CN107649957A - A kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus and the technique for grinding of silicon plate - Google Patents
A kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus and the technique for grinding of silicon plate Download PDFInfo
- Publication number
- CN107649957A CN107649957A CN201710855178.8A CN201710855178A CN107649957A CN 107649957 A CN107649957 A CN 107649957A CN 201710855178 A CN201710855178 A CN 201710855178A CN 107649957 A CN107649957 A CN 107649957A
- Authority
- CN
- China
- Prior art keywords
- silicon
- silicon plate
- plate
- sanding apparatus
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a kind of silicon edges of boards of photovoltaic electroplax along sanding apparatus, including base, it is centrally located on the base to be provided with erecting bed, multiple silicon board clamping mechanisms are installed on the erecting bed, the silicon plate workpiece polishing mechanism being driven by the cylinder is provided with the base positioned at the both sides of erecting bed, the silicon plate workpiece polishing mechanism is connected with the slide on base.Silicon plate is placed in clamp system by the present invention when using, and the both ends of clamping plate is exposed to outside clamp system, and silicon plate workpiece polishing mechanism is slidably reciprocated under the driving of cylinder along chute, and silicon plate is polished.The present invention is clamped by the way that silicon plate is placed in silicon board clamping mechanism, then the silicon plate workpiece polishing mechanism by being arranged on silicon board clamping mechanism both sides carries out grinding efficiency height of polishing to silicon plate both ends simultaneously, and has multiple silicon board clamping mechanisms, and can polish polylith silicon plate simultaneously.
Description
Technical field
The present invention relates to a kind of silicon edges of boards of photovoltaic electroplax along sanding apparatus and the technique for grinding of silicon plate, belong to photovoltaic electroplax
Processing technique field.
Background technology
Solar energy is increasingly becoming the main conversion art of the energy at this stage, and the appearance of new energy improves the output of electricity
Amount, while and can enough reduces the influence to environment, but because the technical requirements of solar power generation are higher, especially in solar energy
Photovoltaic electroplax absorbs to solar energy, but due to solar energy electroplax silicon plate processing when, the especially meeting when being cut to silicon plate
Occur to edge burr, cause edge occur contacting when connecting it is not compact, it is less efficient when causing photovoltaic generation, simultaneously because
Staff can be caused damage along burr, safety coefficient is relatively low.Therefore, it is proposed that a kind of silicon edges of boards edge of photovoltaic electroplax is beaten
The technique for grinding of mill apparatus and silicon plate.
The content of the invention
It is a primary object of the present invention to provide a kind of polishing work of silicon edges of boards of photovoltaic electroplax along sanding apparatus and silicon plate
Skill, clamped by the way that silicon plate is placed in silicon board clamping mechanism, then the silicon plate by being arranged on silicon board clamping mechanism both sides is polished
Mechanism carries out grinding efficiency height of polishing to silicon plate both ends simultaneously, and has multiple silicon board clamping mechanisms, and can polish polylith silicon simultaneously
Plate, effectively can solve the problems, such as in background technology.
To achieve the above object, the technical scheme taken of the present invention is：
A kind of silicon edges of boards of photovoltaic electroplax are centrally located on the base to be provided with installation along sanding apparatus, including base
Platform, multiple silicon board clamping mechanisms are installed on the erecting bed, is provided with positioned at the both sides of erecting bed on the base and is driven by cylinder
Dynamic silicon plate workpiece polishing mechanism, the silicon plate workpiece polishing mechanism are connected with the slide on base.
Further, the silicon board clamping mechanism includes shell, and silicon plate is offered in the shell and accommodates storehouse, the shell
Both ends are hinged with silicon board clamping plate.
Further, the bottom of the silicon board clamping plate is provided with one layer of flannelette napped fabric layer.
Further, the silicon plate workpiece polishing mechanism includes the guide shaft being arranged in chute, and polishing is socketed with the guide shaft
Disk, the polishing pad side wall are provided with the locking device being connected with guide shaft.
Further, the both ends of the guide shaft are provided with pillar, and the bottom of the pillar is provided with chimeric be arranged in chute
Sliding block.
Further, the polishing pad includes installing plate, and grinding disc is provided with the installing plate.
Further, the locking device includes the sleeve being socketed on guide shaft, and the both sides of the sleeve are threaded with
Trip bolt.
