CN107791320B - Drilling and cooling method of circuit board - Google Patents
Drilling and cooling method of circuit board Download PDFInfo
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- CN107791320B CN107791320B CN201610746089.5A CN201610746089A CN107791320B CN 107791320 B CN107791320 B CN 107791320B CN 201610746089 A CN201610746089 A CN 201610746089A CN 107791320 B CN107791320 B CN 107791320B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Abstract
The invention provides a drilling and cooling method of a circuit board, which not only reduces the processing temperature, but also avoids various problems existing in the liquid cooling process, can effectively avoid the phenomena of processing retention, processing layering and the like, and reduces the quality problems of accumulated chip, processing burrs and the like, thereby greatly improving the machining performance of the PTFE circuit board. Meanwhile, the used equipment is economical and simple and is easy to realize, and the cold air in the invention is compressed air, has the advantages of economy, environmental protection, no damage to processed plates and low price, and can be used in the field of PTFE circuit board processing.
Description
Technical Field
The invention relates to a drilling and cooling method of a circuit board, in particular to an innovative technology of the drilling and cooling method of a PTFE circuit board.
Background
The PTFE circuit board has excellent dielectric property (the loss in the current base material is the lowest), so that the PTFE circuit board can be applied to high-frequency high-speed transmission with the transmission rate of 100GHz or above. The transmission loss of the PTFE circuit board has a close relationship with the processing quality thereof.
In the PTFE circuit board machine course of working, because the PTFE material is soft partially, belong to difficult chip breaking material, drill point/milling cutter twines the bits phenomenon seriously (the patent can cover and bores with milling process), great burr easily appears, influences the loss that influences terminal product signal transmission when influencing processingquality.
At present, the main solutions to the problems are to use special tools and to use cooling liquid. Although the above problems can be solved by adopting such a processing method, the following disadvantages still exist: 1) the special cutter is adopted and the cost of using the cooling liquid is high; 2) the cooling liquid is used to destroy and pollute the plates and the environment; 3) the processing quality effect still has great promotion space.
Disclosure of Invention
In view of the above, the present invention provides a drilling cooling method for a circuit board to solve the above problems.
The invention is realized by the following technical scheme: a drilling cooling method of a circuit board comprises the following specific steps: and S1, before drilling, freezing the circuit board to make the temperature reach the lower value of the safe storage temperature range.
S2, drilling holes on the circuit board by a micro drill arranged on the main shaft, and respectively cooling different working areas by cold air through a cold air device in the drilling process of the micro drill so as to reduce the temperature of the cooled areas;
and S3, monitoring the temperature in the processing process through the temperature sensor, feeding the monitored information back to the air speed regulator, and controlling the air inlet flow and the air inlet pressure of the compressor by the air speed regulator according to the detected temperature so as to control the temperature and the flow of cold air of the low-temperature cold air device.
In step S2, the cold air device includes a compressor, at least three cold air guns, and a robot arm for fixing the positions of the cold air guns; the cold air gun comprises an air inlet pipe, a hot air pipe, a cold air pipe and an air outlet, wherein the air inlet pipe is arranged below the gun body, the hot air pipe is arranged on one side of the gun body, the cold air pipe is arranged inside the gun body and connected with the air outlet, the air outlet is arranged on one side of the gun body, an air mixing cavity communicated with the air inlet pipe is arranged in the gun body, a vortex chamber, a heat insulating layer and a heat radiating block are further arranged inside the gun body, the heat insulating layer is arranged outside the cold air pipe, the heat radiating block is arranged outside the hot air pipe, the air mixing cavity is communicated with the vortex chamber through an air guide hole arranged on the heat radiating block, one sides of the hot air pipe and the cold air pipe are respectively communicated with the vortex chamber at different positions; still be equipped with at least one temperature sensor and air speed regulator, temperature sensor set up in around the air gun air outlet, the air speed regulator set up in inside the compressor, temperature sensor with the air speed regulator is connected, the cold wind of different flows is blown out to air gun accessible air speed regulator.
