CN107723711B - Copper polishing agent - Google Patents
Copper polishing agent Download PDFInfo
- Publication number
- CN107723711B CN107723711B CN201610664104.1A CN201610664104A CN107723711B CN 107723711 B CN107723711 B CN 107723711B CN 201610664104 A CN201610664104 A CN 201610664104A CN 107723711 B CN107723711 B CN 107723711B
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- China
- Prior art keywords
- copper
- brightener
- cationic polymer
- polyethylene glycol
- plating layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention belongs to the technical field of copper-plating polishing agents for electroplating through holes of circuit boards, and particularly relates to a copper polishing agent. The invention aims to solve the technical problem of providing a copper brightener which can realize the characteristics of uniform plating layer surface, good ductility, high tensile strength and the like. In order to solve the above problems, the technical scheme provided by the invention is as follows: the copper brightener comprises the components and the content of 50-100g of polyethylene oxide propylene oxide monobutyl ether, 10-50g of polyethylene glycol, 10-30g of cationic polymer, 5-15g of sodium polydithio-dipropyl sulfonate and the balance of water in each liter of copper brightener. The invention has the beneficial effects that: the surface of the plating layer is uniform, and the glossiness is moderate; the copper plating layer has good ductility, and the average elongation is more than or equal to 25 percent; the copper plating layer has good tensile strength, and the average tensile strength is more than or equal to 300 MPa; the deposition rate is high, the deposition rate is 0.4-0.5 mu m/min, the throwing power is good, 2A/dm2, the throwing power is more than or equal to 94%, and the surface copper deposition rate is lower than the hole copper deposition rate.
Description
Technical Field
The invention belongs to the technical field of copper-plating polishing agents for electroplating through holes of circuit boards, and particularly relates to a copper polishing agent.
Background
The existing copper polishing agent has various defects, such as uneven plating layer, poor ductility, low tensile strength and the like after use, and can not meet the requirements of high-end products, especially the production requirements of high-precision equipment.
Disclosure of Invention
The invention aims to solve the technical problem of providing a copper brightener which can realize the characteristics of uniform plating layer surface, good ductility, high tensile strength and the like.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the copper brightener comprises the components and the content of 50-100g of polyethylene oxide propylene oxide monobutyl ether, 10-50g of polyethylene glycol, 10-30g of cationic polymer, 5-15g of sodium polydithio-dipropyl sulfonate and the balance of water in each liter of copper brightener.
Optionally, the copper polish comprises 50-70g of polyethylene oxide propylene oxide monobutyl ether, 10-25g of polyethylene glycol, 10-15g of cationic polymer, 5-8g of sodium polydithio-dipropyl sulfonate and the balance of water in each liter of copper polish.
Optionally, the copper polish comprises 70-85g of polyethylene oxide propylene oxide monobutyl ether, 25-40g of polyethylene glycol, 15-25g of cationic polymer, 8-12g of sodium polydithio-dipropyl sulfonate and the balance of water in each liter of copper polish.
Optionally, the copper polish comprises 85-100g of polyethylene oxide propylene oxide monobutyl ether, 40-50g of polyethylene glycol, 25-30g of cationic polymer, 12-15g of sodium polydithio-dipropyl sulfonate and the balance of water in each liter of copper polish.
Optionally, the cationic polymer is at least one of polyacrylamide, polyformaldehyde, or polyisocyanurate resin.
Optionally, the polyethylene glycol is polyethylene glycol-10000.
The invention has the beneficial effects that: the surface of the plating layer is uniform, and the glossiness is moderate; the copper plating layer has good ductility, and the average elongation is more than or equal to 25 percent; the copper plating layer has good tensile strength, and the average tensile strength is more than or equal to 300 MPa; the deposition rate is high, the deposition rate is 0.4-0.5 mu m/min, the throwing power is good, 2A/dm2, the throwing power is more than or equal to 94%, and the surface copper deposition rate is lower than the hole copper deposition rate.
