CN107678108A - A kind of effectively high coupling ratios photoelectric subassembly - Google Patents
A kind of effectively high coupling ratios photoelectric subassembly Download PDFInfo
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- CN107678108A CN107678108A CN201711168492.5A CN201711168492A CN107678108A CN 107678108 A CN107678108 A CN 107678108A CN 201711168492 A CN201711168492 A CN 201711168492A CN 107678108 A CN107678108 A CN 107678108A
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- Prior art keywords
- photoelectric subassembly
- laser
- laser module
- coaxial packaging
- contact pin
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to optical module technical field, there is provided a kind of effectively high coupling ratios photoelectric subassembly.Including contact pin component 1, the laser module 2 of coaxial packaging, pellicle 3, coaxial packaging photo-detector 4 and photoelectric subassembly body 5, pellicle 3 is arranged on the first inclined-plane 11 of wedge base 10, for launching from the optical signal that contact pin component 1 receives to photo-detector 4；For wedge base 10 towards clinohedral 13 is provided with the incident optical plane 12 of the side of the laser module 2 of coaxial packaging, wherein clinohedral 13 possesses the second tilt angle theta4；Wherein, clinohedral 13 causes the optical signal of the laser module 2 of coaxial packaging to produce the first tilt angle theta when through clinohedral 133.Photoelectric subassembly structure proposed by the invention, refraction problems can be occurred at fiber end face by overcoming light, can effectively improve coupling efficiency, and then increase power budget, and can be realized with less cost.
Description
【Technical field】
The present invention relates to optical module technical field, more particularly to a kind of effectively high coupling ratios photoelectric subassembly.
【Background technology】
Fiber optic communication is due to capacity is big, repeater span is long, security performance is good, small volume and is easy to construction maintenance etc. excellent
Point, the very big attention of people is received in nearest many decades.Photoelectric device is as the core work in optical fiber telecommunications system
Part, its performance directly determine the transmission quality of fiber optic communication.As depicted in figs. 1 and 2, in the prior art for fiber optic communication
Single-fiber bidirectional photoelectric component mainly by the spy of contact pin component 1, the laser 2 of coaxial packaging, pellicle 3 and coaxial packaging
Survey device 4 to form, wherein laser 2 is fixed on the horizontal side of a round and square tube body (not shown), and contact pin component 1 is fixed on circle
The horizontal opposite side of square tube body, detector 4 are fixed on the upside of round and square tube body, and pellicle 3 is located inside round and square tube body simultaneously
It is in 45° angle with horizontal axis.It can cause after entering laser 2 due to the reflected light formed in the fiber end face 20 of contact pin component 1
The P-I poor linearities of laser 2, so as to cause modulated signal to be distorted, therefore it can be incited somebody to action in the contact pin component 1 of reality makes
Fiber end face 20 be ground into it is angle o with perpendicular, wherein θ angles be 6~11 degree.It is 1.25Gbit/s and its following for speed
Photoelectric device, this method effectively improves the linear of transmitting terminal.But the phototube for speed for more than 2.5Gbit/s
Part, this method can not only solve the reflection problems that fiber end face 20 is brought, and due to the presence at θ inclinations angle, light is in light
It can be reflected at fine end face 20, cause light a bias angle theta to be present with horizontal plane1, as shown in Fig. 2 wherein θ1For 2~4 degree, most
Transmitting terminal and receiving terminal coupling efficiency is caused to decline eventually.
The utility model patent proposed before inventor《Single-fiber bidirectional photoelectric component》, Application No.:
In CN201120174231.6 technical scheme, employ one kind and couple boundary between round and square tube body and contact pin component 1 by adjusting
Improvement project of the thinking of face angle degree as above-mentioned technical problem, however, it is found by the inventors that the processing mode virtually adds
The coupling area of contact pin component 1, and the overall volume of whole photoelectric subassembly.
【The content of the invention】
The technical problem to be solved in the present invention is for the photoelectric device that speed is more than 2.5Gbit/s, prior art side
The problem of fiber end face 20 is brought in method, it is specially：Due to the presence at θ inclinations angle, light can be rolled at fiber end face 20
Penetrate, cause light a bias angle theta to be present with horizontal plane1, as shown in Fig. 2 wherein θ1For 2~4 degree, finally cause transmitting terminal and reception
Coupling efficiency is held to decline.
