CN107704035A - M.2 connector, M.2 modular assembly and system disk - Google Patents

M.2 connector, M.2 modular assembly and system disk Download PDF

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Publication number
CN107704035A
CN107704035A CN201710758791.8A CN201710758791A CN107704035A CN 107704035 A CN107704035 A CN 107704035A CN 201710758791 A CN201710758791 A CN 201710758791A CN 107704035 A CN107704035 A CN 107704035A
Authority
CN
China
Prior art keywords
connector
pcie
system disk
module
modular assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710758791.8A
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Chinese (zh)
Inventor
刘松
陶朗
张�杰
唐银中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN201710758791.8A priority Critical patent/CN107704035A/en
Priority to CN202010368114.7A priority patent/CN111665913A/en
Publication of CN107704035A publication Critical patent/CN107704035A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/187Mounting of fixed and removable disk drives
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/4068Electrical coupling
    • G06F13/4081Live connection to bus, e.g. hot-plugging

Abstract

The application provides one kind, and M.2 connector, M.2 modular assembly and system disk, the system disk include:PCIe bottom plates, the holding area of two M.2 modular assemblies is provided with PCIe bottom plates, M.2 the holding area of the modular assembly is used for accommodating M.2 modular assembly, because the size of M.2 modular assembly is smaller, by the holding area that two M.2 modular assemblies are provided with PCIe bottom plates, by two M.2 modular assembly be arranged on PCIe bottom plates and realize that system disk supports hard RAID1, PCIe bottom plates need to only take a groove position, occupy little space, therefore, the storage density of server is improved, and then, improve the systematic function of server.

