CN107852813A

CN107852813A - The frequency-selective structure mitigated for EMI

Info

Publication number: CN107852813A
Application number: CN201680043996.1A
Authority: CN
Inventors: J·宋; P·F·狄克逊
Original assignee: Laird Technologies Inc
Current assignee: Laird Technologies Inc
Priority date: 2015-07-30
Filing date: 2016-07-29
Publication date: 2018-03-27
Also published as: DE202016008742U1; WO2017019948A1; EP3329750A4; EP3329750A1

Abstract

According to various aspects, illustrative embodiments include one or more frequency-selective structures (for example, two dimension or three-dimensional frequency selective structure or surface etc.), and it can be used for shielding or mitigating the EMI in open or close structure.Also disclose method of one or more frequency-selective structures for shielding or mitigating the electromagnetic interference (EMI) in open or close structure.

Description

The frequency-selective structure mitigated for EMI

The cross reference of related application

The application is the U.S. Patent application No.14/814008 submitted on July 30th, 2015 PCT international applications, the U.S. State patent application No.14/814008 transfers and is：

● the PCT international applications No.PCT/US2014/012551 that on January 22nd, 2014 submits is (on July 31st, 2014 Be disclosed as WO2014/116703) part continuation application, PCT international applications No.PCT/US2014/012551 transfers to require The U.S. Patent application No.13/853248 and the U.S. Patent application submitted on January 25th, 2013 that on March 29th, 2013 submits No.13/750680 priority；And

● the U.S. Patent application No.13/853248 that on March 29th, 2013 submits (was disclosed as on July 31st, 2014 US2014/0209374 part continuation application), U.S. Patent application No.13/853248 transfer to be to carry on January 25th, 2013 The U.S. Patent application No.13/750680 of friendship part continuation application；And

● the U.S. Patent application No.13/750680 that on January 25th, 2013 submits (was disclosed as on July 31st, 2014 US2014/0209374 part continuation application).

The complete disclosure of each in above-mentioned application is incorporated herein by reference.

Technical field

This disclosure relates to for shielding or mitigating electromagnetic interference (EMI) frequency-selective structure (for example, two dimension or three-dimensional Frequency-selective structure or surface etc.).

Background technology

This part provides background information related to the disclosure but being not necessarily prior art.

The operation of electronic installation generates electromagnetic radiation in the electronic circuit of equipment.This radiation may cause electromagnetic interference (EMI) or Radio frequency interference (RFI), this may interfere with the operation of a certain other electronic installations close in scope.Not enough In the case of shielding, EMI/RFI interference may cause the deterioration of signal of interest or lose completely, so that electronic equipment efficiency is low Down or it can not use.

The common solution for mitigating EMI/RFI influence is by using can absorb and/or reflect and/or redirect The shielding part of EMI energy.These shielding parts are generally used for EMI/RFI being positioned in its source, and by close to EMI/RFI sources its Its device is isolated.

Term as used herein " EMI " should be considered as generally including and referring to EMI transmittings and RFI transmittings, term " electricity Magnetic " it should be considered as generally including and referring to electromagnetic frequency and radio frequency from external source and inside sources.Therefore, term shields (as used herein) widely includes and referred to such as by decaying, absorbing, reflecting, stopping and/or redirecting energy Or their certain combination mitigates (or limitation) EMI and/or RFI so that EMI and/or RFI no longer for example contradict government specifications And/or the built-in function of interference electronic component system.

Brief description of the drawings

Accompanying drawing as described herein only for illustrating selected embodiment rather than all possible embodiment, and Be not intended to limit scope of the present disclosure.

Fig. 1 has integrated circuit exemplified with the printed circuit board (PCB) (PCB) according to illustrative embodiments, the PCB；In PCB Compact frequency selective surface/periodic structure；And Compact frequency selective surface/periodic structure, the Compact frequency selective surface/cycle knot Structure is applied or is arranged in above integrated circuit, and thus, frequency selectivity/periodic structure can be used to provide screen to integrated circuit Cover.

Fig. 2 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction Illustrative embodiments, wherein, frequency-selective structure can include such as by series of points expression it is any appropriate number of The conductions of suitable constructions (for example, shaping and scale etc.), electromagnetic energy absorption and/or magnetic component are (for example, ring and/or other Construction etc.).

Fig. 3 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction Illustrative embodiments, wherein, frequency-selective structure is included in electromagnetism in dielectric substance, being coated to conductive material Energy absorbing material.

Fig. 4 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction Illustrative embodiments, wherein, frequency-selective structure includes dielectric and conductive material on dielectric surfaces.

Fig. 5 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction Illustrative embodiments, wherein, frequency-selective structure includes dielectric and electromagnetic energy absorption on dielectric surfaces Material.

Fig. 6 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction Illustrative embodiments, wherein, frequency-selective structure includes dielectric and the conductive material that is coated on dielectric surface Electromagnetic energy absorption material.

For Fig. 7 exemplified with the illustrative embodiments of frequency-selective structure, the frequency-selective structure has dielectric structure Part and conducting ring, these conducting rings are supported by dielectric component, and will be spaced apart in specific location by dielectric component, Wherein, frequency-selective structure is shown in the test fixture on the microstrip line of MSL tests (its result figure 8 illustrates).

Fig. 8 is to show that (unit is decibel for the first and second signal intensities tested and (be referred to as S21 and MSL tests) (dB)) to the exemplary line graph of frequency (unit is gigahertz (GHz)), in first and second test, in frequency selectivity The illustrative embodiments of structure do not recorded in the case of pointing between mutual two antennas or not described two antennas it Between reference signal, with show the band of frequency-selective structure hinder ability.

The exemplary reality for the frequency-selective structure that Fig. 9 reduces exemplified with the cavity resonance that can be used for inside enclosed construction Mode is applied, wherein, frequency-selective structure includes the electromagnetic energy absorption material for the conductive material being coated on dielectric base plate, And Fig. 9 also show the frequency-selective structure being arranged in cavity resonance test fixture.

Figure 10 is to show to be coupled to the energy fluence of port 2 (being referred to as S21) from the port 1 of test fixture that (unit is decibel (dB)) to it is being measured when frequency-selective structure test sample is in the test fixture cavity inside shown in Fig. 9 and as than Compared with the frequency measured when only a piece of electromagnetic energy absorption material is in test fixture cavity inside (unit is gigahertz (GHz)) Exemplary line graph.

Figure 11 is exemplified with the multilayer or three-dimensional frequency that may be used as single band or multi-band bandstop waveguide and/or shielding construction The illustrative embodiments of selective structure, wherein, three-dimensional frequency selective structure includes stacking multilayer on top of each other Compact frequency selective surface.

Figure 12 is example of the insertion loss (or S21) (unit is decibel (dB)) to frequency (unit is gigahertz (GHz)) Property line chart, wherein, be as a result included in prototype three-dimensional frequency selective structure in the case where pointing between mutual two antennas Two antennas between reference signal actual measurement and the porose different metal piece of tool pointing to mutual two antennas Between in the case of two antennas between reference signal modeling result.

Figure 13 is exemplary line graph of the shield effectiveness (dB) to frequency (GHz), wherein, shield effectiveness limits according to positive dB It is fixed, and be the opposite number of the insertion loss shown in Figure 12.

Embodiment

Illustrative embodiments are described in detail below with reference to accompanying drawings.

As described in above in the introduction, shielding part is usually used in by absorbing and/or reflecting and/or redirect EMI Energy mitigates EMI/RFI influence.Traditional screen method and material rely on the conductive surface of completely enclosed electromagnetic radiation source.So And in fact, some gaps in conductive surface must retain, to allow instrument outgoing and/or allow air flow, these Gap will allow signal to reveal.Electromagnetic absorption agent material can be used for decay to be revealed by the signal in gap.But in order to effective, absorption Gap must be completely covered in agent.In this case, absorbent suppresses or prevents equipment close or air flow, and this often can not OK, because must maintain equipment close sometimes and/or air flow.

After the above is recognized, it is public that inventor develops the institute including one or more frequency-selective structures The illustrative embodiments opened, one or more frequency-selective structure can be used for shielding or mitigate open or close EMI in structure.Also disclose and be used to shield by one or more frequency-selective structures or mitigate open or close structure The method of interior electromagnetic interference (EMI).

Disclose use or single band or multiband band including one or more Compact frequency selective surface/periodic structures Wave arrestment is led and/or the illustrative embodiments of shielding construction.There is disclosed herein for by using one or more frequencies Selective surface/periodic structure is come the illustrative methods that decay by open architecture or the electromagnetic signal inside enclosed construction. It was recognized by the inventor that the advantages of being used for and shield purpose frequency-selective structure is：Frequency-selective structure can not hinder Only the gentle stream of object is arranged in open architecture through in the case of open architecture, so as to decay, reflect, stop, redirect and/ Or absorb the electromagnetic signal for passing through the open architecture.