In step S2, the different working areas include a processing area, a processed area and an area to be processed of the workpiece, and the low-temperature cold air device includes at least one cold air gun for cooling the three areas by circularly blowing cold air.
In step S3, the working height of the air outlet of the air gun is 7-13mm, that is, the vertical distance from the air outlet end of the air outlet to the working area is 7-13 mm.
In step S2, the angle between the air outlet direction of the air outlet of the air gun and the center line of the drill point is between 30 ° and 75 °, and particularly, the best effect is obtained when the angle between the air outlet direction of the air outlet of the air gun and the center line of the drill point is consistent with the spiral angle of the drill point.
In step S2, the ambient temperature of the processing region, the processed region, or the region to be processed is maintained between 15 and 25 ℃ by blowing air through the cold air gun.
In step S3, the processing procedure may be performed by adjusting the air speed regulator to blow out cold air at different flow rates, and blowing cold air at 0.25-0.4MPa in the early stage of processing and blowing cold air at 0.65-0.8MPa in the later stage of processing. Through the processing mode of this kind of combination is bloied, can make the cold wind fluid power reduce the drill point vibration influence in processing earlier stage to help processing later stage chip removal, reach best effect.
In step S3, the processing procedure may include adjusting the compressor to blow cold air at different temperatures, blowing cold air at-70 to-50 ℃ in the early stage of processing, and blowing cold air at-40 to-20 ℃ in the later stage of processing. By the processing mode, the PTFE material is embrittled and easy to cut in the early processing period, PTFE chips are softened and easy to extrude and discharge in the later processing period, and the optimal processing effect is achieved.
Particularly, the machining early stage is from the beginning of machining to before the chip removal is increased sharply; the later processing stage is started when a large amount of chips are removed, namely the drill point is in a stable stage.
In particular, components not described in detail in the present invention can be implemented by any of the prior art.
The specific working principle of the cold air device in the drilling and cooling method of the circuit board is as follows: compressed air flows into the air mixing cavity from the air inlet pipe through the compressor, the temperature of high-pressure air flow rises due to pressure increase when the high-pressure air flow passes through the air guide hole, heat carried by the air flow is absorbed and conducted to the outside of the gun body through the heat dissipation block, the heat dissipation block can use metals such as copper, aluminum and the like which absorb heat faster to dissipate heat more quickly, the air guide hole guides the high-pressure air flow to enter the vortex chamber, the air flow rotates at high speed in the vortex chamber, the air in the outer ring rotates at a speed of two million revolutions per minute, the air in the inner ring rotates in the reverse direction at the same speed, the air in the inner ring and the air in the outer ring of the vortex flow can exchange heat, the temperature of the central area of the vortex flow can be rapidly reduced, the air flow in the outer layer and the air flow in the inner layer move in the opposite direction while rotating, the hot air flow in, the cold air flows through the air outlet of the cold air gun to cool the working area. The ambient temperature of a working area where the cold air gun is located is monitored in real time through temperature sensors arranged around the air outlet, temperature information is fed back to the air speed regulator, and according to the set working ambient temperature, the air speed regulator controls the temperature and the flow of cold air flow by regulating the air inlet flow and the air inlet pressure of the compressor.
The circuit board is cooled in a cold air mode, the mechanical arm is arranged near different processing areas, the cold air gun is fixed on the mechanical arm, the air outlet angle and the air outlet position are adjusted through the mechanical arm according to the requirements of different working areas, and the area to be processed, the processing area and the processed area of the circuit board are cooled in a cold air mode. The cooling method can keep the frozen circuit board at a lower temperature, keep the circuit board at a low temperature continuously, avoid repeated circuit board loading and unloading due to repeated freezing caused by temperature rise, simultaneously play a cooling role in the drilling process of the circuit board, reduce the drilling temperature to a great extent, cool the processed area of the circuit board by cold air, reduce the heat generated in the drilling process, prevent the area to be processed of the circuit board from being influenced by the temperature conduction of the processed area of the circuit board, and realize omnibearing cooling and cooling in the processing process of the circuit board. Meanwhile, for the area to be processed, the circuit board is cooled for 20-60s by using cold air before drilling, the temperature of the area to be processed after freezing treatment can be maintained, and at the moment, the angle between the air outlet of the cold air gun and the cold air spraying area and the distance between the air outlet of the cold air gun and the micro drill can be controlled, so that the cold air can not be directly sprayed onto a drill point of the micro drill, and the working stability of the micro drill is effectively kept. Meanwhile, the direction of the air outlet of the cold air gun is consistent with the direction of the spiral angle of the micro-drilling drill point, so that the air fluid field of a drilling environment can be changed, and the throwing-out of drill cuttings is facilitated.