Description

M.2 connector, M.2 modular assembly and system disk
Technical field
The application is related to chip technology, more particularly to a kind of M.2 connector, M.2 modular assembly and system disk.
Background technology
With the stream of distributed storage, big data or software definition storage (Software Defined Storage, SDS) OK, in many applications such as virtualization storage Local Area Network (virtual Storage Area Network, vSAN), distributed text Part system (Ceph) or memory space lead directly to (Storage Spaces Direct, S2D) etc., in order to lift the reliability of storage And security, system disk and data disks are separated, and system disk is supported hard RAID (redundant Array of independent disks, RAID1) requirement, to realize optimization application, lift the system robustness of application.
In the prior art, usual system disk is realized by two 2.5 cun of hard disks, to support hard RAID1, therefore, system disk Need to take 2.5 cun of hard-disk slots of server two.
However, by the way of prior art, the storage density of server is influenceed.
The content of the invention
The application provides a kind of M.2 connector, M.2 modular assembly and system disk, to improve the storage density of server.
In a first aspect, the application provides a kind of system disk, including:High speed serialization computer expansion bus standard PCIe bottoms Plate, the holding area of two M.2 modular assemblies is provided with PCIe bottom plates, and the holding area of the M.2 modular assembly is used to hold Put M.2 modular assembly.
Because the size of M.2 modular assembly is smaller, by being provided with two M.2 modular assemblies on PCIe bottom plates Holding area, by two M.2 modular assembly be arranged on PCIe bottom plates and realize that system disk supports hard RAID1, PCIe bottom plates only need A groove position is taken, is occupied little space, this improves the storage density of server, and then, improve the systematicness of server Energy.
In a kind of possible implementation, onboard RAID1 chips are additionally provided with the PCIe bottom plates.
By the way that RAID1 chips are set on PCIe bottom plates, the PCIe slot position shared by external RAID1 chips is saved, is entered One step, improve storage density.
In a kind of possible implementation, one end of each M.2 holding area of modular assembly is additionally provided with bottom Connector for substrate, the back plane connector and the hot-swappable Interface Matching of the M.2 connect base of connector.
By setting the back plane connector with the M.2 hot-swappable Interface Matching of the connect base of connector, M.2 realization connects The heat group for connecing device is inserted, and then is realized that the heat of M.2 modular assembly is dialled and inserted, and is convenient for changing M.2 modular assembly, system disk easy to maintain.
In a kind of possible implementation, the back plane connector is serial connecting small computer system interface SAS Connector or it is small-sized can plug SFP+ connectors.
By the way that back plane connector is arranged into SAS connector or SFP+ connectors, the logical of connector is further improved The property used.
In a kind of possible implementation, the PCIe bottom plates are half high half long card bottom plates of PCIe.
By being designed on the half high half long card bottom plates of PCIe of standard, the versatility of system disk is improved.
In a kind of possible implementation, in addition to:Two M.2 modular assembly, described two M.2 modular assemblies are distinguished It is positioned in the holding area of described two M.2 modular assemblies.
Second aspect, the application provide a kind of M.2 connector, including:
Connect base, the storage tank of M.2 module is provided with the connect base, one end of the connect base is provided with For hot-swappable interface, the other end of the connect base sets finite place piece, the locating part be used for will described in M.2 module It is limited in the storage tank.
Because there is the connect base heat to dial slotting interface, therefore, the connect base can realize that heat is dialled and insert, due to connecting bottom The storage tank of M.2 module is provided with seat, M.2 module is positioned over M.2 in the storage tank of module, it is indirect by connect base Realize that M.2 module heat is dialled to insert, consequently facilitating safeguarding M.2 module.
In a kind of possible implementation, described for hot-swappable interface is golden finger.
Heat is used as by golden finger and dials slotting interface, improves its versatility.
In a kind of possible implementation, the locating part is catch, and the free end of the catch points to the connection One end for hot-swappable interface of base, the bottom surface of the parallel storage tank of plane of the catch.
The third aspect, the application provide a kind of M.2 modular assembly, including:M.2 module and as described in any one of second aspect M.2 connector, the M.2 module is positioned over described M.2 in the storage tank of module.
Because M.2 connector can realize that heat group is inserted, M.2 module is positioned over M.2 in the storage tank of module, therefore, is passed through Connect base is indirectly realized that M.2 module heat is dialled and inserted so that M.2 module is easy to maintain.
Brief description of the drawings
Fig. 1 is a kind of structural representation for the M.2 connector that the application provides;
Fig. 2 is another structural representation for the M.2 connector that the application provides;
Fig. 3 is a kind of structural representation for the M.2 modular assembly that the application provides;
Fig. 4 is a kind of structural representation for the system disk that the application provides;
Fig. 5 is another structural representation for the system disk that the application provides;
Fig. 6 is the yet another construction schematic diagram for the system disk that the application provides;
Fig. 7 is another structural representation for the system disk that the application provides;
Fig. 8 is the top view of the system disk shown in Fig. 7;
Fig. 9 is the logical schematic for the system disk that the application provides.
Embodiment
RAID 1 realizes data redundancy by data in magnetic disk mirror image, and mutually redundant number is produced on paired independent disk According to.When initial data is busy, data can be directly read from mirror-image copies, therefore RAID 1 can improve reading performance. RAID 1 provides very high Information Security and availability.When a disk failure, system can automatically switch to mirror image Read and write on disk, the data without recombinating failure.
Its operation principle is:One two pieces of hard disk is formed RAID disk array by RAID1, and its capacity is only equal to one piece firmly The capacity of disk, because another piece is as data " mirror image ".The disk arrays of RAID 1 are a kind of reliable arrays, because It is always to maintain a complete data backup.Its digital independent is fast compared with what single hardware came, because data can be from two pieces of hard disks In read in faster one piece.The disk arrays of RAID 1 are typically supported " heat exchange ", that is the removal of hard disk or are replaced in array Changing can be carried out in system operation, be logged off without interruption.The disk arrays of RAID 1 are foolproof.The disks of RAID 1 Array is used primarily in that Information Security is very high, and is required to the occasion of the destroyed data of fast quick-recovery.
