CN107868633A - A kind of capacitive pressure touch sensing and electronic component - Google Patents
A kind of capacitive pressure touch sensing and electronic component Download PDFInfo
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- CN107868633A CN107868633A CN201610846096.2A CN201610846096A CN107868633A CN 107868633 A CN107868633 A CN 107868633A CN 201610846096 A CN201610846096 A CN 201610846096A CN 107868633 A CN107868633 A CN 107868633A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides a kind of capacitive pressure touch sensing, including Top electrode, bottom electrode and the adhesive for being bonded upper and lower two layers of electrode, and the adhesive is by being 100 including transparent resin adhesive and nano barium titanate copper calcium and the two mass ratio:0.1~20 raw material is prepared.The present invention correspondingly provides a kind of electronic component and a kind of adhesive.Being added in the present invention by using a certain amount of and certain particle size CCTO in transparent resin adhesive and adhesive is prepared, such adhesive is used to that in capacitive pressure touch sensing its touch-control sensitiveness can be significantly improved, while on its light penetration substantially without influence.
Description
Technical field
The present invention relates to pressure touch sensor field, and in particular to a kind of capacitive pressure touch sensing and electronics member
Part.
Background technology
In existing touch panel of cell phone, there are fraction mobile phone productses to use capacitive pressure touch sensing and (pass through
Electric capacity changes to detect the size of pressure), such as patent application CN201380070603 or the Iphone 6S of Apple Inc..
Also there is the report of other capacitive pressure touch sensings in the prior art, as disclosed in patent application CN201610147520.4
A kind of adjustable capacitance pressure transducer and true person's handwriting stylus, the adjustable capacitance pressure transducer can power transformations including pressure
Hold, pressure touch switch, there is pressure detecting function;True person's handwriting stylus includes true person's handwriting optical touch-control pen, true person's handwriting electromagnetism
Stylus, there is pressure sensitivity function, the writing effect with true person's handwriting.
Because capacitive pressure touch sensing by two layers of electrode adds one layer of glue laminating, then with panel (cover sheet) by another
One layer of glue laminating, because current panel is generally glass, the deflection very little in pressing, according to electric capacity calculation formula, C=ε S/4
π kd, C is capacitance in formula, and the dielectric constant of ε materials between electrode, S is the area of two-plate, and k is electrostatic force constant, and d is
The distance of two-plate.In the case where d variable quantities are small, the variable quantity of capacitance also can very little, influence the detecting effect of sensor.
That is, with during finger pressure contact panel, it is necessary to the numerical value of electric capacity could be produced when finger pressure is larger it is certain influence, such as
The problem is there is in Iphone 6S products.Its capacitive pressure touch-control disclosed in patent application CN201380070603 passes
Sensor by 100N power when being acted on, the deformation quantity about 1.3um of electronic equipment, this caused capacitance change very little, about
Pf levels, the i.e. sensor are very low to the induction sensitivity of power.That is the Consumer's Experience effect of the said goods is poor, causes this
The application of new sensor is greatly limited.
The present inventor is directed to solving the above problems always, it is intended to seeks a kind of lifting of pressure sensitivity, can be with
The capacitive pressure touch sensing being preferably applied in the electronic products such as mobile phone.
The content of the invention
First, the electronics member of the touch sensing containing capacitive pressure of two kinds of different structures is disclosed in Apple Inc.'s patent
Part, a kind of is to be followed successively by cover sheet 2, capacitive pressure touch sensing 1 and display from top to bottom as shown in Fig. 1 of the present invention
The structure of device 3, second is to be followed successively by cover sheet 2, display device 3 and capacitive pressure touch sensing 1 from top to bottom
Structure.It is that capacitive pressure touch sensing 1 includes Top electrode 11, adhesive 12 successively from top to bottom in both structures
And bottom electrode.
In structure shown in Fig. 1, the light that display device 3 is sent arrives cover sheet 2, thus this again by pressure sensor 1
Require that the electrode material in pressure sensor 1 and adhesive are transparent in the structure of sample.In the structure, people protects in pressing
During cover plate, the lower caused deformation quantity of pressure effect can be embodied directly on pressure sensor.And pressure passes in second of structure
Sensor 1 is arranged on the lower section of display device 3, thus to pressure sensor 1 without transparent requirement, the light that display device 3 is sent can be straight
Connect through cover sheet 2 and enter human eye, but people, when pressing the cover sheet, the lower caused deformation quantity of pressure effect will also quilt
Display device (display device is typically made up of parts such as layer glass, polaroid, light guide plate and housings) sponges most,
Thus it is applied to pressure sensor 1 and brings it about the power of deformation and has a greatly reduced quality, thus to provide more sensitive product, in the present invention
Electronic component structure as shown in Figure 1 is selected first.