The drilling and cooling method for the circuit board provided by the invention not only reduces the processing temperature, but also avoids various problems in the liquid cooling process, can effectively avoid the phenomena of processing retention, processing layering and the like, and reduces the quality problems of accumulated chip, processing burrs and the like, thereby greatly improving the machining performance of the aluminum substrate. Meanwhile, the used equipment is economical and simple and is easy to realize, and the cold air in the invention is compressed air, has the advantages of economy, environmental protection, no damage to processed plates and low price, and can be used in the field of processing of LED aluminum substrates.
Drawings
FIG. 1 is a schematic diagram of the application of the cooling method of the present invention;
FIG. 2 is a schematic view of the structure of the air cooler according to the present invention;
FIG. 3 is a cross-sectional view of the air gun of the present invention;
FIG. 4 is a partial schematic view of the present invention;
FIG. 5 is a schematic view of another application of the cooling method of the present invention;
FIG. 6 is a schematic diagram of another application of the cooling method of the present invention.
Detailed Description
The following provides a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings.
Example 1
A drilling cooling method of a circuit board comprises the following specific steps:
and S1, before drilling, freezing the circuit board to make the temperature reach the lower value of the safe storage temperature range.
S2, drilling holes on the circuit board 5 by a micro drill arranged on the main shaft, and respectively cooling different working areas by cold air through a cold air device 100 in the drilling process of the micro drill so as to reduce the temperature of the cooled areas;
and S3, monitoring the temperature in the processing process through the temperature sensor 4, and feeding the monitored information back to the air speed regulator, wherein the air speed regulator controls the air inlet flow and the air inlet pressure of the compressor 3 according to the detected temperature so as to control the temperature and the flow of the cold air of the low-temperature cold air device.
In step S2, the cooling device 100 includes a compressor 3, at least one cooling gun for cooling three areas to form a circulating cooling air cooling device 1, and a mechanical arm 2 for fixing the position of the cooling gun; the cold air gun comprises a gun body 11, an air inlet pipe 12 arranged below the gun body, a hot air pipe 13 arranged at one side of the gun body, a cold air pipe 14 arranged inside the gun body and connected with an air outlet, and an air outlet 15 positioned at one side of the gun body, a gas mixing cavity 16 communicated with the gas inlet pipe 12 is arranged in the gun body 11, a swirl chamber 17, a heat insulation layer 18 and a heat dissipation block 19 are also arranged in the gun body, the heat insulation layer is arranged outside the cold air pipe 14, the heat dissipation block is arranged outside the hot air pipe 13, the air mixing chamber 16 is communicated with the vortex chamber 17 through an air guide hole 191 provided on the heat radiating block 19, one side of the hot air pipe 12 and one side of the cold air pipe 14 are respectively communicated with the vortex chamber 17 at different positions, an air outlet pipe 152 is arranged on the other side of the cold air pipe, an air outlet 151 is arranged at the tail end of the air outlet pipe, and one end of the air inlet pipe 12 is connected with the compressor 3; the low-temperature cold air device is further provided with two temperature sensors 4 and a wind speed regulator, the temperature sensors are arranged on the periphery of the air outlet 15 of the cold air gun, the wind speed regulator is arranged inside the compressor, the temperature sensors are connected with the wind speed regulator, and the cold air gun can blow out cold air with different flow rates through the wind speed regulator.
In step S2, the different working areas include a processing area, a processed area, and an area to be processed of the workpiece, the cooling device includes two cooling air guns to form a circular cooling air blower for cooling the three areas, and the cooling air guns can respectively blow out cooling air with different flow rates through the air speed regulator.
