CN107785401B - Manufacturing method of color film substrate, color film substrate and display panel - Google Patents
Manufacturing method of color film substrate, color film substrate and display panel Download PDFInfo
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- CN107785401B CN107785401B CN201711027589.4A CN201711027589A CN107785401B CN 107785401 B CN107785401 B CN 107785401B CN 201711027589 A CN201711027589 A CN 201711027589A CN 107785401 B CN107785401 B CN 107785401B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
Abstract
The invention relates to the technical field of display, and discloses a manufacturing method of a color film substrate, the color film substrate and a display panel, so as to improve the manufacturing precision of the color film substrate. The manufacturing method of the color film substrate comprises the following steps: forming a pattern of an alignment mark on the substrate, wherein the alignment mark comprises a mark used when a color photoresist is correspondingly manufactured and an original mark used when a black matrix is correspondingly manufactured; forming a pattern of a color photoresist on the substrate base plate according to the alignment mark, and simultaneously forming a copy mark superposed with the original mark on one side of the original mark far away from the substrate base plate, wherein the original mark is used for correspondingly manufacturing the black matrix; and forming a black matrix pattern in the region defined by the color photoresist on the substrate according to the copy mark.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of a color film substrate, the color film substrate and a display panel.
Background
An Organic Light-Emitting Diode (OLED) display device has been regarded as a next generation display technology with great development prospect due to its advantages of being thin, Light, wide in viewing angle, active in Light emission, continuously adjustable in Light color, low in cost, fast in response speed, low in energy consumption, low in driving voltage, wide in working temperature range, simple in production process, high in Light-Emitting efficiency, capable of flexibly displaying, and the like.
The OLED display technology can be roughly divided into three ways of implementing color display: red (R), green (G), blue (B) independent pixel emission, color conversion emission, and white OLED and color filter combination. The mode of combining the white light OLED and the color filter follows the principle of full color Liquid Crystal Display (LCD), and only the white light emitting OLED is used to emit light, and then the color filter is used to filter out the three primary colors R, G, B, because a single OLED light source is adopted, the brightness life of the three primary colors R, G, B is the same, and no color distortion occurs, the white light OLED and the color filter are widely applied to large-size Display panels. The OLED top emission device applying the mode generally comprises an OLED display substrate, a color film substrate and a filling layer filled between the OLED display substrate and the color film substrate.
The existing color film substrate comprises a substrate, and an alignment mark, a black matrix, an R photoresist, a G photoresist, a B photoresist, a flat layer, an auxiliary cathode, a spacer and a contact electrode layer which are sequentially manufactured on the substrate through a composition process, wherein the contact electrode layer is used for realizing the bridging of the auxiliary cathode and a cathode layer of an OLED substrate, the alignment mark comprises marks used for aligning a mask plate and the substrate when the subsequent layers are manufactured correspondingly, the marks are identified by automatic alignment equipment, so that the mask plate and the substrate can be accurately aligned, and the graphical manufacturing of the layers on the substrate is realized. The prior art has the defects that after the whole layer of black matrix is formed on the alignment mark, because the shading degree of the black matrix material is high, the automatic alignment equipment cannot identify the mark used for aligning the mask plate and the substrate when the black matrix pattern is correspondingly manufactured, so that normal alignment cannot be realized, and the manufacturing precision is low.
Disclosure of Invention
The embodiment of the invention aims to provide a manufacturing method of a color film substrate, the color film substrate and a display panel, so as to improve the manufacturing precision of the color film substrate.
The embodiment of the invention provides a manufacturing method of a color film substrate, which comprises the following steps:
forming a pattern of an alignment mark on a substrate, wherein the alignment mark comprises a mark used when a color light resistor is correspondingly manufactured and an original mark used when a black matrix is correspondingly manufactured;
forming a pattern of a color photoresist on the substrate according to the alignment mark, and simultaneously forming a copy mark superposed with the original mark on one side of the original mark far away from the substrate when the black matrix is correspondingly manufactured;
and forming a black matrix pattern in an area defined by the color photoresist on the substrate according to the replication mark.
