CN107705988A - A kind of preparation method of thin film capacitor - Google Patents
A kind of preparation method of thin film capacitor Download PDFInfo
- Publication number
- CN107705988A CN107705988A CN201710865773.XA CN201710865773A CN107705988A CN 107705988 A CN107705988 A CN 107705988A CN 201710865773 A CN201710865773 A CN 201710865773A CN 107705988 A CN107705988 A CN 107705988A
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- Prior art keywords
- fuse
- preparation
- metal spraying
- thin film
- pressing
- Prior art date
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- 239000003990 capacitor Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000010409 thin film Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 26
- 238000005507 spraying Methods 0.000 claims abstract description 22
- 239000010408 film Substances 0.000 claims abstract description 17
- 238000007731 hot pressing Methods 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 238000004513 sizing Methods 0.000 claims abstract description 9
- 238000004804 winding Methods 0.000 claims abstract description 9
- 239000004743 Polypropylene Substances 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- -1 polypropylene Polymers 0.000 claims abstract description 8
- 229920001155 polypropylene Polymers 0.000 claims abstract description 8
- 101100248240 Arabidopsis thaliana RH35 gene Proteins 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 230000008450 motivation Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 230000008030 elimination Effects 0.000 abstract description 3
- 238000003379 elimination reaction Methods 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention relates to a kind of preparation method of thin film capacitor, including wind, be cold-pressed, hot pressing, heat is dried, metal spraying and rear process, the preparation method and its step are followed successively by：（1）Winding：Winding forms fuse after metallized polypropylene film is superimposed；（2）Cold pressing：Flatten fuse；（3）Pretreatment：Fuse after cold pressing is placed in the space of sealing, adjusts the temperature to 40 DEG C ± 5 DEG C, below humidity RH35%, 2 10 hours standing times；（3）Hot pressing：Pretreated fuse is tentatively shaped；（4）Metal spraying：Metal spraying coating is carried out on fuse end face after hot-pressing, metal spraying coating is contacted and is drawn with the coat of metal on metallized polypropylene film；（5）Heat is dried：Fuse by metal spraying is put into baking oven sizing；（6）Process afterwards；Present invention effect elimination is various to stress caused by film, is unlikely to deform, can guarantee that fuse end face is effectively drawn, gilding layer is unlikely to deform, and capacitor hum is decreased obviously.
Description
Technical field
The present embodiments relate to the preparation method of capacitor, and in particular to a kind of preparation method of thin film capacitor.
Background technology
In the prior art, there is following defect in the production technology for thin film capacitor：
1st, without pretreating process, film the process of neither one tensile stress elimination, is directly heat-treated after winding,
In this way, film is had a great influence by tension force stretching, between film microlesion be difficult to be effectively restored.
, current motor capacitor process sequence substantially using being first heat-treated, then the order of metal spraying, its defect
It is that gap is still had between film, the hum after motor is larger.
, current product, rear process, especially embedding and solidification process, can all carry out the heat treatment of certain temperature, than
Such as 60 DEG C, hot baking processing is carried out under the conditions of 115 DEG C of equitemperatures, to ensure curing performance, but so carries out heat treatment work by 85 DEG C
Sequence, secondary sizing can be caused to capacitor body stereotyped in early days, actually this secondary sizing, can caused originally
Fuse without the air gap generates certain gap on the contrary, simultaneously as there is the condition of cure of certain temperature, epoxy resin is solid
Compound can at relatively high temperatures, mobility enhancing, and then enters in fuse gap, and certain destruction is formed to fuse, is made
Into the harmful effect of hum increase.
The content of the invention
The present invention provides one kind and effectively eliminates various to stress caused by film, is unlikely to deform, can guarantee that fuse end face has
Effect is drawn, and gilding layer is unlikely to deform, the preparation method for the thin film capacitor that capacitor hum is decreased obviously.
In order to solve the above technical problems, one aspect of the present invention is：A kind of preparation side of thin film capacitor
Method, including wind, be cold-pressed, hot pressing, heat is dried, metal spraying and rear process, its feature, the preparation method and its step are followed successively by：
（1）Winding：Winding forms fuse after metallized polypropylene film is superimposed；
（2）Cold pressing：Flatten fuse；
（3）Pretreatment：Fuse after cold pressing is placed in the space of sealing, adjusts the temperature to 40 DEG C ± 5 DEG C, humidity RH35%
Hereinafter, standing time 2-10 hours；
（3）Hot pressing：Pretreated fuse is tentatively shaped；
（4）Metal spraying：Metal spraying coating is carried out on fuse end face after hot-pressing, is made on metal spraying coating and metallized polypropylene film
The coat of metal is contacted and drawn；
（5）Heat is dried：Fuse by metal spraying is put into baking oven sizing；
（6）Process afterwards.
Preferably, fixed clip cavity both sides have each extended over fixed plate, fixing hole are offered in fixed plate, the bolt other end is worn
Cross fixing hole and each extend over portable plate corresponding with fixed plate, portable plate by the spacing fixation of nut, activity clip cavity both sides
On offer movable span, portable plate is located on bolt by movable span activity, and elastomer one end is pressed against on portable plate；Bolt
What is played is guide effect, make activity be clipped in sliding process keep balance, make portable plate on bolt can flexibly, freedom,
Swimmingly slide, nut and the thread segment locking positioning on bolt, position-limiting action is played to fixed plate.
