CN107808675A - Processing method of testing, processing test monitoring device and the process equipment of head-slider - Google Patents
Processing method of testing, processing test monitoring device and the process equipment of head-slider Download PDFInfo
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- CN107808675A CN107808675A CN201610814757.3A CN201610814757A CN107808675A CN 107808675 A CN107808675 A CN 107808675A CN 201610814757 A CN201610814757 A CN 201610814757A CN 107808675 A CN107808675 A CN 107808675A
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B15/00—Systems controlled by a computer
- G05B15/02—Systems controlled by a computer electric
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- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Processing method of testing, processing test monitoring device and process equipment, the processing method of testing of the head-slider that the present patent application discloses a kind of head-slider include：At least one strain gauge is provided in wafer, and control device is provided and is connected with the strain gauge；The wafer is processed into head-slider using processing unit (plant), the control device monitors the performance parameter of the strain gauge to determine whether current machined parameters are suitable in head-slider process, and when current machined parameters are substandard, adjustment signal is sent to the processing unit (plant), the processing unit (plant) is according to the adjustment signal adjustment machined parameters.The present patent application can monitor the processing test of head-slider in real time, so as to more effectively easily be processed test to head-slider.
Description
Technical field
Present patent application is related to hard disk drive, more particularly to a kind of processing test side of the head-slider of hard disk drive
Method, processing test monitoring device and process equipment.
Background technology
Hard disk drive comprising multiple spinning disks is commonly used the magnetic matchmaker for storing data in its magnetic disk surface
On Jie, typically, the magnetic head being embedded in the head-slider of hard disk drive includes having magnetoresistive element
(magnetoresistive, hereinafter referred to as MR elements) and the reproduction components (read head) for reading data, and with sensing
Formula electromagnetic transducer and the recording element (writing head) for writing data.Fig. 1 a illustrate a typical structure of hard disk drive
Make.Hard disk drive 100 includes spindle motor 30, a series of rotatable discs 80 being installed on the spindle motor 30, magnetic head
Tabs combination (HGA, head gimbal assembly) 40, the actuating arm 50 being connected with the magnetic head fold piece combination 40, it is arranged at
The distal end of actuating arm 50 and the head-slider 60 including read head, and the housing 70 that said elements are assembled together.Such as ability
Known to field technique personnel, when hard disk drive 100 works, disk 80 drives rotation by spindle motor 30, thus produces
Air pressure head-slider 60 can be made to be flown above disk 80 (it is high to be referred to as flight for the height away from disk during head-slider flight
Degree, referred to as fly height), and then cause the read head on head-slider 60 to read data in disc tracks.Fig. 1 b and Fig. 1 c are illustrated
The detailed construction of read head, read head 10 include being formed at first screen layer 111 on a substrate 110, secondary shielding layer 114, layer
The MR elements 112 being pressed between first, second screen layer 111,114, and a pair of Hard Magnetics 113 positioned at the both sides of MR elements 112.
For read head, a kind of giant magnetoresistance (giant magnetoresistive, GMR) element using giant magnetic effect is existing
It has been used as MR elements.A kind of traditional GMR element has " electric current is planar " (Current-In-Plane, CIP) formula knot
Structure, i.e. the direction of the electric current (hereinafter referred to as induced-current) as detection magnetic field signal and the place of each layer body of GMR element are put down
Face is parallel；Another traditional GMR element have " current-perpendicular-to-the-plane " (Current-Perpendicular-to-Plane,
CPP) formula structure, i.e. faradic direction is intersected with the place plane of each layer body of GMR element, for example, perpendicular to GMR members
The place plane of each layer body of part.Another MR elements are tunnel magnetoresistive (tunnel magnetoresistive, TMR) element,
It equally has CPP structures.
