CN107845851A - The cavity body filter manufacture method of bolt quantity can be reduced - Google Patents
The cavity body filter manufacture method of bolt quantity can be reduced Download PDFInfo
- Publication number
- CN107845851A CN107845851A CN201710979827.5A CN201710979827A CN107845851A CN 107845851 A CN107845851 A CN 107845851A CN 201710979827 A CN201710979827 A CN 201710979827A CN 107845851 A CN107845851 A CN 107845851A
- Authority
- CN
- China
- Prior art keywords
- cavity
- cover plate
- shell
- conducting resinl
- wave filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/002—Manufacturing hollow waveguides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses the cavity body filter manufacture method that can reduce bolt quantity, follow the steps below successively：The cavity, shell and cover plate that the wave filter of profile will be processed carry out electric conductive oxidation in advance；Position for dispensing glue is needed to be covered the cavity, shell and cover plate of the wave filter for processing profile；After masking, cavity, shell and cover plate are electroplated, remove veil needs point conducting resinl in position for dispensing glue in cavity, shell and cover plate, by cover plate lid on shell, the position point conducting resinl that is contacted to shell with cover plate.It is existing in order to ensure the sealing of cavity and cover plate that the present invention solves prior art, need substantial amounts of bolt is installed and fix, debug and installation process in because caused by demounting bolt repeatedly reduction wave filter service life the problem of, the cavity body filter manufacture method of bolt quantity can be reduced by providing, using when using conducting resinl to being fixed between the cavity, cover plate and shell of wave filter, so as to largely reduce the bolt quantity of wave filter.
Description
Technical field
The present invention relates to cavity body filter manufacturing field, and in particular to can reduce the cavity body filter manufacturer of bolt quantity
Method.
Background technology
In the base station system of mobile communication, the carrying communication number in particular frequency range is generally launched by transmitting antenna
According to signal of communication, and signal of communication is received by reception antenna.Above-mentioned spy is not only included in the signal received by reception antenna
Determine the signal of communication of the carrying communication data in frequency range, but also including the clutter outside many above-mentioned particular frequency ranges or
Interference signal.The carrying communication number in the particular frequency range of transmitting antenna transmitting is obtained in the signal to be received from reception antenna
According to signal of communication, it usually needs the signal that the reception antenna receives is filtered by wave filter, by the carrying communicate number
According to signal of communication specific frequency outside clutter or interference signal filter out.Cavity body filter is generally used in base station system.It is existing
Cavity body filter include the component such as connector, cavity, cover plate, resonatron, bolt, wherein pass through bolt between cavity and cover plate
To seal to prevent electromagnetic exposure, so as to ensure the realization of RF index.In order to ensure the sealing of cavity and cover plate, it is necessary to pacify
Substantial amounts of bolt is filled to be fixed.
In the research and practice process to prior art, existing cavity body filter uses to prevent electromagnetic exposure
A large amount of bolts are fixed, but in debugging and installation, it is necessary to which disassembly and installation cover plate, disassembly and installation workload are huge repeatedly
Greatly.Simultaneously as dismantling a large amount of bolts back and forth, often result in and draw silk phenomenon, reduce the service life of cover plate, batch production effect
Rate is low.
Based on above mentioned problem, the present invention is proposed.
The content of the invention
It is existing in order to ensure the sealing of cavity and cover plate, it is necessary to install substantial amounts of spiral shell that the present invention solves prior art
Bolt is fixed, debug and installation process in because caused by demounting bolt repeatedly reduction wave filter service life the problem of, carry
Cavity body filter manufacture method for bolt quantity can be reduced, when it is applied using conducting resinl to the cavity of wave filter, cover plate with
And be fixed between shell, so as to largely reduce the bolt quantity of wave filter, and then avoid above mentioned problem.
