Anti-static card support structure
Technical Field
The invention relates to the technical field of mobile terminals, in particular to an anti-static card support structure.
Background
At present, in order to improve the position degree and the gap uniformity between the card support cap and the middle frame hole, a combined structure of the card support cap and the card tray which can move slightly is generally used for the mobile phone. The card of this kind of structure holds in the palm the cap and the card tray between be movable, has slight clearance to exist each other, when the card holds in the palm the cap and uses aluminum alloy material, the surface can generate the oxide film that does not conduct behind the anodic process, and the card holds in the palm the cap because the friction produces static easily and gather and can't derive on the card holds in the palm the cap and influence the cell-phone performance like this in the user's use.
Disclosure of Invention
The invention aims to provide an anti-static card support structure, which solves the problem that static electricity is generated due to friction between a card support cap and a card support tray in the prior art.
The technical scheme adopted by the invention for solving the technical problem is as follows: an anti-static card support structure comprises a card support tray and a card support cap arranged at one end of the card support tray, wherein the card support cap is movably connected with the card support tray relatively through a welding piece, the welding piece is provided with at least one first conductive part, the card support cap is provided with a second conductive part which is communicated with each first conductive part, and the first conductive parts are mutually butted with the corresponding second conductive parts.
Optionally, the card support cap is made of conductive metal, an oxide film layer is arranged on the surface of the card support cap, and a conductive through hole is formed in the oxide film layer, so that the conductive metal of the card support cap is exposed to form the second conductive part which is mutually butted with the first conductive part.
Optionally, the first conductive part is that the welding part is concave downwards in the direction of the card support cap to form a convex part, the convex part is coated with a conductive metal layer or the welding part is a welding part made of conductive metal, and the first conductive part extends into the conductive through hole and the second conductive part are mutually butted.
Optionally, the protruding height of the first conductive part is greater than the thickness of the oxide film of the card support cap; the protruding height of the first conductive part is 0.1mm-2 mm.
Optionally, an exposed area of the exposed conductive metal as the second conductive part is 0.25mm2-4mm2。
Optionally, at least one connecting column is formed on a side wall of one end of the card tray, which is connected with the card support cap, a through hole corresponding to the connecting column is formed in the card support cap, and the card support cap is sleeved on the connecting column through the through hole; and a clearance space for movement is arranged between the hole wall corresponding to the through hole and the connecting column.
Optionally, at least one buckling part is further formed on a side wall of one end, connected with the clamping support cap, of the clamping tray, a clamping hole is formed in the clamping support cap, the clamping hole is mutually clamped with the buckling part, and a gap space for movement is formed between a hole wall corresponding to the clamping hole and the buckling part.
Optionally, a first groove is formed in a side wall of one end, connected with the card support cap, of the card tray, a second groove is formed in a bottom wall of the first groove, the card support cap comprises a cap body and a connector matched with the second groove, the connector is connected with the cap body, the cap body abuts against the end portion of the card tray, the connector is installed in the second groove, the connecting column and the buckling portion are formed in the bottom wall of the second groove, and the through hole and the buckling hole are formed in the connector.
Optionally, the welding part is adapted to the first groove and encapsulates the connecting body in the second groove by welding with the first groove, the second conductive part is formed on a side wall of the connecting body facing away from the bottom wall of the second groove, and the first conductive part is formed on a side wall of the welding part facing the connecting body.
Optionally, the card that the cap was held in the palm to the card made by conductive metal holds in the palm the cap, and the card holds in the palm the surface of cap and is provided with the oxidation rete, the card holds in the palm the cap on with the protruding conduct that has regarded as of the protruding of first conductive part, just the arch passes the oxidation rete exposes out on the welding piece orientation one side of second conductive part seted up with protruding butt joint's recess in the recess the coating has conductive metal layer or the welding piece is made by conductive metal.
The anti-static card support structure has the following beneficial effects: according to the invention, the first conductive part which is mutually conducted with the second conductive part on the card support cap is arranged on the welding part, so that static electricity generated by aggregation is led out, an anti-static function is realized, adverse effects on the performance of the mobile phone are avoided, and the use experience of a user is improved.
Drawings
FIG. 1 is an exploded view of the anti-electrostatic card holder structure of the present invention;
FIG. 2 is a schematic structural view of a card tray in the anti-static card tray structure of the present invention;
FIG. 3 is a schematic structural diagram of a card-holding cap in the anti-static card-holding structure according to the present invention;
fig. 4 is a schematic structural view of a solder part in the anti-static card support structure of the invention.
Detailed Description
The structure and the specific implementation of the anti-static card holder of the present invention are further described with reference to the accompanying drawings and embodiments:
it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, the present invention relates to an anti-static card holder structure, which comprises a card holder 1 and a card holder cap 2 installed at one end of the card holder 1, wherein the card holder cap 2 is movably connected with the card holder 1 through a welding member 3, the welding member 3 is provided with at least one first conductive portion 31, the card holder cap 2 is provided with a second conductive portion 21 which is in conductive connection with each first conductive portion 31, and the first conductive portions 31 are in mutual butt joint with the corresponding second conductive portions 21.
Because the card support cap 2 and the card tray 1 with the structure are movable, the card support cap 2 is easy to generate static electricity due to friction and can not be led out when being gathered on the card support cap 2 in the using process of a user, so that the performance of the mobile phone is influenced. According to the invention, the first conductive part 31 which is mutually conducted with the second conductive part 21 on the card support cap 2 is arranged on the welding part 3, so that static electricity generated by aggregation is led out, an anti-static function is realized, adverse effects on the performance of a mobile phone are avoided, and the use experience of a user is improved.