Traditionally, the manufacture of head-slider need to be formed by wafer, the multiple working procedure such as long strips grinding.Entirely manufacturing
During, it experienced multiple force processes, these force processes such as cutting, grinding and inevitably head-slider material made
Bent into influence, such as stress, processing is thermally deformed etc., and then the magnetic head performance ultimately produced will be impacted.At present,
Head-slider can only be processed before stress and be analyzed after stress, so as to show that its stress is reacted, there is no entirely to exert a force
During the method that monitors in real time.
The content of the invention
For the drawbacks described above of prior art, according to the one side of present patent application, there is provided a kind of head-slider
Method of testing is processed, it can monitor the processing stress of head-slider in real time.
The processing method of testing of the head-slider, including：At least one strain gauge is provided in wafer, and is provided
Control device is connected with the strain gauge；The wafer is processed into head-slider, the control dress using processing unit (plant)
The performance parameter that the strain gauge is monitored in head-slider process is put to determine whether current machined parameters are suitable,
And when current machined parameters are substandard, adjustment signal is sent to the processing unit (plant), the processing unit (plant) is according to the tune
Entire signal adjusts machined parameters.
In one embodiment, the strain gauge also includes being used for the winged high heating power sensing for monitoring the magnetic head
Device.
In one embodiment, the manufacture material of the strain gauge is selected from nickel, copper, chromium, molybdenum, iron, manganese, platinum, iridium, aluminium
In one or more.
In one embodiment, the performance parameter of the strain gauge includes the resistance value of the strain gauge.
In one embodiment, the strain gauge includes the first strain gauge and the second strain gauge, wherein,
First strain gauge is disposed in proximity to the air bearing face of the read head or head-slider in head-slider, the second strain gauge
It is arranged at the preset reference point of head-slider, the control device is according to the property of the first strain gauge and the second strain gauge
Can parameter differences determine whether machined parameters up to specification.
In one embodiment, in sample test, the strain gauge is measured at least twice, the control dress
Put according to the difference of measurement result twice to determine whether the sample is up to specification.
In one embodiment, in sample test, control group is set, stress sensing is carried out to sample and control group respectively
The measurement at least twice of device, the control device according to the difference of the measurement result twice of compensation of the sample based on control group come
Determine whether the sample is up to specification.
According to the another aspect of present patent application, the head-slider processing test monitoring device of present patent application includes monitoring
Unit and the control unit being connected with the monitoring unit；Wherein, the monitoring unit, and being processed into the crystalline substance of head-slider
Strain gauge connection in circle, for monitoring the performance parameter of the strain gauge described in head-slider process；Institute
State control unit, for the performance parameter according to the strain gauge with determine for process the head-slider processing fill
Whether the current machined parameters put are suitable, and when current machined parameters are substandard, adjustment letter is sent to the processing unit (plant)
Number to indicate processing unit (plant) adjustment machined parameters.
According to the another aspect of present patent application, a kind of head-slider process equipment of present patent application includes：Processing dress
Put, for wafer to be processed into head-slider, contain at least one strain gauge in the wafer；Control device, it is and described
In wafer strain gauge connection, for monitor the strain gauge described in head-slider process performance parameter with
Determine whether the current machined parameters of processing unit (plant) are suitable, and when current machined parameters are substandard, to the processing unit (plant)
Send adjustment signal；The processing unit (plant) is adjusted according to the adjustment signal to machined parameters.
The head-slider processing method of testing of present patent application, processing test that can be to head-slider are supervised in real time
Control, it is thus possible to the processing test effectively easily to head-slider is adjusted, so as to improve the processing yield of head-slider,
The test process of head-slider can also be simplified.
