CN107644717A - A kind of preparation method and application of anti-oxidant bonding brass wire - Google Patents
A kind of preparation method and application of anti-oxidant bonding brass wire Download PDFInfo
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- CN107644717A CN107644717A CN201710840045.3A CN201710840045A CN107644717A CN 107644717 A CN107644717 A CN 107644717A CN 201710840045 A CN201710840045 A CN 201710840045A CN 107644717 A CN107644717 A CN 107644717A
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- copper
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- 229910001369 Brass Inorganic materials 0.000 title claims abstract description 50
- 239000010951 brass Substances 0.000 title claims abstract description 50
- 239000003963 antioxidant agent Substances 0.000 title claims abstract description 19
- 230000003078 antioxidant effect Effects 0.000 title claims abstract description 19
- 235000006708 antioxidants Nutrition 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 168
- 229910052802 copper Inorganic materials 0.000 claims abstract description 117
- 239000010949 copper Substances 0.000 claims abstract description 117
- 239000007788 liquid Substances 0.000 claims abstract description 107
- 238000002156 mixing Methods 0.000 claims abstract description 55
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 29
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 28
- 239000011733 molybdenum Substances 0.000 claims abstract description 27
- 238000013019 agitation Methods 0.000 claims abstract description 24
- 229910052582 BN Inorganic materials 0.000 claims abstract description 22
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 22
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 20
- 239000005011 phenolic resin Substances 0.000 claims abstract description 20
- 238000003490 calendering Methods 0.000 claims abstract description 14
- 238000002425 crystallisation Methods 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 14
- 239000011261 inert gas Substances 0.000 claims abstract description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 62
- 229910052757 nitrogen Inorganic materials 0.000 claims description 31
- 239000007789 gas Substances 0.000 claims description 23
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- VZOPRCCTKLAGPN-ZFJVMAEJSA-L potassium;sodium;(2r,3r)-2,3-dihydroxybutanedioate;tetrahydrate Chemical compound O.O.O.O.[Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O VZOPRCCTKLAGPN-ZFJVMAEJSA-L 0.000 claims description 12
- 229940074446 sodium potassium tartrate tetrahydrate Drugs 0.000 claims description 12
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 claims description 11
- 239000001263 FEMA 3042 Substances 0.000 claims description 11
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 claims description 11
- 238000003723 Smelting Methods 0.000 claims description 11
- 239000000498 cooling water Substances 0.000 claims description 11
- 230000008025 crystallization Effects 0.000 claims description 11
- 229920000058 polyacrylate Polymers 0.000 claims description 11
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 claims description 11
- 229940033123 tannic acid Drugs 0.000 claims description 11
- 235000015523 tannic acid Nutrition 0.000 claims description 11
- 229920002258 tannic acid Polymers 0.000 claims description 11
- 238000001291 vacuum drying Methods 0.000 claims description 11
- 229940070721 polyacrylate Drugs 0.000 claims description 10
- 229910000337 indium(III) sulfate Inorganic materials 0.000 claims description 3
- XGCKLPDYTQRDTR-UHFFFAOYSA-H indium(iii) sulfate Chemical compound [In+3].[In+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O XGCKLPDYTQRDTR-UHFFFAOYSA-H 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 7
- 230000003026 anti-oxygenic effect Effects 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 10
- 229910052738 indium Inorganic materials 0.000 description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 206010013786 Dry skin Diseases 0.000 description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 8
- 239000005864 Sulphur Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910001018 Cast iron Inorganic materials 0.000 description 3
- 229910000072 bismuth hydride Inorganic materials 0.000 description 3
- BPBOBPIKWGUSQG-UHFFFAOYSA-N bismuthane Chemical compound [BiH3] BPBOBPIKWGUSQG-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 239000011819 refractory material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910001296 Malleable iron Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000002783 friction material Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910001060 Gray iron Inorganic materials 0.000 description 1
- 108010038629 Molybdoferredoxin Proteins 0.000 description 1
- 235000003283 Pachira macrocarpa Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 241001083492 Trapa Species 0.000 description 1
- 235000014364 Trapa natans Nutrition 0.000 description 1
- HBELESVMOSDEOV-UHFFFAOYSA-N [Fe].[Mo] Chemical compound [Fe].[Mo] HBELESVMOSDEOV-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007866 anti-wear additive Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 229910000238 buergerite Inorganic materials 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- IQPNAANSBPBGFQ-UHFFFAOYSA-N luteolin Chemical compound C=1C(O)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(O)C(O)=C1 IQPNAANSBPBGFQ-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000009165 saligot Nutrition 0.000 description 1
- 150000004771 selenides Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
The invention discloses a kind of preparation method and application of anti-oxidant bonding brass wire; the preparation method of the anti-oxidant bonding brass wire obtains copper liquid after first cathode copper is melted; then molybdenum, bismuth, boron nitride, phenolic resin are added in copper liquid under the protection of inert gas, then mixing copper liquid is obtained through magnetic agitation.Then mixing copper liquid is obtained through crystallisation by cooling to be bonded copper ingot, drawing obtains the bonding brass wire that diameter meets to require repeatedly after calendering, and anticorrosive liquid finally is added dropwise on copper wire surface under inert gas shielding, finished product is obtained after drying.The anti-oxidant bonding brass wire being prepared using this method has good antioxygenic property, mechanical strength and decay resistance, and cost is relatively low, disclosure satisfy that the requirement of industry, has a good application prospect.Meanwhile the application the invention also discloses the copper wire obtained by this method in integrated circuits.
