CN107808841A - A kind of nation's header structure of 180 ° of bonders - Google Patents
A kind of nation's header structure of 180 ° of bonders Download PDFInfo
- Publication number
- CN107808841A CN107808841A CN201711313999.5A CN201711313999A CN107808841A CN 107808841 A CN107808841 A CN 107808841A CN 201711313999 A CN201711313999 A CN 201711313999A CN 107808841 A CN107808841 A CN 107808841A
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- China
- Prior art keywords
- swing arm
- contiguous block
- axis
- nation
- header structure
- Prior art date
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- Pending
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 230000000694 effects Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000010355 oscillation Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
A kind of nation's header structure of 180 ° of bonders, including drive device and oscillating arm mechanisms, the drive device includes Z axis motor and electric rotating machine, Z axis motor is in Z axis mounting seat, the motor shaft of Z axis has eccentric shaft by bearing attaching, attaching has connecting rod on eccentric shaft, connecting rod attaching has Z axis contiguous block, the motor shaft attaching of electric rotating machine has rotary shaft, rotary shaft is provided with swing arm guide rail, swing arm contiguous block is installed with the swing arm guide rail, swing arm contiguous block is rotatablely connected by fixing axle and Z axis contiguous block and passes through nut check, oscillating arm mechanisms are fixedly connected with swing arm contiguous block, electric rotating machine drives oscillating arm mechanisms 180 degree scale oscillation.The present invention uses flexible swing arm structure, can adjust swing arm pressure, improves swing arm flexibility, the design of nation's header structure of 180 ° of bonders, can improve die bond speed while efficiently reducing and being laid out between nation's Head Section volume, each part of optimization.
Description
Technical field
The present invention relates to a kind of nation's header structure being used in LED bonders, specifically one kind can realize 180 ° of height
The die bond nation header structure of speed motion.
Background technology
At present, domestic LED industry continues to develop, and die bond is one of flow the most key in LED component manufacture, because
This, also more and more higher is required to the capacity efficiency of LED bonders.The process of LED die bonds includes：First on LED support on point
Elargol or insulating cement, then LED chip is bonded in by support relevant position by vacuum suction with swinging arm device.Put in the process
Arm assembly needs to carry out high frequency, come and gone, short distance motion, and can the structure of swing arm meet that the requirement of high-speed, high precision die bond turns into solid
The major criterion that brilliant machine performance judges；Flexible swinging arm device structure can adjust swing arm pressure according to different chips, prevent from pressing
Power is excessive and broken grain situation occurs.
For current LED chip die bond operating efficiency, machining accuracy and reliability be not high the problems such as, improve bonder knot
Structure, research and development are applied to the swing arm structure of high-frequency high-precision processing, turn into the important directions of current LED bonders research and development.
The content of the invention
The technical problem to be solved in the present invention is a kind of nation's header structure of 180 ° of bonders, can efficiently reduce nation's head
Die bond speed is improved while layout between area's volume, each part of optimization.
In order to solve the above-mentioned technical problem, the present invention takes following technical scheme：
A kind of nation's header structure of 180 ° of bonders, including drive device and oscillating arm mechanisms, the drive device include Z axis motor and
Electric rotating machine, for Z axis motor in the Z axis mounting seat, the motor shaft of Z axis has an eccentric shaft by bearing attaching, attaching on eccentric shaft
There is connecting rod, connecting rod attaching has Z axis contiguous block, and the motor shaft attaching of electric rotating machine has rotary shaft, and rotary shaft is provided with swing arm guide rail,
Swing arm contiguous block is installed with the swing arm guide rail, swing arm contiguous block is rotatablely connected by fixing axle and Z axis contiguous block and passes through spiral shell
Mother's locking, oscillating arm mechanisms are fixedly connected with swing arm contiguous block, and electric rotating machine drives oscillating arm mechanisms 180 degree scale oscillation.
Line slideway is equiped with the Z axis mounting seat, Z axis contiguous block clamps with line slideway activity.
The swing arm structure includes swing arm seat and swing arm, and swing arm is arranged in swing arm seat, and swing arm seat is consolidated with swing arm contiguous block
Fixed connection, swing arm end is equiped with vacuum slot.
The swing arm is by screw locking in swing arm seat.
