CN107818861B - 使用一种封装结构来封装锥形电感的方法 - Google Patents

使用一种封装结构来封装锥形电感的方法 Download PDF

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CN107818861B
CN107818861B CN201710898019.6A CN201710898019A CN107818861B CN 107818861 B CN107818861 B CN 107818861B CN 201710898019 A CN201710898019 A CN 201710898019A CN 107818861 B CN107818861 B CN 107818861B
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李国成
李明
闫海涛
祝宁华
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Puyang Photoelectric Technology Industry Research Institute
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/022Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/005Impregnating or encapsulating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings

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Abstract

本发明属于微波和元器件封装领域,具体涉及使用一种封装结构来封装锥形电感的方法。该封装锥形电感的方法包括如下步骤:首先,将锥形电感的引脚一和引脚二穿过下楔形体内的左通孔和右通孔分别与下楔形体下表面电极一和电极二相连;然后将电极一和电极二直接与外围电路引脚焊接,使得整个封装结构能够表贴于外围电路当中;最后用耐高温胶将锥形电感固定在由上楔形体和下楔形体组成的锥形空腔内,同时将对称的上楔形体和下楔形体粘固在一起完成封装。该封装结构可以在不改变现有锥形电感的几何尺寸的情况下改变锥形电感的带宽,同时该封装结构使得锥形电感能够通过表贴技术进行焊接。

Description

使用一种封装结构来封装锥形电感的方法
技术领域
本发明属于微波和元器件封装领域,具体涉及使用一种封装结构来封装锥形电感的方法。
背景技术
在微波射频电路中,通常需要选择电感将射频电路和直流供电电路进行隔离,防止信号之间的相互干扰,同时微波射频电路又具有带宽宽、频率高的特点,普通的电感不能够满足宽带宽的要求,因此通常会选取锥形电感。与普通电感相比,锥形电感因其特殊的几何结构能够实现对一定带宽的射频信号进行隔离,但锥形电感的带宽主要取决于其自身的几何结构,通过调整现有的几何结构来实现更宽的带宽具有一定局限性和困难。并且目前的锥形电感主要是由国外厂家进行生产且大多数为“飞线”结构,在装配过程中有巨大的困难,不能够借助现有的贴片工艺进行自动化焊接。
发明内容
本发明的目的是针对现有技术中存在的问题提供了使用一种封装结构来封装锥形电感的方法,该封装结构可以在不改变现有锥形电感的几何尺寸的情况下改变锥形电感的带宽,同时该封装结构使得锥形电感能够通过表贴技术进行焊接。
本发明提供的技术方案是:
使用一种封装结构来封装锥形电感的方法,包括一种封装结构,所述的封装结构包括上楔形体和下楔形体,所述的上楔形体和下楔形体为对称设置,所述的上楔形体和下楔形体组合体开设有孔形成锥形空腔用来放置锥形电感,所述的下楔形体的下表面镀有电极一和电极二,所述的下楔形体设置有左通孔和右通孔,所述的锥形电感的引脚一和引脚二通过左通孔和右通孔分别与下楔形体下表面电极一和电极二相连,所述电极一和电极二直接与外围电路相焊接。
所述的封装锥形电感的方法包括如下步骤:首先,将锥形电感的引脚一和引脚二穿过下楔形体内的左通孔和右通孔分别与下楔形体下表面电极一和电极二相连;然后将电极一和电极二直接与外围电路引脚焊接,使得整个封装结构能够表贴于外围电路当中;最后用耐高温胶将锥形电感固定在由上楔形体和下楔形体组成的锥形空腔内,同时将对称的上楔形体和下楔形体粘固在一起完成封装。
具体的,所述上楔形体和下楔形体由绝缘、散热性能好、磁阻大于空气磁阻的材料制作。
本发明采用对称楔形体封装锥形电感,端口的磁力线相对于“飞线型”锥形电感的磁力线密度更大,磁场强度更强,表现为同频率下阻抗特性更好,因此这种封装能在不改变锥形电感现有的尺寸和制作工艺的基础的情况下,能提高锥形电感的带宽;使用本发明进行封装的锥形电感能够利用成熟的表贴技术进行贴装,提高生产效率,简化安装工艺,降低生产成本,同时也可以采用现有的分装型号进行定义,如0806-G40表示封装体的长80mil,宽60mil,带宽40G,并将型号丝印在封装体的上表面。
附图说明
图1是本发明所述的一种封装结构的平面示意图;
图2是本发明所述的一种封装结构的立体图;
图3是采用本发明所述的对称楔形体封装结构的锥形电感磁力线分布示意图;
图4为普通“飞线型”锥形电感磁力线分布示意图。
1上楔形体 2下楔形体 3锥形电感 4引脚一 5引脚二 6左通孔
7右通孔 8电极一 9电极二。
具体实施方式
如图所示1所示为本发明所提供的一种封装结构的示意图,其包括上楔形体1和下楔形体2,所述的上楔形体1和下楔形体2为对称设置,所述的上楔形体1和下楔形体2组合体开设孔形成锥形空腔用来放置锥形电感3,所述的下楔形体2的下表面镀有电极一8和电极二9,所述的下楔形体设置有左通孔6和右通孔7,所述的锥形电感3的引脚一4和引脚二5通过左通孔6和右通孔7分别与下楔形体2下表面电极一8和电极二9相连,所述电极一8和和电极二9直接与外围电路相焊接。所述上楔形体1和下楔形体2由绝缘、散热性能好、磁阻大于空气磁阻的材料制作。
一种使用上述封装结构来封装锥形电感的方法,包括如下步骤:首先,将锥形电感的引脚一4和引脚二5穿过下楔形体2内的左通孔6和右通孔7分别与下楔形体2下表面电极一8和电极二9相连;然后将电极一8和电极二9直接与外围电路引脚焊接,使得整个封装结构能够表贴于外围电路当中;最后用耐高温胶将锥形电感3固定在由上楔形体1和下楔形体2组成的锥形空腔内,同时将对称的上楔形体1和下楔形体2粘固在一起完成封装。
如图3所示为采用本发明所述的对称楔形体封装结构的锥形电感磁力线分布示意图;图4为普通“飞线型”锥形电感磁力线分布示意图,“飞线型”锥形电感磁力线分布于整个空间,锥形电感的小端口磁力线分布密集对高频信号有较高的阻抗特性,锥形状电感大端口对低频率电磁波具有较高的阻抗特性,相比较可以明显得出用本发明提供的对称楔形体封装的锥形电感,两端口的磁力线相对于“飞线型”锥形电感的磁力线密度更大,磁场强度更强,表现为同频率下阻抗特性更好,因此这种封装能在不改变锥形电感几何尺寸的情况下,能提高锥形电感的带宽。
最后应当说明的是:以上实施例仅用以说明本发明的技术方案而非对其限制;尽管参照较佳实施例对本发明进行了详细的说明,所属领域的普通技术人员应当理解:依然可以对本发明的具体实施方式进行修改或者对部分技术特征进行等同替换;而不脱离本发明技术方案的精神,其均应涵盖在本发明请求保护的技术方案范围当中。