The present invention adopts the following technical scheme that：
In a first aspect, the invention provides a kind of effectively high coupling ratios photoelectric subassembly, including contact pin component 1, coaxial packaging swash
Light device module 2, pellicle 3, the photo-detector 4 and photoelectric subassembly body 5 of coaxial packaging, wherein, the light of coaxial packaging is visited
Survey device 4 to be arranged on the tube wall of the photoelectric subassembly body 5, the laser module 2 of the contact pin component 1 and coaxial packaging is distinguished
The both ends of the photoelectric subassembly body 5 are arranged on, also, the pellicle 3 is arranged on inside photoelectric subassembly body 5, is used
In transmission the laser module 2 from coaxial packaging export optical signal and reflect the reception optical signal from contact pin component 1 to
Photo-detector 4, including connector 6, the laser module 2 that the connector 6 is used for coaxial packaging couple with photoelectric subassembly body 5
Encapsulation is used, specifically：
The first port of the connector 6 couples with the Base edge of the laser module 2 of coaxial packaging；The connector
6 second port couples with the entering light port of the photoelectric subassembly body 5；Wherein, the second port of connector 6 or the photoelectricity
The entering light port of component body 5 is machined with default first tilt angle theta relative to caliber3；
Wherein, first tilt angle theta3So that the laser signal projected from laser module 2 is arriving at fiber end face
When 20, θ+θ are formed with the normal of fiber end face 203Incidence angle.
Preferably, when the tiltangleθ of the fiber end face 20 is 6~11 degree, first tilt angle theta3Value
For 2~4 degree.
Preferably, the laser module 2 of the coaxial packaging is specially TO encapsulated lasers or butterfly encapsulated laser.
Preferably, it is connected between the laser module 2 and connector 6 of wherein coaxial packaging by welding resistance or Laser Welding
Together；Between connector 6 and photoelectric subassembly body 5, and pass through laser welding between contact pin component 1 and photoelectric subassembly body 5
Connection；Photo-detector 4 is connected with photoelectric subassembly body 5 by laser welding or viscose glue mode.
Second aspect, the invention provides a kind of effectively high coupling ratios photoelectric subassembly, including contact pin component 1, the laser that has encapsulated
Device module 7, pellicle 3, the photo-detector 4 and photoelectric subassembly body 5 of coaxial packaging, wherein, the optical detection of coaxial packaging
Device 4 is arranged on the tube wall of the photoelectric subassembly body 5, and the contact pin component 1 and the laser module 7 encapsulated are set respectively
At the both ends of the photoelectric subassembly body 5, also, the pellicle 3 is arranged on inside photoelectric subassembly body 5, for saturating
Penetrate and export the reception optical signal of optical signal and reflection from contact pin component 1 to photo-detector 4 from laser module 7,
The laser module 7 encapsulated be internally provided with for laser 8 is installed heat sink 9, wherein heat sink 9 use
Default first tilt angle theta has been processed in the surface of fitting laser 83Inclined-plane；
Wherein, it is being mounted with effectively high coupling ratios photoelectric subassembly after each part, first tilt angle theta3So that from laser
The laser signal that device module 7 projects forms θ+θ when arriving at fiber end face 20, with the normal of fiber end face 203Incidence angle.
Preferably, when the tiltangleθ of the fiber end face 20 is 6~11 degree, first tilt angle theta3Value
For 2~4 degree.
Preferably, the laser module 7 encapsulated is specially TO encapsulated lasers or butterfly encapsulated laser.
Preferably, wherein being connected to one by welding resistance or Laser Welding between the laser module 7 and connector 6 that have encapsulated
Rise；Between connector 6 and photoelectric subassembly body 5, and between contact pin component 1 and photoelectric subassembly body 5 by Laser Welding in succession
Connect；Photo-detector 4 is connected with photoelectric subassembly body 5 by laser welding or viscose glue mode.
