CN107650465A - A kind of boring backing plates of PCB and preparation method thereof - Google Patents
A kind of boring backing plates of PCB and preparation method thereof Download PDFInfo
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- CN107650465A CN107650465A CN201710828624.6A CN201710828624A CN107650465A CN 107650465 A CN107650465 A CN 107650465A CN 201710828624 A CN201710828624 A CN 201710828624A CN 107650465 A CN107650465 A CN 107650465A
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- paper
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B21/06—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
Abstract
The present invention discloses boring backing plates of a kind of PCB and preparation method thereof, and the backing plate is made by the fine plate of wood, functional form water solubility gum dipped paper, thermosetting gum dipped paper through high-temperature high-pressure craft；Press close to the fine plate surface of wood for functional form water-soluble resin layer, drilling temperature can be effectively reduced in boring procedure, promotes drill point chip removal, and then suppress blast hole problem, what it is positioned at the fine plate most top layer of wood is thermoset resin layer, the thermoset resin layer make it that plate surface hardness is high, can effectively suppress the burr that drills, simultaneously because its thermosetting feature, sheet material moisture absorption warpage can be prevented, beneficial to storage and transport.
Description
Technical field
The present invention relates to backing plate field, more particularly to boring backing plates of a kind of PCB and preparation method thereof.
Background technology
Printed circuit board（Abbreviation PCB）Usually require to use backing plate in drilling, that commonly uses currently on the market has phenolic aldehyde tree
Fat plate, wood fine plate, melamine plate and compound backing plate.
The main function of backing plate has：Protect pcb board bottom surface and rig table top, the outlet burr for suppressing pcb board bottom surface, drop
Low temperature of diamond bit and reduction bit wear, cleaning drill point, improve borehole accuracy.With the development of pcb board material, particularly radius-thickness ratio
Easily there is bottom surface layers of copper popping phenomenon, traditional backing plate can not solve the technical difficulty in drilling in larger pcb board material.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of boring backing plates of PCB and its preparation
Method, it is intended to solve existing backing plate can not solve the larger pcb board material of radius-thickness ratio drilling when easily there is bottom surface layers of copper blast hole
The problem of.
Technical scheme is as follows：
A kind of preparation method of the boring backing plates of PCB, wherein, including step：
A, by weight percentage, with 15-25% polyethylene glycol, 8-10% aqueous polyurethanes, 12-17% polyvinyl alcohol, 3-7% acetic acid
Ethene, 0.3-0.5% levelling agents, 0.3-0.6% defoamers and 40-55% water, prepare functional form water-soluble resin；
B, the functional form water-soluble resin and paper are passed through into impregnation technology, functional form water solubility gum dipped paper is made；
C, thermosetting resin and paper are passed through into impregnation technology, thermosetting gum dipped paper is made；
D, first in the fine plate upper and lower surface stack at least functional form water solubility gum dipped paper of wood, then above and below the fine plate of wood
A surface stack at least thermosetting gum dipped paper, compression process is carried out to the fine plate of the wood, obtains the boring backing plates of PCB.
The preparation method of the boring backing plates of described PCB, wherein, the step A is specifically included：
A1, water is added into reactor, be heated to 70-90 DEG C, added polyvinyl alcohol afterwards and stir 1-3.5h；
After temperature is cooled to 25-40 DEG C in A2, question response kettle, polyethylene glycol, aqueous polyurethane, acetic acid second are added into reactor
Alkene, levelling agent and defoamer, functional form water-soluble resin is made after stirring 2-3h.
The preparation method of the boring backing plates of described PCB, wherein, in the impregnation technology in the step B, dipping temperature is
100-120 DEG C, speed 10-16m/min.
The preparation method of the boring backing plates of described PCB, wherein, the spread of the functional form water solubility gum dipped paper is
30-80g/m2。
The preparation method of the boring backing plates of described PCB, wherein, the paper is advanced release liners, titanium white paper, balance
One kind in paper, abrasion-proof paper, art paper or bleached wood pulp paper.
The preparation method of the boring backing plates of described PCB, wherein, the thermosetting resin be phenolic resin, epoxy resin,
One kind in Lauxite or polyurethane resin.
The preparation method of the boring backing plates of described PCB, wherein, in the impregnation technology in the step C, dipping temperature is
130-170 DEG C, speed 15-25m/min.
The preparation method of the boring backing plates of described PCB, wherein, the spread of the thermosetting gum dipped paper is 80-160g/
m2, solubility is 30-40%.
