CN107868633A - A kind of capacitive pressure touch sensing and electronic component - Google Patents

A kind of capacitive pressure touch sensing and electronic component Download PDF

Info

Publication number
CN107868633A
CN107868633A CN201610846096.2A CN201610846096A CN107868633A CN 107868633 A CN107868633 A CN 107868633A CN 201610846096 A CN201610846096 A CN 201610846096A CN 107868633 A CN107868633 A CN 107868633A
Authority
CN
China
Prior art keywords
adhesive
transparent resin
barium titanate
curing agent
sensor according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610846096.2A
Other languages
Chinese (zh)
Inventor
周群飞
饶桥兵
林荣丰
项小鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lens Technology Co Ltd
Original Assignee
Lens Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lens Technology Co Ltd filed Critical Lens Technology Co Ltd
Priority to CN201610846096.2A priority Critical patent/CN107868633A/en
Publication of CN107868633A publication Critical patent/CN107868633A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention provides a kind of capacitive pressure touch sensing, including Top electrode, bottom electrode and the adhesive for being bonded upper and lower two layers of electrode, and the adhesive is by being 100 including transparent resin adhesive and nano barium titanate copper calcium and the two mass ratio:0.1~20 raw material is prepared.The present invention correspondingly provides a kind of electronic component and a kind of adhesive.Being added in the present invention by using a certain amount of and certain particle size CCTO in transparent resin adhesive and adhesive is prepared, such adhesive is used to that in capacitive pressure touch sensing its touch-control sensitiveness can be significantly improved, while on its light penetration substantially without influence.