The third aspect, present invention also offers a kind of effectively high coupling ratios photoelectric subassembly, including contact pin component 1, coaxial packaging
Laser module 2, pellicle 3, the photo-detector 4 and photoelectric subassembly body 5 of coaxial packaging, wherein, the light of coaxial packaging
Detector 4 is arranged on the tube wall of the photoelectric subassembly body 5, and the laser module 2 of the contact pin component 1 and coaxial packaging divides
The both ends of the photoelectric subassembly body 5 are not arranged on, also, the pellicle 3 is arranged on inside photoelectric subassembly body 5,
For transmiting the reception optical signal of output optical signal and reflection from contact pin component 1 of the laser module 2 from coaxial packaging
To photo-detector 4, the bottom of the wedge base 10 is fixed on the inner side of photoelectric subassembly body 5, wherein, the film point
Mating plate 3 is arranged on the first inclined-plane 11 of wedge base 10, is visited for launching from the optical signal that contact pin component 1 receives to light
Survey device 4；The wedge base 10 is towards being provided with inclined-plane on the incident optical plane 12 of the side of the laser module 2 of coaxial packaging
Body 13, wherein clinohedral 13 possess the second tilt angle theta4；Wherein, the clinohedral 13 causes the laser module of coaxial packaging
2 optical signal produces the first tilt angle theta when through the clinohedral 133；
Wherein, second tilt angle theta4So that the laser signal projected from laser module 2 is arriving at fiber end face
When 20, θ+θ are formed with the normal of fiber end face 203Incidence angle.
Preferably, when the tiltangleθ of the fiber end face 20 is 6~11 degree, first tilt angle theta3Value
For 2~4 degree；Second tilt angle theta4According to first tilt angle theta3, clinohedral 13 Refractive Index of Material and photoelectricity group
Air mean refractive index is calculated in part body 5.
Preferably, the laser module 2 of the coaxial packaging is specially TO encapsulated lasers or butterfly encapsulated laser.
Preferably, it is connected between the laser module 2 and connector 6 of wherein coaxial packaging by welding resistance or Laser Welding
Together；Between connector 6 and photoelectric subassembly body 5, and pass through laser welding between contact pin component 1 and photoelectric subassembly body 5
Connection；Photo-detector 4 is connected with photoelectric subassembly body 5 by laser welding or viscose glue mode.
Compared with prior art, the beneficial effects of the present invention are：
Photoelectric subassembly structure proposed by the invention, refraction problems can be occurred at fiber end face by overcoming light, can be with
Coupling efficiency is effectively improved, and then increases power budget, and can be realized with less cost.For the field of significant power demand
Close, especially for especially suitable for OLT photoelectric subassemblys.
For the patent that compares CN201120174231.6, also from the job stability and easy making process of photoelectric subassembly and
Further improvement is made that for encapsulation volume.
【Brief description of the drawings】
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of photoelectric subassembly structural representation of the prior art provided in an embodiment of the present invention；
Fig. 2 is a kind of contact pin component structural representation of the prior art provided in an embodiment of the present invention；
Fig. 3 is a kind of improved photoelectric subassembly structural representation of the prior art provided in an embodiment of the present invention；
Fig. 4 is a kind of high coupling efficiency photoelectric subassembly structural representation provided in an embodiment of the present invention；
Fig. 5 is the structural representation of the laser module 2 of coaxial packaging of the prior art provided in an embodiment of the present invention；
Fig. 6 is another high coupling efficiency photoelectric subassembly structural representation provided in an embodiment of the present invention；
Fig. 7 is the structural representation of laser module in another high coupling efficiency photoelectric subassembly provided in an embodiment of the present invention
Figure；
Fig. 8 is another high coupling efficiency photoelectric subassembly structural representation provided in an embodiment of the present invention；
Fig. 9 is a kind of principle schematic for calculating the inclined-plane of wedge base second provided in an embodiment of the present invention.
【Embodiment】
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the invention, term " interior ", " outer ", " longitudinal direction ", " transverse direction ", " on ", " under ", " top ", " bottom " etc. refer to
The orientation or position relationship shown be based on orientation shown in the drawings or position relationship, be for only for ease of the description present invention rather than
It is required that the present invention must be with specific azimuth configuration and operation, therefore it is not construed as limitation of the present invention.