The preparation method of the boring backing plates of described PCB, wherein, in the compression process, press temperature 130-180
DEG C, pressing pressure 2-6Mpa, press time 1-4h.
A kind of boring backing plates of PCB, wherein, prepared using the preparation method of any of the above-described boring backing plates of described PCB
Form.
Beneficial effect：The present invention provides a kind of boring backing plates of PCB and preparation method thereof, and the backing plate is by the fine plate of wood, work(
Energy type water solubility gum dipped paper, thermosetting gum dipped paper are made through high-temperature high-pressure craft；Press close to the fine plate surface of wood for functional form water
Soluble resin layer, drilling temperature can be effectively reduced in boring procedure, promotes drill point chip removal, and then suppress blast hole problem,
What it is positioned at the fine plate most top layer of wood is thermoset resin layer, and the thermoset resin layer make it that plate surface hardness is high, can effectively press down
System drilling burr, simultaneously because its thermosetting feature, can prevent sheet material moisture absorption warpage, beneficial to storage and transport.
Brief description of the drawings
Fig. 1 is a kind of flow chart of the preparation method preferred embodiment of the boring backing plates of PCB of the present invention.
Fig. 2 is a kind of structural representation of the preferred embodiment of the boring backing plates of PCB of the present invention.
Embodiment
The present invention provides a kind of boring backing plates of PCB and preparation method thereof, to make the purpose of the present invention, technical scheme and effect
Fruit is clearer, clear and definite, and the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
Only to explain the present invention, it is not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is a kind of flow chart of the preparation method preferred embodiment of the boring backing plates of PCB of the present invention, such as
Shown in Fig. 1, wherein, including step：
S100, by weight percentage, with 15-25% polyethylene glycol, 8-10% aqueous polyurethanes, 12-17% polyvinyl alcohol, 3-7%
Vinyl acetate, 0.3-0.5% levelling agents, 0.3-0.6% defoamers and 40-55% water, prepare functional form water-soluble resin；
S200, the functional form water-soluble resin and paper passed through into impregnation technology, functional form water solubility gum dipped paper is made；
S300, thermosetting resin and paper passed through into impregnation technology, thermosetting gum dipped paper is made；
S400, first in the fine plate upper and lower surface stack at least functional form water solubility gum dipped paper of wood, then in the fine plate of wood
A upper and lower surface stack at least thermosetting gum dipped paper, compression process is carried out to the fine plate of the wood, obtains the boring pads of PCB
Plate.
Specifically, as the development of pcb board material, the larger pcb board of some radius-thickness ratios are widely used, so
And the larger pcb board of the radius-thickness ratio phenomenon of bottom surface layers of copper blast hole easily occurs in drilling, backing plate of the prior art is simultaneously
Can not effectively solve the technical problem.
To solve the above problems, the invention provides a kind of preparation method of the boring backing plate of pcb board, work(is first prepared respectively
Energy type water solubility gum dipped paper and thermosetting gum dipped paper, then at least respectively it is superimposed a functional form impregnation in the upper and lower surface of the fine plate of wood
Paper, then a few thermosetting gum dipped paper is respectively superimposed in the upper and lower surface of the fine plate of wood, at HTHP
Reason obtains the boring backing plate of pcb board of the present invention.In the boring backing plate of pcb board prepared by the present invention, close to the fine plate surface of wood
Functional form water-soluble resin layer can effectively reduce drilling temperature in boring procedure, promote drill point chip removal, so as to effectively suppress quick-fried
The generation in hole；And the thermoset resin layer positioned at the fine plate most top layer of wood can then lift the hardness of sheet material, so as to effectively suppress to bore
Hole peak, simultaneously because its thermosetting feature, additionally it is possible to effectively sheet material moisture absorption warpage is prevented, beneficial to storage and transport.
Further, in the present invention, the step S100 is specifically included：
S110, water is added into reactor, be heated to 70-90 DEG C, added polyvinyl alcohol afterwards and stir 1-3.5h；
After temperature is cooled to 25-40 DEG C in S120, question response kettle, polyethylene glycol, aqueous polyurethane, acetic acid are added into reactor
Ethene, levelling agent and defoamer, functional form water-soluble resin is made after stirring 2-3h.