Description

A kind of capacitive pressure touch sensing and electronic component
Technical field
The present invention relates to pressure touch sensor field, and in particular to a kind of capacitive pressure touch sensing and electronics member Part.
Background technology
In existing touch panel of cell phone, there are fraction mobile phone productses to use capacitive pressure touch sensing and (pass through Electric capacity changes to detect the size of pressure), such as patent application CN201380070603 or the Iphone 6S of Apple Inc.. Also there is the report of other capacitive pressure touch sensings in the prior art, as disclosed in patent application CN201610147520.4 A kind of adjustable capacitance pressure transducer and true person's handwriting stylus, the adjustable capacitance pressure transducer can power transformations including pressure Hold, pressure touch switch, there is pressure detecting function;True person's handwriting stylus includes true person's handwriting optical touch-control pen, true person's handwriting electromagnetism Stylus, there is pressure sensitivity function, the writing effect with true person's handwriting.
Because capacitive pressure touch sensing by two layers of electrode adds one layer of glue laminating, then with panel (cover sheet) by another One layer of glue laminating, because current panel is generally glass, the deflection very little in pressing, according to electric capacity calculation formula, C=ε S/4 π kd, C is capacitance in formula, and the dielectric constant of ε materials between electrode, S is the area of two-plate, and k is electrostatic force constant, and d is The distance of two-plate.In the case where d variable quantities are small, the variable quantity of capacitance also can very little, influence the detecting effect of sensor. That is, with during finger pressure contact panel, it is necessary to the numerical value of electric capacity could be produced when finger pressure is larger it is certain influence, such as The problem is there is in Iphone 6S products.Its capacitive pressure touch-control disclosed in patent application CN201380070603 passes Sensor by 100N power when being acted on, the deformation quantity about 1.3um of electronic equipment, this caused capacitance change very little, about Pf levels, the i.e. sensor are very low to the induction sensitivity of power.That is the Consumer's Experience effect of the said goods is poor, causes this The application of new sensor is greatly limited.
The present inventor is directed to solving the above problems always, it is intended to seeks a kind of lifting of pressure sensitivity, can be with The capacitive pressure touch sensing being preferably applied in the electronic products such as mobile phone.
The content of the invention
First, the electronics member of the touch sensing containing capacitive pressure of two kinds of different structures is disclosed in Apple Inc.'s patent Part, a kind of is to be followed successively by cover sheet 2, capacitive pressure touch sensing 1 and display from top to bottom as shown in Fig. 1 of the present invention The structure of device 3, second is to be followed successively by cover sheet 2, display device 3 and capacitive pressure touch sensing 1 from top to bottom Structure.It is that capacitive pressure touch sensing 1 includes Top electrode 11, adhesive 12 successively from top to bottom in both structures And bottom electrode.
In structure shown in Fig. 1, the light that display device 3 is sent arrives cover sheet 2, thus this again by pressure sensor 1 Require that the electrode material in pressure sensor 1 and adhesive are transparent in the structure of sample.In the structure, people protects in pressing During cover plate, the lower caused deformation quantity of pressure effect can be embodied directly on pressure sensor.And pressure passes in second of structure Sensor 1 is arranged on the lower section of display device 3, thus to pressure sensor 1 without transparent requirement, the light that display device 3 is sent can be straight Connect through cover sheet 2 and enter human eye, but people, when pressing the cover sheet, the lower caused deformation quantity of pressure effect will also quilt Display device (display device is typically made up of parts such as layer glass, polaroid, light guide plate and housings) sponges most, Thus it is applied to pressure sensor 1 and brings it about the power of deformation and has a greatly reduced quality, thus to provide more sensitive product, in the present invention Electronic component structure as shown in Figure 1 is selected first.
Therefore, the present invention needs to ensure the electric capacity while solving the sensitivity problem of capacitive pressure touch sensing Formula pressure touch sensor light penetration is up to standard.
The present invention realizes foregoing invention purpose especially by finding or preparing a kind of special adhesive so that the present invention The adhesive of offer is used in capacitive pressure touch sensing, and its light is also ensured while its susceptibility greatly improves Transmitance is high.
Inventor is had found, the resin glue of the existing capacitive pressure touch sensing of resin glue is pasted between two battery lead plates During a kind of additive of middle doping, a kind of new adhesive can be successfully developed and a kind of available in the touch-control products such as mobile phone Capacitive pressure touch sensing.By adding the additive so that while the adhesive dielectric constant of gained greatly improves On the light transmission rate of adhesive substantially without influence.