The application separates system disk and data disks, and make system disk branch to further improve the performance of system Hold hard RAID1 requirement, system disk support hard RAID1 need not take central processing unit (Central Processing Unit, CPU disposal ability), therefore, the performance of system can further be improved.
The application substitutes 2.5 cun of traditional hard disks by M.2 module when realizing that system disk supports hard RAID1, due to M.2 module small volume, therefore, two M.2 module can be arranged on a PCIe bottom plate, PCIe bottom plate takes one PCIe slot position, this improves the storage density of server, and then, improve the systematic function of server.
Wherein, M.2 module can select it is various sizes of, such as:2280.
The technical scheme of the application is described in detail with specifically embodiment below.These specific implementations below Example can be combined with each other, and may be repeated no more for same or analogous concept or process in some embodiments.
Fig. 1 be the application provide M.2 connector a kind of structural representation, as shown in figure 1, this M.2 connector 200 wraps Include:Connect base 1, the storage tank 11 of M.2 module is provided with connect base 1, one end of connect base 1 is provided with for hot drawing Slotting interface 12, the other end of connect base 1 set finite place piece 13, and locating part 13 is used to that M.2 module storage tank will to be limited to In 11.
In use, by that M.2 module will be positioned in storage tank 11, M.2 module will be limited to house by locating part 13 In groove 11, it is avoided to rock.
When needing to install M.2 module, can will M.2 module and M.2 connector as in an overall insertion system disk, The heat of connect base 1 is set to dial in the back plane connector of the slotting insertion system disk of interface 12;, will M.2 when needing to change M.2 module Module and M.2 connector are transferred to as an entirety out of system disk.
In the M.2 connector embodiment shown in Fig. 1, dial what is inserted for heat due to being provided with one end of its connect base Interface, therefore, the connect base can realize that heat is dialled and insert, will M.2 mould due to being provided with the storage tank of M.2 module in connect base Block is positioned over indirectly realizes that the heat group of M.2 module is inserted by connect base M.2 in the storage tank of module, consequently facilitating safeguarding M.2 module.
Fig. 2 is another structural representation for the M.2 connector that the application provides, and Fig. 2 is the base in embodiment illustrated in fig. 1 On plinth, realize that heat dials slotting interface 12 by golden finger, so as to improve the versatility of interface so that be more widely applied.
In Fig. 1 or embodiment illustrated in fig. 2, alternatively, locating part 12 can be realized by catch, and the free end of catch refers to To one end for being used for heat and dialling slotting interface of connect base, the bottom surface of the parallel storage tank of plane of catch, so as to will M.2 module It is limited to 11 in the storage tank.
Fig. 3 is a kind of structural representation for the M.2 modular assembly that the application provides, as shown in figure 3, including:M.2 module 100 and M.2 connector 200, M.2 module 100 be positioned over M.2 in the storage tank of module.M.2 the structure of connector 200 such as Fig. 1 or Shown in Fig. 2, here is omitted.
In the embodiment of the M.2 modular assembly shown in Fig. 3, inserted because M.2 connector can realize that heat is dialled, M.2 module It is positioned over M.2 in the storage tank of module, can indirectly realizes that M.2 module heat is dialled by the connect base of M.2 connector and insert, make It is easy to maintain to obtain M.2 module.
Fig. 4 is a kind of structural representation for the system disk that the application provides, as shown in figure 4, the system disk includes:Go here and there at a high speed Row computer expansion bus standard (Peripheral Component Interconnect express, PCIe) bottom plate 41, The holding area 411 of two M.2 modular assemblies is provided with PCIe bottom plates 41, the holding area 411 of the M.2 modular assembly is used In accommodating M.2 modular assembly.
In the system disk embodiment shown in Fig. 4, because the size of M.2 modular assembly is smaller, by PCIe bottoms The holding area of two M.2 modular assemblies is provided with plate, by two M.2 modular assembly be arranged on PCIe bottom plates and realize system Disk supports hard RAID1, and PCIe bottom plates need to only take a groove position, occupy little space, and this improves the storage of server is close Degree, and then, improve the systematic function of server.
Fig. 5 is another structural representation for the system disk that the application provides, and Fig. 5 is on the basis of embodiment illustrated in fig. 4 On, further, onboard RAID1 chips 412 are additionally provided with the PCIe bottom plates 41.
In system shown in Figure 5 disk embodiment, by the way that RAID1 chips 412 are arranged on PCIe bottom plates 41, save outer The PCIe slot position shared by RAID1 chips is connect, further, improves storage density.
Fig. 6 is the yet another construction schematic diagram for the system disk that the application provides, and Fig. 6 is on the basis of embodiment illustrated in fig. 5 On, further, each M.2 one end of the holding area 411 of modular assembly is additionally provided with back plane connector 413, the bottom plate Connector 413 and the hot-swappable Interface Matching of the M.2 connect base of connector.
In system shown in Figure 6 disk embodiment, by setting the hot-swappable interface with the M.2 connect base of connector The back plane connector matched somebody with somebody, realize that the heat of M.2 connector is dialled and insert, and then realize that the heat of M.2 modular assembly is dialled and insert, be convenient for changing M.2 Modular assembly, system disk easy to maintain.
In system shown in Figure 6 disk embodiment, back plane connector can be serial connecting small computer system interface (Serial Attached Small Computer System Interface, SAS) connector or SFP+ connectors, lead to Cross by back plane connector be arranged to SAS connector or it is small-sized can plug (Small Form-Factor Pluggable, SFP+) Connector, further improve the versatility of connector.
Alternatively, back plane connector can also be by the way of connector be customized, on the other hand, the application is not restricted.
In the above-described embodiments, it is half high half long card bottom plates of PCIe.By on the half high half long card bottom plates of PCIe of standard It is designed, improves the versatility of system disk.
Fig. 7 is another structural representation for the system disk that the application provides, and Fig. 8 is the vertical view of the system disk shown in Fig. 7 Figure.Fig. 7 be on the basis of the various embodiments described above, further, in addition to:M.2 modular assembly 300, two M.2 modular assemblies 300 are respectively placed in the holding area of described two M.2 modular assemblies.
Fig. 9 is the logical schematic for the system disk that the application provides, as shown in figure 9, RAID1 chips can be led to from industry Chip, such as:Broadcom, PMC RAID chips, it supports SAS/, Serial Advanced Technology Attachment (Serial Advanced Technology Attachment, SATA) interface M.2 module.Or RAID1 chips can also be selected Broadcom companies support the RAID chips of Tri mode characteristics (such as:SAS3508 of Broadcom companies etc.) or use PCIe Switch chips, to support the M.2 module of PCIe interface.

