CN107809054B

CN107809054B - LD array surface light source packaging structure based on PCB board

Info

Publication number: CN107809054B
Application number: CN201711062223.0A
Authority: CN
Inventors: 熊晓丹; 林犀
Original assignee: Beijing Yinglai Technology Co ltd
Current assignee: Beijing Yinglai Technology Co ltd
Priority date: 2017-11-02
Filing date: 2017-11-02
Publication date: 2020-10-20
Anticipated expiration: 2037-11-02
Also published as: CN107809054A

Abstract

The invention relates to the field of semiconductor laser illumination imaging, in particular to an LD array surface light source packaging structure based on a PCB (printed Circuit Board), which has the advantages of simple structure, weak speckle effect and low production cost.

Description

LD array surface light source packaging structure based on PCB board

Technical Field

The invention relates to the field of semiconductor laser illumination imaging, in particular to an LD array surface light source packaging structure based on a PCB.

Background

With the development of laser technology, laser is widely applied due to the advantages of narrow line width, directivity and the like, and particularly, a semiconductor laser has the characteristics of small volume, high electro-optical efficiency and the like, and is widely applied to the field of laser illumination imaging.

In the field of laser illumination, surface light sources are generally obtained in two ways: one way is to expand/reshape with a beam of laser light, and the other way is to use an LD chip for area array packaging. In the beam expanding mode, because only one or a plurality of LDs exist, the image speckle effect is serious, and therefore, large-scale LD chip area array packaging is adopted well. At present, the packaging technology of the semiconductor laser array mainly comprises a bar (bar), a vertical stack, a horizontal stack and the like, and a plurality of main packaging technologies are one-dimensional packaging and are not suitable for laser illumination in cost and production.

The LD is packaged on the heat sink at present, and the existing patents are all directed to improvement of the packaging structure between the LD and the heat sink, such as patent 201310401971.2, and do not depart from the traditional packaging mode of LD + heat sink. In practical application of laser illumination, a large number of LD chips are often needed, the heat sink packaging manner is not favorable for large-scale packaging of LDs, and the system is complex and high in cost.

Taiwan patent (certificate No. M379174, laser diode array COB module) proposes a method for packaging LD array On PCB (i.e. COB, Chip On Board), but the method only installs LD On the edge of PCB, laser light exits parallel to PCB Board, and still is one-dimensional linear array package in horizontal direction, and the structure is similar to bar, as shown in fig. 1 below, which is realized by stacking COB in vertical direction, and the vertical direction spacing is limited by PCB assembly spacing, furthermore, the arrangement direction of LD in this method is consistent, smile effect is easily formed, and speckle is not easily weakened, and this packaging method is not suitable for reducing packaging cost, and meanwhile, assembly and debugging are difficult, and driving is complicated.

Disclosure of Invention

In order to solve the problems, the invention provides an LD array surface light source packaging structure based on a PCB, which has the advantages of simple structure, weak speckle effect and low production cost.

The technical scheme is as follows: the utility model provides a LD array area source packaging structure based on PCB board, its includes the PCB board, its characterized in that, the welding has two at least LD area source units on the PCB board, LD area source unit is formed by single LD chip and the encapsulation of complex light deflection device.

The LED surface light source unit is further characterized in that the LD surface light source unit is arranged on the PCB board through an SMT paster process;

the LD area light source units are arranged in disorder;

the light deflection device is a plane reflector, a right-angle prism, a trapezoidal prism or a lens;

the reflecting surface of the reflecting component faces the PCB, and the PCB is correspondingly provided with through holes.

After the structure of the invention is adopted, the LD and the light deflection device are completely packaged on one PCB, and the COB-based surface light source is directly formed, the speckle effect is weak, the structure is simple, and the mature SMT paster process can be directly utilized in production, and the production cost is low.

Drawings

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a schematic structural view of the present invention;

fig. 3 is a first front view of an LD surface light source unit;

fig. 4 is a first top view of the LD surface light source unit;

fig. 5 is a second front view of the LD surface light source unit;

FIG. 6 is a schematic diagram of an LD side light-emitting structure;

FIG. 7 is a schematic reflection diagram of a right angle prism.

Detailed Description

As shown in fig. 2, an LD array surface light source package structure based on a PCB comprises a PCB 1, at least two LD surface light source units are welded on the PCB 1, and the LD surface light source units are formed by packaging a single LD chip 2 and a matched planar reflector 3, and the structure of the LD surface light source unit can be as shown in fig. 3 or fig. 4, wherein light is reflected upwards, or as shown in fig. 5, light is emitted downwards, at this time, the planar reflector 3 faces the PCB 1, the PCB 1 is correspondingly provided with through holes 4, and the LD surface light source units are mounted on the PCB 1 through an SMT surface mount technology; the LD surface light source units are arranged in disorder, so that the speckle effect can be reduced to the maximum extent; instead of using the plane mirror 3, a right-angle prism 5, a trapezoidal prism, or a lens may be used to deflect light, as shown in fig. 7, and fig. 6 shows an LD-side light emitting structure.

Claims

1. An LD array surface light source packaging structure based on a PCB comprises the PCB and is characterized in that at least two LD surface light source units are welded on the PCB and are formed by packaging a single LD chip and a matched light deflection device; the LD surface light source unit is arranged on the PCB through an SMT (surface mount technology) chip mounting process; the LD area light source units are arranged in disorder; the light deflection device is a plane reflector, a right-angle prism, a trapezoidal prism or a lens; the reflecting surface of the reflecting component faces the PCB, and the PCB is correspondingly provided with through holes.