Claims (2)

1.使用一种封装结构来封装锥形电感的方法,包括一种封装结构,其特征在于,所述的封装结构包括上楔形体(1)和下楔形体(2),所述的上楔形体(1)和下楔形体(2)为对称设置,所述的上楔形体(1)和下楔形体(2)组合体开设有孔形成锥形空腔用来放置锥形电感(3),所述的下楔形体(2)的下表面镀有电极一(8)和电极二(9),所述的下楔形体(2)设置有左通孔(6)和右通孔(7),所述的锥形电感(3)的引脚一(4)和引脚二(5)通过左通孔(6)和右通孔(7)分别与下楔形体(2)下表面电极一(8)和电极二(9)相连,所述电极一(8)和电极二(9)直接与外围电路相焊接;
所述的封装锥形电感的方法包括如下步骤:首先,将锥形电感的引脚一(4)和引脚二(5)穿过下楔形体(2)内的左通孔(6)和右通孔(7)分别与下楔形体(2)下表面电极一(8)和电极二(9)相连;然后将电极一(8)和电极二(9)直接与外围电路引脚焊接,使得整个封装结构能够表贴于外围电路当中;最后用耐高温胶将锥形电感(3)固定在由上楔形体(1)和下楔形体(2)组成的锥形空腔内,同时将对称的上楔形体(1)和下楔形体(2)粘固在一起完成封装。
2.根据权利要求1所述使用一种封装结构来封装锥形电感的方法,其特征在于,所述上楔形体(1)和下楔形体(2)由绝缘、散热性能好、磁阻大于空气磁阻的材料制作。
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CN103839661A (zh) * 2014-03-12 2014-06-04 华为技术有限公司 一种锥形电感、印刷电路板以及光模块

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Publication number Priority date Publication date Assignee Title
CN1967747A (zh) * 2005-10-31 2007-05-23 有限会社Noc 绕线式电感器
CN201845638U (zh) * 2010-11-08 2011-05-25 贵阳顺络迅达电子有限公司 一种宽带电感器
CN103839661A (zh) * 2014-03-12 2014-06-04 华为技术有限公司 一种锥形电感、印刷电路板以及光模块

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