Brief description of the drawings
Present patent application is described further below in conjunction with drawings and Examples, in accompanying drawing：
Fig. 1 a are a kind of structure charts of typical hard disk drive；
Fig. 1 b are a kind of read head structure stereograms of typical head-slider；
Fig. 1 c are the read head mechanism sectional views shown in Fig. 1 b；
Fig. 2 a are the head-slider manufacturing flow charts according to a kind of embodiment of present patent application；
Fig. 2 b are the crystal circle structure figures according to a kind of embodiment of present patent application；
Fig. 2 c are the long strips structure charts according to a kind of embodiment of present patent application；
Fig. 2 d are the head-slider structure charts according to a kind of embodiment of present patent application；
Fig. 2 e are the sensor arrangement figures according to a kind of embodiment of present patent application；
Fig. 3 is the monitoring method flow chart according to the first embodiment of present patent application；
Fig. 4 is the monitoring method flow chart according to the second embodiment of present patent application；
Fig. 5 is the monitoring method flow chart according to the 3rd embodiment of present patent application；
Fig. 6 is the monitoring method flow chart according to the fourth embodiment of present patent application；
Fig. 7 is the monitoring method flow chart according to the 5th embodiment of present patent application；
Fig. 8 is the supervising device structure chart according to a kind of embodiment of present patent application；
Fig. 9 is the structure chart according to a kind of attrition process part of the process equipment of embodiment of present patent application；
Figure 10 is stress-strain gauge performance change graph of a relation according to a kind of embodiment of present patent application.
Embodiment
In order that the object, technical solution and advantage of present patent application are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, is described in further details to present patent application.It should be appreciated that specific embodiment described herein is only explaining this
Patent application, it is not used to limit present patent application.
Typically, the manufacture method of head-slider is:The wafer with multiple magnetic head elements is cut into multiple length first
Shape bar (Row Bar), some slider elements are arranged with the long strips；Then, each long strips is ground, so that will
The height of element is adjusted to preliminary dimension.One of lapped face is the face towards medium of each head-slider, is referred to as " empty
Air bearing section " (air bearing surface, ABS, referring to shown in 117 in Fig. 1 b).Specifically, the long strips are pre- with one
Fixed pressure is pressed against on the abrasive disk of a rotation, and the ABS of long strips is ground into predetermined dimension.Finally, the long strips quilt
Cut into multiple independent head-sliders.
Fig. 2 a illustrate schematically the manufacturing process of the head-slider of present patent application embodiment；Fig. 2 b, Fig. 2 c and d points of Fig. 2
Wafer, long strips and head-slider in the manufacturing process shown in Fig. 2 a are not illustrated., hereafter will be special to this with reference to these figures
The manufacture method of the head-slider of profit application embodiment is described.
As shown in Figure 2 a, first, a wafer (step S21) is formed.In the wafer formation process, by ceramic material system
Into wafer 20 on by thin film technique (such as photolithography method) formed it is multiple have magnetic head (generally by multiple film layers
Product form) slider element.There is a read head and a writing head on each magnetic head.
Then, it is processed process (step S22).In this process, wafer 20 is cut into multiple blocks first, then will
Each block is cut into multiple long strips 210 (such as Fig. 2 b).Multiple slider elements 220 are arranged with each long strips 210
(such as Fig. 2 d).As illustrated in figures 2 c and 2d, the long strips 210 have the ABS 211, back side 213 relative with the ABS 211, Nian Jie
Face 212, the bottom surface 214 relative with the bonding plane 212, and two sides 215.Each 220 equal heeling-in of slider element
There is magnetic head 230.
With continued reference to Fig. 2 a, after manufacturing procedure, process (comprising at least step S23 and S24) is ground.For enhancing
Grinding effect, grinding can be divided into corase grind and fine grinding.Roughly ground first before the finish grinding, specifically, the bottom surface of long strips 210
214 are coarse to predetermined size (step S23).Then, the ABS 211 of long strips 210 is finely ground (step S24), from
And control the characteristic of magnetic head 230.In addition, before or after ABS 211 is ground, the back side 213 of the long strips 210 is similarly
Predetermined size can be milled to.After process is ground to lapped face, the long strips 210 are cut into multiple independences
Head-slider 220 (step S25)., can be by assembling procedure, by the magnetic head of completion after head-slider 220 machines
Sliding block 220 is assembled into magnetic head fold piece combination 40 until forming hard disk drive 100.In HGA assembling process, typically pass through GBB
Head-slider 220 is connected to by (gold goal connects, gold ball bound) or SBB (soldered ball connects, solderball bound)
Magnetic head fold piece combination 40.
