CN107859884A - A kind of Surface-mount LED lamp and preparation method thereof - Google Patents
A kind of Surface-mount LED lamp and preparation method thereof Download PDFInfo
- Publication number
- CN107859884A CN107859884A CN201711002477.3A CN201711002477A CN107859884A CN 107859884 A CN107859884 A CN 107859884A CN 201711002477 A CN201711002477 A CN 201711002477A CN 107859884 A CN107859884 A CN 107859884A
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- plate
- lamp plate
- lamp
- fixedly connected
- mount led
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 230000003139 buffering effect Effects 0.000 abstract description 7
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 25
- 239000000047 product Substances 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 11
- 238000011161 development Methods 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 10
- 238000005286 illumination Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000006424 Flood reaction Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/04—Resilient mountings, e.g. shock absorbers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a kind of Surface-mount LED lamp and preparation method thereof, including the first lamp plate, the side of first lamp plate is hinged with the second lamp plate by hinge, circular hole is offered on first lamp plate and the second lamp plate, and circular hole is evenly distributed, gripping mechanism has been fixedly connected with the top and bottom of the first lamp plate frontal left, fixed block has been fixedly connected with the top and bottom of the positive right side of face of second lamp plate, and first the positive side of lamp plate and the positive side of the second lamp plate be fixedly connected with buffer unit, the gripping mechanism includes supporting plate, the present invention relates to Surface-mount LED lamp technical field.The Surface-mount LED lamp, SMD lamp effectively can be subjected to clamping, prevent from unclamping when use so that LED pasters drop, and reduce unnecessary waste, improve operating efficiency, row buffering can be entered during use, prevent that Surface-mount LED lamp is caused to damage, extend service life, the burden of worker is alleviated, reduces cost.
Description
Technical field
The invention belongs to Surface-mount LED lamp technical field, more particularly to a kind of Surface-mount LED lamp and preparation method thereof.
Background technology
Issue in 2017《Semiconductor lighting industry " 13 " development plan》Planning proposes, to the year two thousand twenty, China half
Conductor illumination key technology constantly breaks through, and product quality improves constantly, and product structure Continuous optimization, industry size expands steadily,
Industrial concentration steps up, and forms the LED illumination enterprise that more than 1 sales volume breaks through 10,000,000,000 yuan, cultivates 1~2 world and knows
Name brand, 10 or so domestic famous brand names；OLED illuminating products are promoted to realize certain scale application；Application field is constantly opened up
Width, market environment more specification, solid foundation is established to develop into power from semiconductor lighting great industry nation.
Planning by Country science and technology plan (special project, fund etc.) also, it has been proposed that support that semiconductor lighting basis and general character are crucial
Technical research, accelerate the key technology research and development such as material, device preparation and the system integration, carry out the design of OLED illuminating materials, device
The industrialization research of great general character key technology such as structure, preparation technology.Fund and production demonstration work are upgraded by industrial repositioning
The channels such as journey, carry forward vigorously silicon substrate LED technology and products application with independent intellectual property right.Direct product is by emphasis light efficiency
Lifting turns to a variety of photoelectricity indexs to be improved and enhancing jointly, lifts the light quality and light quality of LED product, build it is safer,
Comfortably, efficiently, energy-conservation lighting environment.Strengthen the research and development and popularization and application of LED illumination product automation producing equipment, improve production
Product production efficiency and quality.Promote Integration ofTechnology and the Applied D emonstrations such as wisdom illumination, emerging application.
《Semiconductor lighting industry " 13 " development plan》In just propose the fresh target of " big to strong "：To 2020
Year, the semiconductor lighting industry entirety output value will reach trillion yuan scale.During " 12 ", China is just semiconductor lighting industry
The emerging strategic industries cultivated and developed as emphasis carry out system deployment, pass through semiconductor lighting scientific and technical innovation, energy-conservation skill
The engineerings such as art transformation, Applied D emonstration popularization promote industry development.Nowadays, China has turned into the maximum semiconductor lighting product in the whole world
Production, consumption and exported country.By vigorously supporting for " 12 " planning, China has just like become semiconductor lighting big country.