By adopting the manufacturing method provided by the embodiment of the invention, the pattern of the color photoresist is firstly manufactured on the substrate, and the copy mark superposed with the original mark is formed on the original mark used when the black matrix is correspondingly manufactured while the color photoresist is manufactured, so that the height of the final mark used when the black matrix is manufactured is the sum of the heights of the original mark and the copy mark, and after the whole black matrix film layer is formed on the substrate, the surface reflectivity of the substrate is different due to the relatively higher height of the alignment mark, the alignment mark is favorably identified by automatic alignment equipment, the pattern of the black matrix is manufactured on the premise of accurate alignment, and the manufacturing precision of the color film substrate can be improved; in addition, the method of manufacturing the color photoresist after manufacturing the black matrix on the substrate in the prior art is adopted, the color photoresist is often partially covered on the black matrix, so that the section difference of the surface of the substrate is increased, and the subsequent surface planarization treatment is not facilitated.
Preferably, the forming a pattern of a color photoresist on the substrate according to the alignment mark, and forming a copy mark overlapping with an original mark on a side of the original mark away from the substrate when correspondingly manufacturing a black matrix, specifically includes:
forming a first copy mark superposed with the original mark on one side of the mark used in the corresponding black matrix manufacture far away from the substrate base plate while forming a pattern of a blue light resistance on the substrate base plate;
forming a second replication mark which is overlapped with the first replication mark on one side of the first replication mark far away from the substrate base plate while forming a pattern of a green light resistor on the substrate base plate;
and forming a third replication mark which is overlapped with the second replication mark on the side of the second replication mark far away from the substrate base plate while forming a pattern of a red photoresist on the substrate base plate.
In the embodiment, the three-layer copy mark superposed with the original mark is formed on the original mark used in the corresponding black matrix manufacturing, so that the alignment mark is easier to identify by automatic alignment equipment, and the manufacturing precision of the color film substrate is improved.
Preferably, the method further comprises:
and simultaneously forming a flat layer and a pattern of a spacer on one side of the color photoresist and the black matrix, which are far away from the substrate, wherein the spacer is positioned on one side of the flat layer, which is far away from the substrate, and is opposite to the black matrix.
By adopting the scheme of the embodiment, the flat layer and the spacer are formed by adopting the same mask composition process, so that the manufacturing process of the color film substrate is simplified, and the manufacturing cost is reduced.
Specifically, the method for simultaneously forming the patterns of the flat layer and the spacer on the side, away from the substrate, of the color photoresist and the black matrix comprises the following steps:
forming a negative photoresist film layer on one side of the color photoresist and the black matrix, which is far away from the substrate;
exposing the negative photoresist film layer by taking a mask plate as a protective mask, exposing the part of the region of the negative photoresist film layer corresponding to the flat layer, and not exposing the region corresponding to the spacer;
and developing the exposed negative photoresist film layer.
Optionally, according to the copy mark, a black matrix pattern located in an area defined by the color photoresist is formed on the substrate, specifically:
forming a black matrix pattern in an area defined by the color photoresist on the substrate by adopting an ink-jet printing method; alternatively, the first and second electrodes may be,
and forming a black matrix pattern in an area defined by the color photoresist on the substrate by adopting a mask patterning process.
Preferably, the method further comprises:
and forming a pattern of the auxiliary cathode on the surface of the spacer.
In the embodiment, the auxiliary cathode is manufactured on the surface of the spacer, so that the auxiliary cathode can be directly contacted with the cathode layer of the OLED display substrate, and compared with the prior art, the manufacturing of a contact electrode is omitted, the manufacturing process of the color film substrate is further simplified, and the manufacturing cost is reduced.
The embodiment of the invention also provides a color film substrate manufactured according to the technical scheme. The color film substrate is high in manufacturing precision.
The embodiment of the invention also provides a display panel, wherein the display panel is an organic light emitting diode display panel, and comprises the color film substrate, an organic light emitting diode display substrate arranged opposite to the color film substrate, and a filler filled between the color film substrate and the organic light emitting diode display substrate, wherein an auxiliary cathode positioned on the surface of a spacer of the color film substrate is in contact with a cathode layer of the organic light emitting diode display substrate. The manufacturing precision of the color film substrate is high, so that the display effect of the display panel is good.
The embodiment of the invention also provides a color film substrate manufactured according to the technical scheme. The color film substrate is high in manufacturing precision.