Description
Technical field
The present invention relates to metal material processing technical field, the preparation method of more particularly to a kind of anti-oxidant bonding brass wire and
Using.
Background technology
New research and development material of the bonding brass wire as microelectronics industry, with its excellent mechanical property, electric property and low
Cost factor, bonding gold wire has successfully been substituted applied in road encapsulation after IC with IC package bonding technology technology and equipment
Improvement, copper wire apply from low-end product such as DIP, SOP to middle and high end QFP, QFN, multilayer wire, small pitch pad product scope expand
Exhibition.Because the performance requirement of encapsulation procedure para-linkage copper wire steps up, copper wire manufacturer is promoted to copper wire processing performance to becoming
The development of spun gold processing performance is bordering on, turns into the new material for substituting spun gold encapsulation.But due to itself in the application of current copper cash
Easily oxidation, bonding technology is immature etc., and reason, the application in lsi package are restricted, pass through micro- conjunction
It is more effective method that aurification, which improves bonding brass wire performance,.
Molybdenum is silvery white non-ferrous metal, and molybdenum atom radius is 0.14nm, atomic volume 235.5px/mol, and ligancy 8 is brilliant
Body is Az type body-centered cubic crystallographic systems, and space group is Oh (lm3m).Alloy addition of the molybdenum as iron, helps to form complete pearly-lustre
The matrix of body, the intensity and toughness of cast iron can be improved, improve the uniformity of heavy castings tissue, heat treating castings can also be improved
Hardenability.The tool of grey cast-iron containing molybdenum has good wearability, and can make brake wheel and brake block of heavy vehicle etc..Molybdenum is mainly used in
Steel and iron industry, major part therein are to be smelted into molybdenum-iron to be directly used in steel-making or cast iron, small part after industrial molybdenum oxide briquetting
It is used further to make steel after molybdenum foil molybdenum foil.Molybdenum content in low-alloy steel is not more than 1%, but the consumption of this respect accounts for molybdenum and always disappeared
50% or so of the amount of expense.Molybdenum is added in stainless steel, the corrosion resistance of steel can be improved.Molybdenum is added in cast iron, the strong of iron can be improved
Degree and anti-wear performance.Nickel based super alloy containing molybdenum 18% has fusing point height, density low and the characteristics such as coefficient of thermal expansion is small, for manufacturing
The various high temperature resistant components of aerospace.Metal molybdenum obtains extensively in terms of the electronic devices such as electron tube, transistor and rectifier
General application.
Bismuth is metal of the silvery white to pink, and matter is crisp easily to be crushed, and the chemical property of bismuth is relatively stable.Bismuth in nature with
The form of free metal and mineral is present.Mineral have bismuthine, bismite etc..Bismuth metal aoxidizes two after calcining by mineral into three
Bismuth, then heat-treat and obtain altogether with carbon, it can use pyro-refining and electrorefining that high purity bismuth is made.Pure bismuth is soft metal, no
Property is crisp when pure.It is stable under normal temperature.Main ore is bismuthine (Bi2S3) and reddish brown bismuth stone (Bi2O5).Liquid bismuth has expansion when solidifying
Phenomenon.The conduction and thermal conductivity of bismuth are all poor.The selenides and tellurides of bismuth have semiconductor property.Bismuth is mainly for the manufacture of easy
Fusion gold, the alloy of 47~262 DEG C of melting range, the most commonly metal such as the same lead of bismuth, tin, antimony, indium composition, is filled for fire-fighting
Put, the flame-arrester vent plug of automatic water sprayer, boiler.Add people's trace bismuth in steel, the processing characteristics of steel can be improved, malleable cast iron adds micro
Bismuth, malleable cast iron can be made to possess the performance of similar stainless steel.