The present invention also provides a kind of silicon plate technique for grinding of photovoltaic electroplax, comprises the following steps：
1) the silicon plate cut is wrapped up into upper protective film, and the both ends of silicon plate are exposed in outside；
2) the silicon plate that step 1) is enclosed with to diaphragm is placed into the silicon board clamping mechanism of sanding apparatus；
3) sanding apparatus is adjusted, makes sanding apparatus in running order, the both ends of silicon plate are polished；
4) after the completion of polishing, silicon plate is taken out from silicon board clamping mechanism；
5) diaphragm being wrapped on silicon plate is removed and silicon plate is placed in next process.
Further, operating personnel need to take soft gloves and operated during silicon plate is polished.
Silicon plate is placed in clamp system by the present invention when using, and makes the both ends of clamping plate outside clamp system,
Silicon plate workpiece polishing mechanism is slidably reciprocated under the driving of cylinder along chute, and silicon plate is polished.The present invention is by the way that silicon plate is put
Put and clamped in silicon board clamping mechanism, then by being arranged on the silicon plate workpiece polishing mechanism of silicon board clamping mechanism both sides simultaneously to silicon plate two
End carries out grinding efficiency height of polishing, and has multiple silicon board clamping mechanisms, and can polish polylith silicon plate simultaneously.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the present invention
Fig. 2 is the structure enlargement diagram at A in Fig. 1 of the present invention.
In figure：1st, base；2nd, shell；3rd, silicon plate；4th, chute；5th, grinding disc；6th, sleeve；7th, guide shaft；8th, cylinder；9th, prop up
Post；10th, erecting bed；11st, sliding block；12nd, trip bolt；13rd, installing plate；14th, silicon board clamping plate；15th, silicon plate accommodates storehouse；16th, suede
Layer of cloth.
Embodiment
To be easy to understand the technical means, the inventive features, the objects and the advantages of the present invention, with reference to
Embodiment, the present invention is expanded on further.
As illustrated in fig. 1 and 2, the present embodiment provides a kind of silicon edges of boards of photovoltaic electroplax along sanding apparatus, including base, described
It is centrally located on base to be provided with erecting bed, multiple silicon board clamping mechanisms are installed on the erecting bed, are located on the base
The both sides of erecting bed are provided with the silicon plate workpiece polishing mechanism being driven by the cylinder, and the silicon plate workpiece polishing mechanism connects with the slide on base
Connect.
Silicon plate is placed in clamp system, and makes the both ends of clamping plate outside clamp system, silicon plate workpiece polishing mechanism
Slidably reciprocated under the driving of cylinder along chute, silicon plate is polished.
Further, the silicon board clamping mechanism includes shell, and silicon plate is offered in the shell and accommodates storehouse, the shell
Both ends are hinged with silicon board clamping plate.
Silicon plate is placed on into silicon plate to accommodate in storehouse, then puts down silicon board clamping plate by silicon board clamping, avoids silicon plate in polishing
During be moved.
Further, the bottom of the silicon board clamping plate is provided with one layer of flannelette napped fabric layer.
Flannelette napped fabric layer can prevent silicon board clamping plate by silicon plate surface scratch.
Further, the silicon plate workpiece polishing mechanism includes the guide shaft being arranged in chute, and polishing is socketed with the guide shaft
Disk, the polishing pad side wall are provided with the locking device being connected with guide shaft.
When silicon plate is placed in silicon plate receiving storehouse, polishing pad is moved away from silicon board clamping mechanism, silicon plate places
Afterwards, by polishing pad move to the end in contact of silicon plate two, polishing pad is fixed by locking device.
Further, the both ends of the guide shaft are provided with pillar, and the bottom of the pillar is provided with chimeric be arranged in chute
Sliding block.
It is easy to guide shaft to be slided in chute.
Further, the polishing pad includes installing plate, and grinding disc is provided with the installing plate.
Further, the locking device includes the sleeve being socketed on guide shaft, and the both sides of the sleeve are threaded with
Trip bolt.
Polishing pad is fixed on guide shaft by trip bolt, avoids polishing pad from being moved during polishing along guide shaft
It is dynamic.
The present invention also provides a kind of silicon plate technique for grinding of photovoltaic electroplax, comprises the following steps：
1) the silicon plate cut is wrapped up into upper protective film, and the both ends of silicon plate are exposed in outside；
2) the silicon plate that step 1) is enclosed with to diaphragm is placed into the silicon board clamping mechanism of sanding apparatus；
3) sanding apparatus is adjusted, makes sanding apparatus in running order, the both ends of silicon plate are polished；
4) after the completion of polishing, silicon plate is taken out from silicon board clamping mechanism；
5) diaphragm being wrapped on silicon plate is removed and silicon plate is placed in next process.