Therefore, the present invention provides a kind of capacitive pressure touch sensing, including Top electrode, bottom electrode and for fitting The adhesive of lower two layers of electrode, the adhesive is by being 100 including transparent resin adhesive and nano barium titanate copper calcium and the two mass ratio: 0.1~20 raw material is prepared.
Skilled person will appreciate that:CaCu 3 Ti 4 O, CaCu3Ti4O12Compound (abbreviation CCTO) is perovskite cube Crystal structure, there is unusual huge dielectric constant and extremely low loss, permittivity ε is up to more than 100000.Also there is titanium now Sour copper calcium is used for example prepared by electric capacity, as being related to a kind of flush type of high-k in patent application CN201510622013 The preparation method of electric capacity, including respectively to the titanate as inorganic filler main component, the conductive particle of introducing inorganic filler Carry out surface modification, the titanate after surface modification, the conductive particle after surface modification and polymer blending, stir it is mixed to be formed Slurry is closed, mixed slurry is relative by the one side for being covered with dielectric film of two copper foils coated in copper foil one side and precuring processing The steps such as hot pressing fitting;Titanate is one or more combinations of barium titanate, strontium titanates, strontium titanates magnesium or CaCu 3 Ti 4 O;Polymerization Thing is one or more combinations of polyimides, epoxy resin, polyvinyladine floride, polyurethane;Conductive particle be aluminium powder, zinc powder, One or more combinations in copper powder, silver powder, magnesium powder, carbon black and polyaniline particles.The flush type electricity obtained by the invention Hold, not only good with heat endurance, mechanical tenacity is strong, it is easy to process the characteristics of, it is more crucial to be that it shows higher electric capacity Density.But it is related to the step of surface modification is carried out to metatitanic acid salt particle and conductive particle respectively in the patent application, its electric capacity Preparation process is complex;And a kind of buried capacitor is provided in the patent application, gained electric capacity can not be used to prepare Pressure touch sensor.Separately there is a kind of CaCu disclosed in patent application CN201410479777.03Ti4O12System multi-layer ceramics electricity Container and preparation method thereof.This method uses cupric oxide (CuO), calcium carbonate (CaCO3), titanium oxide (TiO2) it is raw material, addition one Quantitative organic matter (PVB, PAG, BBP etc.), using the method for solid phase method and flow casting molding, the thickness for preparing high quality is 100 μm~10mm thin slices, high-k, low Jie are then obtained by steps such as cutting, dumping, high temperature sintering, device preparations The multilayer ceramic capacitor of electrical loss, high stability.The CCTO ceramic dielectric constants of the invention reach 1.0 × 104, dielectric Loss is suitable for preparing bulky capacitor ceramic material capacitor below 0.2.But be equally in the patent application prepare one kind can not For the capacitor in pressure touch sensor.
In addition, in electric capacity disclosed in these files, its titanate and high molecular polymer be all with other materials (such as Conductive particle) mixing solidify afterwards set to form the electric capacity that shape and structure are fixed, and its electric capacity is not intended to pressure sensor, thus It is produced the process of deformation and capacitance variations when not being related to by by adhesive after cured, be less related to transparent The content of adhesive and transparent pressure sensor.
In a kind of specific embodiment, the transparent resin adhesive is selected from acrylic resin, epoxy resin or had One or more in machine silicones.
In a kind of specific embodiment, the mass ratio of transparent resin adhesive and nano barium titanate copper calcium is in the raw material 100:1~15, preferably 100:3~10.
In a kind of specific embodiment, the average grain diameter of the nano barium titanate copper calcium is 50~1000nm, preferably 50 ~600nm, more preferably below 500nm.In the present invention, nanoscale CCTO particles can be good at being dispersed in resin glue, several The transmitance of resin glue is not influenceed.
In a kind of specific embodiment, preparing also includes curing agent in the raw material of adhesive, the adhesive is by saturating Bright resin glue, nano barium titanate copper calcium and curing agent are mixed with to obtain.Preferably, the curing agent is thermal curing agents, and resin The weight of glue and thermal curing agents ratio is 100:0.1~2;Or the curing agent is UV curing agent, and resin glue and UV curing agent Weight ratio is 100:0.1~10.
In a kind of specific embodiment, the raw material of adhesive is by mixing, 1200~2500 mesh sieve net filtrations and true Sky obtains the adhesive after keeping.
In a kind of specific embodiment, the thickness of the gluing oxidant layer being folded between upper and lower two layers of electrode for 50~ 150 microns.
The present invention correspondingly provides a kind of electronic component, includes cover sheet, electric capacity as described above successively from top to bottom Formula pressure touch sensor and display device.
The present invention also provides a kind of adhesive, and the adhesive is mixed by transparent resin adhesive, nano barium titanate copper calcium and curing agent Conjunction is prepared, and transparent resin adhesive and both nano barium titanate copper calcium mass ratio are 100:0.1~20.
A kind of brand-new adhesive and capacitive pressure touch sensing are provided in the present invention, its adhesive is used for electricity Cause the touch-control susceptibility of pressure touch sensor provided by the invention than of the prior art in appearance formula pressure touch sensor The touch-control susceptibility of capacitive pressure touch sensing significantly improves, while does not influence the light of capacitive pressure touch sensing again Line transmitance.