Specifically, it is poly- to reach fully dissolving after being first heated to 70-90 DEG C by the water in reactor and stir 1-3.5h
The purpose of vinyl alcohol, after the temperature in question response kettle is cooled to 25-40 DEG C, adds and sequentially add 15-25% polyethylene glycol, 8-
10% aqueous polyurethane, 3-7% vinyl acetates, 0.3-0.5% levelling agents, 0.3-0.6% defoamers, functional form is made after stirring 2-3h
Water-soluble resin.It is preferred that to avoid temperature too high, cause moisture evaporation amount too big, so as to influence the viscosity of resin, amount of solid
Etc. performance indications, after the temperature in the present invention preferably question response kettle is cooled to 30-35 DEG C, the polyethylene glycol, water-based is added
Polyurethane, vinyl acetate, levelling agent and defoamer.
Further, considering based on cost and resin property, the present invention preferably 40-55% water match work(
Energy type water-soluble resin, when the content of water is too high, then the viscosity of resin, solid content, compatibility and functional form are difficult to full
Foot requires；When the content of water is too low, then cause the increase of functional form water-soluble resin cost, while be easily caused resin and solution occur
Layering, the problems such as viscosity is too big.
The functional form water-soluble resin prepared by the above method can effectively reduce drilling temperature, promote drill point chip removal, enter
And reach and suppress blast hole problem.
Further, in step S200 of the present invention, by the functional form water-soluble resin and paper by impregnating
Technique, functional form water solubility gum dipped paper is made；Specifically, the impregnation technology parameter of functional form water solubility gum dipped paper is：Dipping
100-120 DEG C of temperature, speed 10-16m/min, it is 30-80g/m that spread, which is made,2Functional form water solubility gummed paper.Preferably,
The functional form water-soluble resin and paper are passed through impregnation technology by the present invention, are 13m/min in speed, temperature is 110 DEG C
Under the conditions of, spread is made as 50%, the functional form water solubility gum dipped paper of uniformity 1.5%, the resin prepared by the above method
Gum dipped paper performance is preferable.
Specifically, paper selected by the present invention is advanced release liners, titanium white paper, balance paper, abrasion-proof paper, art paper or bleaching wood
Starch one kind in paper；Preferably, the paper is bleached wood pulp paper, because bleached wood pulp paper is a kind of material rich in paper fiber
Material, and fibrous matter can clean out the residue after bit bore, it can effectively reduce axial force suffered by drill point, protection
Drill point, reduce broken needle rate.
Further, in step S300 of the present invention, thermosetting resin and paper is passed through into impregnation technology, heat is made
Solidity gum dipped paper；Specifically, the thermosetting resin is in phenolic resin, epoxy resin, Lauxite or polyurethane resin
One kind；The impregnation technology parameter of thermosetting gum dipped paper is that dipping temperature is 130-170 DEG C, speed 15-25m/min, is made
Glue amount is 80-160g/m2, solubility is 30-40% thermosetting gum dipped paper.
More specifically, dipping temperature and speed are the relations to match, and generally speaking then speed is low for temperature height, and temperature is low
Then speed is high, and when temperature is less than 130 DEG C, then thermosetting resin can not carry out precuring, when temperature is higher than 170 DEG C, then technique system
Journey is difficult to reach, and the defects of solidification is excessive occurs in resin.
Further, when the spread of thermosetting gum dipped paper is less than 80 g/m2When, after presswork, easily there is apparent colour
The problems such as damp dumb light, surface starved, finished product sheet material demoulding difficulty；When the spread of thermosetting gum dipped paper is higher than 160 g/m2When,
Cost of manufacture can then be increased, and in subsequent clients application drilling operating, easily cause broken needle risk.
Further, when the solubility of thermosetting gum dipped paper is less than 30%, dipping paper is too dry, and presswork occurs
Surface card defect；When being higher than 40% of thermosetting gum dipped paper, the problem of paper storage bonds together is impregnated, is unfavorable for storing up
Deposit, and in follow-up compacting, the press time can extend, and increase production cost.
It is high by thermoset resin layer plate surface hardness made from the above method, it can effectively suppress the burr that drills,
Simultaneously because its thermosetting feature, can prevent sheet material moisture absorption warpage, beneficial to storage and transport.
Further, in step S400 of the present invention, first in the fine plate upper and lower surface stack at least work(of wood
Can type water solubility gum dipped paper, then in the fine plate upper and lower surface stack of a wood at least thermosetting gum dipped paper, to the wood
Fine plate carries out compression process, obtains the boring backing plates of PCB.