Boron nitride is the crystal being made up of nitrogen-atoms and boron atom.The boron and 56.4% that chemical composition is 43.6%
Nitrogen, there are four kinds of different variants：Hexagonal boron nitride (HBN), water chestnut side's boron nitride (RBN), cubic boron nitride (CBN) and buergerite
Boron nitride (WBN).Boron nitride has chemical resistance of concrete property, not by inorganic acid and water erosion.Boron nitrogen key is broken in hot concentrated alkali
Open.More than 1200 DEG C start to aoxidize in atmosphere.Fusing point starts to distil when being 3000 DEG C, slightly less than 3000 DEG C.The side of boron nitride six
Crystallographic system crystallizes, most commonly graphite lattice, also has amorphous variant, in addition to hexagonal structure, boron carbide also has other crystal formations.
Its application mainly has：(1) lubricant of the releasing agent of metal forming and metal wire-drawing；(2) the special electrolysis of the condition of high temperature, resistance
Material；(3) high temperature solid lubricant, antiwear additive is extruded, produces the additive of ceramic composite, refractory material and antioxygen
Change the occasion of additive, especially resist melt metal erosion, heat enhancing additive, resistant to elevated temperatures insulating materials；(4) heat of transistor
Seal the additive of the polymer such as drier and plastic resin；(5) be pressed into variously-shaped boron nitride product, can be used as high temperature,
High pressure, insulation, thermal component.
Phenolic resin is also bakelite, also known as phenolic moulding powder.There is particle, powdered.Weak acid resistant and weak base, meet strong acid and occur to divide
Solution, meet highly basic and corrode.It is not soluble in water, it is dissolved in the organic solvents such as acetone, alcohol.It is high that phenolic resin is often applied to some
Warm field, such as refractory material, friction material, binding agent and casting industry.One important application of phenolic resin is exactly conduct
Binding agent.Phenolic resin be it is a kind of multi-functional, with various organic and inorganic filler can be compatible material.Design is correct
Phenolic resin, wetting speed is especially fast.And can be grinding tool, refractory material, friction material and phenolic moulding powder after cross-linking
Mechanical strength required for providing, heat resistance and electrical property.
Based on bonding brass wire performance this research direction is improved by microalloying at present, a kind of new bonded copper is developed
Silk is to strengthen its inoxidizability, so as to promote the large-scale application of bonding brass wire to be in integrated circuits just particularly important.
The content of the invention
In order to solve the above technical problems, the present invention provides a kind of preparation method of anti-oxidant bonding brass wire, the anti-oxidant key
The preparation method of conjunction copper wire obtains copper liquid after first cathode copper is melted, then by molybdenum, bismuth, nitridation under the protection of inert gas
Boron, phenolic resin are added in copper liquid, then obtain mixing copper liquid through magnetic agitation.Then mixing copper liquid is obtained through crystallisation by cooling
Be bonded copper ingot, after calendering repeatedly drawing obtain diameter meet require bonding brass wire, finally under inert gas shielding
Anticorrosive liquid is added dropwise in copper wire surface, and finished product is obtained after drying.The anti-oxidant bonding brass wire being prepared using this method has good
Good antioxygenic property, mechanical strength and decay resistance, and cost is relatively low, disclosure satisfy that the requirement of industry, has good
Application prospect.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of preparation method of anti-oxidant bonding brass wire, comprises the following steps：
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050~1080 DEG C, is incubated to cathode copper after being completely melt and obtains
To copper liquid, then to being passed through inert gas in copper liquid, while add the molybdenum for accounting for copper liquid quality 6wt%, 3.5wt% bismuth,
1.8wt% boron nitride, 0.5wt% phenolic resin, 3150~3180 DEG C are risen to after the completion of addition by furnace temperature immediately, are being continued
Magnetic agitation is carried out in the case of being passed through inert gas, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire is passed through in inert gas according to 2.5~3.5m/s speed, while with 3ml/min's
Anticorrosive liquid is uniformly added dropwise to copper wire for speed, and finished product is obtained after drying.
Preferably, in the step (1) and step (4), inert gas is used as nitrogen, and the flow of gas is 175L/h.
Preferably, in the step (1), the speed of magnetic agitation is 350r/min, mixing time 45min.