In the exemplary embodiment, frequency-selective structure can have two dimensional form (for example, two-dimensional frequency is selective Surface or piece etc.) or three dimensional form (for example, three-dimensional periodic structure etc. with periodic pattern, multilayer Compact frequency selective surface). Frequency-selective structure can include passive electrical magnetic sheet or structure, and the passive electrical magnetic sheet or structure are designed to decay, reflect, hinder Keep off, redirect and/or absorb the electromagnetic energy on one or more special frequency bands.Frequency-selective structure is included in pattern Conductive material and/or electromagnetic energy absorption material, the conductive material and/or electromagnetic energy absorption material can be located at dielectric base On plate or for example it is suspended in air (air is considered dielectric).Band-stop response is even in electromagnetic signal and frequency Under the very big incidence angle (for example, glancing angle or grazing angle) that selective structure is nearly parallel advanced there is also.In example In property embodiment, one or more frequency-selective structures can be used to decay, reflect, stop, redirecting, decaying, And/or the electromagnetic signal for propagating through passage, waveguiding structure, vent panel or other open architectures is absorbed, while still permit Perhaps the outgoing and/or air-flow of equipment passes through.

Inventor is also recognized that the advantages of electromagnetic signal being used to decay by frequency-selective structure inside enclosed construction.This Text discloses the cavity resonance reduction including frequency-selective structure and/or the illustrative embodiments of shielding construction.Frequency is selected Selecting property structure is designed or is configured with the conducting element in one or more bands resistance frequency low-resonance.Absorber material couple or It is attached to conducting element.Advantageously, it was found by the inventors that frequency-selective structure and absorber material can be used than using These existing conventional methods of the absorbent piece operated on a wide frequency band significantly less absorber materials reduces or mitigates sky Chamber resonates.By the way that expected frequency is set to target, illustrative embodiments disclosed herein can be with compared with flat absorbent piece There is provided at least equivalent or similar cavity resonance reduces, while due also to required less amount absorbent and significant cost is provided Reduce.

Inventor is also recognized that is used for the open architecture decayed by must be allowed for air flow by frequency-selective structure Electromagnetic signal the advantages of.For example, air vent is needed to allow air flow in many electronic installations, to prevent in electronic building brick Heat accumulation.But for sufficiently cool electronic installation, air vent must be large enough to allow enough air flows to cool down Device.But under higher frequency (less wavelength), air vent allows the leakage of electromagnetic energy.In illustrative embodiments In, frequency-selective structure is used to need or it is expected in ventilation or the application of air flow.Advantageously, frequency-selective structure Illustrative embodiments can include the conducting element (for example, ring etc.) with open area, then the open area can be used Make air vent.Or for example, the illustrative embodiments of frequency-selective structure can include multilayer Compact frequency selective surface, The multilayer Compact frequency selective surface can reduce airflow-resistive while shield effectiveness is improved.Therefore, it is disclosed herein Illustrative embodiments can provide the performance of improved stop electromagnetic energy while air flow is still allowed for.

Frequency-selective structure can be designed as decaying or stop under one or more specific frequencies or frequency range Interior electromagnetic energy.Addition or alternatively, frequency-selective structure can be designed as allowing one or more band logical frequencies Under electromagnetic signal pass through.For example, frequency-selective structure can be designed as allowing to hinder frequency with one or more bands Electromagnetic signal under different one or more band logical frequencies passes through.Or for example, frequency-selective structure can be set It is calculated as also allowing one or more band logical frequencies when frequency-selective structure is not used directly to control or mitigate EMI Under electromagnetic signal pass through.By another example, frequency-selective structure can be configured with the smaller opening of conducting element Region, to allow specific frequency or frequency range to pass through (for example, single band band logical or multiband band logical).Because reduce opening Region or the size of air vent, so frequency-selective structure can be operable as the single band for also allowing ventilation or air flow Or the waveguide of multiband band logical and/or shielding construction.The open area of conducting element (for example, ring etc.) can be wanted according to draft Ask, shielding requirements, the frequency to be stopped and/or the frequency to be passed through and differently constructed.

Inventor, which is also recognized that, to be used to frequency-selective structure reduce the electromagnetism caused by the electronic installation of closing The advantages of interference.Electronic installation may need shell, so that the EMI to other devices minimizes and/or met legal requirements. In illustrative embodiments, one or more frequency-selective structures can be incorporated to inside shell mechanism, with selective stop Or the electromagnetic energy under redirection design frequency.Frequency-selective structure can be used alone or for example together with one or more Waveguiding structure, dielectric/conductive pole and other engineering structures are used together, and electromagnetic energy, which is directed to, to absorb energy Region or the region less important to circuit operation.

Attempt to surround transmitter using conductive material (faraday (Faraday) cage) for the current method that EMI mitigates, To include electromagnetic energy.But itself it was recognized by the inventor that because construction have to leave behind can compared with small wavelength (upper frequency) energy leakage With the gap passed through, so the type of " faraday cup " becomes less effective at higher frequencies.Therefore, it is disclosed herein Illustrative embodiments include also stopping or redirecting the frequency selectivity knot of electromagnetic energy in the presence of small―gap suture Structure.

Referring now to accompanying drawing, Fig. 1 is exemplified with single band or multifrequency including realizing one or more various aspects of the disclosure Band is led with wave arrestment and/or the illustrative embodiments of shielding construction.The illustrated embodiment includes the first and second frequencies Selective structure or periodic structure 104,108, first and second frequency-selective structure or periodic structure can be used to for Integrated circuit 112 on printed circuit board (PCB) (PCB) 116 provides shielding.First frequency selective structure 104 is in PCB 116.The Two frequency-selective structures 108 are positioned, using or be arranged in the top of integrated circuit 112.

Frequency-selective structure 104,108 can be used to decay (for example, reflection, stop, redirection and/or absorption etc.) To/the electromagnetic signal from integrated circuit 112.Frequency-selective structure 104,108 includes the conduction in identical or different pattern And/or electromagnetic energy absorption material or component (for example, conducting ring separated etc.), the conduction and/or electromagnetic energy absorption material Or component is used to decay, stop, reflect, redirect and/or absorb under one or more specific frequencies or in frequency range Electromagnetic energy.In some illustrative embodiments, frequency-selective structure 104,108 alternative one or both acceptable quilt It is constructed to allow for one or more specific frequencies or frequency range to pass through, so as to be operable as single band or multiband band logical ripple Lead and/or shielding construction.

Conductive and/or electromagnetic energy absorption material can be relevant with dielectric (for example, dielectric base plate, air etc.) In pattern.For example, conductive and/or electromagnetic energy absorption material can be on the top surface of dielectric base plate and/or bottom surface and/or electric In medium substrate.As another example, dielectric component can be supported, hangs and/or be maintained to be in pattern and be spaced apart The conduction and/or electromagnetic energy absorption component of position.In this example, because conductive and/or electromagnetic energy absorption component can be with Alternatively it is suspended on by dielectric component in such as air, so frequency-selective structure can not include any dielectric base Plate.In another example, conductive and/or electromagnetic energy absorption component can independently be attached (for example, adhesive attachment etc.) to restriction The cavity or one or more side walls in the cavity of the open architecture or enclosed construction of open architecture or enclosed construction.Lead Electricity and/or electromagnetic energy absorption component can be along one or more side wall location-independents, to form pattern or orderly Or pattern structure.In another example, conductive and/or electromagnetic energy absorption component can be embedded in open or close structure (for example, in the side wall on chassis etc.) or be the open or close indispensable part of structure.

In the illustrative embodiments including more than one frequency-selective structure, frequency-selective structure can be each other It is identical or different from each other.In addition, frequency-selective structure can be included all with same configuration (for example, same shape, identical Size, identical patterns etc.) or it is not all of that there is appointing for same configuration (for example, different shape, different sizes, different pattern etc.) What appropriate number of conductive and/or electromagnetic energy absorption component.For example, frequency-selective structure can have it is differing formed and/ Or conduction and/or electromagnetic energy absorption component of the different scales to work at multiple frequencies and/or over a wide bandwidth.

In some illustrative embodiments, frequency-selective structure can having such as shown in Fig. 2, Fig. 3 and Fig. 6 On conductive material or conductor or it is coupled to the electromagnetic energy absorption material or absorbent of conductive material or conductor.For example, electromagnetism Energy absorbing material or absorbent can be stacked on the top of conductive material or conductor.Or for example, electromagnetic energy absorption is thin Film can be arranged in above conductive material or conductor and be attached to them.As another example, conductive material or conductor can apply It is furnished with one or more electromagnetic energy absorption coatings.In other examples embodiment, frequency-selective structure only includes Electromagnetic energy absorption material or absorbent (for example, Fig. 5 etc.), without conductive material or conductor.In other exemplary implementation In mode, frequency-selective structure only includes conductive material or conductor (for example, Fig. 4 etc.), without electromagnetic energy absorption material Or absorbent.In other illustrative embodiments, frequency-selective structure includes adjacent or simultaneously with conductive material or conductor Row but the electromagnetic energy absorption material or absorbent not being stacked on or below at the top of conductive material or conductor.