As shown in Figure 2 e, in long strips 210, one or more strain gauge 240 can be arranged, itself and read head
(not shown) is spaced apart.The strain gauge 240 can play a part of monitoring stress in process.It should be noted
, only with long strips 210 it is example in figure, being not meant to strain gauge 240 is just formed after long strips 210 are obtained
Into long strips 210, strain gauge 240 can form technology by film same or similar with magnetic head element, in wafer
In formation process, formed in the lump in wafer with magnetic head element.The manufacture material of strain gauge 240 can be selected from nickel (Ni),
The materials such as copper (Cu), chromium (Cr), molybdenum (Mo), iron (Fe), manganese (Mn), platinum (Pt), iridium (Ir), aluminium (Al).
Because in head-slider process, the change for the mechanical stress being applied on wafer, long strips etc. will cause
The performance parameter of strain gauge in it, such as the change of resistance value, thus strain gauge can be used for monitoring in real time
Force change in head-slider process, so as to force when accordingly adjustment is processed, self-shield is played to whole processing and made
With.Further, when carrying out performance test to head-slider, performance test can also equally be carried out with the strain gauge
Monitoring.The flow being monitored using processing of the strain gauge to head-slider and test process is described in detail below.
Referring to Fig. 3, the monitoring method flow of first embodiment of the invention is as follows：
S301：Flow starts；
S302：Processing is proceeded by, for example, processing unit (plant) is cut to wafer；In processing procedure, strain gauge
All the time monitor force change, the monitoring is such as its resistance change and table by the performance parameter of strain gauge itself
Reach, strain gauge feeds back its performance parameter to supervising device；
S303：Whether supervising device identified sign is in specification, in this way, then can keep current machined parameters and continue to locate
Reason；Otherwise, flow is transferred to step S305；
S304：It is determined that whether whole processing procedure finishes, in this way, then flow terminates in step S306, and otherwise, flow returns
To step S302；
S305：When stress is outside specification, machined parameters are adjusted, then, step S303 is returned to and determines to answer again
Whether power is in specification.
Referring to Fig. 4, the monitoring method flow of second embodiment of the invention is as follows：
S401：Flow starts；
S402：Processing is proceeded by, for example, being cut to wafer；In processing procedure, strain gauge monitors all the time
Force change, in this example, two strain gauges can be used to be monitored, wherein, sensor 1 be disposed in proximity to read head/
ABS carries out measuring (step S403) in real time, and sensor 2 is arranged at a default reference point and carries out measuring (step S404) in real time；
S406：In this instance, by judging the performance parameter of two sensorses, if whether the difference of resistance value is in specification
It is determined that whether force is suitable, if improper, step S405 is transferred to, machined parameters are adjusted, subsequent flow returns to
Step S402；If appropriate, terminate to handle in step S407.
Referring to Fig. 5, the monitoring method flow of third embodiment of the invention is as follows：
S501：Processing input；
S502：Processing is proceeded by, strain gauge carries out first time measurement；
S503：Continue to handle, then, in step S504, strain gauge carries out second and measured；
S505：It is determined that whether the difference of measurement result, if it is, can enter step S506, is located in specification twice
Reason output；Otherwise, then refuse the sample into step S507, and checked and finely tuned.
Referring to Fig. 6, the monitoring method flow of fourth embodiment of the invention is as follows：
S601：Processing input；Subsequently, based on test sample and control group, flow is divided into Liang Ge branches；To handle survey respectively
Test agent and control group；
For test sample branch, it carries out the first time measurement (S602) of strain gauge, then handled first
(S604) second of measurement (S605) of strain gauge, is carried out afterwards；
For control group branch, it carries out the first time measurement (S603) of strain gauge, carries out stress biography afterwards first
Second of measurement (S606) of sensor；
In step S607, based on the compensation of control group, judge whether the difference of the measurement result twice of test sample is advising
In lattice, in this way, then processing output (S608), otherwise, then refuse sample and check, finely tune (S609).