The screw is provided with pressure-regulating device.
The pressure-regulating device includes the spring being sleeved on screw and the nut being locked on the screw, spring one end
It rest against spring, the other end rest against swing arm.
It is described that elastic connection block is installed between swing arm contiguous block and swing arm.
The sensor for detection chip is additionally provided with the swing arm.
The invention has the advantages that：
1. the swing arm structure that the present invention uses can rotate 180 ° about the z axis, compared to the 90 ° of rotary swinging arm structures commonly used in bonder
Efficiently reduce swing arm and take volume, increase space availability ratio, while optimize the layout between each part, improve die bond effect
Rate.
2. the present invention is designed using the swing arm structure of flexibility, pressure is set to adjust dress in swing arm frame and swing arm junction
Put, adjust spring-compressed degree using nut so as to adjust swing arm pressure, while be equipped between swing arm contiguous block and swing arm
Flexible connection piece, improve flexibility and nozzle absorption chip shock resistance and the freedom from vibration of swing arm motion process.
Brief description of the drawings
Accompanying drawing 1 is dimensional structure diagram of the present invention；
Accompanying drawing 2 is side structure schematic view of the present invention；
Accompanying drawing 3 is the dimensional structure diagram of oscillating arm mechanisms of the present invention.
Embodiment
For the feature of the present invention, technological means and the specific purposes reached, function can be further appreciated that, with reference to
Accompanying drawing is described in further detail with embodiment to the present invention.
As shown in accompanying drawing 1,2 and 3, present invention is disclosed a kind of nation's header structure of 180 ° of bonders, including drive device and
Oscillating arm mechanisms 2, the drive device include Z axis motor 3 and electric rotating machine 4, and Z axis motor 3 is in Z axis mounting seat 7, Z axis axle
The motor shaft of motor 3 has an eccentric shaft 6 by the attaching of bearing 5, on eccentric shaft 6 attaching have connecting rod 8, the attaching of connecting rod 8 has Z axis contiguous block
9, the motor shaft attaching of electric rotating machine 4 has rotary shaft 11, and rotary shaft 11 is provided with swing arm guide rail 12, clamped on the swing arm guide rail 12
There is swing arm contiguous block 13, swing arm contiguous block 13 is rotatablely connected and by nut check, swing arm by fixing axle and Z axis contiguous block 9
Mechanism is fixedly connected with swing arm contiguous block 13, and electric rotating machine 4 drives oscillating arm mechanisms 180 degree scale oscillation.Filled in Z axis mounting seat 7
Provided with line slideway 10, Z axis contiguous block 9 clamps with the activity of line slideway 10.Z axis motor driven eccentric shaft turns, eccentric shaft
Drivening rod moves up and down, and then drives Z axis contiguous block is lower in the Z-axis direction to move, and by the restriction of line slideway, protects
Demonstrate,prove the accuracy moved up and down.
The swing arm structure includes swing arm seat 14 and swing arm 15, and swing arm 15 is arranged in swing arm seat 14, swing arm seat 14 and pendulum
Arm contiguous block 13 is fixedly connected, and the end of swing arm 15 is equiped with vacuum slot 16, passes through vacuum slot absorption chip.May be used also in swing arm
It is equiped with and the sensor in detection chip.
Swing arm 15 is locked in swing arm seat 14 by screw 18.Screw 18 is provided with pressure-regulating device 17, passes through the pressure
Apparatus for adjusting force adjusts the pressure of swing arm.Pressure-regulating device includes the spring 19 being sleeved on screw 18 and is locked at the screw
Nut 20 on 18, spring one end rest against spring, the other end rest against swing arm., can be with by the locked position of adjusting nut
The compression degree of spring is realized, and then controls swing arm pressure.
It is described that elastic connection block 21 is installed between swing arm contiguous block 13 and swing arm 15, make swing arm and swing arm contiguous block it
Between be flexibility structure, can improve nozzle 16 adsorb chip during shock resistance and freedom from vibration.