Embodiment illustrated in Fig. 1 includes the first and second frequency-selective structures 104,108, and described first and second Frequency-selective structure is respectively in PCB 116 and is arranged in the top of integrated circuit 112.Alternative example embodiment can be with Including more or less than two frequency-selective structures.For example, other examples embodiment includes the first frequency in PCB substrate Second frequency selective structure alternative one above rate selective structure or the integrated circuit being arranged on PCB, but be not all Including.Other illustrative embodiments are included in the frequency-selective structure on the top surface and/or bottom surface of PCB substrate, and do not have Any frequency-selective structure for having in PCB substrate or being arranged in above the integrated circuit on substrate.Other exemplary reality Apply mode and include more than two frequency-selective structure and (first frequency selective structure such as in PCB substrate, be arranged in PCB On integrated circuit above second frequency selective structure and on the top surface of PCB substrate or bottom surface the 3rd frequency selection Property structure).Also some illustrative embodiments are included in first frequency selective structure in PCB substrate, are arranged on PCB Second frequency selective structure above integrated circuit, the 3rd frequency-selective structure on the top surface of PCB substrate and The 4th frequency-selective structure on the bottom surface of PCB substrate.Addition or alternatively, frequency-selective structure is except that can be placed on Placed on circuit, in PCB and/or PCB surface (for example, lower section etc.) or instead of such, EMI noise road can also be placed on On another surface near footpath.

Fig. 2 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction Or the illustrative embodiments of periodic structure 204.As represented by the series of points in Fig. 2 and distance (d), frequency selectivity knot Structure 204 (or other frequency-selective structures disclosed herein) such as basis will be reflected by the frequency-selective structure 204, be inhaled Receive, stop and/or redirect what frequency and can include any appropriate number of suitable constructions (for example, shaping, scale, every Open, pattern) conduction and/or electromagnetic energy absorption component (ring and/or other shapes etc.).Frequency-selective structure 204 It can be designed, construct or be tuned as to reflect, absorb, stop and/or redirect under one or more expected frequencies or frequency The energy at bandwidth (for example, about 9 gigahertzs etc.) place.In some illustrative embodiments, frequency-selective structure 204 may be used also To be configured to allow for one or more specific frequencies or frequency range to pass through so that frequency-selective structure 204 can be with It is operable as single band or the waveguide of multiband band logical and/or shielding construction.

In the illustrated example shown in fig. 2, frequency-selective structure 204 includes conductive material or conductor 220 and in the conduction On material or conductor 220 or it is coated to the electromagnetic energy absorption material or absorbent 224 of the conductive material or conductor 220.Fig. 2 is also Exemplified with dielectric 228, the dielectric can include any suitable dielectric, including dielectric base plate material, air etc.. In operation, frequency-selective structure 204 reflects, absorbs, stops and/or redirected the signal of almost glancing incidence (deviateing 90 degree), To prevent energy.In some illustrative embodiments, frequency-selective structure 204 (and other frequencies disclosed herein Selective structure) it can also allow for other objects and/or draft through the frequency-selective structure (such as in dielectric 228 when be air etc.).

Fig. 3 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction 304 illustrative embodiments.As shown in figure 3, electromagnetic energy absorption material or absorbent 324 are in conductive material or electric conductor On 320 or it is coated to conductive material or electric conductor 320.During use, electromagnetic energy absorption material 324 can be used to decay Or absorb the electromagnetic signal reflected by frequency-selective structure 304.Although Fig. 3 illustrate only single electric conductor 320 and thereon Single absorbent 324, but what frequency-selective structure 304 for example can be according to will reflect by the frequency-selective structure 304 Frequency and electric conductor 320 including any appropriate number of suitable constructions (for example, shaping, scale, separate, pattern) and inhale Receive agent 324 (for example, ring and/or other shapes etc.).In some illustrative embodiments, electric conductor 320 and absorber 324 Whether construction (for example, quantity, shape, size, separate, pattern etc.) for example might also depend on should allow frequency or frequency band to pass through With what frequency or frequency band should be allowed to pass through.

Fig. 3 also illustrates dielectric 328 and 332.Dielectric 328,332 can include same dielectric part (for example, The upper and lower part of same dielectric base plate).Or dielectric 328,332 can include different dielectrics.For example, electricity is situated between Matter 328 can be dielectric base plate, and dielectric 332 can include air.

Fig. 4 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction 404 illustrative embodiments.As shown in figure 4, frequency-selective structure 404 is included in the conduction material on the surface of dielectric 428 Material or electric conductor 420.Although Fig. 4 illustrate only single electric conductor 420, frequency-selective structure 404 for example can be according to will What frequency is reflected by frequency-selective structure 404 and including any appropriate number of suitable constructions (for example, shaping, scale, every Open, pattern) electric conductor.In some illustrative embodiments, the electric conductor 420 of frequency-selective structure 404 may be used also To be configured to allow for one or more specific frequencies or frequency band to pass through so that frequency-selective structure 404 can be can grasp As single band or the waveguide of multiband band logical and/or shielding construction.

Fig. 5 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction 504 illustrative embodiments.As shown in figure 5, frequency-selective structure 504 is included in the electromagnetic energy on the surface of dielectric 528 Measure absorbing material or absorbent 524.Although Fig. 5 illustrate only single absorbent 524, frequency-selective structure 504 for example may be used With according to reflect what frequency by frequency-selective structure 504 and including any appropriate number of suitable constructions (for example, into Shape, scale, separate, pattern) absorbent 524.In some illustrative embodiments, frequency-selective structure 504 Absorbent 524 can also be configured to allow for one or more specific frequencies or frequency band to pass through so that frequency-selective structure 504 can also be operable as single band or the waveguide of multiband band logical and/or shielding construction.

Fig. 6 is exemplified with may be used as single band or the frequency-selective structure of multi-band bandstop waveguide and/or shielding construction 604 illustrative embodiments.As shown in fig. 6, frequency-selective structure 604 includes transferring leading on the surface of dielectric 628 On electric material or conductor 620 or it is coated to the electromagnetic energy absorption material or absorbent 624 of the conductive material or conductor.Alternative In embodiment, the positioning of electromagnetic energy absorption material or absorbent 624 and conductive material or conductor 620 can be overturned so that Conductive material or conductor 620 are on electromagnetic energy absorption material or absorbent 624 or are coated to electromagnetic energy absorption material or suction Receive agent 624.Although Fig. 6 illustrate only single electric conductor 620 and single absorbent 624 thereon, frequency-selective structure 604 Such as can be according to reflecting any frequency and including any appropriate number of suitable constructions by the frequency-selective structure 604 The electric conductor 620 and absorbent 624 (for example, ring and/or other shapes etc.) of (for example, shaping, scale, separate, pattern). In some illustrative embodiments, the conductor 620 and absorbent 624 of frequency-selective structure 604 can also be configured to permit Perhaps one or more specific frequencies or frequency band pass through so that frequency-selective structure 604 can also be operable as single band or The waveguide of multiband band logical and/or shielding construction.

Fig. 7 is exemplified with the example frequency that test fixture 732 is interior and is placed on the microstrip line 736 tested for MSL Selective structure 704, figure 8 illustrates the result of MSL tests, and hereinafter it is described.As shown in fig. 7, frequency Rate selective structure 704 include multiple conductive and/or electromagnetic energy absorption components 720 and multiple dielectric components, pillar or Spacer 740.Dielectric component 740 is connected to paired conduction and/or electromagnetic energy absorption component 720, and at this to it Between extend.

In this example, frequency-selective structure 704 does not include dielectric base plate.Conductive member and/or electromagnetic energy are inhaled Component 720 is received alternatively for example to be suspended in air (air is considered dielectric), and by dielectric component 740 Remain to appropriate position.By the construction, the major part of frequency-selective structure 704 is open.As shown in fig. 7, frequency Selective structure 704 has the open area and dielectric limited by annular conductive component and/or electromagnetic energy absorption component 720 The open area limited between component 740.These open areas of frequency-selective structure 704 may be used as air vent.Therefore, Frequency-selective structure 704 may be advantageously used with decay by need draft open architecture (it is all if desired for air-flow come The electronic installation for preventing the heat in electronic building brick from gathering) electromagnetic signal.

In the embodiment illustrated in Fig. 7, conductive member and/or electromagnetic energy absorption component 720 are circular rings.It is more Individual dielectric component 740 is linear or linear member, and each in these linear or linear members is connected to corresponding a pair Between conductive and/or electromagnetic energy absorption ring.Conductive member and/or electromagnetic energy absorption component 720 are in by dielectric component The apex of 740 equilateral triangles limited.

Continued with the example shown in Fig. 7, conductive member and/or electromagnetic energy absorption component 720 can have about The ring interior diameter of 10.2 millimeters (mm) and about 12mm ring overall diameter.The center of these rings can in hexagonal shaped pattern by every Open about 17.5mm.Any three adjacent rings form the equilateral triangle that side is equal to about 17.5mm.Thickness can be about 1mm.Because frequency-selective structure can require according to draft, shielding requirements, the frequency to be stopped and/or be passed through Frequency etc. and be configured differently, so the dimension provided in the paragraph is only example.For example, conductive member and/or electromagnetic energy Absorption component 720 can be constructed (for example, scale, shaping etc.) as decay or stop under one or more specific frequencies or frequency Electromagnetic energy at rate scope.Conductive member and/or electromagnetic energy absorption component 720 can also be constructed (for example, scale, into Shape etc.) it is to allow specific frequency or frequency range to pass through (for example, single band or multiband band logical).Because reduce open area Or the size of air vent, so frequency-selective structure 704 can be operable as the single band for also allowing ventilation or air flow Or the waveguide of multiband band logical and/or shielding construction.

