CN107778440A - A kind of special corrosion-resistant compound polyurethane material of circuit board - Google Patents
A kind of special corrosion-resistant compound polyurethane material of circuit board Download PDFInfo
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- CN107778440A CN107778440A CN201711091103.3A CN201711091103A CN107778440A CN 107778440 A CN107778440 A CN 107778440A CN 201711091103 A CN201711091103 A CN 201711091103A CN 107778440 A CN107778440 A CN 107778440A
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
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Abstract
The invention discloses a kind of special corrosion-resistant compound polyurethane material of circuit board, its raw material includes：PTMG, dimethyl diphenyl diisocyanate, norbornene alkyl diisocyanate, 2,2 dimethyl 1,3 propane diols, dimethylolpropionic acid, IPD, hydroquinone two hydroxy ethyl ether, modified montmorillonoid, silica, zirconium oxide, catalyst, plasticizer, 3 NCO propyl-triethoxysilicanes, 2, the dihydroxy diphenyl ether of 4,4 ' trichlorine 2 ', soybean protein, Ludox.The special corrosion-resistant compound polyurethane material of circuit board proposed by the present invention, its heat resistance, resistance to ag(e)ing are good, excellent anti-corrosion performance, service life length.
Description
Technical field
The present invention relates to circuit board material technical field, more particularly to a kind of special corrosion-resistant polyurethane composite of circuit board
Material.
Background technology
Polyurethane is the general name for the compound for containing carbamate groups in intramolecular, is said in a broad sense, except amino first
Outside acid esters based compound, in addition to as derived from the isocyanate compounds such as urea groups, allophanate group, biuret groups it is all poly-
Compound.Polyurethane has the characteristic such as high intensity, tear-proof, wear-resisting, has been used as roller, conveyer belt, flexible pipe, automobile zero at present
The fields such as part, sole, synthetic leather, electric wire, medical artificial organ and electronic apparatus, also turn into the material that circuit board is commonly used
One of material.But when circuit board is applied in acid-alkali medium, in addition to requiring polyurethane and possessing conventional performance, also require it
Possesses higher corrosion resistance, but common polyurethane material corrosion resistance is poor, seriously limits polyurethane circuit board
Service life and safety in utilization.
The content of the invention
Based on technical problem existing for background technology, it is compound that the present invention proposes a kind of special corrosion-resistant polyurethane of circuit board
Material, its heat resistance, resistance to ag(e)ing are good, excellent anti-corrosion performance, service life length.
The special corrosion-resistant compound polyurethane material of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly-
Tetrahydrofuran ether glycol 35-45 parts, dimethyl diphenyl diisocyanate 10-25 parts, norbornene alkyl diisocyanate 15-30 parts,
NPG 3-10 parts, dimethylolpropionic acid 1-9 parts, IPD 2-9 parts, hydroquinones dihydroxy
Ethylether 2-9 parts, modified montmorillonoid 3-10 parts, silica 2-8 parts, zirconium oxide 1-4 parts, catalyst 0.01-0.15 parts, plasticising
Agent 0.5-3 parts, 3- NCO propyl-triethoxysilicane 0.5-2 parts, 2,4,4 '-three chloro- 2 '-dihydroxy diphenyl ether 0.1-
0.9 part, soybean protein 0.6-2.5 parts, Ludox 0.1-1.5 parts.
Preferably, modified montmorillonoid is prepared according to following technique：By N, N- dimethyl propylene amines add absolute ethyl alcohol
In, formalin is stirring evenly and then adding into, adds Tea Polyphenols, back flow reaction after stirring reaction 80-150min at 70-80 DEG C
120-250min, -3~-8 DEG C are cooled to, stand 10-20 days, filter, wash, be dried to obtain intermediate product；By montmorillonite silicon
Alkane coupling agent kh-570 is modified, and is added in toluene and is stirred, and is added intermediate product and benzoyl peroxide, is passed through nitrogen, is risen
Temperature is to 75-85 DEG C, stirring reaction 100-200min, through precipitating, filtering, being dried to obtain the modified montmorillonoid.
Preferably, in the formalin, the mass fraction of formaldehyde is 37-40wt%.
Preferably, in the preparation process of modified montmorillonoid, N, formaldehyde, tea in N- dimethyl propylene amines, formalin
The weight ratio of polyphenol is 2-3：3-4：12-16.
Preferably, in the preparation process of modified montmorillonoid, the modified montmorillonite of Silane coupling reagent KH-570, middle production
The weight ratio of thing is 20-35：8-19.
Preferably, the catalyst be dibutyl tin laurate, one kind in 2,2- dual-morpholinyl diethyl ethers or
Two kinds of mixture.
Preferably, the plasticizer is dioctyl adipate.