In die bond adsorption process, suction nozzle 16 is excessive with respect to chip, and chip stress surface can be caused too small, be only pressed onto four
Angle, chip is set irregularly to crush, suction nozzle 16 is too small with respect to chip, can make chip unbalance stress.Therefore, the present invention has also set up suction
The database of relation between the model of mouth 16 and die size, the model of suction nozzle 16 can be according to treating die bond chip size in database
After middle retrieval, installed in the end of swing arm 15.
In the present invention, by Z axis motor driven eccentric shaft turns, drivening rod moves up and down, and then drives Z axis contiguous block
Moved up and down along line slideway, so as to also drive oscillating arm mechanisms and swing arm contiguous block to be moved up and down along swing arm guide rail so that
Swing arm can descend short distance lifting moving in the Z-axis direction.Electric rotating machine then drives rotary shaft to rotate at a high speed, and then drives swing arm
Rotate at a high speed, so as to drive swing arm seat and swing arm high-speed rotation together, the left and right for carrying out 180 degree about the z axis swings back and forth.
During die bond, the swing arm is first moved to above chip, and Z axis motor 3 drives swing arm to be moved downward along Z axis,
After picking up chip by suction nozzle 16, then moved upwards along Z axis under the driving of Z axis motor 3, after the absorption for completing chip, rotation
Motor 4 drives swing arm to be rotated around Z, then is moved downward along Z axis, and chip is fixed on into correspondence position, transported by adjusting Z axis motor 3
Scanning frequency degree can adjust swing arm rising and falling time, and the speed of service of regulation electric rotating machine 4 can adjust the rotation of swing arm 15
Time required for 180 °, so as to control die bond efficiency.
With the support of chip and chip to be fixed on the same line, oscillating arm mechanisms 2 can revolve the crystal solidifying apparatus about the z axis
Turn 180 °, reduce pendulum arm length, realize light-weighted structure design
It should be noted that these are only the preferred embodiments of the present invention, it is not intended to limit the invention, although with reference to reality
Apply example the present invention is described in detail, for those skilled in the art, it still can be to previous embodiment
Described technical scheme is modified, or equivalent substitution is carried out to which part technical characteristic, but all the present invention's
Within spirit and principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (8)
1. a kind of nation's header structure of 180 ° of bonders, including drive device and oscillating arm mechanisms, it is characterised in that the drive device
Including Z axis motor and electric rotating machine, for Z axis motor in Z axis mounting seat, the motor shaft of Z axis has eccentric shaft by bearing attaching,
Attaching has a connecting rod on eccentric shaft, and connecting rod attaching has a Z axis contiguous block, and the motor shaft attaching of electric rotating machine has a rotary shaft, in rotary shaft
Provided with swing arm guide rail, swing arm contiguous block is installed with the swing arm guide rail, swing arm contiguous block is rotated by fixing axle and Z axis contiguous block
Connect and be fixedly connected by nut check, oscillating arm mechanisms with swing arm contiguous block, electric rotating machine drives oscillating arm mechanisms 180 degree scope
Swing.
2. nation's header structure of 180 ° of bonders according to claim 1, it is characterised in that installed in the Z axis mounting seat
There is line slideway, Z axis contiguous block clamps with line slideway activity.
3. nation's header structure of 180 ° of bonders according to claim 2, it is characterised in that the swing arm structure includes swing arm
Seat and swing arm, swing arm are arranged in swing arm seat, and swing arm seat is fixedly connected with swing arm contiguous block, and swing arm end is equiped with vacuum suction
Mouth.
4. nation's header structure of 180 ° of bonders according to claim 3, it is characterised in that the swing arm passes through screw locking
In swing arm seat.
5. nation's header structure of 180 ° of bonders according to claim 4, it is characterised in that the screw is adjusted provided with pressure
Regulating device.
6. nation's header structure of 180 ° of bonders according to claim 5, it is characterised in that the pressure-regulating device includes
The spring being sleeved on screw and the nut being locked on the screw, spring one end rest against spring, the other end rest against swing arm.
7. nation's header structure of 180 ° of bonders according to claim 6, it is characterised in that described in swing arm contiguous block and pendulum
Elastic connection block is installed between arm.