Construction shown in Fig. 7 only can be used for one of the possibility frequency-selective structure in illustrative embodiments Example is (because other examples embodiment can include by changing dielectric component and/or conductive member and/or electromagnetic energy Measure the shape of absorption component, size, separated by a distance, whole geometry layout etc. come be tuned to different frequency one or more frequencies Rate selective structure).Other layouts or geometry can be used for (such as more or less quantity of frequency-selective structure 704 , different (for example, each other closer to or farther) separated, and/or conductive member and/or electromagnetic energy with grade of different shapes Measure absorption component).For example, conductive member and/or electromagnetic energy absorption component 720 can be non-circular (for example, triangle , rectangle, pentagonal, hexagon, spiral, intersection etc.).In addition, dielectric component 740 can be it is nonlinear and/ Or it is arranged differently to limit the other shapes in addition to equilateral triangle or hexagonal shaped pattern shown in Fig. 7.

In addition, frequency-selective structure 704 can be positioned in open architecture so that the frequency-selective structure can be grasped Act on not exclusively block open architecture (such as, it is allowed to draft etc.) in the case of stop propagate through open architecture , electromagnetic signal under one or more bands resistance frequency.Or for example, frequency-selective structure 704 can be positioned in envelope Close in the cavity of structure so that frequency-selective structure can be used under one or more bands resistance frequency in attenuating cavity Electromagnetic signal, propagated so as to reduce cavity resonance in cavity and/or electromagnetic energy.As other example, frequency selection Property structure 704 can be used alone or for example together with one or more waveguiding structures, dielectric/conductive pole and other works Journey structure is used together, and electromagnetic energy is directed to the region for absorbing energy or the area less important to circuit operation Domain.

Fig. 8 is to show that (unit is gigabit to frequency for two different signal intensities (unit is decibel (dB)) tested Conspicuous (GHz)) exemplary line graph.Two test during, frequency-selective structure illustrative embodiments with do not exist Reference signal in the case of pointing between mutual two antennas between two antennas of measurement or record.As a result show that frequency is selected The band resistance ability of selecting property structure.These test results shown in Fig. 8 provide only for the purpose of illustration, rather than in order to limit The purpose of system and provide.

For the first test (being referred to as S21), measurement or record reference signal between mutual two antennas are pointed to.So Afterwards, insertion or location frequency selective structure between two antennas, and reference signal is measured or recorded again.In fig. 8, S21 test results represent the measurement carried out when frequency-selective structure is between two antennas.

Generally, S21 test results show that frequency-selective structure stops, reflects, redirects and/or absorbed about 9GHz's Energy under frequency.Grade (level) with resistance is better than 30dB, it means that the signal passed through is in the level of reference signal 1/1000.It is aobvious under about 9GHz that these test results show that the illustrative embodiments for including frequency-selective structure have Write band resistance ability.Although Fig. 8 shows the frequency that the illustrative embodiments including frequency-selective structure stop about 9GHz Energy under rate, but other examples embodiment can include being tuned to prevent one of the energy under other suitable frequencies Or more frequency-selective structure.

The second test (being referred to as microstrip line (MSL) test) is performed on the microstrip line.Reference measure is entered using empty fixture OK.Then, frequency-selective structure 704 is placed on the upper conductor of microstrip line 736 as shown in Figure 7, and measurement signal. MSL test results in Fig. 8 show notable with resistance ability (for example, the band more than 25dB hinders grade) under about 8GHz.It is logical Often, MSL test instruction include frequency-selective structure led with wave arrestment and/or the band of shielding construction hinder ability.Signal is surveyed in MSL Abreast advanced with frequency-selective structure during examination, and the surface or plane of electric field and magnetic field and frequency-selective structure are hung down Directly.By contrast, surface of the energy with frequency-selective structure during S21 is tested travels vertically, and electric field and magnetic field It is parallel with the surface of frequency-selective structure.

Frequency-selective structure can be designed or be configured with the conductive material, element or structure in specific frequency low-resonance Part.In the exemplary embodiment, electromagnetic energy absorption material is coated, adheres to or is otherwise affixed to conducting element. Electromagnetic energy absorption material and/or conducting element can be supported and/or coupled (for example, attachment, adhesion by dielectric base plate Deng) arrive the dielectric base plate.Alternatively, frequency-selective structure (for example, 704 etc. in Fig. 7) can not include any electricity Jie Matter substrate.In the exemplary embodiment, electromagnetic energy absorption material is adhered on the top of conducting element, these conducting elements Then dielectric base plate can be adhered to or be coupled by dielectric component etc..In use, frequency-selective structure can Operate for reducing or mitigating cavity resonance and electromagnetic energy propagation (being also known as standing wave) inside enclosed construction.

Frequency-selective structure can reduce electromagnetic energy required inside enclosed construction and EMI shielding amounts.Frequency selects Property structure can energy reach EMI shielding parts before reduce enclosed construction cavity in energy.For example, frequency selectivity knot Structure can position relative to shielding part (for example, upstream of shielding part etc.), to be reduced before electromagnetic energy reaches shielding part Electromagnetic energy in cavity.In this case, therefore frequency-selective structure can improve bulk shielding performance.Frequency selects Property structure may be considered as cavity resonance reduce structure and/or shielding construction or part thereof.

As background, cavity resonance occurs when electronic installation is closed and (protected for physically or electrically magnetic) in conductive box. The energy launched by device may be in cavity internal resonance.Cavity has the specific frequency that the size according to cavity or size resonate Rate.If one that the signal launched is in these resonant frequencies, cavity will resonate.This cause electric field and magnetic field with The volume of cavity and change, this may negatively affect the expected performance of circuit.

Traditional cavity resonance method uses the thin electromagnetic absorption agent piece being placed on cavity wall.Absorber material is generally filled with There is the dry load for absorbing magnetic field and/or electric field.Absorbent makes the frequency shift (FS) of cavity resonance, and absorbs deviation energy, this Circuit is suitably operated.Traditional cavity resonance mitigates absorbent and operated in wide frequency ranges.It can be directed to for example Cavity resonance in the frequency ranges such as 2GHz to 26GHz, which reduces, recommends given absorber material.Cost is that cavity resonance is inhaled A factor of agent is received, the cost produces mainly due to dry load.

Frequency-selective structure is passive electrical magnetic sheet, and the passive electrical magnetic sheet is designed to using the conduction on dielectric base plate The electromagnetic energy on one or more special frequency bands is decayed, reflects, stops, redirects and/or absorbed to pattern.It is being placed on During cavity inside, conductive pattern is by one or more design frequency low-resonances of frequency-selective structure.In exemplary reality Apply in mode, electromagnetic energy absorption material is attached to conductive pattern, mitigates structure to absorb energy and provide cavity resonance.Have Sharp ground, this illustrative embodiments can provide at least equivalent or similar cavity resonance compared with flat absorbent piece and reduce, Simultaneously due also to required less amount absorbent and providing significant cost reduces.Cavity resonance disclosed herein mitigates structure Illustrative embodiments can be used for wide scope application (such as needed in narrow-band absorb and be not on a wide frequency band must The application absorbed must be needed) in.

Exemplary implementations of the Fig. 9 exemplified with the frequency-selective structure 804 for realizing one or more various aspects of the disclosure Mode.The cavity resonance that frequency-selective structure 804 can be used for inside enclosed construction reduces.Frequency-selective structure 804 can With the energy in the cavity of enclosed construction is reduced before energy reaches the also shielding part in enclosed construction.With the exemplary side Therefore formula, frequency-selective structure 804 can advantageously improve bulk shielding performance.Therefore, frequency-selective structure 804 may be used also Be cavity resonance reduce structure and/or shielding construction or part thereof.

As shown in figure 9, frequency-selective structure 804 includes electromagnetic energy absorption material 824, the electromagnetic energy absorption material 824 on conductive material 820, it is coated and/or is coupled to conductive material (for example, attachment or adhering to the top surface of conductive material Deng).Conductive material 820 and electromagnetic energy absorption material 824 or be supported on dielectric 828 surface top.But at it In its illustrative embodiments, frequency-selective structure does not include dielectric 828.

In alternative embodiment, determining for electromagnetic energy absorption material or absorbent and conductive material or conductor can be overturned Position so that conductive material or conductor are on electromagnetic energy absorption material or absorbent or are coated to electromagnetic energy absorption material or suction Receive agent.As disclosed in the other examples embodiment herein for frequency-selective structure, frequency-selective structure 804 is for example Can be according to object tape resistance frequency (for example, it is contemplated that frequency that electric conductor and absorbent resonate) and including any appropriate number of conjunction The electric conductor and absorbent (for example, ring and/or other shapes etc.) of suitable construction (for example, shaping, scale, separate, pattern).