Silicon plate is wrapped up into upper protective film before polishing, avoids the silicon plate surface during polishing from being ground by silicon board clamping mechanism
Damage.
Further, operating personnel need to take soft gloves and operated during silicon plate is polished.
Take soft gloves to be operated, can not only avoid hand from being scratched, it can also be ensured that silicon plate surface is not damaged.
Some one exemplary embodiments of the present invention are only described by way of explanation above, undoubtedly, for ability
The those of ordinary skill in domain, without departing from the spirit and scope of the present invention, can be with a variety of modes to institute
The embodiment of description is modified.Therefore, above-mentioned accompanying drawing and description are inherently illustrative, should not be construed as to the present invention
The limitation of claims.
Claims (9)
1. a kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus, including base, it is characterised in that：It is centrally located on the base
Provided with erecting bed, multiple silicon board clamping mechanisms are installed on the erecting bed, are provided with the base positioned at the both sides of erecting bed
The silicon plate workpiece polishing mechanism being driven by the cylinder, the silicon plate workpiece polishing mechanism are connected with the slide on base.
2. a kind of silicon edges of boards of photovoltaic electroplax according to claim 1 are along sanding apparatus, it is characterised in that：The silicon plate folder
Tight mechanism includes shell, and silicon plate is offered in the shell and accommodates storehouse, the shell both ends are hinged with silicon board clamping plate.
3. a kind of silicon edges of boards of photovoltaic electroplax according to claim 2 are along sanding apparatus, it is characterised in that：The silicon plate folder
The bottom of tight plate is provided with one layer of flannelette napped fabric layer.
4. a kind of silicon edges of boards of photovoltaic electroplax according to claim 1 are along sanding apparatus, it is characterised in that：The silicon plate is beaten
Grinding machine structure includes the guide shaft being arranged in chute, is socketed with polishing pad on the guide shaft, the polishing pad side wall is provided with and guide shaft
Connected locking device.
5. a kind of silicon edges of boards of photovoltaic electroplax according to claim 4 are along sanding apparatus, it is characterised in that：The guide shaft
Both ends are provided with pillar, and the bottom of the pillar is provided with the chimeric sliding block in chute.
6. a kind of silicon edges of boards of photovoltaic electroplax according to claim 4 are along sanding apparatus, it is characterised in that：The polishing pad
Including installing plate, grinding disc is installed on the installing plate.
7. a kind of silicon edges of boards of photovoltaic electroplax according to claim 4 are along sanding apparatus, it is characterised in that：The locking dress
The sleeve including being socketed on guide shaft is put, the both sides of the sleeve are threaded with trip bolt.
8. the silicon plate technique for grinding of a kind of photovoltaic electroplax, it is characterised in that comprise the following steps：
1) the silicon plate cut is wrapped up into upper protective film, and the both ends of silicon plate are exposed in outside；
2) the silicon plate that step 1) is enclosed with to diaphragm is placed into the silicon board clamping mechanism of sanding apparatus；
3) sanding apparatus is adjusted, makes sanding apparatus in running order, the both ends of silicon plate are polished；
4) after the completion of polishing, silicon plate is taken out from silicon board clamping mechanism；
5) diaphragm being wrapped on silicon plate is removed and silicon plate is placed in next process.