Preferably, in the step (4), anticorrosive liquid be polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, indium sulfate with
7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%.
Preferably, in the step (4), drying process is specifically in 70 DEG C of dry 12h in vacuum drying chamber.
It is a further object to provide the application of the copper wire obtained by this preparation method in integrated circuits.
Compared with prior art, its advantage is the present invention：
(1) molybdenum, bismuth, boron nitride, phenolic resin are added in copper liquid so as to which bonding brass wire be prepared by the present invention, pass through
Caused synergy between molybdenum, bismuth, boron nitride, phenolic resin and copper, the inoxidizability of copper wire itself can be greatly improved
Can, while also improve the mechanical strength of copper wire.
(2) present invention using polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, indium sulfate as raw material carry out proportioning be prepared into it is anti-
Corrosive liquid, through applying behind bonding brass wire surface, anticorrosion ability can be persistently played, substantially increases copper wire product
Service life.
(3) technique used in the preparation method of anti-oxidant bonding brass wire of the invention is simple, is used suitable for heavy industrialization,
It is practical.
Embodiment
The technical scheme of invention is described in detail with reference to specific embodiment.
Embodiment 1
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
3.5wt% bismuth, 1.8wt% boron nitride, 0.5wt% phenolic resin, 3150 DEG C are risen to after the completion of addition by furnace temperature immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 2.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h.
Embodiment 2
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
3.5wt% bismuth, 1.8wt% boron nitride, 0.5wt% phenolic resin, 3180 DEG C are risen to after the completion of addition by furnace temperature immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 3.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h..
Comparative example 1
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 3.5wt% bismuth,
1.8wt% boron nitride, 0.5wt% phenolic resin, 3150 DEG C are risen to after the completion of addition by furnace temperature immediately, are being continually fed into nitrogen
Magnetic agitation is carried out in the case of gas, the speed of magnetic agitation is 350r/min, mixing time 45min, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 2.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h.
Comparative example 2
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
1.8wt% boron nitride, 0.5wt% phenolic resin, 3150 DEG C are risen to after the completion of addition by furnace temperature immediately, are being continually fed into nitrogen
Magnetic agitation is carried out in the case of gas, the speed of magnetic agitation is 350r/min, mixing time 45min, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 3.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h.
Comparative example 3
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
3.5wt% bismuth, 0.5wt% phenolic resin, 3180 DEG C are risen to after the completion of addition by furnace temperature immediately, are being continually fed into nitrogen
In the case of carry out magnetic agitation, the speed of magnetic agitation is 350r/min, mixing time 45min, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 3.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h.
Comparative example 4
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
3.5wt% bismuth, 1.8wt% boron nitride, 3180 DEG C are risen to after the completion of addition by furnace temperature immediately, are being continually fed into the feelings of nitrogen
Magnetic agitation is carried out under condition, the speed of magnetic agitation is 350r/min, mixing time 45min, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 3.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h.
Comparative example 5
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
3.5wt% bismuth, 1.8wt% boron nitride, 0.5wt% phenolic resin, 3150 DEG C are risen to after the completion of addition by furnace temperature immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 2.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polyacrylate, citric acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h.
Comparative example 6
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
3.5wt% bismuth, 1.8wt% boron nitride, 0.5wt% phenolic resin, 3180 DEG C are risen to after the completion of addition by furnace temperature immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 3.5m/s speed, the flow of gas is 175L/h, while with
Anticorrosive liquid is uniformly added dropwise to copper wire for 3ml/min speed, and anticorrosive liquid is polytetrafluoroethylene (PTFE), tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with 7:4:3:1 weight is than the manufactured aqueous solution after mixing, concentration 0.5%, in 70 DEG C of dryings in vacuum drying chamber
Finished product is obtained after 12h.
Comparative example 7
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same add account for copper liquid quality 6wt% molybdenum,
3.5wt% bismuth, 1.8wt% boron nitride, 0.5wt% phenolic resin, 3180 DEG C are risen to after the completion of addition by furnace temperature immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by guiding gutter, then entered using cooling water
Row cooling, makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, work as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to 3.5m/s speed, the flow of gas is 175L/h, while with
3ml/min speed is uniformly added dropwise anticorrosive liquid to copper wire, anticorrosive liquid be polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate with
7:4:3 weight concentration 0.5%, obtains than the manufactured aqueous solution after mixing in vacuum drying chamber after 70 DEG C of dry 12h
Finished product.