And marched toward " 13 " period, then it is the critical period that China turns to power from semiconductor lighting great industry nation.
State is based oneself upon one after another by common concern and great attention of the semiconductor lighting as new industry by various countries, national governments
Family's strategic level carries out system deployment, and technological break-through is maked rapid progress, and market scale constantly expands, and application field is constantly expanded, section
Energy emission reduction effect is notable, and semiconductor lighting industry development welcomes new opportunity period.
Under the international competition of fierceness, China's semiconductor lighting industry development still faces the challenge.First, semiconductor lighting
Industry is also among fast development, and market-oriented institutional mechanisms and business model need to explore, and policy system has to be strengthened.Two
It is that original innovation and high-end technology innovation ability are weaker, is not yet formed with the innovation system of enterprises as principal components, public research/development platform
Still need exploration, the capability of independent innovation has to be hoisted.Third, enterprise is mostly medium-sized and small enterprises, industrial concentration is not high, with manufacture
Based on low-end product, homogeneous warfare be present, structural production capacity surplus shows；Domestic enterprise's intensified competition, exported product
Based on the foundries such as OEM, ODM, internationally renowned brand is not yet formed, nationality's manufacture brand is badly in need of establishing.Fourth, semiconductor lighting
Product quality, Energy Efficiency Standard and application specification not yet system are established；Product specification is mixed and disorderly, and quality is very different；Standard criterion is stagnant
Afterwards, test in laboratory data consistency has to be hoisted, and portioned product does not include authentication system；Lack to standard implementation result with
Track is assessed and apprasial of lighting；Lack effective market quality supervision mechanism, low-quality counterfeit product floods market, and upsets competing
Strive order.
Meanwhile China's semiconductor lighting industry development faces important historic opportunities.First, China's energy saving requirement is urgent, half
Conductor illumination is the realistic choice that China realizes Green Development target.Second, semiconductor lighting industry is typical technology, work
Double intensive industries, Industrial Linkage is strong, be the Belt and Road,《Made in China 2025》The important incision implemented etc. national strategy
Point.Third, China's semiconductor lighting industry size speedup from " ultrahigh speed " to " middling speed " changes, enterprise transformation upgrading accelerates.Fourth,
Semiconductor lighting merges with other technologies field, constantly expedites the emergence of out new application, is the perfect embodiment of multi-crossed disciplines fusion.Five
It is that global semiconductor Lighting Industry general layout is remolded, China has breakthrough in part core technology field, and in the manufacturing side
The material time window that the huge production capacity formed will support China to be overtaken other vehicles in semiconductor lighting or even third generation semiconductor applications bend
The mouth phase holds actively.
It it is the most critical period of China's semiconductor lighting industry development, we should seize the opportunity, meet during " 13 "
Challenge is connect, China's semiconductor lighting industry is surmounted from tracing into, finally realizes and leads, it is strong to develop into semiconductor lighting industry
State.
Surface-mount LED lamp is made up of FPC circuit boards, LED, high-quality silica gel sheath pipe.Water resistance, use low-voltage DC supply
Safe ready, glow color is various, bright in luster；Outdoor use can resist the advantages such as UV agings, flavescence, high temperature resistance, the product
It is widely used in contour of building lamp, the quasi- decorative lighting in public place of entertainment, ad decoration lighting lamp field, the illumination of jewelry showcase,
Showcase illumination, illuminated cabinet, wardrobe illumination, brand shop's decorative lighting, luminal art illumination, advertising lamp box illumination and wine
Shop, hotel, house villa decorative lighting etc..