In step S3, the working height of the outlet of the cooling gun is 10mm, that is, the vertical distance between the outlet end 151 of the outlet and the working area is 10 mm.
In step S2, the angle between the air outlet direction of the air outlet of the air gun and the center line of the drill point is 70 °.
In step S2, the ambient temperature of the processing region, the processed region, or the region to be processed is maintained at 22 ℃.
In step S3, the processing procedure may be performed by adjusting the air speed regulator to blow out cold air at different flow rates, and the processing mode of blowing cold air at a small flow rate of 0.3MPa in the early stage of processing and blowing cold air at a large flow rate of 0.7MPa in the later stage of processing is used to achieve the best effect.
In step S3, the processing procedure can be performed by adjusting the compressor to blow out cold air at different temperatures, in this embodiment, the best effect is achieved by blowing cold air at a temperature of-60 ℃ during the early stage of the processing and blowing cold air at a temperature of-30 ℃ during the later stage of the processing (i.e., starting a lot of chips removal and the drill point is in the stabilization period).
Example 2
A drilling cooling method of a circuit board comprises the following specific steps:
and S1, before drilling, freezing the circuit board to make the temperature reach the lower value of the safe storage temperature range.
S2, drilling holes on the circuit board 5 by a micro drill arranged on the main shaft, and respectively cooling different working areas by cold air through a cold air device 100 in the drilling process of the micro drill so as to reduce the temperature of the cooled areas;
and S3, monitoring the temperature in the processing process through the temperature sensor 4, and feeding the monitored information back to the air speed regulator, wherein the air speed regulator controls the air inlet flow and the air inlet pressure of the compressor 3 according to the detected temperature so as to control the temperature and the flow of the cold air of the low-temperature cold air device.
In step S2, the cooling device 100 includes a compressor 3, at least one cooling gun for cooling three areas to form a circulating cooling air cooling device 1, and a mechanical arm 2 for fixing the position of the cooling gun; the cold air gun comprises a gun body 11, an air inlet pipe 12 arranged below the gun body, a hot air pipe 13 arranged at one side of the gun body, a cold air pipe 14 arranged inside the gun body and connected with an air outlet, and an air outlet 15 positioned at one side of the gun body, a gas mixing cavity 16 communicated with the gas inlet pipe 12 is arranged in the gun body 11, a swirl chamber 17, a heat insulation layer 18 and a heat dissipation block 19 are also arranged in the gun body, the heat insulation layer is arranged outside the cold air pipe 14, the heat dissipation block is arranged outside the hot air pipe 13, the air mixing chamber 16 is communicated with the vortex chamber 17 through an air guide hole 191 provided on the heat radiating block 19, one side of the hot air pipe 12 and one side of the cold air pipe 14 are respectively communicated with the vortex chamber 17 at different positions, an air outlet pipe 152 is arranged on the other side of the cold air pipe, an air outlet 151 is arranged at the tail end of the air outlet pipe, and one end of the air inlet pipe 12 is connected with the compressor 3; the low-temperature cold air device is further provided with a temperature sensor 4 and a wind speed regulator, the temperature sensor is arranged around the air outlet 15 of the cold air gun, the wind speed regulator is arranged inside the compressor, the temperature sensor is connected with the wind speed regulator, and the cold air gun can blow out cold air with different flow rates through the wind speed regulator.
In step S2, the different working areas include a processing area, a processed area, and an area to be processed of the workpiece, the cooling device includes a cooling gun for cooling the three areas by blowing cooling air, and the cooling gun can respectively blow out cooling air with different flow rates through the air speed regulator.
In step S3, the working height of the outlet of the cooling gun is 7mm, that is, the vertical distance between the outlet end 151 of the outlet and the working area is 7 mm.
In step S2, the angle between the air outlet direction of the air outlet of the air gun and the center line of the drill point is 30 °.
In step S2, the ambient temperature of the processing region, the processed region, or the region to be processed is maintained at 25 ℃.