It will be aoxidized respectively by anti-oxidant bonding brass wire made from embodiment 1-2 and comparative example 1-7 preparation method
Thickness degree (being tested after placing 120h in the environment of 25 DEG C of temperature, humidity 70%), tensile property, hydrochloric acid, polysulfide test
This several performance tests, the test result of gained are shown in Table 1, it is seen that each raw material used in the present invention has not to copper wire overall performance
The influence that can or lack.
Table 1
The preparation method of anti-oxidant bonding brass wire involved in the present invention obtains copper liquid after first cathode copper is melted, and then exists
Molybdenum, bismuth, boron nitride, phenolic resin are added in copper liquid under the protection of inert gas, then mixed copper is obtained through magnetic agitation
Liquid.Then mixing copper liquid is obtained through crystallisation by cooling to be bonded copper ingot, drawing obtains what diameter satisfaction required repeatedly after calendering
Bonding brass wire, anticorrosive liquid finally is added dropwise on copper wire surface under inert gas shielding, finished product is obtained after drying.Utilize this method
The anti-oxidant bonding brass wire being prepared has good antioxygenic property, mechanical strength and a decay resistance, and cost compared with
It is low, the requirement of industry is disclosure satisfy that, is had a good application prospect.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, it is included within the scope of the present invention.
Claims (6)
1. a kind of preparation method of anti-oxidant bonding brass wire, it is characterised in that comprise the following steps：
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050~1080 DEG C, is incubated to cathode copper after being completely melt and obtains copper
Liquid, then to being passed through inert gas in copper liquid, while add and account for copper liquid quality 6wt% molybdenum, 3.5wt% bismuth, 1.8wt%
The phenolic resin of boron nitride, 0.5wt%, furnace temperature is risen to 3150~3180 DEG C immediately after the completion of addition, be continually fed into inertia
Magnetic agitation is carried out in the case of gas, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, crystallization groove is flowed into by guiding gutter, then carried out using cooling water cold
But, mixing copper liquid is made to crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to drawing repeatedly after calendering, gained bonding brass wire diameter is progressively reduced, when bonding brass wire is straight
When footpath is less than 0.05mm, stop drawing；
(4) gained bonding brass wire is passed through in inert gas according to 2.5~3.5m/s speed, while with 3ml/min speed
Anticorrosive liquid is uniformly added dropwise to copper wire, finished product is obtained after drying.
2. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that：The step (1) and step
Suddenly in (4), inert gas is used as nitrogen, and the flow of gas is 175L/h.
3. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that：In the step (1), magnetic
The speed of power stirring is 350r/min, mixing time 45min.
4. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that：In the step (4), resist
Corrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, indium sulfate with 7:4:3:1 weight is manufactured more water-soluble than after mixing
Liquid, concentration 0.5%.
5. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that：In the step (4), do
Dry operation is specifically in 70 DEG C of dry 12h in vacuum drying chamber.
6. the application of the copper wire obtained by preparation method in integrated circuits described in any one of Claims 1 to 5.
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| CN109182830A (en) * | 2018-09-21 | 2019-01-11 | 广东华科新材料研究院有限公司 | A kind of preparation method of oxidation-resistant alloy copper wire |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1949493A (en) * | 2006-11-03 | 2007-04-18 | 宁波康强电子股份有限公司 | Bonded copper wire and preparing method thereof |
| US20100213613A1 (en) * | 2005-06-22 | 2010-08-26 | Infineon Technologies Ag | Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same |
| CN104818404A (en) * | 2015-04-22 | 2015-08-05 | 苏州劲元油压机械有限公司 | Corrosion-resistant copper wire for oil filter screen and manufacturing process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100213613A1 (en) * | 2005-06-22 | 2010-08-26 | Infineon Technologies Ag | Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same |
| CN1949493A (en) * | 2006-11-03 | 2007-04-18 | 宁波康强电子股份有限公司 | Bonded copper wire and preparing method thereof |
| CN104818404A (en) * | 2015-04-22 | 2015-08-05 | 苏州劲元油压机械有限公司 | Corrosion-resistant copper wire for oil filter screen and manufacturing process thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109182830A (en) * | 2018-09-21 | 2019-01-11 | 广东华科新材料研究院有限公司 | A kind of preparation method of oxidation-resistant alloy copper wire |
| CN109182830B (en) * | 2018-09-21 | 2020-08-21 | 广东华科新材料研究院有限公司 | Preparation method of antioxidant alloy copper wire |
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