A kind of 9. silicon plate technique for grinding of photovoltaic electroplax according to claim 8, it is characterised in that：In the mistake of silicon plate polishing
Operating personnel, which need to take soft gloves, in journey is operated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710855178.8A CN107649957A (en) | 2017-09-20 | 2017-09-20 | A kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus and the technique for grinding of silicon plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710855178.8A CN107649957A (en) | 2017-09-20 | 2017-09-20 | A kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus and the technique for grinding of silicon plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107649957A true CN107649957A (en) | 2018-02-02 |
Family
ID=61130098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710855178.8A Pending CN107649957A (en) | 2017-09-20 | 2017-09-20 | A kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus and the technique for grinding of silicon plate |
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| Country | Link |
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| CN (1) | CN107649957A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109352445A (en) * | 2018-12-05 | 2019-02-19 | 滁州市云米工业设计有限公司 | A kind of grinding device and its working method for electronic product interior panels |
| CN112692695A (en) * | 2020-12-24 | 2021-04-23 | 芜湖恒坤汽车部件有限公司 | Multi-surface polishing machine for copper bar modification |
| CN113182987A (en) * | 2021-05-13 | 2021-07-30 | 彩虹（合肥）液晶玻璃有限公司 | Glass substrate grinding device |
| CN114800214A (en) * | 2021-01-19 | 2022-07-29 | 富鼎电子科技(嘉善)有限公司 | Polishing device |
| CN115091322A (en) * | 2022-08-01 | 2022-09-23 | 四川海英电子科技有限公司 | Equipment and method for precisely polishing outer end face of HDI multilayer circuit board |
| CN115284112A (en) * | 2022-07-08 | 2022-11-04 | 昆明华城兴建材有限公司 | Processing device of fiber cement explosion-proof plate |
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| JPH08309649A (en) * | 1995-05-12 | 1996-11-26 | Nisshin Kogyo Kk | Carrier method and carrier device for workpiece in double head surface grinder |
| CN102351409A (en) * | 2011-07-15 | 2012-02-15 | 佛山市三求电子材料有限公司 | Processing technology of glass protection |
| CN203622118U (en) * | 2013-11-11 | 2014-06-04 | 苏州科联精密机械有限公司 | Double-face grinding device for valve core of automotive oil pump |
| CN104959898A (en) * | 2015-06-23 | 2015-10-07 | 孟如苗 | Large efficient cutting machine |
| CN105215840A (en) * | 2015-08-31 | 2016-01-06 | 上海华虹宏力半导体制造有限公司 | A kind of thining method of silicon through hole |
| CN106312742A (en) * | 2016-11-10 | 2017-01-11 | 天津南玻节能玻璃有限公司 | Flat glass grinding device |
| CN205904845U (en) * | 2016-06-30 | 2017-01-25 | 江西大杰新能源技术有限公司 | Reciprocating type silico briquette burnishing machine |
| CN206302373U (en) * | 2016-11-30 | 2017-07-04 | 安徽振兴光伏新能源有限公司 | A kind of fixing device for installing of photovoltaic electroplax |
| CN207155443U (en) * | 2017-09-20 | 2018-03-30 | 安徽振兴光伏新能源有限公司 | A kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus |
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2017
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Patent Citations (9)
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| JPH08309649A (en) * | 1995-05-12 | 1996-11-26 | Nisshin Kogyo Kk | Carrier method and carrier device for workpiece in double head surface grinder |
| CN102351409A (en) * | 2011-07-15 | 2012-02-15 | 佛山市三求电子材料有限公司 | Processing technology of glass protection |
| CN203622118U (en) * | 2013-11-11 | 2014-06-04 | 苏州科联精密机械有限公司 | Double-face grinding device for valve core of automotive oil pump |
| CN104959898A (en) * | 2015-06-23 | 2015-10-07 | 孟如苗 | Large efficient cutting machine |
| CN105215840A (en) * | 2015-08-31 | 2016-01-06 | 上海华虹宏力半导体制造有限公司 | A kind of thining method of silicon through hole |
| CN205904845U (en) * | 2016-06-30 | 2017-01-25 | 江西大杰新能源技术有限公司 | Reciprocating type silico briquette burnishing machine |
| CN106312742A (en) * | 2016-11-10 | 2017-01-11 | 天津南玻节能玻璃有限公司 | Flat glass grinding device |
| CN206302373U (en) * | 2016-11-30 | 2017-07-04 | 安徽振兴光伏新能源有限公司 | A kind of fixing device for installing of photovoltaic electroplax |
| CN207155443U (en) * | 2017-09-20 | 2018-03-30 | 安徽振兴光伏新能源有限公司 | A kind of silicon edges of boards of photovoltaic electroplax are along sanding apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109352445A (en) * | 2018-12-05 | 2019-02-19 | 滁州市云米工业设计有限公司 | A kind of grinding device and its working method for electronic product interior panels |
| CN112692695A (en) * | 2020-12-24 | 2021-04-23 | 芜湖恒坤汽车部件有限公司 | Multi-surface polishing machine for copper bar modification |
| CN114800214A (en) * | 2021-01-19 | 2022-07-29 | 富鼎电子科技(嘉善)有限公司 | Polishing device |
| CN113182987A (en) * | 2021-05-13 | 2021-07-30 | 彩虹（合肥）液晶玻璃有限公司 | Glass substrate grinding device |
| CN115284112A (en) * | 2022-07-08 | 2022-11-04 | 昆明华城兴建材有限公司 | Processing device of fiber cement explosion-proof plate |
| CN115091322A (en) * | 2022-08-01 | 2022-09-23 | 四川海英电子科技有限公司 | Equipment and method for precisely polishing outer end face of HDI multilayer circuit board |
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Application publication date: 20180202 |
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