In various embodiments of the present invention, symbol "/" represents the implication with two kinds of functions, such as " the second entry/exit light
Mouthful " show that the port both can also light extraction with entering light.And for symbol, " A and/or B " then show before and after being connected by the symbol
Combination between object include " A ", " B ", " three kinds of situations of A and B ", such as " back-scattering light and/or reflected light ", then show it
It can express single " back-scattering light ", single " reflected light ", and in " back-scattering light and reflected light " three kinds of implications
Any one.
In addition, as long as technical characteristic involved in each embodiment of invention described below is each other not
Conflict can is formed to be mutually combined.
Embodiment 1:
The embodiment of the present invention 1 provides a kind of effectively high coupling ratios photoelectric subassembly, as shown in figure 4, including contact pin component 1, coaxial
Laser module 2, pellicle 3, the photo-detector 4 and photoelectric subassembly body 5 of coaxial packaging of encapsulation, wherein, same to axle envelope
The photo-detector 4 of dress is arranged on the tube wall of the photoelectric subassembly body 5, the laser of the contact pin component 1 and coaxial packaging
Module 2 is separately positioned on the both ends of the photoelectric subassembly body 5, also, the pellicle 3 is arranged on photoelectric subassembly body
Inside 5, for transmiting the reception of output optical signal and reflection from contact pin component 1 of the laser module 2 from coaxial packaging
Optical signal is used for the laser module 2 and photoelectric subassembly of coaxial packaging to photo-detector 4, including connector 6, the connector 6
The coupling package of body 5 is used, specifically：
The first port of the connector 6 couples with the Base edge of the laser module 2 of coaxial packaging；The connector
6 second port couples with the entering light port of the photoelectric subassembly body 5；Wherein, the second port of connector 6 or the photoelectricity
The entering light port of component body 5 is machined with default first tilt angle theta relative to caliber3；
Wherein, first tilt angle theta3So that the laser signal projected from laser module 2 is arriving at fiber end face
When 20, θ+θ are formed with the normal of fiber end face 203Incidence angle.
Photoelectric subassembly structure proposed by the invention, refraction problems can be occurred at fiber end face 20 by overcoming light, can
To effectively improve coupling efficiency, and then increase power budget, and can be realized with less cost.For the field of significant power demand
Close, especially for especially suitable for OLT photoelectric subassemblys.
In embodiments of the present invention, the angle of inclination section also based on the existing routine fiber end face 20 (such as：6
~11 degree) provide one group of first feasible tilt angle theta3Parameter setting values, specifically, first tilt angle theta3Take
It is worth for 2~4 degree.Usual above-mentioned first tilt angle theta3Interval value go for more than 2.5Gbit/s speed, and optical fiber
End face 20 is most of photoelectric subassembly occasion of not 0 deg.
Mainly it is shown in accompanying drawing corresponding to various embodiments of the present invention so that TO is encapsulated as an example, still, the coaxial packaging
Laser module 2 be specially TO encapsulated lasers or butterfly encapsulated laser, belong in protection scope of the present invention.
In embodiments of the present invention, welding resistance or Laser Welding are passed through between the laser module 2 and connector 6 of coaxial packaging
Link together；Between connector 6 and photoelectric subassembly body 5, and by swashing between contact pin component 1 and photoelectric subassembly body 5
Photocoagulation connects；Photo-detector 4 is connected with photoelectric subassembly body 5 by laser welding or viscose glue mode.
Embodiment 2:
In order to solve technical problem proposed by the invention, except the company in coupling described in embodiment 1 can be used
Set on fitting 6 or the interface coupled thereto of photoelectric subassembly body 5 outside the mode of inclined plane, the embodiment of the present invention is then direct
Set about from the laser setting structure inside the laser module 7 encapsulated, realize that optical signal is entering the optical fiber of contact pin component 1
Angle excursion θ before face1Realization.The embodiment that compares 1, the embodiment of the present invention specially distinguish reality with laser module 7
The laser module 2 in example 1 is applied, is the laser module after the embodiment of the present invention is improved for refering in particular to laser module 7.