The present invention is achieved through the following technical solutions：
Can reduce the cavity body filter manufacture method of bolt quantity, including wave filter, the wave filter include shell and
The cover plate matched with shell, the enclosure set cavity, followed the steps below successively：
A：The cavity that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
B：Position for dispensing glue is needed to be covered the cavity for the wave filter for processing profile；
C：After masking, cavity is electroplated；
D：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in cavity；
E：Dewater treatment is carried out to the conducting resinl put；
F：The cover plate that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
G：Position for dispensing glue is needed to be covered the cover plate for the wave filter for processing profile；
H：After masking, cover plate is electroplated；
I：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in cover plate；
J：Dewater treatment is carried out to the conducting resinl put；
K：The shell that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
L：Position for dispensing glue is needed to be covered on the shell for the wave filter for processing profile；
M：After masking, shell is electroplated；
N：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in shell；
O：Dewater treatment is carried out to the conducting resinl put；
P：By cover plate lid on shell, the position point conducting resinl that is contacted to shell with cover plate；
Q：Dewater treatment is carried out to the conducting resinl put.
Further, the cavity body filter manufacture method of bolt quantity, the step E, step G, step O and step can be reduced
Conducting resinl dewater treatment is included in rapid Q：It is dehydrated using drying mode or is dehydrated using the mode of air-drying.
Further, the cavity body filter manufacture method of bolt quantity can be reduced, cavity needs a little described in the step D
The position of glue includes：Divider wall end face and cavity housing end face in cavity between single-chamber.
Further, the cavity body filter manufacture method of bolt quantity can be reduced, cover plate needs a little described in the step I
The position of glue includes：The corresponding position in divider wall end face and position corresponding with cavity housing end face between single-chamber in cavity
Put.
Further, the cavity body filter manufacture method of bolt quantity, the step D, step I, step N and step can be reduced
Conducting resinl in rapid P is copper silver conductive adhesive or nickel carbonaceous conductive glue.
The present invention compared with prior art, has the following advantages and advantages：
1st, the present invention puts conducting resinl by gluing process between cavity, cover plate and shell, greatly reduces to realize
The sealing of cover plate and cavity and the bolt quantity installed, make the dismounting of cavity body filter simpler.
2nd, present invention reduces the risk that screw usage amount and generation draw silk, assembling and the operating efficiency debugged are improved.
3rd, by the present invention in that with conducting resinl, RF index has been effectively ensured, has improved the electromagnetic shielding of cavity body filter
Performance.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is the workflow diagram of the present invention.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and accompanying drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment
As shown in figure 1, the cavity body filter manufacture method of bolt quantity can be reduced, including wave filter, the wave filter bag
Shell and the cover plate matched with shell are included, the enclosure sets cavity, followed the steps below successively：
A：The cavity that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
B：Position for dispensing glue is needed to be covered the cavity for the wave filter for processing profile；
C：After masking, cavity is electroplated；
D：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in cavity；
E：Dewater treatment is carried out to the conducting resinl put；
F：The cover plate that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
G：Position for dispensing glue is needed to be covered the cover plate for the wave filter for processing profile；
H：After masking, cover plate is electroplated；
I：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in cover plate；
J：Dewater treatment is carried out to the conducting resinl put；
K：The shell that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
L：Position for dispensing glue is needed to be covered on the shell for the wave filter for processing profile；
M：After masking, shell is electroplated；
N：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in shell；
O：Dewater treatment is carried out to the conducting resinl put；
P：By cover plate lid on shell, the position point conducting resinl that is contacted to shell with cover plate；
Q：Dewater treatment is carried out to the conducting resinl put.
What deserves to be explained is conducting resinl dewater treatment is included in the step E, step G, step O and step Q：Using
Drying mode is dehydrated or is dehydrated using the mode of air-drying.Cavity described in the step D needs position for dispensing glue to include：In cavity
Divider wall end face and cavity housing end face between single-chamber.Cover plate described in the step I needs position for dispensing glue to include：With chamber
Position and position corresponding with cavity housing end face corresponding to divider wall end face between internal single-chamber.The step D, step
I, the conducting resinl in step N and step P is copper silver conductive adhesive or nickel carbonaceous conductive glue.
Above-described embodiment, the purpose of the present invention, technical scheme and beneficial effect are carried out further
Describe in detail, should be understood that the embodiment that the foregoing is only the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution and improvements done etc., all should include
Within protection scope of the present invention.