The use of Surface-mount LED lamp is very frequent, applies in multiple fields, but existing Surface-mount LED lamp use when
Wait it is inconvenient, when being added LED pasters need manually be added, sufficiently complex, Simultaneous Stabilization is poor, takes
When it is laborious, increase cost.
The content of the invention
In view of the shortcomings of the prior art, the invention provides a kind of Surface-mount LED lamp and preparation method thereof, solve existing
Surface-mount LED lamp is inconvenient when in use, needs manually to be added when being added LED pasters, very multiple
Miscellaneous, Simultaneous Stabilization is poor, wastes time and energy, increase cost the problem of.
To realize object above, the present invention is achieved by the following technical programs：A kind of Surface-mount LED lamp and its making side
Method, including the first lamp plate, the side of first lamp plate are hinged with the second lamp plate, first lamp plate and the second lamp by hinge
Circular hole is offered on plate, and circular hole is evenly distributed, and is fixedly connected with the top and bottom of the first lamp plate frontal left
There is gripping mechanism, fixed block, and the first lamp plate front have been fixedly connected with the top and bottom of the positive right side of face of the second lamp plate
Side and the positive side of the second lamp plate be fixedly connected with buffer unit.
As a preferred technical solution of the present invention, the gripping mechanism includes supporting plate, the side of the supporting plate
It is fixedly connected with the first lamp plate.
As a preferred technical solution of the present invention, the side of the supporting plate is fixedly connected with clamping block, and clamping
The bottom of block inwall is fixedly connected with garter spring.
As a preferred technical solution of the present invention, the side of the garter spring is fixedly connected with fixture block, the card
The side of block is through clamping block and extends to the outside of clamping block.
As a preferred technical solution of the present invention, the side of the fixed block offers neck, and neck and clamping
Block is in be adapted setting.
As a preferred technical solution of the present invention, the buffer unit includes bottom plate, and the side of the bottom plate is fixed
Buffer spring is connected with, the side of the buffer spring is fixedly connected with top plate, and offers what is be adapted with top plate on bottom plate
Groove.
As a preferred technical solution of the present invention, the V-shaped setting of the first lamp plate and the second lamp plate.
As a preferred technical solution of the present invention, the quantity of the buffer unit is provided with six.
Beneficial effect
The invention provides a kind of Surface-mount LED lamp and preparation method thereof.Possesses following beneficial effect：
(1), the Surface-mount LED lamp, the second lamp plate is hinged with by hinge by the side of first lamp plate, described first
Circular hole is offered on lamp plate and the second lamp plate, and circular hole is evenly distributed, the top and bottom of the first lamp plate frontal left
Portion has been fixedly connected with gripping mechanism, and fixed block has been fixedly connected with the top and bottom of the positive right side of face of the second lamp plate, and
The positive side of first lamp plate and the positive side of the second lamp plate have been fixedly connected with buffer unit, the side of the supporting plate with
First lamp plate is fixedly connected, and the side of the supporting plate is fixedly connected with clamping block, and the bottom of clamping block inwall is fixedly connected
There is garter spring, the side of the garter spring is fixedly connected with fixture block, and the side of the fixture block through clamping block and extends to
The outside of clamping block, the side of the fixed block offers neck, and neck is in be adapted setting with clamping block, can be effective
SMD lamp is subjected to clamping, prevents from unclamping when use so that LED pasters drop, and reduce unnecessary waste, improve
Operating efficiency.
(2), the Surface-mount LED lamp, buffer spring is fixedly connected with by the side of bottom plate, the side of the buffer spring is consolidated
Surely top plate is connected with, and the groove being adapted with top plate is offered on bottom plate, row buffering can be entered during use, is prevented
Surface-mount LED lamp is caused to damage, extends service life, the burden of worker is alleviated, reduces cost.
Brief description of the drawings
Fig. 1 is the overall structural representation of the present invention；
Fig. 2 is the structural representation of gripping mechanism of the present invention；
Fig. 3 is the structural representation of fixed block of the present invention；
Fig. 4 is the structural representation of buffer unit of the present invention.