As shown in figure 5, for the embodiments of the invention provide the structural representation of the laser module 2 of existing coaxial packaging
Figure, it can be seen that wherein between the main shaft of the exiting surface of laser and the laser module of coaxial packaging 2 in 90 ° of angles (wherein
The exiting surface of laser is also parallel with the seating plane of the laser module 2 of coaxial packaging), that is, the laser signal launched with
The main shaft is to overlap.
A kind of effectively high coupling ratios photoelectric subassembly that the embodiment of the present invention is proposed, as shown in fig. 6, including contact pin component 1, having sealed
Laser module 7, pellicle 3, the photo-detector 4 and photoelectric subassembly body 5 of coaxial packaging of dress, wherein, coaxial packaging
Photo-detector 4 be arranged on the tube wall of the photoelectric subassembly body 5, the contact pin component 1 and the laser module 7 encapsulated
The both ends of the photoelectric subassembly body 5 are separately positioned on, also, the pellicle 3 is arranged in photoelectric subassembly body 5
Portion, the reception optical signal of optical signal and reflection from contact pin component 1 is exported to optical detection from laser module 7 for transmiting
Device 4.Further, as shown in fig. 7,
The laser module 7 encapsulated be internally provided with for laser 8 is installed heat sink 9, wherein heat sink 9 use
Default first tilt angle theta has been processed in the surface of fitting laser 83Inclined-plane；
Wherein, it is being mounted with effectively high coupling ratios photoelectric subassembly after each component, first tilt angle theta3So that from laser
The laser signal that device module 7 projects forms θ+θ when arriving at fiber end face 20, with the normal of fiber end face 203Incidence angle.Its
In, each component includes above-mentioned contact pin component 1, the laser module 7 encapsulated, pellicle 3, the light of coaxial packaging and visited
Survey device 4 and photoelectric subassembly body 5 etc..
In specific implementation, with reference to structure chart as shown in Figure 7, described heat sink 9 can also be with base one into
Type (now heat sink 9 shown in Fig. 7 be base a part), and laser 8 then can be individually cut into pre- by another
If the first tilt angle theta3Inclined-plane it is heat sink, complete and the fixation of base.
Photoelectric subassembly structure proposed by the invention, refraction problems can be occurred at fiber end face by overcoming light, can be with
Coupling efficiency is effectively improved, and then increases power budget, and can be realized with less cost.For the field of significant power demand
Close, especially for especially suitable for OLT photoelectric subassemblys.
As shown in fig. 7, by such adjustment, it can make it that the emergent light of laser can be with level side after by lens
To θ at an angle5, wherein θ5=θ3.If above-mentioned laser is positioned in photoelectric subassembly, angle, θ5Can be in distal end and angle, θ1
Overlap, as shown in Figure 6.
In embodiments of the present invention, the angle of inclination section also based on the existing routine fiber end face 20 (such as：6
~11 degree) provide one group of first feasible tilt angle theta3Parameter setting values, specifically, first tilt angle theta3Take
It is worth for 2~4 degree.Usual above-mentioned first tilt angle theta3Interval value go for more than 2.5Gbit/s speed, and optical fiber
End face 20 is most of photoelectric subassembly occasion of not 0 deg.
Mainly it is shown so that TO is encapsulated as an example in accompanying drawing corresponding to various embodiments of the present invention, it is still, described to have encapsulated
Laser module 7 is specially TO encapsulated lasers or butterfly encapsulated laser, is belonged in protection scope of the present invention.
In embodiments of the present invention, connected between the laser module 7 and connector 6 that have encapsulated by welding resistance or Laser Welding
It is connected together；Between connector 6 and photoelectric subassembly body 5, and pass through laser between contact pin component 1 and photoelectric subassembly body 5
It is welded to connect；Photo-detector 4 is connected with photoelectric subassembly body 5 by laser welding or viscose glue mode.