The special corrosion-resistant compound polyurethane material of circuit board of the present invention, it is with PTMG, dimethyl
Biphenyl diisocyanate, norbornene alkyl diisocyanate are raw material, assign the excellent heat resistance of composite, intensity and ageing-resistant
Property；Coordinated using NPG, dimethylolpropionic acid and IPD as chain extender, improved multiple
The curing degree and solidification rate of condensation material；In the preparation process of preferred embodiment modified montmorillonoid, first with N, N- dimethyl allenes
Amine, formalin and Tea Polyphenols are raw material, by controlling the condition of reaction, are reacted three, have obtained intermediate product,
After intermediate product is mixed with the montmorillonite that Silane coupling reagent KH-570 is modified, double bond and silane coupler in intermediate product
There occurs reaction to have obtained modified montmorillonoid for the double bond for the montmorillonite that KH-570 is modified, so as to by N, N- dimethyl propylene amines, first
Aldehyde, Tea Polyphenols and Silane coupling reagent KH-570 have been incorporated into the surface of montmorillonite, are added into system, disperse in system equal
It is even, on the one hand, it can coordinate with silica, zirconium oxide, assign composite excellent heat resistance and intensity, on the other hand,
It can coordinate with the soybean protein in system and Ludox, assign composite excellent corrosion resistance and heat endurance.
Embodiment
Below, technical scheme is described in detail by specific embodiment.
Embodiment 1
The special corrosion-resistant compound polyurethane material of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly-
45 parts of tetrahydrofuran ether glycol, 10 parts of dimethyl diphenyl diisocyanate, 30 parts of norbornene alkyl diisocyanate, 2,2- diformazans
3 parts of base -1,3-PD, 9 parts of dimethylolpropionic acid, 2 parts of IPD, 9 parts of hydroquinone two hydroxy ethyl ether, modified illiteracy
De- 3 parts of soil, 8 parts of silica, 1 part of zirconium oxide, 0.15 part of catalyst, 0.5 part of plasticizer, the ethoxy of 3- NCOs propyl group three
2 parts of base silane, 2,4,4 '-three chloro- 0.1 part of 2 '-dihydroxy diphenyl ethers, 2.5 parts of soybean protein, 0.1 part of Ludox.
Embodiment 2
The special corrosion-resistant compound polyurethane material of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly-
35 parts of tetrahydrofuran ether glycol, 25 parts of dimethyl diphenyl diisocyanate, 15 parts of norbornene alkyl diisocyanate, 2,2- diformazans
10 parts of base -1,3-PD, 1 part of dimethylolpropionic acid, 9 parts of IPD, 2 parts of hydroquinone two hydroxy ethyl ether, modification
10 parts of montmorillonite, 2 parts of silica, 4 parts of zirconium oxide, 0.01 part of catalyst, 3 parts of plasticizer, the second of 3- NCOs propyl group three
0.5 part of TMOS, 2,4,4 '-three chloro- 0.9 part of 2 '-dihydroxy diphenyl ethers, 0.6 part of soybean protein, 1.5 parts of Ludox.
Embodiment 3
The special corrosion-resistant compound polyurethane material of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly-
43 parts of tetrahydrofuran ether glycol, 16 parts of dimethyl diphenyl diisocyanate, 26 parts of norbornene alkyl diisocyanate, 2,2- diformazans
4.7 parts of base -1,3-PD, 8.3 parts of dimethylolpropionic acid, 3.6 parts of IPD, hydroquinone two hydroxy ethyl ether 8.7
Part, 4 parts of modified montmorillonoid, 2.6 parts of silica, 3.6 parts of zirconium oxide, 0.03 part of dibutyl tin laurate, adipic acid two are pungent
It is 2.6 parts of ester, 1.1 parts of 3- NCOs propyl-triethoxysilicane, 2,4,4 '-three chloro- 0.85 part of 2 '-dihydroxy diphenyl ethers, big
1 part of legumin, 1.3 parts of Ludox；
Wherein, modified montmorillonoid is prepared according to following technique：By N, N- dimethyl propylene amines are added in absolute ethyl alcohol,
The formalin that mass fraction is 40% is stirring evenly and then adding into, stirring reaction 150min obtains material A at 70 DEG C, wherein,
The weight ratio of formaldehyde, Tea Polyphenols in N, N- dimethyl propylene amine, formalin is 2：4：12；Tea Polyphenols is added into absolute ethyl alcohol
In, it is stirring evenly and then adding into material A, back flow reaction 250min, is cooled to -3 DEG C, stands 20 days, it is filtering, washing, dry
To intermediate product；Montmorillonite is modified with Silane coupling reagent KH-570, adds in toluene and stirs, adds intermediate product and mistake
BP, wherein, the modified montmorillonite of Silane coupling reagent KH-570, the weight ratio of intermediate product are 20：19, it is passed through nitrogen
Gas, 75 DEG C, stirring reaction 200min are warming up to, through precipitating, filtering, being dried to obtain the modified montmorillonoid；
The plasticizer is dioctyl adipate.