The material of wide scope can be used for dielectric base plate, conductive material and electromagnetic energy in the exemplary embodiment Absorbing material.One example embodiment includes dielectric foam base plate, and the dielectric foam base plate has conductive aluminum thereon Ring.Electromagnetic energy absorption material with ring-shaped identical with conducting ring is adhered to (for example, using pressure-sensitive adhesive acrylic adhesive tape Deng) or be otherwise in top on be attached to conducting ring.Therefore, the illustrative embodiments include gold on the dielectric substrate Belong to backing absorbent ring.Only for example, electromagnetic energy absorption material can include magnetic carrying silastic material (for example, ECCOSORB^TMBSR etc.).Receive on material or absorbent 624 or be coated to electromagnetic energy absorption material or absorbent 624.Equally Only for example, dielectric foam base plate can include the closing with low-dielectric loss, low-k and low-density Unit, cross-linked hydrocarbon foam are (for example, ECCOSTOCK^TMPP-4 foams etc.).Alternative material is implemented in other examples Dielectric base plate (for example, with high dielectric constant etc.), electromagnetic energy absorption material are can be used in mode, and/or is led Electric material.In other embodiment, frequency-selective structure does not include any dielectric base plate.On the contrary, the example frequency Selective structure includes the metal back of the body for hanging and being coupled via the dielectric support or component that generally extend between the rings Serve as a contrast absorbent ring (for example, falope of aluminium backing magnetic carrying etc.) (for example, with reference to Fig. 7).

Figure 10 provides the performance test data of the test sample measurement for frequency-selective structure.Test sample and survey Test result provides only for the purpose of illustration, rather than is provided for the purpose of limitation.

More specifically, Figure 10 is the amount for showing to be coupled to from the port 1 of test fixture the energy of port 2 (being referred to as S21) (unit is decibel (dB)) is to the frequency (unit that is measured when some test samples are in the test fixture cavity inside shown in Fig. 9 For gigahertz (GHz)) exemplary line graph.It is also empty in test fixture in only electromagnetic energy absorption material piece in order to omparison purpose The amount of the energy of port 2 is coupled in measurement from port 1 during intracavitary portion.

In the test of the particular series, test fixture is included with 14 inchages, 8 inch in width and 0.75 inch Sizable cavity of height.The input/output end port 1 and 2 of test fixture is type N microwaves port.

Test for example series, test sample are made up of following exemplary technique.With about 0.002 inch The conductive aluminum of degree is by 12 inches of ECCOSORB with 0.04 inch or 40 mil thickness^TMBSR-2 pieces adhere to the one of 12 inches Side.ECCOSORB^TMBSR-2 is the silastic material of non-conductive magnetic carrying.Using water jet in conductive material and electromagnetism The ring of diameter change is cut in energy absorbing material (for example, about 7mm ring interior diameter and about 8.5mm ring overall diameter Deng).Multigroup 4 rings with same or about size are placed on the dielectric material.In this example, dielectric material Material includes the ECCOSTOCK with 0.125 inch thickness^TM PP-4。ECCOSTOCK^TMPP-4 is with low-density, low dielectric Matter is lost and the closed cell of sufficiently low dielectric constant (k=1.05), the hydrocarbon foam of crosslinking so that it is to RF and microwave-based It is transparent in sheet.Dielectric substance operates or for being suspended on the ring of the conductive material of waveguide core and electromagnetic energy absorption material.

As shown in Figure 10, it is randomly placed test in some (for example, five or six etc.) metal-backed absorbent rings When in the cavity of fixture, the good attenuation of cavity resonance be present.In fact, 20 or 25 metal-backed absorbent rings obtain With by only absorbent ECCOSORB^TMThe almost equivalent decay that BSR-2 4 inch of * 4 inch plaques obtains.Only wrapped in view of ring About 7% containing such as volume for the electromagnetic energy absorption material that 4 inches of * 4 inches of absorbent pieces include, the result is unexpected. In view of the higher cost of electromagnetic energy absorption material, with the energy of less amount of electromagnetic energy absorption material offer good attenuation Power can provide significant cost savings.

For example, ring can have interior diameter in the range of about 7 millimeters to about 7.5 millimeters with scale and from about For 9mm to the overall diameter about in the range of 9.5mm, this can optimize or improve the performance for 10.3GHz.In addition, test sample Dielectric base plate there is about 0.125 inch of thickness.Because other examples embodiment can include having different (examples Such as, it is smaller etc.) dielectric base plate of thickness, the ring etc. with different-diameter, so size disclosed herein is substantially shown Example and do not limit the scope of the present disclosure.

Figure 11 is exemplified with the multilayer or three-dimensional frequency selective structure 1104 for realizing one or more various aspects of the disclosure Illustrative embodiments.Frequency-selective structure 1104 can be configured to use single band or multi-band bandstop waveguide And/or shielding construction.

As shown in figure 11, frequency-selective structure 1104 includes multilayer Compact frequency selective surface 1150,1160 and 1170. Compact frequency selective surface 1150,1160 and 1170 can stack or be laminated on top of each other, single or uniformly to be formed Frequency-selective structure 1104.Only for example, three layers of Compact frequency selective surface 1150,1160 and 1170 can use electricity to be situated between Matter adhesive, pressure-sensitive adhesive or other suitable means are attached to each other.Compact frequency selective surface 1104 can be designed, structure Make or be tuned as to reflect, absorb, stop and/or redirect one or more expected frequencies or frequency bandwidth (for example, from about 20 gigahertzs (GHz) arrive about 27GHz, from about 20 gigahertzs (GHz) to about 35GHz, about about 25GHz, 35GHz Deng) energy.In some illustrative embodiments, frequency-selective structure, which may be constructed such that, is reducing the same of airflow-resistive When and/or make air flow limitation minimize while provide EMI shielding.

Frequency-selective structure 1104 can also be configured to allow for draft to pass through frequency-selective structure 1104.Example Such as, Figure 11 shows first, second and the third layer 1150,1160,1170 each with ring-type rectangular shape, the ring-type square Shape shape, which has, passes through its opening.When layer 1150,1160,1170 is stacked arrangement, each layer 1150,1160,1170 is opened Mouth or open area are in alignment with each other so that draft can flow through alignd opening or open area.

In the embodiment illustrated in Figure 11, frequency-selective structure 1104 includes three layers of Compact frequency selective surface 1150th, 1160 and 1170.But other examples embodiment can include the Compact frequency selective surface (example of any number of layers Such as, more or less than three layers, two layers to ten layers etc.).

Each layer Compact frequency selective surface is not required as formed objects and same shape.On the contrary, illustrative embodiments can With including one layer with the shape and/or size different from the one or more layers in other layers of Compact frequency selective surface or more Multilayer Compact frequency selective surface.For example, Figure 11 show each with different size of ring-type rectangular shape first, second with And third layer 1150,1160,1170, wherein, first layer 1150 is smallest tier (for example, the width of about 0.35 centimetre (cm) Deng), and the second layer 1160 is maximum layer (for example, about 0.7cm width etc.).In other examples embodiment, three Each multilayer Compact frequency selective surface with same shape and/or formed objects can be included by tieing up frequency-selective structure.

Frequency-selective structure 1104, which may be constructed such that, allows one or more specific frequencies or frequency range to pass through, So that frequency-selective structure 1104 may also operate as single band or the waveguide of multiband band logical and/or shielding construction.At some In illustrative embodiments, multilayer Compact frequency selective surface can have for example at multiple frequencies and/or in wider bandwidth Any shape (for example, rectangle, circular, triangle etc.) and/or size of first-class work.

Frequency-selective structure 1104 can include conductive material and/or conductor and on conductive material or conductor or apply It is applied to the electromagnetic energy absorption material and/or absorbent of conductive material or conductor.In the frequency-selective structure shown in Figure 11 In 1104 illustrative embodiments, each in three layers of Compact frequency selective surface 1150,1160,1170 includes conductive element Part.In alternative embodiment, each layer frequency-selective structure is not required only to include conducting element.For example, frequency selectivity The illustrative embodiments of structure can include the one or more layers conducting element of no any absorbent, without any conduction The one or more layers electromagnetic energy absorption material of element and/or the one or more layers conducting element thereon with absorbent.

Frequency-selective structure 1104 can include dielectric, and the dielectric can include any suitable dielectric, bag Include dielectric base plate material, air etc..In operation, frequency-selective structure 1104 reflects, absorbs, stops and/or redirected The almost signal of glancing incidence (deviateing 90 degree), to prevent energy.In some illustrative embodiments, frequency-selective structure 1104 (and other frequency-selective structures disclosed herein) can also allow for other objects and/or draft to pass through this Frequency-selective structure.

Figure 12 is example of the insertion loss (or S21) (unit is decibel (dB)) to frequency (unit is gigahertz (GHz)) Property line chart.Result shown in Figure 12 is in three-dimensional or multilayer frequency-selective structure prototype between mutual two antennas are pointed to In the case of obtained by the actual measurement of the reference signal between two antennas.In order to omparison purpose, Figure 12 is additionally included in not With traditional shielding material (for example, having porose sheet metal) in the case where pointing between mutual two antennas, two The modeling result of reference signal between antenna.More specifically, modeling S21 test results generally show having porose three not Signal intensities in the case of being positioned in corresponding one in sheet metal between two antennas, between two antennas.The One sheet metal has the 0.5mm diametric holes for being separated by 1mm.Second sheet metal has the 1mm diametric holes for being separated by 1mm.3rd sheet metal With the 1mm diametric holes for being separated by 1.25mm.