Figure of description
Fig. 1 is the structural representation of electronic component in the present invention,
In figure, 1, capacitive pressure touch sensing, 11, Top electrode, 12, adhesive, 13, bottom electrode, 2, cover sheet, 3rd, display device.
Embodiment
With reference to the accompanying drawings and examples, the present invention is further described, is not intended to limit the present invention.Original of the present invention Material can by commercially available acquisition, such as the transparent resin adhesive such as the acrylic resin, epoxy resin and organic siliconresin, and The nanoscale CCTO.The nanoscale CCTO used in following examples is CCTO powder of the average grain diameter for 500nm or so.
Comparative example 1
Common glue (epoxide-resin glue) is encapsulated between two electrodes.
Comparative example 2
A kind of adhesive and preparation method thereof is provided in this comparative example.
1):Weigh acrylic resin 100g, average grain diameter is 500nm or so nanoscale barium titanate powder 5g, heat cure Agent 0.5g, mix with 40khz ultrasonic waves+magnetic agitation 5 hours, barium titanate powder and thermal curing agents is dispersed in glue In body;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Comparative example 3
A kind of adhesive and preparation method thereof is provided in this comparative example.
1):Weigh acrylic resin 100g, average grain diameter is 500nm or so nanoscale barium titanate powder 3g, heat cure Agent 0.5g, mix with 40khz ultrasonic waves+magnetic agitation 5 hours, barium titanate powder and thermal curing agents is dispersed in glue In body;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 1
A kind of adhesive and preparation method thereof is provided in the present embodiment.
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 5g, thermal curing agents 0.5g, mixes and is surpassed with 40khz Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 2
A kind of adhesive and preparation method thereof is provided in the present embodiment.
1):Epoxy resin 100g, nanoscale CCTO powder 5g, thermal curing agents 0.5g are weighed, is mixed with 40khz ultrasounds Ripple+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 3
1):Organic siliconresin 100g is weighed, nanoscale CCTO powder 5g, thermal curing agents 0.5g, mixes and is surpassed with 40khz Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 4
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 3g, thermal curing agents 0.5g, mixes and is surpassed with 40khz Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 5
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 10g, thermal curing agents 0.5g, mixes and uses 40khz Ultrasonic wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 6
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 1g, thermal curing agents 0.5g, mixes and is surpassed with 40khz Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 7
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 0.1g, thermal curing agents 0.5g, mixes and uses 40khz Ultrasonic wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
The glue encapsulated in comparative example 1~3 and embodiment 1~7 is subjected to heat cure, heat cure temperature together with battery lead plate Degree for example, 80 DEG C (heat curing temperature is unrestricted), detects Jie of adhesive in capacitive pressure touch sensing after heat cure Electric constant and light penetration are listed in table 1, are specifically dielectric constant of the detection adhesive when power frequency is 100kHz in table 1 Value.
Table 1
From table 1, no matter the use of acrylic resin, epoxy resin or organic siliconresin is resin glue, adds in raw material When the CCTO dosages added are identical, the dielectric constants of gained adhesive are little.And when using different amounts of CCTO, to adhesive The dielectric constant values of product influence notable.Inventor is found by experiment that, the use of weight ratio is 100:3~10 resin glue with During CCTO, the dielectric constant of products obtained therefrom is sufficiently high, and the capacitance of the capacitive pressure touch sensing of gained is to finger Press quite sensitive.And CCTO dosage exceedes certain value (such as the CCTO amounts used in 100g resin glues are more than 40g) When, may have a negative impact to the adhesivity of adhesive, and the light penetration of adhesive is significantly reduced.Thus this hair Bright middle adhesive is by being 100 including resin glue and CaCu 3 Ti 4 O and the two mass ratio:0.1~20 raw material is prepared, preferably The mass ratio of resin glue and CaCu 3 Ti 4 O is 100:1~15, more preferably 100:3~10.And the glue provided in comparative example 2 and 3 The dielectric constant of stick can be equally substantially increased, but the light penetration of adhesive is a greater impact.Therefore, lead in the present invention Cross to add in transparent resin adhesive using a certain amount of and certain particle size CCTO and adhesive is prepared, such adhesive is used for electricity Its touch-control sensitiveness can be significantly improved in appearance formula pressure touch sensor, while on its light penetration substantially without influence.
Adhesive provided by the invention is after package curing, and (adhesive after solidification has certain when pressing Elasticity), the electric capacity C of sensor can change with the distance d between two-plate, and the permittivity ε of adhesive also can and then Change.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies Change, equivalent substitution, improvement etc., should be included in the scope of the protection.

