CN107623012A - Display device and forming method thereof - Google Patents
Display device and forming method thereof Download PDFInfo
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- CN107623012A CN107623012A CN201710061424.2A CN201710061424A CN107623012A CN 107623012 A CN107623012 A CN 107623012A CN 201710061424 A CN201710061424 A CN 201710061424A CN 107623012 A CN107623012 A CN 107623012A
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Abstract
The present invention discloses a kind of display device and forming method thereof.The display device includes the first conductive pad being arranged on substrate, wherein having contact area between the first conductive pad and substrate.Display device is also comprising the first grafting material being arranged on the first conductive pad, wherein the first grafting material has sectional area on the direction parallel to substrate surface.Display device is also comprising the second conductive pad being arranged on the first grafting material, and the first ray structure being arranged on the second conductive pad, wherein the sectional area of the first grafting material is less than the contact area of the first conductive pad.
Description
Technical field
The present invention relates to display device, and ray structure is bonded into substrate more particularly to using the mode of eutectic bonding
Display device and forming method thereof.
Background technology
In the packaging manufacturing process of general display device, eutectic bonding (eutectic bonding) is one of which phase
To stable juncture, this juncture is the eutectic alloy material using low melting point, and it can be by during thawing
Solid phase is directly changed into liquid phase, and without going past the equalization point of liquid phase and solid phase, the eutectic temperature of this material, i.e. fusion temperature can
Less than the respective fusing point of metal of its composition.
Although display device being packaged at present using eutectic bonding mode and forming method thereof deals with them enough
Original predetermined purposes, but they all do not meet the requirements thoroughly in all fields yet, therefore the eutectic bonding skill of display device
Art still has the direction that need to make great efforts at present.
The content of the invention
The embodiments of the invention provide display device and forming method thereof.In general, multiple ray structure eutectics are connect
It is bonded in the manufacture craft of substrate, because ray structure has leading in difference in thickness, or each ray structure each other
Electrical pad has difference in thickness so that relatively thin conductive pad can not on the conductive pad or ray structure on the ray structure of thinner thickness
Conductive pad corresponding with substrate produces eutectic bonding, if using forcing pressuring method to be engaged, may cause light-emitting junction
Structure is damaged, or the short circuit between conductive pad.
During eutectic bonding, the thicker ray structure of thickness or conductive pad will squeeze out more grafting material,
In order to solve this problem, the embodiment of the present invention reduce the sectional area of grafting material or by bonding material pattern by way of,
Accommodation space is produced between conductive pad on substrate and ray structure so that because extruding and caused excessive grafting material
Into this accommodation space, to avoid producing the problem of short-circuit between conductive pad.
Furthermore the embodiment of the present invention between substrate and ray structure by setting multiple contour separation materials, to ensure
When engaging manufacture craft and stopping, the surface of the remote substrate of each ray structure to the distance of substrate is consistent, in addition,
By the way that on substrate or ray structure, separation material is set between two adjacent conductive pads, can avoid in engagement manufacture craft
Afterwards, short circuit is produced between adjacent two conductive pad on substrate or ray structure.
According to some embodiments, there is provided display device.Display device includes the first conductive pad being arranged on substrate, wherein
There is contact area between first conductive pad and substrate.Display device is also comprising the first engagement material being arranged on the first conductive pad
Material, wherein the first grafting material has sectional area on the direction parallel to substrate surface.Display device is also comprising being arranged at the
The second conductive pad on one grafting material, and the first ray structure being arranged on the second conductive pad, wherein the first engagement material
The sectional area of material is less than the contact area of the first conductive pad.
According to some embodiments, there is provided display device.Display device includes the first conductive pad being arranged on substrate, sets
In the first grafting material on the first conductive pad, and the second conductive pad being arranged on the first grafting material.In addition, display dress
Put also comprising being arranged at the first ray structure on the second conductive pad, and the be arranged between substrate and the first ray structure
One separation material.
According to some embodiments, there is provided the forming method of display device.The forming method of display device includes and forms first
Conduction is padded on substrate, wherein having contact area between the first conductive pad and substrate.The forming method of display device also includes
Form the second conduction to be padded on the first ray structure, and form the first grafting material on the first conductive pad, wherein first connects
Condensation material has sectional area on the direction parallel to substrate surface, and the sectional area of the first grafting material is less than the first conductive pad
Contact area, and implement engagement manufacture craft, the first ray structure is bonded to substrate.
According to some embodiments, there is provided the forming method of display device.The forming method of display device includes and forms first
Conduction is padded on substrate, and is formed the second conduction and be padded on ray structure.Between the forming method of display device is also comprising forming
Gap thing is on substrate or ray structure, and forms coating glue on substrate and the first conductive pad.The forming method of display device
Also comprising forming grafting material on coating glue, and in grafting material insertion coating glue, between the thickness of wherein grafting material is more than
The thickness of gap thing, and implement engagement manufacture craft, ray structure is bonded to substrate.