Preferably, step（6）Process includes following process successively afterwards：
（6.1）Energize：Fuse light current is eliminated；
（6.2）Half examines：Fuse detects；
（6.3）Welding：Fuse electrode is drawn；
（6.4）Assembling：Fuse is loaded into housing；
（6.5）Embedding：Embedding Material is poured into housing, fixes fuse；
（6.6）Solidification：Under normal temperature, solidify encapsulating material；
（6.7）Trimming school pin：Electrode is drawn and corrected；
（6.8）Mark/lettering；
（6.9）Outward appearance is examined；
（6.10）Packaging and storage.
Preferably, step（4）、（5）、（6）Carried out under the conditions of ambient temperature and moisture.Especially step 6.5,6.6 must be
Carried out under normal temperature, without any heat treatment；So as to solve background technology（3）The defects of point.
Step（5）Heat is dried to be carried out under the following conditions：120 DEG C ± 5 DEG C of temperature, time are 8-16 hours.
Obtained capacitor is arranged on condenser unit, possesses following parameter and performance：Hum≤5 of motor capacitor
Decibel.
The beneficial effect of the embodiment of the present invention is：
1）A kind of preparation method of thin film capacitor of the present invention, common process is after the completion of rolling, to be tentatively cold-pressed, Ran Houzhi
Tap into and tentatively shaped into hot pressing, and invention increases pretreating process, can be effectively by fuse when rolling and cold pressing treatment
The various stress eliminations to film.
2）A kind of preparation method of thin film capacitor of the present invention, the present invention are carried out to the process sequence after the preliminary sizing of hot pressing
Adjustment, metal spraying process is adjusted before drying process to heat, benefit is：After fuse is tentatively shaped, but not sizing completely
Under conditions of, first gilding layer is coated, ensures effective extraction of fuse end face, simultaneously as gilding layer is after application
On-deformable solid-state, then heat is carried out to fuse and dries sizing so that film layer can be more completely bonded；And eliminate sky between film
Gas gap, reduce the source of generation of hum.
3）A kind of preparation method of thin film capacitor of the present invention, all process steps after fuse thermal finalization are ambient temperature and moisture
Under the conditions of carry out, the manufacture craft of prior art, generally can carry out high-temperature process again to product, for accelerate technique circulate the time.
Specific embodiment
For the ease of understanding the present invention, with reference to specific embodiment, the present invention will be described in more detail.
Unless otherwise defined, technology all used in this specification and scientific terminology are led with belonging to the technology of the present invention
The implication that the technical staff in domain is generally understood that is identical.Used term is simply in the description of the invention in this specification
The purpose of description specific embodiment, it is not intended to the limitation present invention.
A kind of preparation method of thin film capacitor, including wind, be cold-pressed, hot pressing, heat are dried, metal spraying and rear process, it is special
Sign, the preparation method and its step are followed successively by：
（1）Winding：Winding forms fuse after metallized polypropylene film is superimposed；
（2）Cold pressing：Flatten fuse；
（3）Pretreatment：Fuse after cold pressing is placed in the space of sealing, adjusts the temperature to 40 DEG C ± 5 DEG C, humidity RH35%
Hereinafter, standing time 2-10 hours；
（3）Hot pressing：Pretreated fuse is tentatively shaped；
（4）Metal spraying：Metal spraying coating is carried out on fuse end face after hot-pressing, is made on metal spraying coating and metallized polypropylene film
The coat of metal is contacted and drawn；
（5）Heat is dried：Fuse by metal spraying is put into baking oven sizing；
（6）Process afterwards.
Preferably, fixed clip cavity both sides have each extended over fixed plate, fixing hole are offered in fixed plate, the bolt other end is worn
Cross fixing hole and each extend over portable plate corresponding with fixed plate, portable plate by the spacing fixation of nut, activity clip cavity both sides
On offer movable span, portable plate is located on bolt by movable span activity, and elastomer one end is pressed against on portable plate；Bolt
What is played is guide effect, make activity be clipped in sliding process keep balance, make portable plate on bolt can flexibly, freedom,
Swimmingly slide, nut and the thread segment locking positioning on bolt, position-limiting action is played to fixed plate.
Preferably, step（6）Process includes following process successively afterwards：
（6.1）Energize：Fuse light current is eliminated；
（6.2）Half examines：Fuse detects；
（6.3）Welding：Fuse electrode is drawn；
（6.4）Assembling：Fuse is loaded into housing；
（6.5）Embedding：Embedding Material is poured into housing, fixes fuse；
（6.6）Solidification：Under normal temperature, solidify encapsulating material；
（6.7）Trimming school pin：Electrode is drawn and corrected；
（6.8）Mark/lettering；
（6.9）Outward appearance is examined；
（6.10）Packaging and storage.