Therefore, the present invention needs to ensure the electric capacity while solving the sensitivity problem of capacitive pressure touch sensing
Formula pressure touch sensor light penetration is up to standard.
The present invention realizes foregoing invention purpose especially by finding or preparing a kind of special adhesive so that the present invention
The adhesive of offer is used in capacitive pressure touch sensing, and its light is also ensured while its susceptibility greatly improves
Transmitance is high.
Inventor is had found, the resin glue of the existing capacitive pressure touch sensing of resin glue is pasted between two battery lead plates
During a kind of additive of middle doping, a kind of new adhesive can be successfully developed and a kind of available in the touch-control products such as mobile phone
Capacitive pressure touch sensing.By adding the additive so that while the adhesive dielectric constant of gained greatly improves
On the light transmission rate of adhesive substantially without influence.
Therefore, the present invention provides a kind of capacitive pressure touch sensing, including Top electrode, bottom electrode and for fitting
The adhesive of lower two layers of electrode, the adhesive is by being 100 including transparent resin adhesive and nano barium titanate copper calcium and the two mass ratio:
0.1~20 raw material is prepared.
Skilled person will appreciate that:CaCu 3 Ti 4 O, CaCu3Ti4O12Compound (abbreviation CCTO) is perovskite cube
Crystal structure, there is unusual huge dielectric constant and extremely low loss, permittivity ε is up to more than 100000.Also there is titanium now
Sour copper calcium is used for example prepared by electric capacity, as being related to a kind of flush type of high-k in patent application CN201510622013
The preparation method of electric capacity, including respectively to the titanate as inorganic filler main component, the conductive particle of introducing inorganic filler
Carry out surface modification, the titanate after surface modification, the conductive particle after surface modification and polymer blending, stir it is mixed to be formed
Slurry is closed, mixed slurry is relative by the one side for being covered with dielectric film of two copper foils coated in copper foil one side and precuring processing
The steps such as hot pressing fitting;Titanate is one or more combinations of barium titanate, strontium titanates, strontium titanates magnesium or CaCu 3 Ti 4 O;Polymerization
Thing is one or more combinations of polyimides, epoxy resin, polyvinyladine floride, polyurethane;Conductive particle be aluminium powder, zinc powder,
One or more combinations in copper powder, silver powder, magnesium powder, carbon black and polyaniline particles.The flush type electricity obtained by the invention
Hold, not only good with heat endurance, mechanical tenacity is strong, it is easy to process the characteristics of, it is more crucial to be that it shows higher electric capacity
Density.But it is related to the step of surface modification is carried out to metatitanic acid salt particle and conductive particle respectively in the patent application, its electric capacity
Preparation process is complex;And a kind of buried capacitor is provided in the patent application, gained electric capacity can not be used to prepare
Pressure touch sensor.Separately there is a kind of CaCu disclosed in patent application CN201410479777.03Ti4O12System multi-layer ceramics electricity
Container and preparation method thereof.This method uses cupric oxide (CuO), calcium carbonate (CaCO3), titanium oxide (TiO2) it is raw material, addition one
Quantitative organic matter (PVB, PAG, BBP etc.), using the method for solid phase method and flow casting molding, the thickness for preparing high quality is
100 μm~10mm thin slices, high-k, low Jie are then obtained by steps such as cutting, dumping, high temperature sintering, device preparations
The multilayer ceramic capacitor of electrical loss, high stability.The CCTO ceramic dielectric constants of the invention reach 1.0 × 104, dielectric
Loss is suitable for preparing bulky capacitor ceramic material capacitor below 0.2.But be equally in the patent application prepare one kind can not
For the capacitor in pressure touch sensor.
In addition, in electric capacity disclosed in these files, its titanate and high molecular polymer be all with other materials (such as
Conductive particle) mixing solidify afterwards set to form the electric capacity that shape and structure are fixed, and its electric capacity is not intended to pressure sensor, thus
It is produced the process of deformation and capacitance variations when not being related to by by adhesive after cured, be less related to transparent
The content of adhesive and transparent pressure sensor.
In a kind of specific embodiment, the transparent resin adhesive is selected from acrylic resin, epoxy resin or had
One or more in machine silicones.
In a kind of specific embodiment, the mass ratio of transparent resin adhesive and nano barium titanate copper calcium is in the raw material
100:1~15, preferably 100:3~10.
In a kind of specific embodiment, the average grain diameter of the nano barium titanate copper calcium is 50~1000nm, preferably 50
~600nm, more preferably below 500nm.In the present invention, nanoscale CCTO particles can be good at being dispersed in resin glue, several
The transmitance of resin glue is not influenceed.