Because strain gauge may be influenceed by external factor, in the above-described embodiments, establish a control group and be used to go
Except the difference of external factor, i.e. control group can be used for the influence for supervising external factor.To control group as reference, it can be determined that
Test sample is influenceed situation by external factor, and can judge the measurement knot twice of test sample based on the compensation of control group
During the difference of fruit, the difference that control group removes external factor is primarily based on, is then compared again.
Referring to Fig. 7, the monitoring method flow of fifth embodiment of the invention is as follows：
S701：Processing starts；
S702：Tested without external stress；
S703：External stress test is carried out；
S704：If test parameter in specification, into step S705, determines whether all stress situations are completed, such as
Fruit is, then into step S706, otherwise to return to step S703；If test parameter is not in specification, into step S706；
S706：Test parameter is handled；Then, flow terminates to handle in step S707.
It can see by upper, based on strain gauge, the monitoring method of present patent application can be in the whole flow process of processing
In analysis monitoring is carried out to force in real time, so as to adjusting machined parameters in real time, thus, it is possible to effectively carry out head-slider plus
Work, there is provided the processing yield of head-slider.
On the other hand, it can be seen that the monitoring method of present patent application can be used in the performance test of head-slider,
For example, before test event identified sign sensor current performance parameters, after the completion of test event, again identified sign pass
The new capability parameter of sensor, the performance parameter variations based on strain gauge, it is determined that whether the difference of measurement result is advising twice
In lattice, so as to be screened to sample.
Currently, magnetic head is before use, a series of performance test must be carried out, such as resistance to elevated temperatures, dynamic fly height
(dynamic flying height, DFH) performance, signal to noise ratio (Signal-to-Noise Ratio, SNR) performance, reliability,
Stability etc..For example, a magnetic head with poor resistance to elevated temperatures, it can produce substantial amounts of noise in high temperature environments.
The read stability of magnetic head can be damaged if there is poor SNR performances if magnetic head, the final reading performance for influenceing magnetic head, therefore,
The performance test of magnetic head is particularly significant and necessary.
The monitoring method of present patent application can be applied in these performance tests of magnetic head.It is for example, resistance in test magnetic head
In high-temperature behavior, MR element of the heating element heater into magnetic head can be utilized to apply heat and stress.Specifically, when energized, add
Thermal element generates heat, and in this case, thermal expansion occurs for the material of MR elements and its surrounding, so that MR elements are produced in substantial amounts of
Stress, in addition, MR elements also occur that internal modification.Similar, the aforesaid stresses sensor arranged in magnetic head receives internal stress
Influence, its performance parameter, can by the monitoring of the performance parameter to strain gauge for example, its resistance value can change
To determine whether the temperature distortion of MR elements is up to specification, if be not inconsistent, it can determine that the magnetic head fails by performance test,
Belong to non-and close rule sample.I.e., it is possible to the performance test of magnetic head is carried out based on strain gauge.In addition, become in MR elements
Shape, such as when being thermally deformed, the winged height of magnetic head to disk will also change, and generally use heating power sensor is winged high to monitor
Change.In the present patent application, heating power sensor is also used as foregoing strain gauge, monitors head-slider in real time
Process, easily carry out the performance test of magnetic head.
