion light source is changed into LED electricity-saving lamps by incandescent lamp, and certain contribution is made for energy-conserving and environment-protective.
2nd, research and development ability：The research and development of this product can lift the research and development ability of company, and in terms of heat conduction and increase adhesive tape is sticky
On have a very big lifting, this development project improves company core competence, also can be that industry technology lifting be contributed share.
3rd, product promotion：This product can be additionally used in the bonding such as the bonding in other fields, such as chip, CPU, screen.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent feature
The other technical schemes for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed herein
The technical scheme that the technical characteristic of energy is replaced mutually and formed.
Claims (7)
- A kind of 1. thermal conductive adhesive, it is characterised in that including acrylate, isocyanate crosslinking and heat conduction dispersion liquid, Formed by following parts by weighbf component：
- 2. thermal conductive adhesive according to claim 1, it is characterised in that the acrylate includes acrylate list Body, initiator, solvent, pentalyn and rosin sorbitol ester, the acrylate monomer include butyl acrylate, third Ester, hydroxy-ethyl acrylate, methyl methacrylate and acrylated phosphate, the solvent are ethyl acetate to olefin(e) acid diethyl, The initiator is azodiisobutyronitrile or cumyl peroxide, is formed by following parts by weighbf component：
- 3. thermal conductive adhesive according to claim 2, it is characterised in that the preparation technology of the acrylate is：Will The acrylate monomer, solvent and initiator synthesize 5- in the case where temperature is 60-100 DEG C, mixing speed is 200-400r/min 30 hours, pentalyn and rosin sorbitol ester are then added, and stir.
- 4. thermal conductive adhesive according to claim 1, it is characterised in that the heat conduction dispersion liquid include heat filling, solvent, Coupling agent and surfactant, wherein heat filling are nanometer high heat conduction graphite and nano ceramic powder, coupling agent KH560, KH550 and KH570, solvent are ethyl acetate, and surfactant is that betaine type amphoteric surfactant and APEO surface are lived Property agent, by following parts by weighbf component form：
- 5. thermal conductive adhesive according to claim 4, it is characterised in that the preparation technology of the heat conduction dispersion liquid is：It will lead Hot filler, coupling agent, solvent and surfactant put together be stirred under low whipping speed 1000-3000R/min it is scattered, Then heat filling is further disperseed by high pressure homogenizer again.
- 6. one kind is without base material high-termal conductivity double faced adhesive tape, it is characterised in that gluing including the heat conduction as described in claim 1-5 is any Agent, and it is separately positioned on first mould release membrance and the second mould release membrance on thermal conductive adhesive two sides, the thickness of first mould release membrance For 25-50um, the thickness of the second mould release membrance is 50-75um, and the thickness of thermal conductive adhesive is 10-50um.
- 7. a kind of preparation method based on without base material high-termal conductivity double faced adhesive tape described in claim 6, it is characterised in that including following Step：A, the adhesive is stirred into 30~60min with 500~2000r/min speed；B, the adhesive to be stirred in step A is coated on the described second release film surface, coating speed 5-30m/min, And dried in the environment of 50-100 DEG C；C, first mould release membrance is bonded on expandable adhesive dried in stepb；D, the adhesive tape posted in step C is wound；E, the adhesive tape wound in step D is subjected to curing 2-4 days at a temperature of 30-50 DEG C, that is, the no base material is made High-termal conductivity double faced adhesive tape.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711374486.5A CN107880822A (en) | 2017-12-15 | 2017-12-15 | A kind of thermal conductive adhesive and its making without base material high-termal conductivity double faced adhesive tape |
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| CN201711374486.5A CN107880822A (en) | 2017-12-15 | 2017-12-15 | A kind of thermal conductive adhesive and its making without base material high-termal conductivity double faced adhesive tape |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109618426A (en) * | 2018-11-20 | 2019-04-12 | 海盐徐氏电控设备有限公司 | A kind of electric ripple type PTC heating block being easily installed |
| CN110815968A (en) * | 2019-09-26 | 2020-02-21 | 江苏晶华新材料科技有限公司 | Composite graphite heat-conducting film and preparation process thereof |
| CN110922912A (en) * | 2019-12-02 | 2020-03-27 | 苏州泰仑电子材料有限公司 | High-temperature-resistant olefine acid ester high-viscosity adhesive tape and preparation method thereof |
| EP3736300A1 (en) * | 2019-05-06 | 2020-11-11 | 3M Innovative Properties Company | Curable precursor of a thermally- conductive adhesive composition |
| CN112961611A (en) * | 2020-12-23 | 2021-06-15 | 烟台德邦科技股份有限公司 | Acrylate structural adhesive with high thermal conductivity, high reliability and rapid curing |
| CN114874759A (en) * | 2022-06-15 | 2022-08-09 | 天津澳普林特科技股份有限公司 | Method for pretreating heat-conducting filler sample |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109618426A (en) * | 2018-11-20 | 2019-04-12 | 海盐徐氏电控设备有限公司 | A kind of electric ripple type PTC heating block being easily installed |
| EP3736300A1 (en) * | 2019-05-06 | 2020-11-11 | 3M Innovative Properties Company | Curable precursor of a thermally- conductive adhesive composition |
| WO2020225638A1 (en) * | 2019-05-06 | 2020-11-12 | 3M Innovative Properties Company | Curable precursor of a thermally-conductive adhesive composition |
| CN110815968A (en) * | 2019-09-26 | 2020-02-21 | 江苏晶华新材料科技有限公司 | Composite graphite heat-conducting film and preparation process thereof |
| CN110815968B (en) * | 2019-09-26 | 2023-08-29 | 江苏晶华新材料科技有限公司 | Composite graphite heat conducting film and preparation process thereof |
| CN110922912A (en) * | 2019-12-02 | 2020-03-27 | 苏州泰仑电子材料有限公司 | High-temperature-resistant olefine acid ester high-viscosity adhesive tape and preparation method thereof |
| CN112961611A (en) * | 2020-12-23 | 2021-06-15 | 烟台德邦科技股份有限公司 | Acrylate structural adhesive with high thermal conductivity, high reliability and rapid curing |
| CN112961611B (en) * | 2020-12-23 | 2023-02-03 | 烟台德邦科技股份有限公司 | Acrylate structural adhesive with high thermal conductivity, high reliability and rapid curing |
| CN114874759A (en) * | 2022-06-15 | 2022-08-09 | 天津澳普林特科技股份有限公司 | Method for pretreating heat-conducting filler sample |
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