In a kind of specific embodiment, the present fine plate upper and lower surface stack one of wood opens functional form water solubility impregnation
Paper, then the thermosetting gum dipped paper is opened in the fine plate upper and lower surface stack one of the wood, it is boring by obtaining PCB after compression process
Backing plate.Specifically, the fine plate of wood is high density fiberboard or VHD fiberboard, and its density is 800-1000kg/m3,
Hardness is 65-80 shore D；In the compression process, press temperature is 130-180 DEG C, pressing pressure 2-6Mpa, compacting
Time is 1-4h.The PCB pad surfaces flat smooth and angularity ＜ 1% prepared in the parameter area.
Based on the above method, the present invention also provides a kind of boring backing plates of PCB, wherein, using any of the above-described described PCB
The preparation method of boring backing plate is prepared, as shown in Fig. 2 the boring backing plates of the PCB include thermosetting successively from bottom to up
Property gum dipped paper 10, functional form water solubility gum dipped paper 20, wood fine plate 30, functional form water solubility gum dipped paper 20 and thermosetting gum dipped paper
10。
A kind of preparation method of the boring backing plates of PCB of the present invention is further explained below by specific embodiment
It is bright：
Embodiment 1
A. 49% water is added into reactor, heated up 70 DEG C, stirred 15% polyvinyl alcohol of lower addition, stirring and dissolving 2h, be subsequently cooled to
30℃.Then 20% polyethylene glycol is sequentially added, 10% aqueous polyurethane, 5% vinyl acetate, 0.5% levelling agent, 0.5% defoamer,
Stir 3h；
B. through impregnation technology 110 DEG C, speed 12m/min of temperature, function is made in resin made from step a and bleached wood pulp paper
The water-soluble dipping paper of type, spread 60g/m2；
C. through impregnation technology 150 DEG C, speed 16m/min of temperature, resin impregnating is made in phenolic resin and bleached wood pulp paper
Paper, spread 120g/m2, solubility 35%；
D. the fine plate upper and lower surface stack one of wood is opened into the water-soluble dipping paper of functional form, then phenol is opened in the stack up and down one of this combination
Urea formaldehyde impregnates paper, and this finally is integrally placed at into the lower HTHP of compacting, 160 DEG C of temperature, pressure 4Mpa, time 2h, is made
The apparent flat smooth of sheet material, angularity 0.5%.
Embodiment 2：
A. 49% water is added into reactor, heated up 70 DEG C, stirred 17% polyvinyl alcohol of lower addition, stirring and dissolving 2h, be subsequently cooled to
30℃.Then 20% polyethylene glycol is sequentially added, 8% aqueous polyurethane, 5% vinyl acetate, 0.5% levelling agent, 0.5% defoamer, is stirred
Mix 3h；
B. through impregnation technology 110 DEG C, speed 11m/min of temperature, function is made in resin made from step a and bleached wood pulp paper
The water-soluble dipping paper of type, spread 58g/m2；
C. through impregnation technology 140 DEG C, speed 16m/min of temperature, resin impregnating is made in Lauxite and bleached wood pulp paper
Paper, spread 110g/m2, solubility 38%；
D. the fine plate upper and lower surface stack one of wood is opened into the water-soluble dipping paper of functional form, then urea is opened in the stack up and down one of this combination
Urea formaldehyde impregnates paper, and this finally is integrally placed at into the lower HTHP of compacting, 140 DEG C of temperature, pressure 2Mpa, time 2h, is made
The apparent flat smooth of sheet material, angularity 0.8%.
Embodiment 3：
A. 49.4% water is added into reactor, heated up 80 DEG C, stirred 16% polyvinyl alcohol of lower addition, stirring and dissolving 2h, then cool down
To 30 DEG C.Then 19% polyethylene glycol, 10% aqueous polyurethane, 5% vinyl acetate, 0.3% levelling agent, 0.3% defoaming are sequentially added
Agent, stir 3h；
B. through impregnation technology 110 DEG C, speed 13m/min of temperature, functional form water is made in resin made from step a and balance paper
Dissolubility impregnates paper, spread 55g/m2；
C. 150 DEG C, speed 17m/min of temperature, resin impregnating paper is made through impregnation technology in phenolic resin and balance paper,
Spread 110g/m2, solubility 35%；
D. the fine plate upper and lower surface stack one of wood is opened into the water-soluble dipping paper of functional form, then phenol is opened in the stack up and down one of this combination
Urea formaldehyde impregnates paper, and this finally is integrally placed at into the lower HTHP of compacting, 160 DEG C of temperature, pressure 4Mpa, time 2h, is made
The apparent flat smooth of sheet material, angularity 0.5%.