In a kind of specific embodiment, preparing also includes curing agent in the raw material of adhesive, the adhesive is by saturating
Bright resin glue, nano barium titanate copper calcium and curing agent are mixed with to obtain.Preferably, the curing agent is thermal curing agents, and resin
The weight of glue and thermal curing agents ratio is 100:0.1~2;Or the curing agent is UV curing agent, and resin glue and UV curing agent
Weight ratio is 100:0.1~10.
In a kind of specific embodiment, the raw material of adhesive is by mixing, 1200~2500 mesh sieve net filtrations and true
Sky obtains the adhesive after keeping.
In a kind of specific embodiment, the thickness of the gluing oxidant layer being folded between upper and lower two layers of electrode for 50~
150 microns.
The present invention correspondingly provides a kind of electronic component, includes cover sheet, electric capacity as described above successively from top to bottom
Formula pressure touch sensor and display device.
The present invention also provides a kind of adhesive, and the adhesive is mixed by transparent resin adhesive, nano barium titanate copper calcium and curing agent
Conjunction is prepared, and transparent resin adhesive and both nano barium titanate copper calcium mass ratio are 100:0.1~20.
A kind of brand-new adhesive and capacitive pressure touch sensing are provided in the present invention, its adhesive is used for electricity
Cause the touch-control susceptibility of pressure touch sensor provided by the invention than of the prior art in appearance formula pressure touch sensor
The touch-control susceptibility of capacitive pressure touch sensing significantly improves, while does not influence the light of capacitive pressure touch sensing again
Line transmitance.
Figure of description
Fig. 1 is the structural representation of electronic component in the present invention,
In figure, 1, capacitive pressure touch sensing, 11, Top electrode, 12, adhesive, 13, bottom electrode, 2, cover sheet,
3rd, display device.
Embodiment
With reference to the accompanying drawings and examples, the present invention is further described, is not intended to limit the present invention.Original of the present invention
Material can by commercially available acquisition, such as the transparent resin adhesive such as the acrylic resin, epoxy resin and organic siliconresin, and
The nanoscale CCTO.The nanoscale CCTO used in following examples is CCTO powder of the average grain diameter for 500nm or so.
Comparative example 1
Common glue (epoxide-resin glue) is encapsulated between two electrodes.
Comparative example 2
A kind of adhesive and preparation method thereof is provided in this comparative example.
1):Weigh acrylic resin 100g, average grain diameter is 500nm or so nanoscale barium titanate powder 5g, heat cure
Agent 0.5g, mix with 40khz ultrasonic waves+magnetic agitation 5 hours, barium titanate powder and thermal curing agents is dispersed in glue
In body;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Comparative example 3
A kind of adhesive and preparation method thereof is provided in this comparative example.
1):Weigh acrylic resin 100g, average grain diameter is 500nm or so nanoscale barium titanate powder 3g, heat cure
Agent 0.5g, mix with 40khz ultrasonic waves+magnetic agitation 5 hours, barium titanate powder and thermal curing agents is dispersed in glue
In body;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 1
A kind of adhesive and preparation method thereof is provided in the present embodiment.
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 5g, thermal curing agents 0.5g, mixes and is surpassed with 40khz
Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 2
A kind of adhesive and preparation method thereof is provided in the present embodiment.
1):Epoxy resin 100g, nanoscale CCTO powder 5g, thermal curing agents 0.5g are weighed, is mixed with 40khz ultrasounds
Ripple+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 3
1):Organic siliconresin 100g is weighed, nanoscale CCTO powder 5g, thermal curing agents 0.5g, mixes and is surpassed with 40khz
Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 4
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 3g, thermal curing agents 0.5g, mixes and is surpassed with 40khz
Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 5
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 10g, thermal curing agents 0.5g, mixes and uses 40khz
Ultrasonic wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 6
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 1g, thermal curing agents 0.5g, mixes and is surpassed with 40khz
Sound wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
Embodiment 7
1):Acrylic resin 100g is weighed, nanoscale CCTO powder 0.1g, thermal curing agents 0.5g, mixes and uses 40khz
Ultrasonic wave+magnetic agitation 5 hours, makes CCTO and thermal curing agents be dispersed in colloid;
2):Filtered again through 1800 mesh stainless steel mesh;
3):Glue after filtering is put into vacuum cavity, suction to 0.01torr, kept for 2 hours;
4):Encapsulate glue.
The glue encapsulated in comparative example 1~3 and embodiment 1~7 is subjected to heat cure, heat cure temperature together with battery lead plate
Degree for example, 80 DEG C (heat curing temperature is unrestricted), detects Jie of adhesive in capacitive pressure touch sensing after heat cure
Electric constant and light penetration are listed in table 1, are specifically dielectric constant of the detection adhesive when power frequency is 100kHz in table 1
Value.