Embodiment 3:
The present invention additionally provides one in addition to providing the effectively high coupling ratios photoelectric subassembly solution of embodiment 1 and embodiment 2
Kind processing cost is lower, the higher solution with each intermodule compatibility of existing package assembling, specifically, as shown in figure 8, one
Kind effectively high coupling ratios photoelectric subassembly, including the laser module 2 of contact pin component 1, coaxial packaging, pellicle 3, coaxial packaging
Photo-detector 4 and photoelectric subassembly body 5, wherein, the photo-detector 4 of coaxial packaging is arranged on the pipe of the photoelectric subassembly body 5
On wall, the laser module 2 of the contact pin component 1 and coaxial packaging is separately positioned on the both ends of the photoelectric subassembly body 5, and
And the pellicle 3 is arranged on inside photoelectric subassembly body 5, for transmiting the laser module 2 from coaxial packaging
The reception optical signal of optical signal and reflection from contact pin component 1 is exported to photo-detector 4, the bottom of the wedge base 10 to be consolidated
The inner side of photoelectric subassembly body 5 is scheduled on, wherein, the pellicle 3 is arranged on the first inclined-plane 11 of wedge base 10
On, for launching from the optical signal that contact pin component 1 receives to photo-detector 4；The wedge base 10 is towards coaxial packaging
Clinohedral 13 is provided with the incident optical plane 12 of the side of laser module 2, wherein clinohedral 13 possesses the second angle of inclination
θ4；Wherein, the clinohedral 13 causes the optical signal of the laser module 2 of coaxial packaging to be produced when through the clinohedral 13
First tilt angle theta3；
Wherein, second tilt angle theta4So that the laser signal projected from laser module 2 is arriving at fiber end face
When 20, θ+θ are formed with the normal of fiber end face 203Incidence angle.
Wherein, the clinohedral 13 can make to obtain by possessing the light transmissive material of specific refractive index.Its refractive index
Mainly " laser signal when arriving at fiber end face 20, θ+θ are formed with the normal of fiber end face 20 according to what it to be realized3's
Depending on incidence angle " purpose.
Photoelectric subassembly structure proposed by the invention, refraction problems can be occurred at fiber end face by overcoming light, can be with
Coupling efficiency is effectively improved, and then increases power budget, and can be realized with less cost.For the field of significant power demand
Close, especially for especially suitable for OLT photoelectric subassemblys.For the embodiment that compares 1 and embodiment 2, the embodiment of the present invention
Improving cost and convenient degree be all optimal.
In embodiments of the present invention, and in Fig. 4 and Fig. 6 it can be gold to correspond to the corresponding wedge base 10 shown in Fig. 8
Belong to material to make either by ceramic material, its structure is typically hollow design for light path, and it is in optical mode
The carrying pellicle 3 is generally only served in block to use.Wherein, Fig. 4 and Fig. 6 correspond to the wedge base 10 structure it is equal
For sectional view, therefore, hollow structure is not shown intuitively.
It is emphasized that the size in Fig. 9 is only schematic diagram effect, the thickness of pellicle 3 in actual product
Very thin, it can be ignored for the refraction action of laser signal.
In embodiments of the present invention, the angle of inclination section also based on the existing routine fiber end face 20 (such as：6
~11 degree) provide one group of first feasible tilt angle theta3Parameter setting values, specifically, first tilt angle theta3Take
It is worth for 2~4 degree；Second tilt angle theta4According to first tilt angle theta3, clinohedral 13 Refractive Index of Material and photoelectricity
Air mean refractive index is calculated in component body 5.As shown in figure 9, the first tilt angle theta is being determined3Afterwards, can be with logical
Cross air mean refractive index in the Refractive Index of Material and photoelectric subassembly body 5 of clinohedral 13 just press out laser output optical signal with
The angle calcu-lation on the second inclined-plane 12 goes out the second tilt angle theta4。
Mainly it is shown in accompanying drawing corresponding to various embodiments of the present invention so that TO is encapsulated as an example, still, the coaxial packaging
Laser module 2 be specially TO encapsulated lasers or butterfly encapsulated laser, belong in protection scope of the present invention.