Detailed Description
In order to more clearly and fully illustrate the present invention, the following best mode is provided to illustrate the inventive concept. Of course, the examples are provided to illustrate the concept of the invention, not to be all the design of the invention, and should not be construed as limitations of the invention. In the light of the embodiments provided, any solution made is within the scope of the present invention.
Example 1
The copper brightener comprises the components and the content of 50g of polyoxyethylene propylene oxide monobutyl ether, 10g of polyethylene glycol-10000 and 10g of cationic polymer in each liter of copper brightener, wherein the cationic polymer is at least one of polyacrylamide, polyformaldehyde or polyisocyanurate resin, 5g of sodium polydithio dipropyl sulfonate and the balance of water.
In the invention, the polyethylene glycol is a surface active agent, and can use polyethylene glycol-6000 or polyethylene glycol-8000, and the invention uses polyethylene glycol-10000 with the highest effect. The cationic polymer is mainly used as a leveling agent, sodium polydithio dipropyl sulfonate, and is used as a grain refiner and an accelerator in the invention. The effects of the components in the remaining examples were the same as in the example.
The preparation method of the copper polish provided by the invention comprises the following steps: adding water into a stirring medicinal liquid tank, wherein the water is preferably less than 0.8L, sequentially adding polyethylene oxide propylene oxide monobutyl ether, polyethylene glycol, cationic polymer and sodium polydithio-dipropyl sulfonate according to the amount, stirring uniformly, adding water to 1L, and stirring uniformly. The preparation method of the copper luster agent in the other examples is the same as that in the example.
Example 2
The copper brightener comprises 70g of polyethylene oxide propylene oxide monobutyl ether, 25g of polyethylene glycol and 15g of cationic polymer in each liter of copper brightener, wherein the cationic polymer is at least one of polyacrylamide, polyformaldehyde or polyisocyanurate resin, 8g of sodium polydithio-dipropyl sulfonate and the balance of water.
Example 3
The copper brightener comprises the components and the content of 85g of polyoxyethylene propylene oxide monobutyl ether, 40g of polyethylene glycol and 25g of cationic polymer in each liter of copper brightener, wherein the cationic polymer is at least one of polyacrylamide, polyformaldehyde or trimeric isocyanide resin, 12g of sodium polydithio dipropyl sulfonate and the balance of water.
Example 4
The copper brightener comprises 100g of polyethylene oxide propylene oxide monobutyl ether, 50g of polyethylene glycol and 30g of cationic polymer per liter of the copper brightener, wherein the cationic polymer is at least one of polyacrylamide, polyformaldehyde or polyisocyanurate resin, 15g of sodium polydithio-dipropyl sulfonate and the balance of water.
Example 5
The copper brightener comprises the components and the content of 60g of polyoxyethylene propylene oxide monobutyl ether, 15g of polyethylene glycol-10000 and 20g of cationic polymer in each liter of copper brightener, wherein the cationic polymer is at least one of polyacrylamide, polyformaldehyde or polyisocyanurate resin, 10g of sodium polydithio dipropyl sulfonate and the balance of water.
Example 6
The copper brightener comprises the components and the content of 90g of polyoxyethylene propylene oxide monobutyl ether, 20g of polyethylene glycol and 23g of cationic polymer in each liter of copper brightener, wherein the cationic polymer is at least one of polyacrylamide, polyformaldehyde or trimeric isocyanide resin, 14g of sodium polydithio dipropyl sulfonate and the balance of water.
Claims (6)
1. The copper brightener is characterized by comprising the components and the content of 50-100g of polyethylene oxide propylene oxide monobutyl ether, 10-50g of polyethylene glycol, 10-30g of cationic polymer, 5-15g of sodium polydithio dipropyl sulfonate and the balance of water in each liter of the copper brightener.
2. The copper brightener as claimed in claim 1, wherein the copper brightener comprises the components and the content of polyethylene oxide propylene oxide monobutyl ether 50-70g, polyethylene glycol 10-25g, cationic polymer 10-15g, sodium polydithio-dipropyl sulfonate 5-8g, and the balance of water in each liter of copper brightener.