According to some embodiments, there is provided the forming method of display device.The forming method of display device includes and forms first
Conduction is padded on substrate, and is formed the second conduction and be padded on ray structure.The forming method of display device also applies comprising formation
Cloth glue is on substrate and the first conductive pad, or forms coating glue on ray structure and the second conductive pad, wherein having in coating glue
There is separation material.In addition, the forming method of display device also comprising formed grafting material in coating glue on, and grafting material insertion apply
In cloth glue, wherein the thickness of grafting material is more than the thickness of separation material, and implements engagement manufacture craft, and ray structure is engaged
To substrate.
Brief description of the drawings
By accompanying drawing appended by following detailed description cooperation, we can more understand the viewpoint of the embodiment of the present invention.It is worth
It is noted that according to industrial standard convention, various elements may be not to scale.In fact, in order to clear
Ground discussion, the size of various elements may be increased or decreased arbitrarily.
Fig. 1-Fig. 2 is the diagrammatic cross-section that explanation forms display device；
Fig. 3 A- Fig. 3 C are that the section in each stage for according to some embodiments of the present invention, illustrating to form display device shows
It is intended to；
Fig. 4 is the diagrammatic cross-section for illustrating display device according to some embodiments of the present invention；
Fig. 5 A- Fig. 5 B are according to some embodiments of the present invention, and each interstage for illustrating to form display device is cutd open
Face schematic diagram；
Fig. 6 A- Fig. 6 F are according to some embodiments of the present invention, illustrate line A-A or line B-B along Fig. 5 A, or along Fig. 5 B
Top views of line the A '-A ' or line B '-B ' grafting materials of display device on conductive pad；
Fig. 7 A- Fig. 7 D are according to some embodiments of the present invention, and each interstage for illustrating to form display device is cutd open
Face schematic diagram；
Fig. 8 A- Fig. 8 B are according to some embodiments of the present invention, and each interstage for illustrating to form display device is cutd open
Face schematic diagram；
Fig. 9 A- Fig. 9 D are according to some embodiments of the present invention, and each interstage for illustrating to form display device is cutd open
Face schematic diagram；
Figure 10 A- Figure 10 B be according to some embodiments of the present invention, each interstage for illustrating to form display device
Diagrammatic cross-section；
Figure 11 A- Figure 11 E be according to some embodiments of the present invention, each interstage for illustrating to form display device
Diagrammatic cross-section；
Figure 12 A- Figure 12 E be according to some embodiments of the present invention, each interstage for illustrating to form display device
Diagrammatic cross-section；
Figure 13 A- Figure 13 E be according to some embodiments of the present invention, each interstage for illustrating to form display device
Diagrammatic cross-section.
Symbol description
100th, 200,300,400,500,700,800,900,1000,1100,1200,1300~display device；
101st, 201,301,401,501,701,801,901,1001,1101,1201,1301~substrate；
103a, 203a, 303a, 403a, 503a, 703a, 803a, 903a, 1003a, 1103a, 1203a, 1303a~first
Conductive pad；
103b, 203b, 303b, 403b, 503b, 703b, 803b, 903b, 1003b, 1103b, 1203b, 1303b~the 3rd
Conductive pad；
The separation material of 704a, 804a, 904a, 1004a, 1104a, 1204a, 1304a~first；
The separation material of 704b, 804b, 904b, 1004b, 1104b, 1204b, 1304b~second；
105a, 205a, 305a, 405a, 505a, 705a, 805a, 905a, 1005a, 1105a, 1205a, 1305a~first
Grafting material；
105b, 205b, 305b, 405b, 505b, 705b, 805b, 905b, 1005b, 1105b, 1205b, 1305b~second
Grafting material；
107a, 207a, 307a, 407a, 507a, 707a, 807a, 907a, 1007a, 1107a, 1207a, 1307a~second
Conductive pad；
107b, 207b, 307b, 407b, 507b, 707b, 807b, 907b, 1007b, 1107b, 1207b, 1307b~the 4th
Conductive pad；
109a, 209a, 309a, 409a, 509a, 709a, 809a, 909a, 1009a, 1109a, 1209a, 1309a~first
Ray structure；
109b, 209b, 309b, 409b, 509b, 709b, 809b, 909b, 1009b, 1109b, 1209b, 1309b~second
Ray structure；
111st, 211,311,411,511,711,811,911,1011,1111,1211,1311~joint；
The gap of 506a~first；
The hole of 506a '~first；
The gap of 506b~second；
The hole of 506b '~second；
1113rd, 1213,1313~coating glue；
1304~separation material；
C~center；
T~thickness.