In embodiments of the present invention, welding resistance or Laser Welding are passed through between the laser module 2 and connector 6 of coaxial packaging
Link together；Between connector 6 and photoelectric subassembly body 5, and by swashing between contact pin component 1 and photoelectric subassembly body 5
Photocoagulation connects；Photo-detector 4 is connected with photoelectric subassembly body 5 by laser welding or viscose glue mode.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of effectively high coupling ratios photoelectric subassembly, include laser module (2), the pellicle of contact pin component (1), coaxial packaging
(3), the photo-detector (4) and photoelectric subassembly body (5) of coaxial packaging, wherein, the photo-detector (4) of coaxial packaging is arranged on institute
On the tube wall for stating photoelectric subassembly body (5), the laser module (2) of the contact pin component (1) and coaxial packaging is separately positioned on
The both ends of the photoelectric subassembly body (5), also, the pellicle (3) is arranged on photoelectric subassembly body (5) inside, uses
Believe in the reception light of output optical signal and reflection from contact pin component (1) of laser module (2) of the transmission from coaxial packaging
Number give photo-detector (4), it is characterised in that including connector (6), the connector (6) is used for the laser die of coaxial packaging
Block (2) is used with photoelectric subassembly body (5) coupling package, specifically：
The first port of the connector (6) couples with the Base edge of the laser module (2) of coaxial packaging；The connector
(6) second port couples with the entering light port of the photoelectric subassembly body (5)；Wherein, connector (6) second port or institute
The entering light port for stating photoelectric subassembly body (5) is machined with default first tilt angle theta relative to caliber3；
Wherein, first tilt angle theta3So that the laser signal projected from laser module (2) is arriving at fiber end face (20)
When, form θ+θ with the normal of fiber end face (20)3Incidence angle.
2. effectively high coupling ratios photoelectric subassembly according to claim 1, it is characterised in that the inclination in the fiber end face (20)
When angle θ is 6~11 degree, first tilt angle theta3Value be 2~4 degree.
3. effectively high coupling ratios photoelectric subassembly according to claim 1, it is characterised in that the laser module of the coaxial packaging
(2) it is specially TO encapsulated lasers or butterfly encapsulated laser.
4. effectively high coupling ratios photoelectric subassembly according to claim 1, it is characterised in that the wherein laser module of coaxial packaging
(2) linked together between connector (6) by welding resistance or Laser Welding；Connector (6) and photoelectric subassembly body (5) it
Between, and connected between contact pin component (1) and photoelectric subassembly body (5) by laser welding；Photo-detector (4) and photoelectric subassembly
Body (5) is connected by laser welding or viscose glue mode.
5. a kind of effectively high coupling ratios photoelectric subassembly, including contact pin component (1), the laser module (7), the pellicle that have encapsulated
(3), the photo-detector (4) and photoelectric subassembly body (5) of coaxial packaging, wherein, the photo-detector (4) of coaxial packaging is arranged on institute
On the tube wall for stating photoelectric subassembly body (5), the contact pin component (1) and the laser module (7) encapsulated are separately positioned on institute
The both ends of photoelectric subassembly body (5) are stated, also, the pellicle 3 is arranged on photoelectric subassembly body (5) inside, for saturating
Penetrate and export the reception optical signal of optical signal and reflection from contact pin component (1) to photo-detector from laser module (7)
(4), it is characterised in that
The laser module (7) encapsulated is internally provided with heat sink (9) for installing laser (8), wherein heat sink (9)
Be used for be bonded the surface of laser (8) and be processed to default first tilt angle theta3Inclined-plane；
Wherein, first tilt angle theta3So that the laser signal projected from laser module (7) is arriving at fiber end face (20)
When, form θ+θ with the normal of fiber end face (20)3Incidence angle.
6. effectively high coupling ratios photoelectric subassembly according to claim 5, it is characterised in that the inclination in the fiber end face (20)
When angle θ is 6~11 degree, first tilt angle theta3Value be 2~4 degree.
7. effectively high coupling ratios photoelectric subassembly according to claim 5, it is characterised in that the laser module encapsulated
(7) it is specially TO encapsulated lasers or butterfly encapsulated laser.