Claims (5)
1. the cavity body filter manufacture method of bolt quantity can be reduced, it is characterised in that including wave filter, the wave filter includes
Shell and the cover plate matched with shell, the enclosure set cavity, followed the steps below successively：
A：The cavity that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
B：Position for dispensing glue is needed to be covered the cavity for the wave filter for processing profile；
C：After masking, cavity is electroplated；
D：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in cavity；
E：Dewater treatment is carried out to the conducting resinl put；
F：The cover plate that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
G：Position for dispensing glue is needed to be covered the cover plate for the wave filter for processing profile；
H：After masking, cover plate is electroplated；
I：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in cover plate；
J：Dewater treatment is carried out to the conducting resinl put；
K：The shell that the wave filter of profile will be processed carries out electric conductive oxidation in advance；
L：Position for dispensing glue is needed to be covered on the shell for the wave filter for processing profile；
M：After masking, shell is electroplated；
N：Plating is completed, and is removed veil and is needed point conducting resinl in position for dispensing glue in shell；
O：Dewater treatment is carried out to the conducting resinl put；
P：By cover plate lid on shell, the position point conducting resinl that is contacted to shell with cover plate；
Q：Dewater treatment is carried out to the conducting resinl put.
2. the cavity body filter manufacture method according to claim 1 for reducing bolt quantity, it is characterised in that the step
Conducting resinl dewater treatment is included in rapid E, step G, step O and step Q：It is dehydrated using drying mode or using the mode of air-drying
Dehydration.
3. the cavity body filter manufacture method according to claim 1 for reducing bolt quantity, it is characterised in that the step
Cavity needs position for dispensing glue to include described in rapid D：Divider wall end face and cavity housing end face in cavity between single-chamber.
4. the cavity body filter manufacture method according to claim 3 for reducing bolt quantity, it is characterised in that the step
Cover plate needs position for dispensing glue to include described in rapid I：The corresponding position in divider wall end face between single-chamber in cavity and with
Position corresponding to cavity housing end face.
5. the cavity body filter manufacture method according to claim 1 for reducing bolt quantity, it is characterised in that the step
Conducting resinl in rapid D, step I, step N and step P is copper silver conductive adhesive or nickel carbonaceous conductive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710979827.5A CN107845851A (en) | 2017-10-19 | 2017-10-19 | The cavity body filter manufacture method of bolt quantity can be reduced |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710979827.5A CN107845851A (en) | 2017-10-19 | 2017-10-19 | The cavity body filter manufacture method of bolt quantity can be reduced |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107845851A true CN107845851A (en) | 2018-03-27 |
Family
ID=61661539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710979827.5A Withdrawn CN107845851A (en) | 2017-10-19 | 2017-10-19 | The cavity body filter manufacture method of bolt quantity can be reduced |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107845851A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752642A (en) * | 2010-02-09 | 2010-06-23 | 安徽省大富机电技术有限公司 | Cavity filter casing, cavity making method and cover plate making method |
| CN102810715A (en) * | 2011-06-01 | 2012-12-05 | 深圳市大富科技股份有限公司 | Resonance rod, cavity filter and method for manufacturing resonance rod |
| CN103268969A (en) * | 2013-05-06 | 2013-08-28 | 深圳市大富科技股份有限公司 | Cavity filter, filter cavity body and method for manufacturing cavity filter |
| CN104112896A (en) * | 2013-04-16 | 2014-10-22 | 深圳光启创新技术有限公司 | Method of manufacturing harmonic oscillator, harmonic oscillator and filter |
-
2017
- 2017-10-19 CN CN201710979827.5A patent/CN107845851A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752642A (en) * | 2010-02-09 | 2010-06-23 | 安徽省大富机电技术有限公司 | Cavity filter casing, cavity making method and cover plate making method |
| CN102810715A (en) * | 2011-06-01 | 2012-12-05 | 深圳市大富科技股份有限公司 | Resonance rod, cavity filter and method for manufacturing resonance rod |
| CN104112896A (en) * | 2013-04-16 | 2014-10-22 | 深圳光启创新技术有限公司 | Method of manufacturing harmonic oscillator, harmonic oscillator and filter |
| CN103268969A (en) * | 2013-05-06 | 2013-08-28 | 深圳市大富科技股份有限公司 | Cavity filter, filter cavity body and method for manufacturing cavity filter |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180327 |
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| WW01 | Invention patent application withdrawn after publication |