CN107841263A - A kind of water-soluble hot-melt adhesive glue - Google Patents

A kind of water-soluble hot-melt adhesive glue Download PDF

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Publication number
CN107841263A
CN107841263A CN201711127633.9A CN201711127633A CN107841263A CN 107841263 A CN107841263 A CN 107841263A CN 201711127633 A CN201711127633 A CN 201711127633A CN 107841263 A CN107841263 A CN 107841263A
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CN
China
Prior art keywords
parts
water
melt adhesive
emulsion
adhesive glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711127633.9A
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Chinese (zh)
Inventor
王婷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Kelixin New Material Co Ltd
Original Assignee
Sichuan Kelixin New Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Kelixin New Material Co Ltd filed Critical Sichuan Kelixin New Material Co Ltd
Priority to CN201711127633.9A priority Critical patent/CN107841263A/en
Publication of CN107841263A publication Critical patent/CN107841263A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/08Copolymers of ethene
    • C09J123/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853Vinylacetate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • C08K2003/265Calcium, strontium or barium carbonate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention discloses a kind of preparation method of water-soluble hot-melt adhesive glue, including binding agent, tackifier, filler, organic silicon defoamer, organosilicon mould inhibitor and other auxiliary agents and water, it is characterised in that be formulated as follows for the usage ratio based on 100 parts of weight by non-volatile component total amount:10 40 parts of binding agent, 10 30 parts of tackifier, 20 60 parts of filler, the 100000ppm of organic silicon defoamer 10, the 10000ppm of organosilicon mould inhibitor 1,0.1 5 parts of auxiliary agent, 100 300 parts of water.The present invention compared with the existing technology fills up China's blank, is worthy of popularization.