Table 1
From table 1, no matter the use of acrylic resin, epoxy resin or organic siliconresin is resin glue, adds in raw material
When the CCTO dosages added are identical, the dielectric constants of gained adhesive are little.And when using different amounts of CCTO, to adhesive
The dielectric constant values of product influence notable.Inventor is found by experiment that, the use of weight ratio is 100:3~10 resin glue with
During CCTO, the dielectric constant of products obtained therefrom is sufficiently high, and the capacitance of the capacitive pressure touch sensing of gained is to finger
Press quite sensitive.And CCTO dosage exceedes certain value (such as the CCTO amounts used in 100g resin glues are more than 40g)
When, may have a negative impact to the adhesivity of adhesive, and the light penetration of adhesive is significantly reduced.Thus this hair
Bright middle adhesive is by being 100 including resin glue and CaCu 3 Ti 4 O and the two mass ratio:0.1~20 raw material is prepared, preferably
The mass ratio of resin glue and CaCu 3 Ti 4 O is 100:1~15, more preferably 100:3~10.And the glue provided in comparative example 2 and 3
The dielectric constant of stick can be equally substantially increased, but the light penetration of adhesive is a greater impact.Therefore, lead in the present invention
Cross to add in transparent resin adhesive using a certain amount of and certain particle size CCTO and adhesive is prepared, such adhesive is used for electricity
Its touch-control sensitiveness can be significantly improved in appearance formula pressure touch sensor, while on its light penetration substantially without influence.
Adhesive provided by the invention is after package curing, and (adhesive after solidification has certain when pressing
Elasticity), the electric capacity C of sensor can change with the distance d between two-plate, and the permittivity ε of adhesive also can and then
Change.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of capacitive pressure touch sensing, including Top electrode (11), bottom electrode (13) and for being bonded two layers of electricity up and down
The adhesive (12) of pole, the adhesive is by being 100 including transparent resin adhesive and nano barium titanate copper calcium and the two mass ratio:0.1
~20 raw material is prepared.
2. sensor according to claim 1, it is characterised in that the transparent resin adhesive is selected from acrylic resin, epoxy
One or more in resin or organic siliconresin.
3. sensor according to claim 1, it is characterised in that transparent resin adhesive and nano barium titanate copper calcium in the raw material
Mass ratio is 100:1~15, preferably 100:3~10.
4. the sensor according to any one in claims 1 to 3, it is characterised in that the nano barium titanate copper calcium is averaged
Particle diameter is 50~1000nm, preferably 50~600nm, more preferably below 500nm.
5. the sensor according to any one in Claims 1 to 4, it is characterised in that prepare and also wrapped in the raw material of adhesive
Curing agent is included, the adhesive is mixed with to obtain by transparent resin adhesive, nano barium titanate copper calcium and curing agent.
6. sensor according to claim 5, it is characterised in that the curing agent is thermal curing agents, and transparent resin adhesive with
The weight ratio of thermal curing agents is 100:0.1~2;Or the curing agent is UV curing agent, and transparent resin adhesive and UV curing agent
Weight ratio is 100:0.1~10.
7. the sensor according to any one in claim 1~6, it is characterised in that the raw material process mixing of adhesive,
1200~2500 mesh sieve net filtrations and vacuum obtain the adhesive after keeping.
8. sensor according to claim 1, it is characterised in that the thickness for the gluing oxidant layer being folded between upper and lower two layers of electrode
Spend for 50~150 microns.
9. a kind of electronic component, include cover sheet (2) successively from top to bottom, as described in any one in claim 1~8
Capacitive pressure touch sensing (1) and display device (3).
10. a kind of adhesive, it is characterised in that the adhesive is mixed by transparent resin adhesive, nano barium titanate copper calcium and curing agent
It is prepared, and transparent resin adhesive and both nano barium titanate copper calcium mass ratio are 100:0.1~20.
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WO2020064957A1 (en) * | 2018-09-26 | 2020-04-02 | Arkema France | Composition comprising scattering particles |
CN113165959A (en) * | 2018-09-26 | 2021-07-23 | 阿科玛法国公司 | Composition comprising scattering particles |
CN113165959B (en) * | 2018-09-26 | 2023-05-05 | 盛禧奥欧洲有限责任公司 | Composition comprising scattering particles |
WO2021191395A1 (en) * | 2020-03-26 | 2021-09-30 | Arkema France | Composition comprising inorganic particles dispersed in a transparent material |
FR3108614A1 (en) * | 2020-03-26 | 2021-10-01 | Arkema France | Composition comprising particles |
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