Claims (10)

  1. A kind of 1. system disk, it is characterised in that including:
    High speed serialization computer expansion bus standard PCIe bottom plates, two M.2 modular assemblies are provided with the PCIe bottom plates Holding area, the holding area of the M.2 modular assembly are used for accommodating M.2 modular assembly.
  2. 2. system disk according to claim 1, it is characterised in that onboard RAID1 cores are additionally provided with the PCIE bottom plates Piece.
  3. 3. system disk according to claim 1 or 2, it is characterised in that each M.2 holding area of modular assembly One end is additionally provided with back plane connector, the back plane connector and the hot-swappable Interface Matching of the M.2 connect base of connector.
  4. 4. system disk according to claim 3, it is characterised in that the back plane connector is Serial Attached Small Computer System interface SAS connector or it is small-sized can plug SFP+ connectors.
  5. 5. system disk according to claim 1, it is characterised in that the PCIe bottom plates are half high half long card bottom plates of PCIe.
  6. 6. according to the system disk described in claim any one of 1-5, it is characterised in that also include:
    Two M.2 modular assembly, described two M.2 modular assemblies are respectively placed in the accommodating area of described two M.2 modular assemblies In domain.
  7. A kind of 7. M.2 connector, it is characterised in that including:
    Connect base, the storage tank of M.2 module is provided with the connect base, one end of the connect base, which is provided with, to be used for Hot-swappable interface, the other end of the connect base set finite place piece, and the locating part is used for the M.2 module limitation by described in In in the storage tank.
  8. 8. M.2 connector according to claim 7, it is characterised in that described for hot-swappable interface is golden finger.
  9. 9. the M.2 connector according to claim 7 or 8, it is characterised in that the locating part is catch, the catch Free end points to one end for hot-swappable interface of the connect base, the parallel storage tank of plane of the catch Bottom surface.
  10. A kind of 10. M.2 modular assembly, it is characterised in that including:M.2 module and as described in claim any one of 7-9 M.2 Connector, the M.2 module are positioned over described M.2 in the storage tank of module.
CN201710758791.8A 2017-08-29 2017-08-29 M.2 connector, M.2 modular assembly and system disk Pending CN107704035A (en)

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Application Number Priority Date Filing Date Title
CN201710758791.8A CN107704035A (en) 2017-08-29 2017-08-29 M.2 connector, M.2 modular assembly and system disk
CN202010368114.7A CN111665913A (en) 2017-08-29 2017-08-29 M.2 connector, M.2 module assembly and system disk

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Application Number Priority Date Filing Date Title
CN201710758791.8A CN107704035A (en) 2017-08-29 2017-08-29 M.2 connector, M.2 modular assembly and system disk

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117331403A (en) * 2023-11-29 2024-01-02 苏州元脑智能科技有限公司 M.2 element switching module, M.2 element device assembly and server

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CN106155231A (en) * 2016-08-01 2016-11-23 浪潮电子信息产业股份有限公司 A kind of storage server
CN107077438A (en) * 2014-10-29 2017-08-18 惠普发展公司有限责任合伙企业 Communicated by the part of communication media

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Publication number Priority date Publication date Assignee Title
CN107077438A (en) * 2014-10-29 2017-08-18 惠普发展公司有限责任合伙企业 Communicated by the part of communication media
CN105929903A (en) * 2015-02-27 2016-09-07 三星电子株式会社 Modular Non-volatile Flash Memory Blade
CN105514683A (en) * 2015-12-17 2016-04-20 宜鼎国际股份有限公司 M.2 interface memory device and M.2 interface connecting seat for inserting same
CN106155231A (en) * 2016-08-01 2016-11-23 浪潮电子信息产业股份有限公司 A kind of storage server

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Application publication date: 20180216