Referring to Fig. 8, by taking long strips 801 as an example, can be placed on bar flector 802, bar flector 802 can be to length
The force of shape bar 801 bends its stress, so as to apply external stress, the stress pair to the strain gauge inside long strips 801
The processing test that Ying Yu is processed or tested to long strips.In addition, analyzer 803 whenever necessary, can utilized to stress
Sensor and read head monitor when putting into effect.Using strain gauge monitoring apply external stress while, then apply magnetic field B to
Read head, to supervise the performance change of read head.Then, analyzer 803 can reception signal, long strips stress is analyzed, really
Surely test parameter is processed whether within specification, if processing test parameter can continue to extra power, enter in specification
And analyzer 803 receives new signal, new processing test parameter is analyzed, the process is persistently carried out until test parameter surpasses
Go out specification.Using this mode, strain gauge performance parameter can be established in advance and is worked into the machined parameters of magnetic head with wafer
And/or the mapping table of the test parameter of magnetic head, or the only specification limit of identified sign sensor performance parameter.Return to ginseng
According to Fig. 3, the step of being shown using Fig. 3, stress can be supervised in real time and adjust machined parameters in real time.
In the present patent application, head-slider processing test monitoring device can be provided independently from, is so independently arranged
Head-slider processing test monitoring device, can include：Monitoring unit and the control unit being connected with monitoring unit；Monitoring is single
Member is connected with to the strain gauge being processed into the wafer of head-slider, is answered for monitoring in head-slider process
The performance parameter of force snesor.Control unit is used for according to the performance parameter of strain gauge to determine to be used for process head-slider
Processing unit (plant) current machined parameters it is whether suitable, and when current machined parameters are substandard, tune is sent to processing unit (plant)
Entire signal is to indicate processing unit (plant) adjustment machined parameters.Monitoring unit for example can include signal picker, signal is changed
Device etc., strain gauge is connected to for example, by plain conductor, signal picker can collect the performance ginseng of strain gauge
Number, such as resistance value, signal adapter can be changed the signal collected, such as resistance value is converted into current value,
Even carry out conversion of analog to digital etc..Control unit for example can be MCU (micro-control unit), DSP (Digital Signal Processing
Device), FPGA (FPGA), ARM (advanced reduced instruction set machine) etc. have the machine for calculating disposal ability
Device.As it was previously stated, answering corresponding to head-slider processing test specification can be determined for compliance with for example, by the method shown in Fig. 8
The specification limit of the performance parameter of force snesor, the specification limit can be deposited into a database, and control unit is single from monitoring
After member obtains the performance parameter of strain gauge, by data base querying, according to the specification model of the performance parameter of strain gauge
Whether the performance parameter for enclosing identified sign sensor closes rule, and then determines whether current machined parameters are up to specification, and is processing
Parameter produces adjustment signal when not conforming to rule, indicate the processing unit (plant) adjustment machined parameters of head-slider.Under such a setting, magnetic head
The processing unit (plant) of sliding block, such as cutting machine, kibbling mill, refiner etc. and head-slider processing test monitoring device are physics independence
's.
In another embodiment, the head-slider processing test monitoring function of present patent application is desirably integrated into processing dress
In putting, such integrated processing unit (plant) is formed as the head-slider process equipment of the embodiment of present patent application one.The processing is set
It is standby to include processing unit (plant), for the wafer for wherein containing at least one strain gauge to be processed into head-slider；And
Control device, it is connected with the strain gauge in the wafer, is passed for monitoring the stress described in head-slider process
Whether the performance parameter of sensor is suitable and substandard in current machined parameters to determine the current machined parameters of processing unit (plant)
When, send adjustment signal to the processing unit (plant)；Then, processing unit (plant) is adjusted according to adjustment signal to machined parameters.