Embodiment
Following description provides many different embodiments or example, for implementing provided display device.Each element
It is described as follows with the concrete example of its configuration, to simplify embodiments of the invention.Certainly, these are only example, and are not used to
Limit the present invention.For example, if being referred in narration, the first element is formed on the second element, may include first and second
The embodiment that element directly contacts, it is also possible to formed comprising extra part between the first and second elements so that the first He
The embodiment that second element is not directly contacted with.In addition, embodiments of the invention may in different examples repeat reference numerals
And/or letter.So repeat be in order to concise and clear, and be not used to the expression different embodiments and/or form that are discussed it
Between relation.
Some changes of embodiment are described below.In the embodiment of different accompanying drawings and explanation, similar reference numeral quilt
For indicating similar element.It is understood that extra operation can be provided before and after, during following methods,
And the operation of some narrations can be in order to which the other embodiment of this method is substituted or deletes.
Fig. 1-Fig. 2 is the diagrammatic cross-section that explanation forms display device 100 and 200, and wherein Fig. 1-Fig. 2 is for illustrating to show
In showing device 100 and 200, relatively thin conductive pad can not be with base on the conductive pad or ray structure on the ray structure of thinner thickness
Corresponding conductive pad produces the problem of eutectic bonding on plate.
As shown in figure 1, there are multiple first conductive pad 103a and multiple 3rd conductions on the substrate 101 of display device 100
103b is padded, there is respective first grafting material 105a, and each second conductive pad on each first conductive pad 103a
There is respective second grafting material 105b on 103b.In addition, display device 100 has the first ray structure of different-thickness
109a and the second ray structure 109b, wherein, the first ray structure 109a thickness is less than the second ray structure 109b thickness.
Multiple second conductive pad 107a, and the first ray structure 109a and position are formed on first ray structure 109a bottom surface
The first light-emitting component is formed in multiple second conductive pad 107a on its bottom surface；Formed on second ray structure 109b bottom surface more
Individual 4th conductive pad 107b and the second ray structure 109b and multiple 4th conductive pad 107b compositions second on its bottom surface
Light-emitting component.First ray structure 109a and the second ray structure 109b is to be engaged using joint 111 with substrate 101, wherein the
One grafting material 105a and the second conductive pad 107a position have corresponding relation on the direction on the surface of substrate 101,
And second grafting material 105b and the 4th conductive pad 107b position there is corresponding pass on the direction on the surface of substrate 101
System.
As shown in figure 1, because the first ray structure 109a and the second ray structure 109b have difference in thickness, work as substrate
101 with the second ray structure 109b when engaging, and still has space between the first ray structure 109a and substrate 101 and can not be complete
Engagement.Now, if forcing to pressurize at the end of joint 111, the first ray structure 109a and the second ray structure 109b may be damaged,
Or second grafting material 105b may because excessively pressurization and outwards extrude, cause two neighboring second grafting material 150b mutual
Contact and produce the problem of short-circuit.
As shown in Fig. 2 Fig. 2 display device 200 has the element similar in appearance to Fig. 1 display device 100, in order to describe letter
Just for the sake of, just do not repeat herein.It is worth noting that, Fig. 2 display device 200 has the first ray structure of same thickness
209a and the second ray structure 209b, but because the second conductive pad 207a of display device 200 and the 4th conductive pad 207b have
The difference of thickness, display device 200 can be also produced similar in appearance to above-mentioned asking on display device 100 in manufacture craft is engaged
Topic.Clearly, because the second conductive pad 207a of display device 200 thickness is less than the 4th conductive pad 207b thickness, when
, still can not with space between the first ray structure 209a and substrate 201 when substrate 201 engages with the second ray structure 209b
Complete engagement.Now, if forcing to pressurize at the end of joint 211, the problem of above-mentioned can be produced.
Generally speaking, when the thickness of the first light-emitting component and the variable thickness of the second light-emitting component cause, substrate and first
And the second engagement manufacture craft between light-emitting component will be unable to smoothly complete, the problem of foregoing is easily produced.
The first purpose of following examples is foregoing in order to solve the problems, such as, following embodiments are included not with display device
The the first ray structure 109a and the second ray structure 109b of stack pile are example, illustrate how to solve foregoing problems, but
Not limited to this, display device can also include the first conductive pad 103a and the 3rd conductive pad 103b of different-thickness, or different thick
The the second conductive pad 107a and the 4th conductive pad 107b of degree.
Fig. 3 A- Fig. 3 C are according to some embodiments of the present invention, illustrate the section in each stage to form display device 300
Schematic diagram.