8. effectively high coupling ratios photoelectric subassembly according to claim 5, it is characterised in that the laser module wherein encapsulated
(7) linked together between connector (6) by welding resistance or Laser Welding；Connector (6) and photoelectric subassembly body (5) it
Between, and connected between contact pin component (1) and photoelectric subassembly body (5) by laser welding；Photo-detector (4) and photoelectric subassembly
Body (5) is connected by laser welding or viscose glue mode.
9. a kind of effectively high coupling ratios photoelectric subassembly, include laser module (2), the pellicle of contact pin component (1), coaxial packaging
(3), the photo-detector (4) and photoelectric subassembly body (5) of coaxial packaging, wherein, the photo-detector (4) of coaxial packaging is arranged on institute
On the tube wall for stating photoelectric subassembly body (5), the laser module (2) of the contact pin component (1) and coaxial packaging is separately positioned on
The both ends of the photoelectric subassembly body (5), also, the pellicle 3 is arranged on photoelectric subassembly body (5) inside, is used for
Transmit the reception optical signal of output optical signal and reflection from contact pin component (1) of the laser module (2) from coaxial packaging
Give photo-detector (4), it is characterised in that the bottom of wedge base (10) is fixed on the inside of the photoelectric subassembly body (5), its
In, the pellicle (3) is arranged on the first inclined-plane (11) of wedge base (10), for launching from contact pin component
(1) optical signal received gives photo-detector (4)；The laser module (2) of the wedge base (10) towards coaxial packaging
Clinohedral (13) is provided with the incident optical plane (12) of side, wherein clinohedral (13) possesses the second tilt angle theta4；Wherein,
The clinohedral (13) causes the optical signal of the laser module (2) of coaxial packaging to produce the when through the clinohedral (13)
One tilt angle theta3；
Wherein, second tilt angle theta4So that the laser signal projected from laser module (2) is arriving at fiber end face (20)
When, form θ+θ with the normal of fiber end face (20)3Incidence angle.
10. effectively high coupling ratios photoelectric subassembly according to claim 9, it is characterised in that in inclining for the fiber end face (20)
When bevel angle θ is 6~11 degree, first tilt angle theta3Value be 2~4 degree；Second tilt angle theta4According to described
One tilt angle theta3, clinohedral (13) Refractive Index of Material and photoelectric subassembly body (5) in air mean refractive index be calculated.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711168492.5A CN107678108A (en) | 2017-11-21 | 2017-11-21 | A kind of effectively high coupling ratios photoelectric subassembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711168492.5A CN107678108A (en) | 2017-11-21 | 2017-11-21 | A kind of effectively high coupling ratios photoelectric subassembly |
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| CN107678108A true CN107678108A (en) | 2018-02-09 |
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ID=61149277
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108398752A (en) * | 2018-04-02 | 2018-08-14 | 深圳市光兴创科技有限公司 | The novel single fiber bi-directional electrooptical device and its integrated base without lock pin |
| WO2020253339A1 (en) * | 2019-06-19 | 2020-12-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN205826918U (en) * | 2016-07-14 | 2016-12-21 | 东莞铭普光磁股份有限公司 | A kind of base construction improving bi-directional single fiber component power coupling efficiency |
| CN106353861A (en) * | 2016-10-31 | 2017-01-25 | 成都优博创通信技术股份有限公司 | Intensive wavelength division multiplexing optical transceiver assembly based on PON system |
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| JPH11295564A (en) * | 1998-04-10 | 1999-10-29 | Sumitomo Metal Mining Co Ltd | Optical isolator module and optical isolator component |
| CN202102148U (en) * | 2011-05-27 | 2012-01-04 | 武汉电信器件有限公司 | Single-fiber bidirectional photoelectric component |
| CN205594202U (en) * | 2016-05-03 | 2016-09-21 | 武汉凌科通光电科技有限公司 | Light receiving device |
| CN205826918U (en) * | 2016-07-14 | 2016-12-21 | 东莞铭普光磁股份有限公司 | A kind of base construction improving bi-directional single fiber component power coupling efficiency |
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| CN108398752A (en) * | 2018-04-02 | 2018-08-14 | 深圳市光兴创科技有限公司 | The novel single fiber bi-directional electrooptical device and its integrated base without lock pin |
| WO2020253339A1 (en) * | 2019-06-19 | 2020-12-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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