Figure 13 is exemplary line graph of the shield effectiveness (dB) to frequency (GHz).Shield effectiveness limits according to positive decibel.Figure Shield effectiveness shown in 13 is the opposite number of the insertion loss shown in Figure 12.

Figure 12 and Figure 13 totally demonstrates the band resistance ability gold different with having porose three of three-dimensional frequency selective structure Belong to the band of each the resistance ability in piece.Figure 12 generally illustrates three-dimensional frequency selective structure and is directed in about 24GHz to greatly Frequency between about 33GHz more preferably stops, reflects, redirects and/or absorbed energy than having all three porose metal levels. For example, for three-dimensional frequency selective structure insertion loss (Figure 12) and shielding properties (Figure 13) in about 20GHz to 35GHz Between frequency under be better than be separated by 1.25mm 1mm diametric holes the 3rd sheet metal, between about 23GHz to 34GHz Frequency under be better than be separated by 1mm 1mm diametric holes the second sheet metal, and for about 24GHz to about 33GHz it Between frequency under be better than be separated by 1mm 0.5mm diametric holes the first sheet metal.

With resistance grade be better than 60dB under about 30GHz, it means that across or through signal be in reference signal Level 1/1000000.The illustrative embodiments that Figure 12 and Figure 13 also show three-dimensional frequency selective structure are effective Ground stop from about 20GHz to about 35GHz frequency under energy, peak value or maximum insertion and shield effectiveness are about Produced under 30GHz (for example, about negative 60dB insertion loss (Figure 12), about 60dB shield effectiveness (Figure 13) etc.).Although Figure 12 and Figure 13 shows that the example embodiment of three-dimensional frequency selective structure effectively stops from about 20GHz to about Energy under 35GHz frequency, but the other examples embodiment of three-dimensional frequency selective structure can be tuned at it The energy barrier of its suitable frequency or frequency range.Thus, can using multilevel method disclosed herein, illustrative embodiments With the multilayer Compact frequency selective surface including being tuned to produce the wider frequency range for energy barrier.Because other examples Property embodiment can differently be constructed (such as being tuned to the different frequency scope for energy barrier), so Figure 12 There is provided only for the purpose of illustration with the result shown in Figure 13, rather than provided for the purpose of limitation.

In the illustrative embodiments including conductive member or electric conductor, the material of wide scope can be used for conductive member Or electric conductor (for example, 220,320,420,620,720,820 etc.).Examples material includes metal (for example, copper, nickel copper, silver, aluminium Deng), conducing composite material etc..Some illustrative embodiments include conductive member or electric conductor, these conductive members or conductance Body includes conductive pressure sensitive adhesive (the conductive pressure sensitive adhesive such as from laird (Laird)).Only for example, it is exemplary Embodiment includes one or more frequencies with the conductive member made of the adhesive tape of laird's black conductive ribbon 86250 Selective structure, the adhesive tape of laird's black conductive ribbon 86250 are that the nickel copper metallization with conductive pressure sensitive adhesive is knitted Thing.By another example, another exemplary embodiment includes having by corresponding conductive and/or electromagnetic energy absorption pressure sensitive adhesive Conductive and/or electromagnetic energy absorption component one or more frequency-selective structures made of stick.Another is exemplary Embodiment includes one or more frequency-selective structures, and one or more frequency-selective structure includes conduction Al member, element or pattern.

The dielectric of wide scope can be used in illustrative embodiments disclosed herein.For example, in exemplary reality The dielectric component that conductive and/or electromagnetic energy absorption component (for example, 720 etc.) are connected in mode is applied (for example, 740 (Fig. 7 In) etc.) can be made up of plastics (for example, acronitrile-butadiene-styrene (ABS) plastics etc.), non-conductive pressure sensitive adhesive etc.. In the exemplary embodiment, dielectric component 740 is made up of ABS plastic.In another exemplary embodiment, dielectric structure Part 740 is made up of non-conductive or dielectric pressure-sensitive adhesive.

In the illustrative embodiments including dielectric base plate, the material of wide scope can be used for dielectric base plate (example Such as, 228,328,428,528,628,828 etc.).Example dielectric materials include plastics (for example, ABS plastic, polyester film Plastics etc.), composite (for example, FR4 composites etc.), flexible and/or Heat Conduction Material.Illustrative embodiments include having The frequency-selective structure of dielectric base plate including ABS plastic.Another exemplary embodiment includes compound with RF4 is included The frequency-selective structure of the dielectric base plate of material, the composite include the braiding of the epoxy adhesive with fire resisting Glass fibre.Other illustrative embodiments include having dielectric foam base plate (such as, closed cell, crosslinking hydrocarbonization Compound foam is (for example, ECCOSTOCK^TMPP-4 foams etc.)) frequency-selective structure, the dielectric foam base plate has low Dielectric loss, low-k and low-density.

In some illustrative embodiments, frequency-selective structure (for example, 704 etc. in Fig. 7) does not include any electricity Medium substrate.The shortage of dielectric base plate can allow more preferably air flow.For example, frequency-selective structure can wrap Include the conductive member and/or electromagnetic energy absorption structure for hanging without dielectric base plate and being held in place by by dielectric component Part, the dielectric component extend between conductive member and/or electromagnetic energy absorption component.By another example, it is conductive and/or Electromagnetic energy absorption component can independently be attached (adhesive attachment etc.) to one or more sides of open architecture or enclosed construction Wall.For example, conductive and/or electromagnetic energy absorption component can be adhesively attached to it is one or more in the cavity of enclosed construction Internal side wall.Conductive and/or electromagnetic energy absorption component can be along one or more side wall location-independents, to form figure Case or orderly or pattern structure.In another example, conductive and/or electromagnetic energy absorption component can be embedded in open or envelope Close in structure (for example, in the side wall on chassis etc.) or be the open or close indispensable part of structure.

With or without dielectric base plate frequency-selective structure (for example, 104,204,304,404,504,604, 704th, 804,1104 etc.) can be positioned in open architecture so that frequency-selective structure can be used to not exclusively stifled Stop the electromagnetic signal under one or more bands resistance frequency for propagating through open architecture in the case of plug open architecture.Or Person, for example, with or without dielectric base plate frequency-selective structure (for example, 104,204,304,404,504,604, 704th, 804,1104 etc.) can be positioned in the cavity of enclosed construction so that frequency-selective structure can be used to decay The electromagnetic signal under one or more bands resistance frequency in cavity, so as to reduce cavity resonance and/or the electromagnetic energy in cavity Amount is propagated.As another example, with or without dielectric base plate frequency-selective structure (for example, 104,204,304, 404th, 504,604,704,804,1104 etc.) signal-conditioning unit is may be used as, in the signal-conditioning unit, frequency-selective structure It is constructed or is custom made with the repetitive structure that specific frequency components are taken out or removed from signal.As another example, have or not Frequency-selective structure (for example, 104,204,304,404,504,604,704,804,1104 etc.) with dielectric base plate can For use as waveguide, so that harmful EMI redirect to less sensitive region and/or changes electronic box electromagnetic signature, to realize Acceptable performance.

In some illustrative embodiments, frequency-selective structure can be flexible and/or heat conduction (for example, having More than the thermal conductivity of air, have and be more than 0.5 watt every meter thermal conductivity per Kelvin (Kelvin) (w/mK) etc.).Citing comes Say, illustrative embodiments include frequency-selective structure, and the frequency-selective structure, which has, to be sufficient so that it and designing and making Any portion of flexibility of the device can be substantially applied to afterwards by making device.For example, frequency-selective structure can answer Electronic building brick on PCB after manufacture or its top, or be applied to after manufacture PCB and electronic building brick electronic building brick or Its top.

In the exemplary embodiment, flexible frequency-selective structure include non-conductive or dielectric component and/or including The substrate of ABS plastic.Equally in the illustrative embodiments, frequency-selective structure includes conductive member, the conductive member Including conductive pressure sensitive adhesive (for example, adhesive tape of black conductive ribbon 86250 of laird etc.).In another exemplary embodiment In, flexible frequency-selective structure includes conductive member, and the conductive member includes copper and substrate, and the substrate includes polyester film. In this example, copper pattern is etched on polyester film using FR4/PCB manufacturing process, this has thinner and may be easier The advantages of manufacture.