Embodiment 4：
A. 49.4% water is added into reactor, heated up 80 DEG C, stirred 15% polyvinyl alcohol of lower addition, stirring and dissolving 2h, then cool down
To 30 DEG C.Then 19% polyethylene glycol, 11% aqueous polyurethane, 5% vinyl acetate, 0.3% levelling agent, 0.3% defoaming are sequentially added
Agent, stir 3h；
B. through impregnation technology 120 DEG C, speed 15m/min of temperature, functional form water is made in resin made from step a and balance paper
Dissolubility impregnates paper, spread 50g/m2；
C. through impregnation technology 150 DEG C, speed 15m/min of temperature, resin impregnating is made in phenolic resin and advanced release liners
Paper, spread 120g/m2, solubility 35%；
D. the fine plate upper and lower surface stack one of wood is opened into the water-soluble dipping paper of functional form, then phenol is opened in the stack up and down one of this combination
Urea formaldehyde impregnates paper, and this finally is integrally placed at into the lower HTHP of compacting, 160 DEG C of temperature, pressure 4Mpa, time 2h, is made
The apparent flat smooth of sheet material, angularity 0.5%.
In summary, the present invention provides a kind of boring backing plates of PCB and preparation method thereof, and the backing plate is by the fine plate of wood, work(
Energy type water solubility gum dipped paper, thermosetting gum dipped paper are made through high-temperature high-pressure craft；Press close to the fine plate surface of wood for functional form water
Soluble resin layer, drilling temperature can be effectively reduced in boring procedure, promotes drill point chip removal, and then suppress blast hole problem,
What it is positioned at the fine plate most top layer of wood is thermoset resin layer, and the thermoset resin layer make it that plate surface hardness is high, can effectively press down
System drilling burr, simultaneously because its thermosetting feature, can prevent sheet material moisture absorption warpage, beneficial to storage and transport.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (10)
1. a kind of preparation method of the boring backing plates of PCB, it is characterised in that including step：
A, by weight percentage, with 15-25% polyethylene glycol, 8-10% aqueous polyurethanes, 12-17% polyvinyl alcohol, 3-7% acetic acid
Ethene, 0.3-0.5% levelling agents, 0.3-0.6% defoamers and 40-55% water, prepare functional form water-soluble resin；
B, the functional form water-soluble resin and paper are passed through into impregnation technology, functional form water solubility gum dipped paper is made；
C, thermosetting resin and paper are passed through into impregnation technology, thermosetting gum dipped paper is made；
D, first in the fine plate upper and lower surface stack at least functional form water solubility gum dipped paper of wood, then above and below the fine plate of wood
A surface stack at least thermosetting gum dipped paper, compression process is carried out to the fine plate of the wood, obtains the boring backing plates of PCB.
2. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that the step A is specifically wrapped
Include：
A1, water is added into reactor, be heated to 70-90 DEG C, added polyvinyl alcohol afterwards and stir 1-3.5h；
After temperature is cooled to 25-40 DEG C in A2, question response kettle, polyethylene glycol, aqueous polyurethane, acetic acid second are added into reactor
Alkene, levelling agent and defoamer, functional form water-soluble resin is made after stirring 2-3h.
3. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that the dipping in the step B
In technique, dipping temperature is 100-120 DEG C, speed 10-16m/min.
4. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that the functional form is water-soluble
The spread of gum dipped paper is 30-80g/m2。
5. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that the paper for it is advanced from
One kind in type paper, titanium white paper, balance paper, abrasion-proof paper, art paper or bleached wood pulp paper.
6. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that the thermosetting resin is
One kind in phenolic resin, epoxy resin, Lauxite or polyurethane resin.
7. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that the dipping in the step C
In technique, dipping temperature is 130-170 DEG C, speed 15-25m/min.
8. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that the thermosetting gum dipped paper
Spread be 80-160g/m2, solubility is 30-40%.
9. the preparation method of the boring backing plates of PCB according to claim 1, it is characterised in that in the compression process, pressure
Temperature processed is 130-180 DEG C, pressing pressure 2-6Mpa, press time 1-4h.
10. a kind of boring backing plates of PCB, it is characterised in that using the boring backing plates of PCB as described in claim 1-9 is any
Preparation method be prepared.
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| CN201710828624.6A CN107650465A (en) | 2017-09-14 | 2017-09-14 | A kind of boring backing plates of PCB and preparation method thereof |
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| CN201710828624.6A CN107650465A (en) | 2017-09-14 | 2017-09-14 | A kind of boring backing plates of PCB and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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