Claims (10)

1. a kind of capacitive pressure touch sensing, including Top electrode (11), bottom electrode (13) and for being bonded two layers of electricity up and down The adhesive (12) of pole, the adhesive is by being 100 including transparent resin adhesive and nano barium titanate copper calcium and the two mass ratio:0.1 ~20 raw material is prepared.
2. sensor according to claim 1, it is characterised in that the transparent resin adhesive is selected from acrylic resin, epoxy One or more in resin or organic siliconresin.
3. sensor according to claim 1, it is characterised in that transparent resin adhesive and nano barium titanate copper calcium in the raw material Mass ratio is 100:1~15, preferably 100:3~10.
4. the sensor according to any one in claims 1 to 3, it is characterised in that the nano barium titanate copper calcium is averaged Particle diameter is 50~1000nm, preferably 50~600nm, more preferably below 500nm.
5. the sensor according to any one in Claims 1 to 4, it is characterised in that prepare and also wrapped in the raw material of adhesive Curing agent is included, the adhesive is mixed with to obtain by transparent resin adhesive, nano barium titanate copper calcium and curing agent.
6. sensor according to claim 5, it is characterised in that the curing agent is thermal curing agents, and transparent resin adhesive with The weight ratio of thermal curing agents is 100:0.1~2;Or the curing agent is UV curing agent, and transparent resin adhesive and UV curing agent Weight ratio is 100:0.1~10.
7. the sensor according to any one in claim 1~6, it is characterised in that the raw material process mixing of adhesive, 1200~2500 mesh sieve net filtrations and vacuum obtain the adhesive after keeping.
8. sensor according to claim 1, it is characterised in that the thickness for the gluing oxidant layer being folded between upper and lower two layers of electrode Spend for 50~150 microns.
9. a kind of electronic component, include cover sheet (2) successively from top to bottom, as described in any one in claim 1~8 Capacitive pressure touch sensing (1) and display device (3).
10. a kind of adhesive, it is characterised in that the adhesive is mixed by transparent resin adhesive, nano barium titanate copper calcium and curing agent It is prepared, and transparent resin adhesive and both nano barium titanate copper calcium mass ratio are 100:0.1~20.
CN201610846096.2A 2016-09-23 2016-09-23 A kind of capacitive pressure touch sensing and electronic component Pending CN107868633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610846096.2A CN107868633A (en) 2016-09-23 2016-09-23 A kind of capacitive pressure touch sensing and electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610846096.2A CN107868633A (en) 2016-09-23 2016-09-23 A kind of capacitive pressure touch sensing and electronic component

Publications (1)

Publication Number Publication Date
CN107868633A true CN107868633A (en) 2018-04-03

Family

ID=61751519

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610846096.2A Pending CN107868633A (en) 2016-09-23 2016-09-23 A kind of capacitive pressure touch sensing and electronic component

Country Status (1)