8. nation's header structure of 180 ° of bonders according to claim 7, it is characterised in that be additionally provided with and be used in the swing arm
The sensor of detection chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711313999.5A CN107808841A (en) | 2017-12-12 | 2017-12-12 | A kind of nation's header structure of 180 ° of bonders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711313999.5A CN107808841A (en) | 2017-12-12 | 2017-12-12 | A kind of nation's header structure of 180 ° of bonders |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107808841A true CN107808841A (en) | 2018-03-16 |
Family
ID=61589094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711313999.5A Pending CN107808841A (en) | 2017-12-12 | 2017-12-12 | A kind of nation's header structure of 180 ° of bonders |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107808841A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108405272A (en) * | 2018-06-14 | 2018-08-17 | 东莞市凯格精密机械有限公司 | A kind of point glue equipment |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101670582A (en) * | 2009-09-23 | 2010-03-17 | 清华大学 | Pressure-adjustable mechanical arm |
| CN101958380A (en) * | 2010-09-03 | 2011-01-26 | 深圳市因沃客科技有限公司 | Solid crystal machine head bonding mechanism |
| CN202633248U (en) * | 2012-05-04 | 2012-12-26 | 先进光电器材（深圳）有限公司 | Die bonding arm |
| CN203288641U (en) * | 2013-05-02 | 2013-11-13 | 深圳市佳思特光电设备有限公司 | Die bonding arm structure applicable to die bonder of LED packaging device |
| CN203882988U (en) * | 2014-06-11 | 2014-10-15 | 深圳市旭日腾科技有限公司 | Chip sucking mechanism of LED die bonder |
| CN204696082U (en) * | 2015-04-22 | 2015-10-07 | 徐大林 | A kind of bonder swing arm transmission mechanism |
| CN106505141A (en) * | 2016-12-29 | 2017-03-15 | 深圳市微恒自动化设备有限公司 | A kind of bonder and die-bonding method |
| CN106952993A (en) * | 2017-05-09 | 2017-07-14 | 深圳市佳思特光电设备有限公司 | A kind of lifting rotating and swinging device of LED bonders die pick gang boss |
| JP2017156241A (en) * | 2016-03-02 | 2017-09-07 | オムロン株式会社 | Pressure sensor chip and pressure sensor |
| CN207834259U (en) * | 2017-12-12 | 2018-09-07 | 深圳市佳思特光电设备有限公司 | A kind of nation's head improved structure of bonder |
-
2017
- 2017-12-12 CN CN201711313999.5A patent/CN107808841A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101670582A (en) * | 2009-09-23 | 2010-03-17 | 清华大学 | Pressure-adjustable mechanical arm |
| CN101958380A (en) * | 2010-09-03 | 2011-01-26 | 深圳市因沃客科技有限公司 | Solid crystal machine head bonding mechanism |
| CN202633248U (en) * | 2012-05-04 | 2012-12-26 | 先进光电器材（深圳）有限公司 | Die bonding arm |
| CN203288641U (en) * | 2013-05-02 | 2013-11-13 | 深圳市佳思特光电设备有限公司 | Die bonding arm structure applicable to die bonder of LED packaging device |
| CN203882988U (en) * | 2014-06-11 | 2014-10-15 | 深圳市旭日腾科技有限公司 | Chip sucking mechanism of LED die bonder |
| CN204696082U (en) * | 2015-04-22 | 2015-10-07 | 徐大林 | A kind of bonder swing arm transmission mechanism |
| JP2017156241A (en) * | 2016-03-02 | 2017-09-07 | オムロン株式会社 | Pressure sensor chip and pressure sensor |
| CN106505141A (en) * | 2016-12-29 | 2017-03-15 | 深圳市微恒自动化设备有限公司 | A kind of bonder and die-bonding method |
| CN106952993A (en) * | 2017-05-09 | 2017-07-14 | 深圳市佳思特光电设备有限公司 | A kind of lifting rotating and swinging device of LED bonders die pick gang boss |
| CN207834259U (en) * | 2017-12-12 | 2018-09-07 | 深圳市佳思特光电设备有限公司 | A kind of nation's head improved structure of bonder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108405272A (en) * | 2018-06-14 | 2018-08-17 | 东莞市凯格精密机械有限公司 | A kind of point glue equipment |
| CN108405272B (en) * | 2018-06-14 | 2024-04-16 | 东莞市凯格精机股份有限公司 | Adhesive dispensing device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180316 |