Embodiment 4
The special corrosion-resistant compound polyurethane material of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly-
37 parts of tetrahydrofuran ether glycol, 21 parts of dimethyl diphenyl diisocyanate, 17 parts of norbornene alkyl diisocyanate, 2,2- diformazans
9.3 parts of base -1,3-PD, 1.9 parts of dimethylolpropionic acid, 8.7 parts of IPD, 3 parts of hydroquinone two hydroxy ethyl ether,
9.2 parts of modified montmorillonoid, 7.3 parts of silica, 2 parts of zirconium oxide, 0.12 part of 2,2- dual-morpholinyl diethyl ethers, 1 part of plasticizer,
1.7 parts of 3- NCOs propyl-triethoxysilicane, 2,4,4 '-three chloro- 0.2 part of 2 '-dihydroxy diphenyl ethers, soybean protein 2.2
Part, 0.3 part of Ludox；
Wherein, modified montmorillonoid is prepared according to following technique：By N, N- dimethyl propylene amines are added in absolute ethyl alcohol,
The formalin that mass fraction is 37% is stirring evenly and then adding into, stirring reaction 80min obtains material A at 80 DEG C, wherein, N,
The weight ratio of formaldehyde, Tea Polyphenols in N- dimethyl propylene amines, formalin is 3：3：16；Tea Polyphenols is added into absolute ethyl alcohol
In, it is stirring evenly and then adding into material A, back flow reaction 120min, is cooled to -8 DEG C, stands 10 days, it is filtering, washing, dry
To intermediate product；Montmorillonite is modified with Silane coupling reagent KH-570, adds in toluene and stirs, adds intermediate product and mistake
BP, wherein, the modified montmorillonite of Silane coupling reagent KH-570, the weight ratio of intermediate product are 35：8, it is passed through nitrogen
Gas, 85 DEG C, stirring reaction 100min are warming up to, through precipitating, filtering, being dried to obtain the modified montmorillonoid.
Embodiment 5
The special corrosion-resistant compound polyurethane material of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly-
40 parts of tetrahydrofuran ether glycol, 17 parts of dimethyl diphenyl diisocyanate, 22 parts of norbornene alkyl diisocyanate, 2,2- diformazans
7 parts of base -1,3-PD, 5 parts of dimethylolpropionic acid, 6 parts of IPD, 6.5 parts of hydroquinone two hydroxy ethyl ether, modification
8 parts of montmorillonite, 4.8 parts of silica, 2.6 parts of zirconium oxide, 0.09 part of catalyst, 2.1 parts of dioctyl adipate, 3- isocyanates
1.3 parts of base propyl-triethoxysilicane, 2,4,4 '-three chloro- 0.5 part of 2 '-dihydroxy diphenyl ethers, 1.3 parts of soybean protein, Ludox
1.2 part；
Wherein, modified montmorillonoid is prepared according to following technique：By N, N- dimethyl propylene amines are added in absolute ethyl alcohol,
The formalin that mass fraction is 38% is stirring evenly and then adding into, stirring reaction 120min obtains material A at 75 DEG C, wherein,
The weight ratio of formaldehyde, Tea Polyphenols in N, N- dimethyl propylene amine, formalin is 2.6：3.7：15；Tea Polyphenols is added anhydrous
In ethanol, it is stirring evenly and then adding into material A, back flow reaction 200min, is cooled to -5 DEG C, stand 17 days, filtering, washing, does
It is dry to obtain intermediate product；Montmorillonite is modified with Silane coupling reagent KH-570, adds in toluene and stirs, adds intermediate product
And benzoyl peroxide, wherein, the modified montmorillonite of Silane coupling reagent KH-570, the weight ratio of intermediate product are 27：11, lead to
Enter nitrogen, be warming up to 80 DEG C, stirring reaction 160min, through precipitating, filtering, being dried to obtain the modified montmorillonoid；
The catalyst is dibutyl tin laurate, the mixture of 2,2- dual-morpholinyl diethyl ethers, and tin dilaurate
Dibutyl tin, the weight ratio of 2,2- dual-morpholinyl diethyl ethers are 3：4.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (7)
1. a kind of special corrosion-resistant compound polyurethane material of circuit board, it is characterised in that its raw material includes by weight：Poly- tetrahydrochysene
Furans ether glycol 35-45 parts, dimethyl diphenyl diisocyanate 10-25 parts, norbornene alkyl diisocyanate 15-30 parts, 2,2-
Dimethyl-1,3-propylene glycol 3-10 parts, dimethylolpropionic acid 1-9 parts, IPD 2-9 parts, hydroquinones dihydroxy ethyl
Ether 2-9 parts, modified montmorillonoid 3-10 parts, silica 2-8 parts, zirconium oxide 1-4 parts, catalyst 0.01-0.15 parts, plasticizer
0.5-3 parts, 3- NCO propyl-triethoxysilicane 0.5-2 parts, 2,4,4 '-three chloro- 2 '-dihydroxy diphenyl ether 0.1-0.9
Part, soybean protein 0.6-2.5 parts, Ludox 0.1-1.5 parts.