Country Link
CN (1) CN107868633A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3086293A1 (en) * 2018-09-26 2020-03-27 Arkema France COMPOSITION COMPRISING DIFFUSING PARTICLES
WO2021191395A1 (en) * 2020-03-26 2021-09-30 Arkema France Composition comprising inorganic particles dispersed in a transparent material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102692548A (en) * 2012-07-06 2012-09-26 上海科润光电技术有限公司 Electroluminescent voltage transducer
CN102752893A (en) * 2012-07-06 2012-10-24 上海科润光电技术有限公司 Electroluminescent display device for high-voltage measurement
CN104194271A (en) * 2014-08-29 2014-12-10 天津德高化成新材料股份有限公司 Dielectric composite material for fingerprint sensor induction layer and preparation method thereof
CN105865667A (en) * 2016-05-19 2016-08-17 北京印刷学院 Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102692548A (en) * 2012-07-06 2012-09-26 上海科润光电技术有限公司 Electroluminescent voltage transducer
CN102752893A (en) * 2012-07-06 2012-10-24 上海科润光电技术有限公司 Electroluminescent display device for high-voltage measurement
CN104194271A (en) * 2014-08-29 2014-12-10 天津德高化成新材料股份有限公司 Dielectric composite material for fingerprint sensor induction layer and preparation method thereof
CN105865667A (en) * 2016-05-19 2016-08-17 北京印刷学院 Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3086293A1 (en) * 2018-09-26 2020-03-27 Arkema France COMPOSITION COMPRISING DIFFUSING PARTICLES
WO2020064957A1 (en) * 2018-09-26 2020-04-02 Arkema France Composition comprising scattering particles
CN113165959A (en) * 2018-09-26 2021-07-23 阿科玛法国公司 Composition comprising scattering particles
CN113165959B (en) * 2018-09-26 2023-05-05 盛禧奥欧洲有限责任公司 Composition comprising scattering particles
WO2021191395A1 (en) * 2020-03-26 2021-09-30 Arkema France Composition comprising inorganic particles dispersed in a transparent material
FR3108614A1 (en) * 2020-03-26 2021-10-01 Arkema France Composition comprising particles

Similar Documents

Publication Publication Date Title
Popielarz et al. Dielectric properties of polymer/ferroelectric ceramic composites from 100 Hz to 10 GHz
Hanemann et al. Polymer-nanoparticle composites: from synthesis to modern applications
CN104044318B (en) Polymer-based dielectric energy-storage composite material of a kind of laminated construction and preparation method thereof
Beier et al. Effect of surface modification on the dielectric properties of BaTiO3 nanocrystals
KR101723804B1 (en) Capacitive force sensor and method for preparing the same
CN106024380A (en) Multilayer ceramic capacitor
CN103358631B (en) One is buried dielectric layer for capacity materials, is buried capacity materials, preparation method and its usage
CN205015877U (en) Touch display device
Magisetty et al. NiFe2O4/Poly (1, 6-heptadiyne) nanocomposite energy-storage device for electrical and electronic applications
CN107868633A (en) A kind of capacitive pressure touch sensing and electronic component
CN103402311A (en) Material of embedded capacitor as well as preparation method and application thereof
CN105308003B (en) Ferrite sintered plate and ferrite sintered
KR20160114734A (en) Noise-suppressing composite magnetic powder
CN106497064A (en) A kind of high-dielectric constant inorganic/dimethyl silicone polymer composite and flexible material and preparation method and application
WO2019093092A1 (en) Piezoelectric component, sensor, and actuator
CN110310829A (en) Buried capacitor material, preparation method and printed wiring board
CN107399967A (en) A kind of ultra-low loss huge dielectric constant temperature-stable capacitor dielectric material
Wittinanon et al. Effect of polyvinylidene fluoride on the acoustic impedance matching, poling enhancement and piezoelectric properties of 0–3 smart lead-free piezoelectric Portland cement composites
Anithkumar et al. Self‐Powered Smart Touchpad using Novel Intrinsic Piezo–Tribo Hybrid Nanogenerator
Harami et al. Mixed Matrix Membranes for Sustainable Electrical Energy‐Saving Applications
Wang et al. Preparation and dielectric properties of Ba0. 95Ca0. 05Ti0. 8Zr0. 2O3-polyethersulfone composites
EP2458595B1 (en) A high-dielectric material
Guler et al. Multi-functional 0–3 composite polyimide films for microsystem applications
Xia et al. Poly (vinylidene fluoride-chlorotrifluoroethylene)/BaTiO3 composites with high electrical energy density
CN103759866A (en) Coplanar small electrode type soft pressure sensitive probe and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180403