The embodiment of the invention also provides a display panel which is a liquid crystal display panel and comprises the color film substrate, the array substrate and a liquid crystal layer, wherein the array substrate is arranged opposite to the color film substrate, and the liquid crystal layer is filled between the color film substrate and the array substrate. The manufacturing precision of the color film substrate is high, so that the display effect of the display panel is good.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a color film substrate according to an embodiment of the invention;
FIG. 2 is a flowchart illustrating the detailed steps of step 102 in FIG. 1;
fig. 3 is a schematic structural diagram of a color film substrate according to an embodiment of the present invention;
FIG. 4 is a flow chart of a method for fabricating a planarization layer and a spacer in accordance with an embodiment of the present invention;
FIG. 5 is a schematic view of a process for fabricating a planarization layer and a spacer according to an embodiment of the present invention.
Reference numerals:
10-substrate 20-color film substrate 30-black matrix 21-blue photoresist
22-Green photoresist 23-Red photoresist 40-planarization layer 50-spacer
60-auxiliary cathode 70-negative photoresist 80-mask plate
Detailed Description
In order to improve the manufacturing precision of the color film substrate, the embodiment of the invention provides a manufacturing method of the color film substrate, the color film substrate and a display panel. In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail by referring to the following examples.
As shown in fig. 1, a method for manufacturing a color filter substrate according to an embodiment of the present invention includes:
101, forming a pattern of an alignment mark on a substrate of a substrate, wherein the alignment mark comprises a mark used for correspondingly manufacturing a color photoresist and an original mark used for correspondingly manufacturing a black matrix;
102, forming a color photoresist pattern on the substrate according to the alignment mark, and simultaneously forming a copy mark superposed with the original mark on one side of the original mark far away from the substrate when the black matrix is correspondingly manufactured;
By adopting the manufacturing method provided by the embodiment of the invention, the pattern of the color photoresist is firstly manufactured on the substrate, and the copy mark superposed with the original mark is formed on the original mark used when the black matrix is correspondingly manufactured while the color photoresist is manufactured, so that the height of the final mark used when the black matrix is manufactured is the sum of the heights of the original mark and the copy mark, and after the whole black matrix film layer is formed on the substrate, the surface reflectivity of the substrate is different due to the relatively higher height of the alignment mark, the alignment mark is favorably identified by automatic alignment equipment, the pattern of the black matrix is manufactured on the premise of accurate alignment, and the manufacturing precision of the color film substrate can be improved; in addition, the method of manufacturing the color photoresist after manufacturing the black matrix on the substrate in the prior art is adopted, the color photoresist is often partially covered on the black matrix, so that the section difference of the surface of the substrate is increased, and the subsequent surface planarization treatment is not facilitated.
As shown in fig. 3, the color filter substrate includes a color filter 20 including a red photoresist 23, a green photoresist 22, and a blue photoresist 21, and the color filter 20 may be made of a resin insulating material. It should be noted that, in the embodiment of the present invention, the color photoresist 20 is not limited to RGB (Red Green Blue ) three colors, and may also be a combination of multiple colors such as RGBW (Red Green Blue White ), RGBY (Red Green Blue Yellow), CMYK (Cyan Magenta Yellow Black), and CMYK (Cyan Magenta Yellow Black).
As shown in fig. 2, step 102 specifically includes:
and 1023, forming a third copy mark which is overlapped with the second copy mark on the side of the second copy mark far away from the substrate while forming a pattern of the red photoresist on the substrate.
When the color photoresist includes a red photoresist, a green photoresist and a blue photoresist, the green photoresist and the red photoresist may be sequentially fabricated on the substrate according to the above processes, and certainly, the red photoresist or the green photoresist may be fabricated first, which is not described herein again. In this embodiment, when the blue photoresist is manufactured, a first copy mark with the same thickness as the blue photoresist is manufactured on the original mark; when the green photoresist is manufactured, a second copy mark with the same thickness as the green photoresist is manufactured on the first copy mark; and when the red photoresist is manufactured, a third copy mark with the same thickness as the red photoresist is manufactured on the second copy mark, so that the height of the final mark used for manufacturing the black matrix is the sum of the original mark and the first copy mark, the second copy mark and the third copy mark, and the reflectivity of the substrate corresponding to the alignment mark is obviously different from the reflectivity of other positions, so that the alignment mark can be more easily identified by automatic alignment equipment, and the manufacturing precision of the color film substrate is improved.