Fig. 9 is the structure chart of the long strips attrition process part of the process equipment of an embodiment of present patent application.It should add
There is the abrasive sheet 92 of the rotation of grinding long strips 210 in the attrition process part 91 of construction equipment, press long strips 210 for providing
It is tightened to the load generating means 94 of the power of abrasive sheet 92, and multiple load transmission fixtures 95.Load generating means 94 uses
Such as the microdrive (actuator) of electromagnetic type or hydraulic type (hydraulic).Load generating means 94 and control device 98
It is connected, and feedback control is carried out according to the resistance value of strain gauge 240, by MR height (from the ABS vertical surveies of MR elements
Height) be machined to predetermined value.Load transmission fixture 95 is located at load generating means 94 and supports the supporter of long strips 210
Between 96, via supporter 96 by the pressure transmission occurred in load generating means 94 to long strips 210, make long strips 210
ABS forming faces G compresses with abrasive sheet 92.Load transmission is provided with multiple with length direction of the fixture 95 along supporter 96.Supporter
96 mounting surface of long strips 210 can be separated by the contact point of load transmission fixture 95 by groove 97, can be made from each load
The pressure that transmission fixture 95 transmits only is passed to around it.The surface of abrasive sheet 92, such as can be by that will be made up of Sn (tin)
Plectane surface is embedded to diamond abrasive grain and formed.Rotary shaft 93 is connected with abrasive sheet 92, passes through actuating unit rotation (not shown)
Turn.When being ground, first, long strips 210 are fixed on supporter 96, and make length direction and the grinding of long strips 210
The radial direction of plate 92 is consistent.ABS forming faces G compresses with the abrasive sheet 92 rotated, so as to which ABS forming faces G is ground, at this moment should
Force snesor 240 can experience stress during grinding, so as to which its performance parameter, such as resistance value change.Control device
98 resistance based on each strain gauge 240 and determine whether machined parameters suitable, and machined parameters are carried out when improper
Adjustment, and indicate that load generating means 94 changes machined parameters, this, which monitors and adjusted in real time, to enter in whole process of lapping
OK.It is appreciated that the other parts of process equipment, can be configured in a similar way, for example, the wafer cutting of process equipment
It part, its force cut, can equally be monitored by strain gauge 240, and feed back to control device 98, so as to which wafer is cut
The machined parameters for cutting part are adapted accordingly.
Figure 10 is stress-strain gauge (using nickel as manufacture material) performance according to a kind of embodiment of present patent application
Variation relation figure, transverse axis represents the outside pressure (Gpa is unit) applied in figure, and negative value represents that external stress is tensile force, just
Value represents that external stress is compression stress.Longitudinal axis dR/R represents the ratio (% is unit) of resistance change and initial resistivity value, i.e.,
The relative variation of resistance value, negative value represent that resistance value reduces relative to former resistance, on the occasion of expression resistance value relative to former resistance
Increase.It can be seen that as tensile force increases, resistance value constantly increases.On the other hand, as compression stress increases, resistance value is not
It is disconnected to reduce.And the relation between the relative change of stress-resistance is approximately linear.Based on such graph of a relation, can be passed by stress
The resistance of sensor obtains applied stress, so as to judge whether the force in process is suitable.
The preferred embodiment of present patent application is the foregoing is only, it is all at this not to limit present patent application
All any modification, equivalent and improvement made within the spirit and principle of patent application etc., should be included in present patent application
Protection domain within.
Claims (10)
- A kind of 1. processing method of testing of head-slider, it is characterised in that including：At least one strain gauge is provided in wafer, and control device is provided and is connected with the strain gauge；The wafer is processed into head-slider using processing unit (plant), the control device monitors in head-slider process The performance parameter of the strain gauge is and substandard in current machined parameters to determine whether current machined parameters are suitable When, adjustment signal is sent to the processing unit (plant), the processing unit (plant) is according to the adjustment signal adjustment machined parameters.
- 2. processing method of testing as claimed in claim 1, it is characterised in that the strain gauge also includes being used to monitor institute State the winged high heating power sensor of magnetic head.
- 3. processing method of testing as claimed in claim 1, it is characterised in that the manufacture material of the strain gauge is selected from One or more in nickel, copper, chromium, molybdenum, iron, manganese, platinum, iridium, aluminium.
- 4. processing method of testing as claimed in claim 1, it is characterised in that the performance parameter of the strain gauge includes institute State the resistance value of strain gauge.