Description

A kind of water-soluble hot-melt adhesive glue
Technical field
The present invention relates to high molecular polymerization emulsion-type glue field, and in particular to a kind of water-soluble hot-melt adhesive glue.
Background technology
As China's medicine equipment and food industry are fast-developing, highly desirable one kind is with ethylene-vinyl acetate copolymer resins The emulsion-type hot-seal glue being processed further for base-material.Disposable medical supplies such as syringe, transfusion device, medical Gauze, sterilization cotton etc. will pass through stringent sterilization before reaching in medical personnel's hand and pack.This packaging material, one Face is transparent plastic sheeting or composite membrane, and another side is to be printed on name of product, the paper of the comment such as specification brand, this paper Easily with pulling brokenly.
Plastic sheeting is typically PVC or PE composite membranes, paper is bonded with PE composite membranes, it is special that this paper will first pass through in advance Working process, typically be coated with one layer of hot-melt adhesive glue.What this glue country oneself can produce preparation is using toluene to be molten Agent, EVA hot-melt resins are dissolved by heating, then add Petropols, microwax, the compounding such as terpene resin, rosin to form, it is a large amount of because having Toluene is present, so being non-environmental type glue, is not welcome by direct labor, is not also received by external businessman.
The content of the invention
In view of this, the application provides a kind of formula of novel aqueous hot-melt adhesive glue, and viscosity is high, hot melt is strong, fills up The market vacancy, meet enterprise demand.
To solve above technical problem, technical scheme provided by the invention is a kind of water-soluble hot-melt adhesive glue, including viscous Tie agent, tackifier, filler, organic silicon defoamer, organosilicon mould inhibitor and other auxiliary agents and water, it is characterised in that formula is not by waving It is as follows for the usage ratio of 100 parts of weight meters to send out component total amount:
Preferably, binding agent used from low ethylene content EVA emulsions and high ethylene contents EVA emulsions it is compound and Into, described EVA emulsions, it is with two kinds of monomers of ethene and vinyl acetate, reacts formed solid by emulsion copolymerization and contain The demarcation emulsion of amount about 50%, the EVA emulsions of described high ethylene contents refer to the ratio of two kinds of monomers in copolymer resins, second Alkene content accounts for the 40-86% of total amount, and the EVA emulsions of low ethylene content refer to two kinds of monomer ratios, ethylene contents in copolymer resins Account for the 5-30% of total amount;Counted by 100 parts of weight of binding agent solid amount, the ratio of two kinds of EVA emulsions is:High ethene EVA breasts Liquid 90-50 parts, low ethene EVA emulsions 10-50 parts
Preferably, one or several kinds of compositions that the tackifier are selected in following latex:Terpene phenolic resin emulsion, it is modified Rosin milk, rosin milk, acrylate copolymer emulsion, ethylene-vinyl chloride copolymer emulsion, vinyl acetate-chloroethylene copolymer emulsion, Binding agent and tackifier usage ratio, by weight:
Binding agent 90-40 parts
Tackifier 60-10 parts
Preferably, silicon powder, calcium carbonate, silica flour, talcum powder, mica powder, kaolin, bentonite etc. one can be selected in filler Kind or it is several mix, resin demand and amount of filler ratio by mass:
Resin 80-35 parts
Filler 65-20 parts
Preferably, from nontoxic organosilicon quaternary ammonium salt as mould inhibitor.
Preferably, the defoamer of selection is organic silicon defoamer.
The present invention compared with the existing technology have technique is simple, cost is low, the advantages of, and this research is linked closely both at home and abroad High molecular polymerization developing direction, it is market-oriented, China's blank is filled up, meets market in urgent need, invested in plant can be met Manufacturing technique requirent, can produce environment-friendly type, three wastes, it is water-based, without organic solvent, it is nontoxic, without blast, without danger of combustion New type hot-melt adhesive glue, is worthy of popularization.
Embodiment
In order that those skilled in the art more fully understands technical scheme, with reference to specific embodiment pair The present invention is described in further detail.
Embodiment 1
In the pill tank that a capacity is 300 liters, 48 kilograms of silicon powder, 100 kilograms of distilled water are added, and add mould inhibitor 10 grams, 100 grams of defoamer, 750 grams of sulfuric acid sulfonation butyl oleate ammonium salt, 600 grams of cetyl alcohol ethylene oxide condensate, hydroxyl second 500 grams of base cellulose, stirring motor is started, after stirring half an hour to 1 hour, add the high ethylene contents of solid content 50% 80 kilograms of EVA emulsions, 20 kilograms of the EVA emulsions of the low ethylene content of solid content 50% are added, after stirring, adds and contains 10 kilograms of the acrylate copolymer emulsion of amount 30%, continue under agitation, to add the public affairs of terpenes phenolic aldehyde emulsion 16 that solid content is 50% Jin, then add 20 kilograms of the rosin milk of solid content 50%, after stirring, PH is adjusted to neutral or alkalescence with ammoniacal liquor.Stirring Discharged after uniformly.
Embodiment 2
In the pill tank of one 300 liters of capacity, 100 kilograms of distilled water, 500 grams of lauryl sodium sulfate, nonyl benzene are added 750 grams of phenol ethylene oxide condensates, 50 grams of mould inhibitor, 500 grams of defoamer are added, start stirring motor, add silicon powder 24 Kilogram, 24 kilograms of Paris white is added, after stirring half an hour to 1 hour, adds the high ethylene contents that solid content is 50% 60 kilograms of EVA emulsions, 40 kilograms of the EVA emulsions of the low ethylene content of solid content 50% are added, after stirring, adds and contains Admittedly measuring 10 kilograms of 30% acrylate copolymer emulsion, continue under agitation, to add the public affairs of terpenes phenolic aldehyde emulsion 16 that solid content is 50% Jin, then add 20 kilograms of the rosin milk of solid content 50%, after stirring, PH is adjusted to neutral or alkalescence with ammoniacal liquor, then Discharging.
Embodiment 3
In 300 liters of pill tank, 100 kilograms of distilled water, 250 grams of succinic acid ethylhexyl sodium sulphate salt, trimerization are added Year, 600 grams of potassium phosphate, (40%) 250 gram of Alkali-soluble acrylic's copolymer emulsion, add 20 grams of mould inhibitor, 200 grams of defoamer, Stirring motor is started, 12 kilograms of silicon powder, 12 kilograms of Paris white is added, 12 kilograms of silica flour, 12 kilograms of talcum powder, then stirs After mixing half an hour to 1 hour, high 70 kilograms of the ethylene contents EVA emulsions that solid content is 50% are added, add solid content 50% Low ethylene content 30 kilograms of EVA emulsions, after stirring, add 15 kilograms of 30% acrylate copolymer emulsion of solid content, 31 kilograms of the rosin milk that solid content is 50% is added, after stirring, PH is adjusted to neutral or alkalescence with ammoniacal liquor.
Embodiment 4
In the pill tank of 300 liters of capacity, 100 kilograms of distilled water, 500 grams of alkyl virtue agent PEO, sorghum are added 500 grams of dextrin, 500 grams of sodium pyrophosphate, 30 grams of mould inhibitor, 300 grams of defoamer are added, start stirring motor, add silicon powder 12 kilograms, 12 kilograms of Paris white is added, 12 kilograms of silica flour, 12 kilograms of talcum powder, then stirs half an hour to 1 hour Afterwards, 70 kilograms of the EVA emulsions for the high ethylene contents that solid content is 50% are added, add the low ethylene content of solid content 50% 30 kilograms of EVA emulsions, after stirring, 5 kilograms of 30% acrylate copolymer emulsion of solid content is added, adds solid content 50% 10 kilograms of rosin milk, 10 kilograms of ethylene-vinyl chloride copolymer emulsion, vinyl acetate -10 kilograms of chloroethylene copolymer emulsion, stirring are equal It is even, PH is adjusted to neutral or alkalescence with ammoniacal liquor.
It the above is only the preferred embodiment of the present invention, it is noted that above-mentioned preferred embodiment is not construed as pair The limitation of the present invention, protection scope of the present invention should be defined by claim limited range.For the art For those of ordinary skill, without departing from the spirit and scope of the present invention, some improvements and modifications can also be made, these change Enter and retouch and also should be regarded as protection scope of the present invention.