The pattern of the color resist is generally formed by a patterning process, and for a pattern structure using a resin material, the one-step patterning process generally includes steps of substrate cleaning, film formation, exposure, development, and the like.
In the embodiment of the invention, the blue photoresist and the first replication mark can be made by adopting a mask plate, namely, the blue photoresist and the first replication mark are formed by a one-time composition process, and the green photoresist and the second replication mark, and the red photoresist and the third replication mark can be made by adopting a mask plate in the same way. For example, the manufacturing process of the blue photoresist and the first copy mark is as follows: forming a whole blue light resistance film layer on a substrate, accurately aligning a mask plate for correspondingly manufacturing the blue light resistance with the substrate according to an alignment mark, enabling a region of the blue light resistance film layer corresponding to the blue light resistance to be formed and a region corresponding to an original mark used in manufacturing a black matrix not to be exposed, completely exposing other regions corresponding to the substrate, and developing the exposed blue light resistance film layer, so that the blue light resistance and a pattern of a first copy mark can be formed on the substrate.
In a preferred embodiment of the present invention, the method for manufacturing a color filter substrate further includes:
and simultaneously forming a flat layer and a pattern of a spacer on one side of the color photoresist and the black matrix, which are far away from the substrate, wherein the spacer is positioned on one side of the flat layer, which is far away from the substrate, and is opposite to the black matrix.
By adopting the scheme of the embodiment, the flat layer and the spacer are formed by adopting the same mask composition process, so that the manufacturing process of the color film substrate is simplified, and the manufacturing cost is reduced.
Specifically, as shown in fig. 4 and 5, the forming of the patterns of the planarization layer 40 and the spacer 50 on the side of the color photoresist 20 and the black matrix 30 away from the substrate includes the following steps:
forming a negative photoresist film layer 70 on the side of the color photoresist 20 and the black matrix 30 away from the substrate 10;
exposing the negative photoresist film layer 70 by taking the mask plate 80 as a protective mask, exposing the part of the negative photoresist film layer 70 corresponding to the region for forming the flat layer 40, and not exposing the region corresponding to the spacer 50;
the exposed negative photoresist film layer 70 is developed.
In the embodiment of the present invention, the manufacturing method of the black matrix is not limited, for example, an inkjet printing method may be adopted to form a pattern of the black matrix on the substrate in the region defined by the color photoresist; alternatively, a mask patterning process may be used to form a black matrix pattern on the substrate within the area defined by the color resists. When the black matrix is formed by using the mask patterning process, the manufacturing process also includes processes such as film formation, exposure, development, post-baking, and the like, which are not described herein again.
As shown in fig. 3, the color filter substrate applied to the OLED display panel further includes an auxiliary cathode 60. In a preferred embodiment of the present invention, the method for manufacturing a color filter substrate further includes: the pattern of the auxiliary cathode 60 is formed on the surface of the spacer 50. In the embodiment, the auxiliary cathode 60 is formed on the surface of the spacer 50 so as to be in direct contact with the cathode layer of the OLED display substrate, which saves the formation of a contact electrode in comparison with the prior art, further simplifies the manufacturing process of the color filter substrate, and reduces the manufacturing cost.
For the pattern structure using metal material for the auxiliary cathode, the one-step composition process usually includes the steps of substrate cleaning, film formation, photoresist coating, exposure, development, etching, photoresist stripping, etc., and the metal layer usually forms a film by physical vapor deposition (for example, magnetron sputtering), and forms a pattern by wet etching.
The embodiment of the invention also provides a color film substrate which is manufactured according to the technical scheme and is applied to the OLED display device. The color film substrate is high in manufacturing precision.
The embodiment of the invention also provides an OLED display panel, which comprises the color film substrate, the OLED display substrate arranged opposite to the color film substrate and a filler filled between the color film substrate and the OLED display substrate, wherein the auxiliary cathode positioned on the surface of the spacer of the color film substrate is in contact with the cathode layer of the OLED display substrate. The manufacturing precision of the color film substrate is high, so that the display effect of the display panel is good.
The embodiment of the invention also provides a color film substrate which is manufactured according to the technical scheme and is applied to the liquid crystal display device. The color film substrate is high in manufacturing precision.