The following description will be made by way of specific examples.
Example 1:
as shown in fig. 2-3, a first groove 11 is formed on a side wall of one end of the card tray 1 connected to the card support cap 2, a second groove 12 is formed on a bottom wall of the first groove 11, and a step shape is formed between the bottom wall of the first groove 11 and the bottom wall of the second groove 12. At least one connecting column 13 is formed on the bottom wall of the second groove 12, a through hole 22 corresponding to the connecting column 13 is formed on the card support cap 2, and the card support cap 2 is sleeved on the connecting column 13 through the through hole 22. In the present embodiment, the number of the connection columns 13 is two, and in other embodiments, the number of the connection columns 13 may be one or more.
At least one buckling part 14 is further formed on the bottom wall of the second groove 12, a buckling hole 23 is formed on the clamping cap 2, and the buckling hole 23 is mutually buckled with the buckling part 14. In the present embodiment, the number of the locking portion 14 is one, and the locking portion is located between two connecting posts 13, and in other embodiments, the number of the locking portion 14 may also be multiple.
The card tray cap 2 is sleeved on the connecting column 13 through the through hole 22, and the clamping hole 23 is clamped with the clamping part 14 to be connected with the card tray 1. A clearance space for movement is provided between the hole wall corresponding to the engaging hole 23 and the engaging portion 14, and a clearance space for movement is also provided between the hole wall corresponding to the through hole 22 and the connecting column 13. Wherein the gap distance of the gap space is 0.1mm-1 mm. This allows a slight articulation between the card-holding cap 2 and the card tray 1.
As shown in fig. 3, the card-holding cap 2 includes a cap body 20a and a connecting body 20b adapted to the second groove 12, the connecting body 20b is connected to the cap body 20a, and preferably, the connecting body 20b is integrally formed with the cap body 20 a. The cap body 20a abuts against the end of the card tray 1, the connecting body 20b is matched with the second groove 12 and is installed in the second groove 12, the connecting column 13 and the buckling part 14 are formed on the bottom wall of the second groove 12, and the through hole 22 and the buckling hole 23 are formed in the connecting body 20 b. As shown in fig. 4, the welding member 3 has a flat plate shape, and the welding member 3 is fitted into the first groove 11 and encapsulates the connecting body 20b in the second groove 12 by welding with the first groove 11.
As shown in fig. 3 to 4, the second conductive part 21 is formed on a side wall of the connecting body 20b facing away from the bottom wall of the second recess 12. The first conductive portion 31 is formed on a side wall of the solder member 3 facing the connecting body 20 b.
In the present embodiment, the card-holding cap 2 and the solder member 3 are made of conductive metal, which may be aluminum, aluminum alloy, copper, gold, silver, or the like. After the anode process is carried out on the card support cap 2, a non-conductive oxide film layer is formed on the surface. The oxide layer is provided with a conductive via (not shown) to expose the conductive metal of the card-holding cap 2 to form a second conductive portion 21 in butt joint with the first conductive portion 31. The first conductive part 31 is a convex part formed by sinking the welding part 3 towards the direction of the card-holding cap 2, and the convex part as the first conductive part 31 extends into the conductive through hole to be mutually butted with the second conductive part 21 to realize conduction. In other embodiments, the solder part 3 may not be made of conductive metal, but a conductive metal layer may be coated on the convex part, and the conductive metal layer may be formed of aluminum, aluminum alloy, copper, gold, silver, or the like. In the present embodiment, the number of the second conductive portions 21 is two and is formed on both sides of the two through holes 22. In other embodiments, the number of the second conductive portions 21 may also be one or more.
The protruding height of the first conductive part 31 is larger than the thickness of the oxide film of the card-holding cap 2, so that the card-holding cap 2 and the card tray 1 can still keep a movable connection state. Wherein the protruding height of the first conductive part 31 is 0.1mm-2mm, preferably 0.5mm-1 mm. The thickness of the oxide film is 0.01mm-0.05 mm.
The exposed area of the exposed conductive metal as the second conductive part 21 was 0.25mm2-4mm2Preferably 1mm2-2.25mm2。
According to the invention, the first conductive part 31 which is mutually conducted with the second conductive part 21 on the card support cap 2 is arranged on the welding part 3, so that static electricity generated by aggregation is led out, an anti-static function is realized, adverse effects on the performance of a mobile phone are avoided, and the use experience of a user is improved.
Example 2:
the difference from the embodiment 1 is that: the card support cap 2 is still a card support cap made of conductive metal, an oxidation film layer is formed on the surface of the card support cap 2, a protrusion serving as the second conductive part 21 protrudes from the position, corresponding to the first conductive part 31, of the card support cap 2, the protrusion penetrates through the oxidation film layer to be exposed outside, a groove in butt joint with the protrusion is formed in one side, facing the second conductive part 21, of the welding part 3, and a conductive metal layer is coated in the groove or the welding part 3 is made of conductive metal. The conductive metal and the conductive metal layer may be made of aluminum, aluminum alloy, copper, gold, silver, or the like.
The anti-static card support structure of the embodiment is a substitute structure of the embodiment 1, and can also realize leading out static electricity generated by aggregation, thereby realizing the anti-static function, avoiding adverse effects on the performance of the mobile phone and improving the use experience of a user.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.