Preferably, step（4）、（5）、（6）Carried out under the conditions of ambient temperature and moisture；Especially step 6.5,6.6 must be
Carried out under normal temperature, without any heat treatment；So as to solve background technology（3）The defects of point.
Step（5）Heat is dried to be carried out under the following conditions：120 DEG C ± 5 DEG C of temperature, time are 8-16 hours.
Obtained capacitor is arranged on condenser unit, possesses following parameter and performance：Hum≤5 of motor capacitor
Decibel.
It should be noted that giving the preferred embodiment of the present invention in the specification of the present invention, still, the present invention can
By by it is many it is different in the form of realize, however it is not limited to the embodiment described by this specification, these embodiments are not as right
The extra limitation of present invention, there is provided the purpose of these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.Also, above-mentioned each technical characteristic continues to be mutually combined, the various embodiments not being enumerated above are formed, are accordingly to be regarded as this hair
Speak frankly the scope that bright secretary carries；Further, for those of ordinary skills, can be improved according to the above description
Or conversion, and all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (5)
1. a kind of preparation method of thin film capacitor, including wind, be cold-pressed, hot pressing, heat are dried, metal spraying and rear process, its feature,
The preparation method and its step are followed successively by：
（1）Winding：Winding forms fuse after metallized polypropylene film is superimposed；
（2）Cold pressing：Flatten fuse；
（3）Pretreatment：Fuse after cold pressing is placed in the space of sealing, adjusts the temperature to 40 DEG C ± 5 DEG C, humidity RH35%
Hereinafter, standing time 2-10 hours；
（3）Hot pressing：Pretreated fuse is tentatively shaped；
（4）Metal spraying：Metal spraying coating is carried out on fuse end face after hot-pressing, is made on metal spraying coating and metallized polypropylene film
The coat of metal is contacted and drawn；
（5）Heat is dried：Fuse by metal spraying is put into baking oven sizing；
（6）Process afterwards.
2. a kind of preparation method of thin film capacitor according to claim 1, it is characterized in that, step（6）Process is wrapped successively afterwards
Include following process：
（6.1）Energize：Fuse light current is eliminated；
（6.2）Half examines：Fuse detects；
（6.3）Welding：Fuse electrode is drawn；
（6.4）Assembling：Fuse is loaded into housing；
（6.5）Embedding：Embedding Material is poured into housing, fixes fuse；
（6.6）Solidification：Under normal temperature, solidify encapsulating material；
（6.7）Trimming school pin：Electrode is drawn and corrected；
（6.8）Mark/lettering；
（6.9）Outward appearance is examined；
（6.10）Packaging and storage.
3. a kind of preparation method of thin film capacitor according to claim 1, it is characterized in that, step（4）、（6）In normal temperature
Carried out under the conditions of often wet.
4. a kind of preparation method of thin film capacitor according to claim 1, it is characterized in that, step（5）Heat is dried in following bar
Carried out under part：120 DEG C ± 5 DEG C of temperature, time are 8-16 hours.
5. a kind of preparation method of thin film capacitor according to claim 1, it is characterized in that, obtained capacitor is arranged on electricity
In motivation, possess following parameter and performance：Hum≤5 decibel of motor capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710865773.XA CN107705988B (en) | 2017-09-22 | 2017-09-22 | Preparation method of thin film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710865773.XA CN107705988B (en) | 2017-09-22 | 2017-09-22 | Preparation method of thin film capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107705988A true CN107705988A (en) | 2018-02-16 |
| CN107705988B CN107705988B (en) | 2023-02-28 |
Family
ID=61173287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710865773.XA Active CN107705988B (en) | 2017-09-22 | 2017-09-22 | Preparation method of thin film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107705988B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110890229A (en) * | 2019-10-11 | 2020-03-17 | 深圳市兴创嘉技术有限公司 | Aluminum electrolytic capacitor sleeve code spraying method |
| CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101399118A (en) * | 2007-09-30 | 2009-04-01 | 扬州高强电子有限公司 | Technique for processing non-inductive organic film capacitor |
| CN104078237A (en) * | 2014-06-23 | 2014-10-01 | 浙江七星电容器有限公司 | Filter capacitor and manufacturing method thereof |
| CN206399681U (en) * | 2017-01-19 | 2017-08-11 | 东莞市全鹏电子科技有限公司 | A kind of electric capacity core precompressed sampler |
-
2017
- 2017-09-22 CN CN201710865773.XA patent/CN107705988B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101399118A (en) * | 2007-09-30 | 2009-04-01 | 扬州高强电子有限公司 | Technique for processing non-inductive organic film capacitor |
| CN104078237A (en) * | 2014-06-23 | 2014-10-01 | 浙江七星电容器有限公司 | Filter capacitor and manufacturing method thereof |
| CN206399681U (en) * | 2017-01-19 | 2017-08-11 | 东莞市全鹏电子科技有限公司 | A kind of electric capacity core precompressed sampler |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
| CN110890229A (en) * | 2019-10-11 | 2020-03-17 | 深圳市兴创嘉技术有限公司 | Aluminum electrolytic capacitor sleeve code spraying method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107705988B (en) | 2023-02-28 |
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