3. The copper brightener as claimed in claim 1, wherein the copper brightener comprises the components and the content of polyethylene oxide propylene oxide monobutyl ether 70-85g, polyethylene glycol 25-40g, cationic polymer 15-25g, sodium polydithio-dipropyl sulfonate 8-12g, and the balance of water.
4. The copper brightener as claimed in claim 1, wherein the copper brightener comprises the components and the content of polyethylene oxide propylene oxide monobutyl ether 85-100g, polyethylene glycol 40-50g, cationic polymer 25-30g, sodium polydithio dipropyl sulfonate 12-15g, and the balance of water in each liter of copper brightener.
5. The coppergloss agent according to any one of claims 1 to 4, wherein the cationic polymer is at least one of polyacrylamide, polyoxymethylene and polyisocyanurate resin.
6. The copper luster agent of any one of claims 1 to 4, wherein the polyethylene glycol is polyethylene glycol-10000.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610664104.1A CN107723711B (en) | 2016-08-12 | 2016-08-12 | Copper polishing agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610664104.1A CN107723711B (en) | 2016-08-12 | 2016-08-12 | Copper polishing agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107723711A CN107723711A (en) | 2018-02-23 |
| CN107723711B true CN107723711B (en) | 2020-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610664104.1A Active CN107723711B (en) | 2016-08-12 | 2016-08-12 | Copper polishing agent |
Country Status (1)
| Country | Link |
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| CN (1) | CN107723711B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016055533A (en) * | 2014-09-10 | 2016-04-21 | 株式会社ツーワン | POLYMER COMPOSITION (a) PROVIDED WITH ANTISTATICITY, ANTIBACTERIAL PROPERTIES, AND LUMINOSITY IN THE DARK, MOLDING AND COVER MATERIAL USING THE POLYMER COMPOSITION (a), AND MOUNTING METHOD OF COVER MATERIAL ON OUTSIDE SURFACE OF METALLIC ARTICLE |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| CN101481812B (en) * | 2008-12-31 | 2011-04-06 | 清华大学 | Electrolytic solution for integrated circuit copper wire laying electrodeposition |
| JP5568250B2 (en) * | 2009-05-18 | 2014-08-06 | 公立大学法人大阪府立大学 | How to fill copper |
| CN102766890A (en) * | 2012-06-29 | 2012-11-07 | 宿迁楚霸体育器械有限公司 | Acid copper brightening agent |
| CN105441993A (en) * | 2015-12-22 | 2016-03-30 | 苏州禾川化学技术服务有限公司 | Electroplating solution and electroplating method for electroplating through holes and blind holes of circuit boards |
| CN105734623A (en) * | 2016-05-06 | 2016-07-06 | 广东利尔化学有限公司 | High-dispersity acidic copper plating additive as well as preparation method and application thereof |
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2016
- 2016-08-12 CN CN201610664104.1A patent/CN107723711B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016055533A (en) * | 2014-09-10 | 2016-04-21 | 株式会社ツーワン | POLYMER COMPOSITION (a) PROVIDED WITH ANTISTATICITY, ANTIBACTERIAL PROPERTIES, AND LUMINOSITY IN THE DARK, MOLDING AND COVER MATERIAL USING THE POLYMER COMPOSITION (a), AND MOUNTING METHOD OF COVER MATERIAL ON OUTSIDE SURFACE OF METALLIC ARTICLE |
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| Publication number | Publication date |
|---|---|
| CN107723711A (en) | 2018-02-23 |
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Effective date of registration: 20200310 Address after: 516369 taiyang'ao industrial city, Baihua Town, Huidong County, Huizhou City, Guangdong Province (50m northwest of the intersection of Xinping Avenue and Yangli Road) Patentee after: Huizhou Jinsheng New Electronic Technology Co., Ltd Address before: 516083 Yang Luo House No. 86 on the west side of Dayawan, Huizhou, Guangdong Patentee before: Huizhou Dayawan Jinsheng science and Technology Co Ltd |
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