In step S3, the air speed regulator is adjusted to blow out cold air with different flow rates during the processing, and the processing mode of blowing cold air with a small flow rate of 0.25MPa in the early stage of processing and blowing cold air with a large flow rate of 0.65MPa in the later stage of processing is adopted to achieve the best effect.
In step S3, the processing procedure can be performed by adjusting the compressor to blow out cold air at different temperatures, in this embodiment, the best effect is achieved by blowing cold air at a temperature of-70 ℃ during the early stage of the processing and blowing cold air at a temperature of-40 ℃ during the later stage of the processing (i.e., starting a lot of chips removal and the drill point is in the stabilization period).
Example 3
A drilling cooling method of a circuit board comprises the following specific steps:
and S1, before drilling, freezing the circuit board to make the temperature reach the lower value of the safe storage temperature range.
S2, drilling holes on the circuit board 5 by a micro drill arranged on the main shaft, and respectively cooling different working areas by cold air through a cold air device 100 in the drilling process of the micro drill so as to reduce the temperature of the cooled areas;
and S3, monitoring the temperature in the processing process through the temperature sensor 4, and feeding the monitored information back to the air speed regulator, wherein the air speed regulator controls the air inlet flow and the air inlet pressure of the compressor 3 according to the detected temperature so as to control the temperature and the flow of the cold air of the low-temperature cold air device.
In step S2, the cooling device 100 includes a compressor 3, at least one cooling gun for cooling three areas to form a circulating cooling air cooling device 1, and a mechanical arm 2 for fixing the position of the cooling gun; the cold air gun comprises a gun body 11, an air inlet pipe 12 arranged below the gun body, a hot air pipe 13 arranged at one side of the gun body, a cold air pipe 14 arranged inside the gun body and connected with an air outlet, and an air outlet 15 positioned at one side of the gun body, a gas mixing cavity 16 communicated with the gas inlet pipe 12 is arranged in the gun body 11, a swirl chamber 17, a heat insulation layer 18 and a heat dissipation block 19 are also arranged in the gun body, the heat insulation layer is arranged outside the cold air pipe 14, the heat dissipation block is arranged outside the hot air pipe 13, the air mixing chamber 16 is communicated with the vortex chamber 17 through an air guide hole 191 provided on the heat radiating block 19, one side of the hot air pipe 12 and one side of the cold air pipe 14 are respectively communicated with the vortex chamber 17 at different positions, an air outlet pipe 152 is arranged on the other side of the cold air pipe, an air outlet 151 is arranged at the tail end of the air outlet pipe, and one end of the air inlet pipe 12 is connected with the compressor 3; the low-temperature cold air device is further provided with four temperature sensors 4 and a wind speed regulator, the temperature sensors are arranged on the periphery of the air outlet 15 of the cold air gun, the wind speed regulator is arranged inside the compressor, the temperature sensors are connected with the wind speed regulator, and the cold air gun can blow out cold air with different flow rates through the wind speed regulator.
In step S2, the different working areas include a processing area, a processed area, and an area to be processed of the workpiece, the cooling device includes three cooling air guns for cooling the three areas by surrounding cooling air, and the cooling air guns can respectively blow out cooling air with different flow rates through the air speed regulator.
In step S3, the working height of the outlet of the cooling gun is 13mm, that is, the vertical distance between the outlet end 151 of the outlet and the working area is 13 mm.
In step S2, the angle between the air outlet direction of the air outlet of the air gun and the center line of the drill point is 75 °.
In step S2, the ambient temperature of the processing region, the processed region, or the region to be processed is maintained at 20 ℃.
In step S3, the processing procedure may be performed by adjusting the air speed regulator to blow out cold air at different flow rates, and the processing mode of blowing cold air at a small flow rate of 0.4MPa in the early stage of processing and blowing cold air at a large flow rate of 0.8MPa in the later stage of processing is used to achieve the best effect.
In step S3, the processing procedure can be performed by adjusting the compressor to blow out cold air at different temperatures, in this embodiment, the best effect is achieved by blowing cold air at a temperature of-50 ℃ during the early stage of the processing and blowing cold air at a temperature of-20 ℃ during the later stage of the processing (i.e., starting a lot of chips removal and the drill point is in the stabilization period).