The embodiment of the invention also provides a liquid crystal display panel, which comprises the color film substrate, the array substrate and a liquid crystal layer, wherein the array substrate is arranged opposite to the color film substrate, and the liquid crystal layer is filled between the color film substrate and the array substrate. The manufacturing precision of the color film substrate is high, so that the display effect of the display panel is good.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A manufacturing method of a color film substrate is characterized by comprising the following steps:
forming a pattern of an alignment mark on a substrate, wherein the alignment mark comprises a mark used when a color light resistor is correspondingly manufactured and an original mark used when a black matrix is correspondingly manufactured;
according to the alignment mark, a pattern of a color photoresist is formed on the substrate base plate, and a copy mark superposed with the original mark is formed on one side of the original mark far away from the substrate base plate when the black matrix is correspondingly manufactured, and the method specifically comprises the following steps:
forming a first copy mark superposed with the original mark on one side of the mark used in the corresponding black matrix manufacturing process, which is far away from the substrate base plate, while forming a pattern of a blue photoresist on the substrate base plate, wherein the film thickness of the first copy mark is equal to that of the blue photoresist;
forming a second copy mark overlapped with the first copy mark on one side of the first copy mark far away from the substrate base plate while forming a pattern of a green light resistor on the substrate base plate, wherein the film thickness of the second copy mark is equal to that of the green light resistor;
forming a third replication mark which is overlapped with the second replication mark on one side of the second replication mark far away from the substrate base plate while forming a pattern of a red photoresist on the substrate base plate, wherein the film thickness of the third replication mark is equal to that of the red photoresist;
and forming a black matrix pattern in an area defined by the color photoresist on the substrate according to the replication mark.
2. The method for manufacturing the color film substrate according to claim 1, further comprising:
and simultaneously forming a flat layer and a pattern of a spacer on one side of the color photoresist and the black matrix, which are far away from the substrate, wherein the spacer is positioned on one side of the flat layer, which is far away from the substrate, and is opposite to the black matrix.
3. The method for manufacturing the color filter substrate according to claim 2, wherein the patterns of the planarization layer and the spacer are formed on the side of the color photoresist and the black matrix away from the substrate, and the method specifically comprises the following steps:
forming a negative photoresist film layer on one side of the color photoresist and the black matrix, which is far away from the substrate;
exposing the negative photoresist film layer by taking a mask plate as a protective mask, exposing the part of the region of the negative photoresist film layer corresponding to the flat layer, and not exposing the region corresponding to the spacer;
and developing the exposed negative photoresist film layer.
4. The method for manufacturing a color filter substrate according to any one of claims 1 to 3, wherein a black matrix pattern located in an area defined by the color photoresist is formed on the substrate according to the copy mark, and specifically includes:
forming a black matrix pattern in an area defined by the color photoresist on the substrate by adopting an ink-jet printing method; alternatively, the first and second electrodes may be,
and forming a black matrix pattern in an area defined by the color photoresist on the substrate by adopting a mask patterning process.
5. The method for manufacturing the color film substrate according to claim 2, further comprising:
and forming a pattern of the auxiliary cathode on the surface of the spacer.
6. A color filter substrate manufactured according to the method for manufacturing a color filter substrate of any one of claims 1 to 5.
7. A display panel, which is an organic light emitting diode display panel, and which includes the color filter substrate of claim 6, an organic light emitting diode display substrate disposed opposite to the color filter substrate, and a filler filled between the color filter substrate and the organic light emitting diode display substrate, wherein an auxiliary cathode on a surface of a spacer of the color filter substrate is disposed in contact with a cathode layer of the organic light emitting diode display substrate.
8. A color filter substrate manufactured according to the method for manufacturing a color filter substrate of any one of claims 1 to 4.
9. A display panel, which is a liquid crystal display panel, and which includes the color filter substrate according to claim 8, an array substrate disposed opposite to the color filter substrate, and a liquid crystal layer filled between the color filter substrate and the array substrate.
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| CN108681166B (en) * | 2018-05-16 | 2021-01-26 | 京东方科技集团股份有限公司 | Preparation method of substrate for display, substrate for display and display device |
| CN110676293A (en) * | 2019-09-16 | 2020-01-10 | 深圳市华星光电半导体显示技术有限公司 | Color film substrate, display panel and preparation method thereof |
| CN112117316A (en) * | 2020-09-23 | 2020-12-22 | 京东方科技集团股份有限公司 | Display mother board, preparation method and alignment method of display mother board |
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