2. the special corrosion-resistant compound polyurethane material of circuit board according to claim 1, it is characterised in that modified montmorillonoid is pressed
Prepared according to following technique：By N, N- dimethyl propylene amines are added in absolute ethyl alcohol, are stirring evenly and then adding into formalin,
Tea Polyphenols is added at 70-80 DEG C after stirring reaction 80-150min, back flow reaction 120-250min, is cooled to -3~-8 DEG C, is stood
10-20 days, filter, wash, be dried to obtain intermediate product；Montmorillonite is modified with Silane coupling reagent KH-570, added in toluene
Stir, add intermediate product and benzoyl peroxide, be passed through nitrogen, be warming up to 75-85 DEG C, stirring reaction 100-
200min, through precipitating, filtering, being dried to obtain the modified montmorillonoid.
3. the special corrosion-resistant compound polyurethane material of circuit board according to claim 2, it is characterised in that the formalin
In, the mass fraction of formaldehyde is 37-40wt%.
4. the special corrosion-resistant compound polyurethane material of the circuit board according to Claims 2 or 3, it is characterised in that covered modified
Take off in native preparation process, N, the formaldehyde, the weight ratio of Tea Polyphenols in N- dimethyl propylene amines, formalin are 2-3：3-4：
12-16。
5. according to the special corrosion-resistant compound polyurethane material of circuit board any one of claim 2-4, it is characterised in that
In the preparation process of modified montmorillonoid, the modified montmorillonite of Silane coupling reagent KH-570, the weight ratio of intermediate product are 20-
35：8-19.
6. according to the special corrosion-resistant compound polyurethane material of circuit board any one of claim 1-5, it is characterised in that institute
Catalyst is stated as one or two kinds of mixture in dibutyl tin laurate, 2,2- dual-morpholinyl diethyl ethers.
7. according to the special corrosion-resistant compound polyurethane material of circuit board any one of claim 1-6, it is characterised in that institute
It is dioctyl adipate to state plasticizer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711091103.3A CN107778440A (en) | 2017-11-08 | 2017-11-08 | A kind of special corrosion-resistant compound polyurethane material of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711091103.3A CN107778440A (en) | 2017-11-08 | 2017-11-08 | A kind of special corrosion-resistant compound polyurethane material of circuit board |
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| CN107778440A true CN107778440A (en) | 2018-03-09 |
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| CN201711091103.3A Withdrawn CN107778440A (en) | 2017-11-08 | 2017-11-08 | A kind of special corrosion-resistant compound polyurethane material of circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105237781A (en) * | 2015-10-09 | 2016-01-13 | 滁州环球聚氨酯科技有限公司 | Heat-resistant water-resistant modified polyurethane composite material |
| CN105331084A (en) * | 2015-10-09 | 2016-02-17 | 滁州环球聚氨酯科技有限公司 | High flame retardant polyurethane composite material |
| CN105860506A (en) * | 2016-04-19 | 2016-08-17 | 滁州环球聚氨酯科技有限公司 | Composite flame retardant modified polyurethane composite material |
| CN105906779A (en) * | 2016-04-19 | 2016-08-31 | 滁州环球聚氨酯科技有限公司 | High-strength flame-retardant modified polyurethane composite material |
-
2017
- 2017-11-08 CN CN201711091103.3A patent/CN107778440A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105237781A (en) * | 2015-10-09 | 2016-01-13 | 滁州环球聚氨酯科技有限公司 | Heat-resistant water-resistant modified polyurethane composite material |
| CN105331084A (en) * | 2015-10-09 | 2016-02-17 | 滁州环球聚氨酯科技有限公司 | High flame retardant polyurethane composite material |
| CN105860506A (en) * | 2016-04-19 | 2016-08-17 | 滁州环球聚氨酯科技有限公司 | Composite flame retardant modified polyurethane composite material |
| CN105906779A (en) * | 2016-04-19 | 2016-08-31 | 滁州环球聚氨酯科技有限公司 | High-strength flame-retardant modified polyurethane composite material |
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