In figure：The lamp plates of 1- first, 2- hinges, the lamp plates of 3- second, 4- circular holes, 5- gripping mechanisms, 51- supporting plates, 52- clampings
Block, 53- garter springs, 54- fixture blocks, 6- fixed blocks, 7- buffer units, 71- bottom plates, 72- buffer springs, 73- top plates, 8- cards
Groove.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1-4 are referred to, the present invention provides a kind of technical scheme：A kind of Surface-mount LED lamp and preparation method thereof, including first
Lamp plate 1, the side of the first lamp plate 1 are hinged with the second lamp plate 3 by hinge 2, offered on the first lamp plate 1 and the second lamp plate 3
Circular hole 4, and circular hole 4 is evenly distributed, and gripping mechanism 5 has been fixedly connected with the top and bottom of the frontal left of the first lamp plate 1, the
Fixed block 6, and 1 positive side of the first lamp plate and the second lamp have been fixedly connected with the top and bottom of two lamp plates, 3 positive right side of face
3 positive side of plate has been fixedly connected with buffer unit 7, and gripping mechanism 5 includes supporting plate 51, the side of supporting plate 51 and first
Lamp plate 1 is fixedly connected, and the side of supporting plate 51 is fixedly connected with clamping block 52, and the bottom of the inwall of clamping block 52 is fixedly connected with
Garter spring 53, the side of garter spring 53 are fixedly connected with fixture block 54, and the side of fixture block 54 through clamping block 52 and extends to
The outside of clamping block 52, the side of fixed block 6 offers neck 8, and neck 8 fills with clamping block 52 in setting, buffering is adapted
Putting 7 includes bottom plate 71, and the side of bottom plate 71 is fixedly connected with buffer spring 72, and the side of buffer spring 72 is fixedly connected with top plate
73, and the groove being adapted with top plate 73 is offered on bottom plate 71, the first lamp plate 1 and the V-shaped setting of the second lamp plate 3, buffering
The quantity of device 7 is provided with six, SMD lamp effectively can be carried out into clamping, prevents from unclamping when use so that LED is pasted
Piece is dropped, and reduces unnecessary waste, improves operating efficiency, and row buffering can be entered during use, is prevented to LED
SMD lamp causes to damage, and extends service life, alleviates the burden of worker, reduces cost.
In use, then LED pasters are rotated the second lamp plate 3, rotated, made by hinge 2 inside circular hole 4
Neck 8 on fixed block 6 extrudes clamping block 52 so that fixture block 54 carries out clamping with neck 8, is fixed, when buffering,
Top plate 73 extrudes bottom plate 71 by buffer spring 72, realizes buffering.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions.By sentence " including one ... the key element limited, it is not excluded that
Other identical element in the process including the key element, method, article or equipment also be present ".
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of Surface-mount LED lamp and preparation method thereof, including the first lamp plate (1), it is characterised in that：First lamp plate (1)
Side is hinged with the second lamp plate (3) by hinge (2), and circular hole is offered on first lamp plate (1) and the second lamp plate (3)
(4), and circular hole (4) is evenly distributed, and clamping dress has been fixedly connected with the top and bottom of the first lamp plate (1) frontal left
Put (5), fixed block (6), and the first lamp plate (1) have been fixedly connected with the top and bottom of the positive right side of face of second lamp plate (3)
Positive side and the second lamp plate (3) positive side have been fixedly connected with buffer unit (7).
A kind of 2. Surface-mount LED lamp according to claim 1 and preparation method thereof, it is characterised in that：The gripping mechanism (5)
Including supporting plate (51), the side of the supporting plate (51) is fixedly connected with the first lamp plate (1).
A kind of 3. Surface-mount LED lamp according to claim 2 and preparation method thereof, it is characterised in that：The supporting plate (51)
Side be fixedly connected with clamping block (52), and the bottom of clamping block (52) inwall is fixedly connected with garter spring (53).