Example 4
A drilling cooling method of a circuit board comprises the following specific steps:
and S1, before drilling, freezing the circuit board to make the temperature reach the lower value of the safe storage temperature range.
S2, drilling holes on the circuit board 5 by a micro drill arranged on the main shaft, and respectively cooling different working areas by cold air through a cold air device 100 in the drilling process of the micro drill so as to reduce the temperature of the cooled areas;
and S3, monitoring the temperature in the processing process through the temperature sensor 4, and feeding the monitored information back to the air speed regulator, wherein the air speed regulator controls the air inlet flow and the air inlet pressure of the compressor 3 according to the detected temperature so as to control the temperature and the flow of the cold air of the low-temperature cold air device.
In step S2, the cooling device 100 includes a compressor 3, at least one cooling gun for cooling three areas to form a circulating cooling air cooling device 1, and a mechanical arm 2 for fixing the position of the cooling gun; the cold air gun comprises a gun body 11, an air inlet pipe 12 arranged below the gun body, a hot air pipe 13 arranged at one side of the gun body, a cold air pipe 14 arranged inside the gun body and connected with an air outlet, and an air outlet 15 positioned at one side of the gun body, a gas mixing cavity 16 communicated with the gas inlet pipe 12 is arranged in the gun body 11, a swirl chamber 17, a heat insulation layer 18 and a heat dissipation block 19 are also arranged in the gun body, the heat insulation layer is arranged outside the cold air pipe 14, the heat dissipation block is arranged outside the hot air pipe 13, the air mixing chamber 16 is communicated with the vortex chamber 17 through an air guide hole 191 provided on the heat radiating block 19, one side of the hot air pipe 12 and one side of the cold air pipe 14 are respectively communicated with the vortex chamber 17 at different positions, an air outlet pipe 152 is arranged on the other side of the cold air pipe, an air outlet 151 is arranged at the tail end of the air outlet pipe, and one end of the air inlet pipe 12 is connected with the compressor 3; the low temperature cold wind device still is equipped with three temperature sensor 4 and air speed regulator, temperature sensor set up in around cold wind rifle air outlet 15, the air speed regulator set up in inside the compressor, temperature sensor with the air speed regulator is connected, cold wind rifle accessible air speed regulator blows out the cold wind of different flows.
In step S2, the different working areas include a processing area, a processed area, and an area to be processed of the workpiece, the cold air device includes four cold air guns to form a circular cooling air blower for cooling the three areas, and the cold air guns can respectively blow out cold air with different flow rates through the air speed regulator.
In step S3, the working height of the outlet of the cooling gun is 11mm, that is, the vertical distance between the outlet end 151 of the outlet and the working area is 11 mm.
In step S2, the air outlet direction of the air outlet of the air gun is at an angle of 65 ° with respect to the center line of the drill point.
In step S2, the ambient temperature of the processing region, the processed region, or the region to be processed is maintained at 15 ℃.
In step S3, the air speed regulator is adjusted to blow out cold air with different flow rates during the processing, and the processing mode of blowing cold air with a small flow rate of 0.35MPa in the early stage of processing and blowing cold air with a large flow rate of 0.75MPa in the later stage of processing is adopted to achieve the best effect.
In step S3, the processing procedure can be performed by adjusting the compressor to blow out cold air at different temperatures, in this embodiment, the best effect is achieved by blowing cold air at a temperature of-65 ℃ during the early stage of the processing and blowing cold air at a temperature of-25 ℃ during the later stage of the processing (i.e., starting a lot of chips removal and the drill point is in the stabilization period).
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. All technical details which are not described in detail in the present invention can be implemented by any prior art in the field.