In some illustrative embodiments, frequency-selective structure includes electromagnetic energy absorption material.During use, Electromagnetic energy absorption material can be used to the electromagnetic signal that decay is reflected by frequency-selective structure.In some exemplary implementations In mode (for example, Fig. 2, Fig. 3, Fig. 5, Fig. 6, Fig. 7, Figure 11 etc.), the electromagnetic energy absorption material of wide scope can be used, these Electromagnetic energy absorption material includes absorbing particles, filler, flakelet etc., and/or by conductive and/or magnetic material (such as carbonyl Iron, Sendust (SENDUST) (alloy for containing about 85% iron, 9.5% silicon and 5.5% aluminium), permalloy (contain Have the alloy of about 20% iron and 80% nickel), iron suicide, iron-chromium compound, containing argent, magnetic alloy, Magnaglo, magnetic Property thin slice, magnetic-particle, nickel-base alloy and powder, evanohm and its any combination etc.) be made.Only for example, frequency selects Property structure illustrative embodiments can include electromagnetism from laird and/or as disclosed in United States Patent (USP) 7135643 Energy absorbing material, the entire content of the patent are incorporated herein by reference.Equally, only for example, frequency-selective structure Another illustrative embodiments can include electromagnetic energy absorption material, the electromagnetic energy absorption material includes magnetic carrying Silastic material (for example, ECCOSORB^TMBSR etc.).

As disclosed herein, illustrative embodiments can include conductive member or electromagnetic energy absorption component.In addition Illustrative embodiments can also include both conductive member and electromagnetic energy absorption component, these conductive members and electromagnetism Energy-absorbing member is adjacent, against each other or for stacked arrangement (for example, electromagnetic energy absorption component is stacked on conductive member, Vice versa).Other examples embodiment can include being configured to conductive and electromagnetic energy absorption component.

In some illustrative embodiments, frequency-selective structure can include heat conduction electromagnetic energy absorption material. In this case, heat conduction electromagnetic energy absorption material can be used to electromagnetism letter of the decay by frequency-selective structure reflection Number, at the same also allow frequency-selective structure and integrated circuit, other heat generation electronic building bricks, radiator etc. close to or contact (for example, forming part etc. of heat path) use.In the exemplary embodiment, frequency-selective structure includes coming from Laird and/or the heat conduction electromagnetic energy absorption composite as disclosed in United States Patent (USP) 7608326, in the entirety of the patent Appearance is incorporated herein by reference.

In some illustrative embodiments, have frequency-selective structure single band or multi-band bandstop waveguide and/ Or shielding construction can also be configured to show or have thermal conduction characteristic.The substrate of frequency-selective structure can be heat conduction (for example, the thermal conductivity with least 0.5 watt every meter every Kelvin (W/mK) or more, has the thermal conductivity more than air Deng).In the exemplary embodiment, frequency-selective structure includes substrate, and the substrate includes the composite wood for being loaded with heat filling Material.In single band or multi-band bandstop waveguide and/or shielding construction have or show the illustrative embodiments of thermal conduction characteristic, Thermal conduction characteristic can enable band wave arrestment to lead and/or shielding construction and integrated circuit, other heat generation electronic building bricks, radiating Device etc. close to or contiguously use.For example, thermal conductive belt wave arrestment is led and/or shielding construction can be with one or more heat generations Component is adjacent or contiguously uses so that thermal conductive belt wave arrestment is led and/or at least a portion of shielding construction is (for example, frequency selects Property structure substrate or conductive member etc.) limit or including the heat conduction heat from one or more heat producing components to radiator Measure the part in path.

In some illustrative embodiments, frequency-selective structure have can be incorporated in circuit board, with circuit board collection Into or one, apply on the surface of circuit board, the flexible structure of over or within etc. (such as after common manufacturing process). In some illustrative embodiments, frequency-selective structure can be integrated and/or heat cure is onboard square.It is exemplary at some In embodiment, frequency-selective structure can be arranged in order perpendicular to plate.For example, frequency-selective structure can To be configured to be incorporated into mating surfaces and/or there is the rigidity and flexible nature similar with printed circuit board base board.

Advantageously, including it can be used as single band disclosed herein or the frequency of multi-band bandstop waveguide and/or shielding construction What the illustrative embodiments of rate selective structure can provide in advantages below one or more (but is not required to be any One or all).For example, illustrative embodiments can provide while allowing other gentle streams of object to pass through open architecture Pass through the decay of the electromagnetic signal of open architecture.Band wave arrestment is led and/or shielding construction can be positioned or installed in open architecture In (for example, opening, gap, passage etc.) so that it can be used to do not preventing proximity device or air-flow from passing through open architecture In the case of be attenuating through the electromagnetic signal or energy of open architecture.Because the open area of frequency-selective structure may be used as Air vent, thus frequency-selective structure can be used for needing or it is expected ventilation or air flow application in.Therefore, even in While band wave arrestment is led and/or shielding construction keeps being mounted or located at open architecture, cooling air-flow can also flow through open knot Structure, and/or can be via open architecture proximity device (for example, to test, repairing, safeguarding, to change).Because the band of installation Wave arrestment is led and/or the incomplete occlusion of openings of shielding construction, gap, passage or other open architectures, it is possible to by opening, Gap, passage or other open architectures insertion instrument or test device.This with by it is completely plugged installation they opening, gap, Passage or other open architectures are different come some the existing tradition shieldings operated or absorbing structure.

In addition, electromagnetism letter of the illustrative embodiments including frequency-selective structure inside for enclosed construction of decaying Number when can also provide in advantages below it is one or more (but be not required for any one or all).For example, invention People has found that being attached with the frequency-selective structure of absorber material can use than using the absorbent piece operated on a wide frequency band Existing conventional method significantly less absorber material reduce or mitigate cavity resonance.In some illustrative embodiments In, the major function of frequency-selective structure is to reduce the cavity resonance and electromagnetic energy propagation inside enclosed construction.Equally exist In some illustrative embodiments, frequency-selective structure, which has, reduces electromagnetic energy and EMI screens required inside enclosed construction The miscellaneous function for the amount of covering.In these illustrative embodiments, therefore frequency-selective structure can reach shielding in energy Therefore energy in preceding reduction cavity, thus, frequency-selective structure can advantageously improve bulk shielding performance.

Frequency-selective structure can be designed as decaying or stop under one or more specific frequencies or frequency range Interior electromagnetic energy.Frequency-selective structure can be configured with the smaller open area of conducting element, to allow specific frequency Or frequency range passes through (for example, single band band logical or multiband band logical).Because reduce the size of open area, frequency Selective structure can be operable as also allowing ventilation or the single band of air flow or the waveguide of multiband band logical and/or shielding knot Structure.Frequency-selective structure can be used alone or for example together with one or more waveguiding structures, dielectric/conductive pole, with And other engineering structures are used together, electromagnetic energy, which is directed to, will absorb the region of energy or less heavy to circuit operation The region wanted.As an example, frequency-selective structure may be used as waveguide, the waveguide makes harmful EMI " steering " or is directed to not So sensitive region, and/or change electronic box electromagnetic signature, to realize acceptable performance.As another example, frequency Selective structure can be designed as also allowing one when frequency-selective structure is not used directly to control or mitigate Or more electromagnetic signal under band logical frequency pass through.

Frequency-selective structure disclosed herein can be formed using various methods or techniques.For example, frequency Selective structure can be formed as three-dimensional periodic structure using three-dimensional printing technology.Pass through another example, frequency-selective structure The three-dimensional or sandwich construction for including multilayer Compact frequency selective surface can be formed.Frequency-selective structure can use through hole Via (thru-hole vias) application (for example, 3D printing etc.) onboard and/or in plate, these vias be currently only used for through All layers of ground connection of plate.Plate (is divided into by one or more predetermined or specific regions that frequency-selective structure can be incorporated to plate Different piece) in.The frequency-selective structure made using 3D printing technique can also be configured to allow for air flow.

There is provided example embodiment is intended to make the disclosure will will pass on thoroughly and fully this public affairs to those skilled in the art The scope opened.Many details (for example, particular elements, example of apparatus and method) are illustrated to provide the implementation to the disclosure The thorough understanding of mode.It will be apparent to the person skilled in the art that without using the detail, example Property embodiment can implement in many different forms, be not necessarily to be construed as limit the scope of the present disclosure.In some examples In embodiment, known processing, apparatus structure and technology are not described in.In addition, pass through the one or more of the disclosure The advantages of individual illustrative embodiments can be realized and improvement provide only for explanation, are not intended to limit the scope of the present disclosure, because All above-mentioned advantages and improvements can be provided for illustrative embodiments disclosed herein or above-mentioned advantages and improvements are not provided, and still Fall within the scope of the disclosure.

What specific size, specific material and/or concrete shape disclosed herein were exemplary in nature, it is not intended to limit this public affairs The scope opened.The disclosure of particular value and specific range of values herein for given parameters is not excluded for disclosed herein one or more Other value or the value scopes to be come in handy in individual example.Moreover, it is foreseeable that any two of design parameter as described herein is specific Value can limit the end points for the value scope that may be adapted to given parameters (that is, for the first value of given parameters and the public affairs of second value Opening can be interpreted to disclose any value that can be also used between the first value of given parameters and second value).If for example, originally Parameter X is exemplified as having value A in text, and is also exemplified as having value Z, then it is foreseeable that parameter X can have from about A to About Z value scope.Similarly, it is foreseeable that the disclosure of two or more value scopes of parameter (no matter whether these scopes embedding It is set, overlapping or completely different) it is possible to combine comprising the value scope for utilizing the end points of disclosed scope to be claimed. For example, if parameter X is exemplified as having the value in 1-10 or 2-9 or 3-8 scope herein, it is also foreseen that parameter X can have There are other value scopes including 1-9,1-8,1-3,1-2,2-10,2-8,2-3,3-10 and 3-9.