- 5. processing method of testing as claimed in claim 1, it is characterised in that the strain gauge includes the first stress sensing Device and the second strain gauge, wherein, the first strain gauge is disposed in proximity to read head in head-slider or head-slider Air bearing face, the second strain gauge are arranged at the preset reference point of head-slider, and the control device is according to the first stress The performance parameter difference of sensor and the second strain gauge determines whether machined parameters are up to specification.
- 6. processing method of testing as claimed in claim 1, it is characterised in that in sample test, the strain gauge enters Row measures at least twice, and the control device determines whether the sample is up to specification according to the difference of measurement result twice.
- 7. processing method of testing as claimed in claim 1, it is characterised in that in sample test, control group is set, it is right respectively Sample and control group carry out the measurement at least twice of strain gauge, and the control device is according to sample based on the benefit for controlling group The difference for the measurement result twice repaid determines whether the sample is up to specification.
- 8. a kind of head-slider processes test monitoring device, it is characterised in that including：Monitoring unit and with the monitoring unit connect The control unit connect；Wherein,The monitoring unit, it is connected with to the strain gauge that is processed into the wafer of head-slider, for monitoring in magnetic head The performance parameter of strain gauge described in sliding block process；Described control unit, for the performance parameter according to the strain gauge to determine for processing the head-slider Whether the current machined parameters of processing unit (plant) are suitable, and when current machined parameters are substandard, are sent to the processing unit (plant) Signal is adjusted to indicate the processing unit (plant) adjustment machined parameters.
- 9. processing test monitoring device as claimed in claim 8, it is characterised in that the performance parameter bag of the strain gauge Include the resistance value of the strain gauge.
- A kind of 10. head-slider process equipment, it is characterised in that including：Processing unit (plant), for wafer to be processed into head-slider, contain at least one strain gauge in the wafer；Control device, it is connected with the strain gauge in the wafer, should described in head-slider process for monitoring Whether the performance parameter of force snesor is suitable to determine the current machined parameters of processing unit (plant), and does not conform to rule in current machined parameters During lattice, adjustment signal is sent to the processing unit (plant)；The processing unit (plant) is adjusted according to the adjustment signal to machined parameters.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610814757.3A CN107808675B (en) | 2016-09-09 | 2016-09-09 | Machining test method, machining test monitoring device and machining equipment for magnetic head slider |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610814757.3A CN107808675B (en) | 2016-09-09 | 2016-09-09 | Machining test method, machining test monitoring device and machining equipment for magnetic head slider |
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| CN107808675A true CN107808675A (en) | 2018-03-16 |
| CN107808675B CN107808675B (en) | 2021-04-30 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1522833A (en) * | 2003-02-18 | 2004-08-25 | 富士通株式会社 | Method of and apparatus for lapping magnetic head slider |
| CN1811920A (en) * | 2005-01-26 | 2006-08-02 | 新科实业有限公司 | Thin-film magnetic head crystal wafer |
| CN102376310A (en) * | 2010-08-13 | 2012-03-14 | 新科实业有限公司 | Magnetic stripe for forming magnetic heads and method for manufacturing magnetic heads |
| US20130219699A1 (en) * | 2012-02-29 | 2013-08-29 | Sae Magnetics (H.K.) Ltd. | Manufacturing method of a slider and manufacturing apparatus thereof |
-
2016
- 2016-09-09 CN CN201610814757.3A patent/CN107808675B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1522833A (en) * | 2003-02-18 | 2004-08-25 | 富士通株式会社 | Method of and apparatus for lapping magnetic head slider |
| CN1811920A (en) * | 2005-01-26 | 2006-08-02 | 新科实业有限公司 | Thin-film magnetic head crystal wafer |
| CN102376310A (en) * | 2010-08-13 | 2012-03-14 | 新科实业有限公司 | Magnetic stripe for forming magnetic heads and method for manufacturing magnetic heads |
| US20130219699A1 (en) * | 2012-02-29 | 2013-08-29 | Sae Magnetics (H.K.) Ltd. | Manufacturing method of a slider and manufacturing apparatus thereof |
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| CN107808675B (en) | 2021-04-30 |
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