Claims (6)

1. a kind of water-soluble hot-melt adhesive glue, including binding agent, tackifier, filler, organic silicon defoamer, organosilicon mould inhibitor and Other auxiliary agents and water, it is characterised in that be formulated as follows for the usage ratio based on 100 parts of weight by non-volatile component total amount:
2. a kind of water-soluble hot-melt adhesive glue according to claim 1, it is characterised in that binding agent used selects low ethene The EVA emulsions of content and the EVA emulsions of high ethylene contents are combined, and described EVA emulsions, are with ethene and vinyl acetate two Kind monomer, react the demarcation emulsion that formed solids content is about 50%, described high ethylene contents by emulsion copolymerization EVA emulsions refer to the ratios of two kinds of monomers in copolymer resins, ethylene contents account for the 40-86% of total amount, the EVA of low ethylene content Emulsion refers to two kinds of monomer ratios in copolymer resins, and ethylene contents account for the 5-30% of total amount;Using binding agent solid amount as 100 parts Weight meter, the ratio of two kinds of EVA emulsions are:High ethene EVA emulsions 90-50 parts, low ethene EVA emulsions 10-50 parts.
3. a kind of water-soluble hot-melt adhesive glue according to claim 1, it is characterised in that tackifier are selected in following latex One or several kinds of compositions:Terpene phenolic resin emulsion, modified rosin emulsion, rosin milk, acrylate copolymer emulsion, ethene- Chloroethylene copolymer emulsion, vinyl acetate-chloroethylene copolymer emulsion, binding agent and tackifier usage ratio, by weight:
Binding agent 90-40 parts
Tackifier 60-10 parts.
4. a kind of water-soluble hot-melt adhesive glue according to claim 1, it is characterised in that silicon powder, carbon can be selected in filler The one or several kinds such as sour calcium, silica flour, talcum powder, mica powder, kaolin, bentonite are mixed, and resin demand and filler are used Measure ratio by mass:
Resin 80-35 parts
Filler 65-20 parts.
5. a kind of water-soluble hot-melt adhesive glue according to claim 1, its feature exist, in from nontoxic organosilicone quaternary ammonium Salt is as mould inhibitor.
6. novel aqueous hot-melt adhesive glue according to claim 1, it is characterised in that the defoamer of selection defoams for organosilicon Agent.
CN201711127633.9A 2017-11-15 2017-11-15 A kind of water-soluble hot-melt adhesive glue Pending CN107841263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711127633.9A CN107841263A (en) 2017-11-15 2017-11-15 A kind of water-soluble hot-melt adhesive glue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711127633.9A CN107841263A (en) 2017-11-15 2017-11-15 A kind of water-soluble hot-melt adhesive glue

Publications (1)

Publication Number Publication Date
CN107841263A true CN107841263A (en) 2018-03-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109227860A (en) * 2018-10-18 2019-01-18 李�杰 A kind of technique increasing Formaldehyde Free Wood-based Panel Prepressing intension using hot melt adhesive
CN109735118A (en) * 2019-01-05 2019-05-10 青岛马基泰商贸有限公司 A kind of environment protection colour sealing wax and preparation method thereof, application
CN114181645A (en) * 2021-12-25 2022-03-15 宁波内索尔工具有限公司 Environment-friendly hot-melt glue and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109227860A (en) * 2018-10-18 2019-01-18 李�杰 A kind of technique increasing Formaldehyde Free Wood-based Panel Prepressing intension using hot melt adhesive
CN109735118A (en) * 2019-01-05 2019-05-10 青岛马基泰商贸有限公司 A kind of environment protection colour sealing wax and preparation method thereof, application
CN109735118B (en) * 2019-01-05 2023-10-24 青岛马基泰商贸有限公司 Environment-friendly color sealing wax and preparation method and application thereof
CN114181645A (en) * 2021-12-25 2022-03-15 宁波内索尔工具有限公司 Environment-friendly hot-melt glue and preparation method thereof
CN114181645B (en) * 2021-12-25 2023-02-03 宁波内索尔工具有限公司 Environment-friendly hot-melt glue and preparation method thereof

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Application publication date: 20180327