A kind of 4. Surface-mount LED lamp according to claim 3 and preparation method thereof, it is characterised in that：The garter spring
(53) side is fixedly connected with fixture block (54), and the side of the fixture block (54) through clamping block (52) and extends to clamping block
(52) outside.
A kind of 5. Surface-mount LED lamp according to claim 1 and preparation method thereof, it is characterised in that：The fixed block (6)
Side offers neck (8), and neck (8) is in be adapted setting with clamping block (52).
A kind of 6. Surface-mount LED lamp according to claim 1 and preparation method thereof, it is characterised in that：The buffer unit (7)
Including bottom plate (71), the side of the bottom plate (71) is fixedly connected with buffer spring (72), the side of the buffer spring (72)
Top plate (73) is fixedly connected with, and the groove being adapted with top plate (73) is offered on bottom plate (71).
A kind of 7. Surface-mount LED lamp according to claim 1 and preparation method thereof, it is characterised in that：First lamp plate (1)
With the V-shaped setting of the second lamp plate (3).
A kind of 8. Surface-mount LED lamp according to claim 1 and preparation method thereof, it is characterised in that：The buffer unit (7)
Quantity be provided with six.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711002477.3A CN107859884A (en) | 2017-10-24 | 2017-10-24 | A kind of Surface-mount LED lamp and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711002477.3A CN107859884A (en) | 2017-10-24 | 2017-10-24 | A kind of Surface-mount LED lamp and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107859884A true CN107859884A (en) | 2018-03-30 |
Family
ID=61696389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711002477.3A Pending CN107859884A (en) | 2017-10-24 | 2017-10-24 | A kind of Surface-mount LED lamp and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107859884A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201194233Y (en) * | 2008-04-10 | 2009-02-11 | 一品光学工业股份有限公司 | Encapsulation construction of LED |
| CN201779569U (en) * | 2010-07-23 | 2011-03-30 | 佛山市神之光宇星照明实业有限公司 | LED ceiling lamp |
| CN202349861U (en) * | 2011-10-20 | 2012-07-25 | 宁波恒力仪表有限公司 | Buckling type soap-shaped LED (Light Emitting Diode) lamp |
| CN106195934A (en) * | 2016-08-23 | 2016-12-07 | 惠州市华阳多媒体电子有限公司 | A kind of fixed structure of HUD illuminating spotlight mirror |
| CN206361469U (en) * | 2016-12-28 | 2017-07-28 | 安徽皖皓节能科技有限公司 | A kind of industrial LED lamp |
| CN207569555U (en) * | 2017-10-24 | 2018-07-03 | 郴州智上光电科技有限公司 | A kind of Surface-mount LED lamp |
-
2017
- 2017-10-24 CN CN201711002477.3A patent/CN107859884A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201194233Y (en) * | 2008-04-10 | 2009-02-11 | 一品光学工业股份有限公司 | Encapsulation construction of LED |
| CN201779569U (en) * | 2010-07-23 | 2011-03-30 | 佛山市神之光宇星照明实业有限公司 | LED ceiling lamp |
| CN202349861U (en) * | 2011-10-20 | 2012-07-25 | 宁波恒力仪表有限公司 | Buckling type soap-shaped LED (Light Emitting Diode) lamp |
| CN106195934A (en) * | 2016-08-23 | 2016-12-07 | 惠州市华阳多媒体电子有限公司 | A kind of fixed structure of HUD illuminating spotlight mirror |
| CN206361469U (en) * | 2016-12-28 | 2017-07-28 | 安徽皖皓节能科技有限公司 | A kind of industrial LED lamp |
| CN207569555U (en) * | 2017-10-24 | 2018-07-03 | 郴州智上光电科技有限公司 | A kind of Surface-mount LED lamp |
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