Claims (7)
1. A drilling cooling method of a circuit board is characterized by comprising the following specific steps:
s1, before drilling, freezing a PTFE circuit board to enable the temperature of the PTFE circuit board to reach a lower value of a safe storage temperature range;
s2, drilling holes on the circuit board (5) by a micro drill arranged on the main shaft, and respectively cooling different working areas by cold air through a cold air device (100) in the drilling process of the micro drill so as to reduce the temperature of the cooled areas;
s3, monitoring the temperature in the machining process through a temperature sensor (4), feeding monitored information back to a wind speed regulator, and controlling the air inlet flow and the air inlet pressure of the compressor (3) by the wind speed regulator according to the detected temperature so as to control the temperature and the flow of cold air of the low-temperature cold air device;
in step S2, the cold air device (100) includes a compressor (3), at least one cold air gun (1), and a robot arm (2) for fixing a position of the cold air gun; the cold air gun comprises a gun body (11), an air inlet pipe (12) arranged below the gun body, a hot air pipe (13) arranged on one side of the gun body, a cold air pipe (14) arranged inside the gun body and connected with an air outlet, and an air outlet (15) arranged on one side of the gun body, wherein an air mixing cavity (16) communicated with the air inlet pipe (12) is arranged in the gun body (11), a vortex chamber (17), a heat insulating layer (18) and a radiating block (19) are further arranged in the gun body, the heat insulating layer is arranged outside the cold air pipe (14), the radiating block is arranged outside the hot air pipe (13), the air mixing cavity (16) is communicated with the vortex chamber (17) through an air guide hole (191) formed in the radiating block (19), one sides of the hot air pipe (13) and the cold air pipe (14) are respectively communicated with the vortex chamber (17) at different positions, and an air outlet pipe (152, an air outlet (15) is formed in the tail end of the air outlet pipe, and one end of the air inlet pipe (12) is connected with the compressor (3); the low-temperature cold air device is further provided with at least one temperature sensor (4) and a wind speed regulator, wherein the temperature sensor is arranged around a cold air gun air outlet (15), the wind speed regulator is arranged inside the compressor, the temperature sensor is connected with the wind speed regulator, and cold air with different flows can be blown out by the cold air gun through the wind speed regulator.
2. The method for drilling and cooling a circuit board according to claim 1, wherein in step S2, the different working areas include a processing area, a processed area and an area to be processed of the workpiece, and the cooling device comprises at least one cooling air gun for cooling the three areas by blowing cooling air.
3. The drilling and cooling method for circuit boards according to claim 1, wherein in step S3, the working height of the air outlet of the air gun is 7-13mm, that is, the vertical distance from the air outlet end (151) of the air outlet to the working area is 7-13 mm.
4. The method for drilling and cooling a circuit board according to claim 1, wherein in step S2, the air outlet direction of the air outlet of the air gun is at an angle of 30-75 ° with respect to the center line of the drill point.
5. Drilling cooling method for circuit boards according to claim 1, characterized in that in step S2 the ambient temperature of the machining area, the machined area or the area to be machined is kept between 15-25 ℃ by blowing air through a cold air gun.
6. The drilling and cooling method for circuit boards according to claim 1, wherein in step S3, the processing procedure can be performed by adjusting the air speed regulator to blow cold air at different flow rates, and the processing procedure comprises blowing cold air at 0.25-0.4MPa in the early stage of processing and blowing cold air at 0.65-0.8MPa in the later stage of processing.
7. The drilling and cooling method for circuit boards according to claim 1, wherein in step S3, the processing procedure can be performed by adjusting the compressor to blow cold air at different temperatures, and the processing procedure comprises blowing cold air at-70 to-50 ℃ in the early stage of processing and blowing cold air at-40 to-20 ℃ in the later stage of processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610746089.5A CN107791320B (en) | 2016-08-29 | 2016-08-29 | Drilling and cooling method of circuit board |
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| CN201610746089.5A CN107791320B (en) | 2016-08-29 | 2016-08-29 | Drilling and cooling method of circuit board |
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| CN101767291A (en) * | 2009-01-06 | 2010-07-07 | 张震 | Low-temperature spraying system and technology of gear cutting equipment |
| CN104552441B (en) * | 2014-12-31 | 2017-05-03 | 广东工业大学 | Micro-pore drilling device for flexible printed circuit board and processing method thereof |
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