Terms used herein is intended merely to describe specific example embodiment, it is not intended that is limited.As herein Used, unless the context clearly, the otherwise description of singulative can be intended to include plural form.Term " comprising ", "comprising" and " having " only refer to containing, therefore show described feature, important document, step, operation, element and/or part be present, but One or more further features, important document, step, operation, element, part and/or its combination are not precluded the presence or addition of.Herein Method and step, processing and the operation of description are not necessarily intended to perform according to particular order that is described herein or showing, except non-specific Indicate execution sequence.It will be further understood that additional or alternative step can be used.

When element or layer be referred to as " ... on ", " being joined to ", " being connected to " or " being couple to " another element or layer When, it can engage directly on another element or layer or directly, be connected or coupled to another element or layer, or Intermediary element or layer also may be present in person.On the contrary, when element be referred to as " on directly existing ... ", " being directly joined to ", " be directly connected to To " or when " being directly coupled to " another element or layer, intermediary element or layer may not be present.For describing the relation between element Other words should also be construed in that manner (for example, " between " and " between directly existing ... ", " adjacent " and " direct neighbor ") etc..Such as Used herein, term "and/or" includes any one or more relevant entry and its all combinations.

Term " about " represents to calculate when applied to value or some small inexactnesies of measurement permissible value (are worth close Accurately；About approximate or reasonable approximation；Almost).If as some reasons, the inexactness provided by " about " is in ability Do not understood in domain with common meaning otherwise, then " about " as used herein represents may by common survey method Cause or utilize at least variable caused by these parameters.For example, term " substantially ", " about " and " substantially " is available herein To represent in manufacturing tolerance.Such as modify the present invention's or during the amount of used composition or reactant it is used Term " about " refers to the number change that may occur in the case where there：Such as when preparing concentrate by using typical case Measurement and processing routine, or by being not intended to mistake in these programs to solve the problems, such as in real world；By for making For the difference of the manufacture of composition or the composition for carrying out methods described, source or purity；Etc..Term " about " also include due to The different equilibrium conditions of composition caused by specific original mixture and different amounts.Regardless of whether modified by term " about ", Claim includes the equivalence of amount.

Although may be described herein using term first, second, third, etc. various elements, part, region, layer and/ Or part, these elements, part, region, layer and/or part should not be limited by these terms.These terms can only be used for distinguishing One element, part, region, layer or part and another region, layer or part.Unless context clearly indicates, otherwise this paper institutes The term of such as " first ", " second " and other numerical terms that use does not imply that order or order.Therefore, show not departing from In the case of the teaching of example embodiment, alternatively referred to as second yuan of the first element, part, region, layer or part discussed below Part, part, region, layer or part.

For ease of description, herein may use space relative terms such as " interior ", " outer ", " following ", " lower section ", " under Portion ", " above ", " top " etc. describe an element shown in figure or feature and another element or the relation of feature.Except Outside orientation described in figure, space relative terms can be intended to the different orientation of equipment in use or operation.For example, such as Equipment upset in fruit figure, then being described as be in other elements or the element of feature " lower section " or " following " will be oriented as in institute State other elements or feature " above ".Therefore, exemplary term " lower section " can cover above and below two orientation.Equipment also can be another Row orientation (be rotated by 90 ° or other orientation), then respective explanations are also wanted in the relative description in space used herein.

It is to illustrate and describe to provide embodiment described above.It is not intended to limit or the limitation disclosure.It is special Determine each element of embodiment, be intended to or described purposes or feature are typically not limited to the particular implementation, but suitable It can exchange, and can be used in selected embodiment (even if being not shown or described in detail) in the case of.These realities The mode of applying can also change in many ways.These change is not construed as depart from the disclosure, all such modifications be intended to by It is included in the scope of the present disclosure.

Claims

1. a kind of multilayer frequency-selective structure, the multilayer frequency-selective structure is described for passing through in endless fully blocking air-flow Shielded in the case of multilayer frequency-selective structure or mitigate electromagnetic interference EMI, the multilayer frequency-selective structure includes more Layer Compact frequency selective surface.

2. multilayer frequency-selective structure according to claim 1, wherein, the multilayer Compact frequency selective surface is constructed For that can co-operate for the energy barrier across wideband frequency range.

3. multilayer frequency-selective structure according to claim 1, wherein, the multilayer frequency-selective structure is constructed For that can operate for the energy barrier across frequency range.

4. multilayer frequency-selective structure according to claim 1, wherein, the multilayer frequency-selective structure is constructed For that can operate for across the energy barrier from about 20 gigahertzs to the frequency range of about 35 gigahertzs.

5. multilayer frequency-selective structure according to claim 1, wherein, the multilayer frequency-selective structure is constructed For that can be operated with least about 20 decibels of shield effectiveness across from about 20 gigahertzs to the frequency range of about 35 gigahertzs.

6. multilayer frequency-selective structure according to claim 1, wherein, the multilayer frequency-selective structure is constructed For that can be operated with the maximum shield effectiveness at least 60 decibels of shield effectiveness and/or about 30 gigahertz frequencies.

7. multilayer frequency-selective structure according to any one of claim 1 to 6, wherein, the multilayer frequency selection Property surface in each include by least one opening on the surface, at least one opening is with passing through other multilayers frequency At least one opening alignment of rate selective surface so that air-flow can flow through the alignment of the multilayer Compact frequency selective surface Opening, whereby, it is described for passing through in endless fully blocking air-flow that the multilayer frequency-selective structure is configured to operation Shielded in the case of multilayer frequency-selective structure or mitigate electromagnetic interference EMI.

8. multilayer frequency-selective structure according to any one of claim 1 to 6, wherein：

Each in the multilayer Compact frequency selective surface has annular shape, and the annular shape has and other multilayers frequency The opening of the register of each in rate selective surface；And

The opening of the alignment of the multilayer Compact frequency selective surface allows draft to pass through the multilayer frequency-selective structure.

9. multilayer frequency-selective structure according to any one of claim 1 to 6, wherein, the multilayer frequency selection Property surface include first layer, the second layer and the third layer Compact frequency selective surface of stacked arrangement, wherein the second layer is arranged Between the first layer and the third layer.

10. multilayer frequency-selective structure according to claim 9, wherein：

Each in the first layer, the second layer and third layer Compact frequency selective surface has the ring-type rectangle for possessing opening Shape；And

The opening of the first layer, the second layer and third layer Compact frequency selective surface allows air-flow to pass through multilayer frequency Rate selective structure.

11. multilayer frequency-selective structure according to claim 9, wherein, the second layer is adhesively attached to described One layer and the third layer.

12. multilayer frequency-selective structure according to any one of claim 1 to 6, wherein, the multilayer frequency selection Each in property surface includes：

Conductive member；Or

Electromagnetic energy absorption component；Or

Conductive, electromagnetic energy absorption component；Or

Conductive member and electromagnetic energy absorption component.

13. multilayer frequency-selective structure according to any one of claim 1 to 6, wherein, the multilayer frequency selection Property surface in each include conductive member and be coated to electromagnetic energy absorption material of the conductive member.

14. a kind of method, the described method comprises the following steps：Stacked multilayer Compact frequency selective surface, so as to provide multilayer frequency Selective structure, the multilayer frequency-selective structure are configured to select by the multilayer frequency in endless fully blocking air-flow Shielded in the case of selecting property structure or mitigate electromagnetic interference EMI.

15. according to the method for claim 14, wherein, stacked multilayer Compact frequency selective surface includes making by the multilayer At least one opening of each in Compact frequency selective surface with each in other multilayer Compact frequency selective surfaces extremely A few register so that air-flow can flow through the opening of the alignment of the multilayer Compact frequency selective surface.

16. the method according to claims 14 or 15, wherein, each bag in the multilayer Compact frequency selective surface Include：

Conductive member；Or

Electromagnetic energy absorption component；Or

Conductive, electromagnetic energy absorption component；Or

Conductive member and electromagnetic energy absorption component.

17. the method according to claims 14 or 15, wherein, each in the multilayer Compact frequency selective surface includes Conductive member and the electromagnetic energy absorption material for being coated to the conductive member.

18. a kind of method, the described method comprises the following steps：Include multilayer frequency relative to the positioning of one or more electronic building bricks The multilayer frequency-selective structure of rate selective surface so that the multilayer frequency-selective structure can be operated for endless Shielded in the case of the draft of the fully blocking heat accumulation being used to help reduce in one or more electronic building brick Or mitigate electromagnetic interference EMI.

19. according to the method for claim 18, wherein, each in the multilayer Compact frequency selective surface is included at least One opening, at least one opening and at least one opening pair of each in other multilayer Compact frequency selective surfaces Together so that air-flow can flow through the opening of the alignment of the multilayer Compact frequency selective surface.

20. the method according to claim 18 or 19, wherein, each in the multilayer Compact frequency selective surface includes Conductive member and the electromagnetic energy absorption material for being coated to the conductive member.