According to some embodiments, as shown in Figure 3A, multiple first conductive pad 303a and the multiple 3rd are formed on substrate 301
Conductive pad 303b.In some embodiments, substrate 301 can be formed with thin film transistor (TFT) (thin film transistor, TFT)
The substrate of array (array).First conductive pad 303a and the 3rd conductive pad 303b formation can by depositing manufacture craft, such as
Chemical vapor deposition (chemical vapor deposition, CVD), physical vapour deposition (PVD) (physical vapor
Deposition, PVD), ald (atomic layer deposition, ALD), metal organic chemical vapor deposition
(metal organic chemical vapor deposition, MOCVD), rotary coating (spin coating) or sputter
(sputtering) form conductive layer and then conductive layer pattern formed into multiple conductive pads by patterning manufacture craft,
Patterning manufacture craft includes photoetching and etching process.
As shown in Figure 3A, respective first grafting material 305a is formed on each first conductive pad 303a, each
Respective second grafting material 305b is formed on individual 3rd conductive pad 303b.It is worth noting that, the first grafting material 305a and
Second grafting material 305b has sectional area on the direction parallel to the surface of substrate 101, and the first conductive pad 303a and the 3rd is led
There is contact area, and first and second grafting material 305a, 305b sectional area difference is small between electrical pad 303b and substrate 101
In the contact area of first and the 3rd between conductive pad 303a, 303b and substrate 301.In some embodiments, first and second connect
Condensation material 305a, 305b can be used spraying (injecting) or the mode for transferring (stamping) and formed.First and second connect
Condensation material 305a, 305b material can be the metal or alloy material of low melting point, in some embodiments, the first and second engagement materials
The material for expecting 305a, 305b can be that fusing point is less than 350 DEG C of eutectic material, for example, tin (Sn), gallium (Ga), indium (In), golden (Au),
Metal alloy, foregoing alloy or other suitable materials such as zinc (Zn), bismuth (Bi), silver-colored (Ag).In other embodiments, first
Material with second grafting material 305a, 305b is heatable electroconductive cured material.In addition, the first conductive pad 303a and the 3rd
Conductive pad 303b material can be similar or identical to that first and second grafting material 305a, 305b, for the sake of describing simplicity,
This is not just repeated.
On the other hand, as shown in Figure 3A, adsorb or stick the first ray structure by the joint 311 of hot press equipment
309a and the second ray structure 309b, in certain embodiments, the first ray structure 309a thickness are less than the second ray structure
309b.Formed with multiple second conductive pad 307a on first ray structure 309a bottom surface, the first ray structure 309a and it is located at
Multiple second conductive pad 307a on its bottom surface form the first light-emitting component, and on the second ray structure 309b bottom surface formed with
Multiple 4th conductive pad 309b, the second ray structure 309b and multiple 4th conductive pad 309b compositions second on its bottom surface
Light-emitting component.In some embodiments, first and second ray structure 309a, 309b can be light emitting diode (light
Emitting diode, LED).In addition, second and the 4th conductive pad 307a, 307b manufacture craft and material can similar or phase
First and the 3rd conductive pad 303a, 303b are same as, for the sake of describing simplicity, is not just repeated herein.
According to some embodiments, as shown in Figure 3 B, implement engagement manufacture craft, sent out by joint 311 by first and second
Photo structure 309a, 309b engage with substrate 301 simultaneously, with the display device 300 formed below of joint 311.Engage manufacture craft
It is that temperature and pressure is applied by joint 311, to help between substrate 101 and first and second ray structure 309a, 309b
Engagement.In general, joint 311 apply temperature depend on first, second, third and fourth conductive pad 105a, 107a,
Material used in 105b, 107b and first and second grafting material 105a, 105b, in some embodiments, joint 311 applies
Temperature be less than 350 DEG C, in the range of about 100 DEG C to 300 DEG C.In addition, the pressure that joint 311 applies depends on being intended to be connect
The ray structure 309a and 309b of conjunction quantity.
Continue foregoing, as shown in Figure 3A, because the sectional area of first and second grafting material 305a, 305b before engagement is small
In the contact area of first and the 3rd between conductive pad 303a, 303b and substrate 101, first and second conductive pad 303a, 307a
Between, and all there is accommodation space between the 3rd and the 4th conductive pad 303b, 307b, after splicing, as shown in Figure 3 B, position
What the second grafting material 305b below the second thicker ray structure 309b was extruded in manufacture craft is engaged by pressurization
The problem of remaining conducting element will not partly being contacted with arround, and then avoiding short circuit.Meanwhile implement engagement manufacture craft it
Afterwards, can smoothly be engaged between first and second ray structure 309a, 309b and substrate 101.Further, since the first ray structure
309a thickness is thin compared with the second ray structure 309b, after engagement, as shown in Figure 3 B, below the first ray structure 309a
The first grafting material 305a there is the section profile that caves inward, and the second engagement below the second ray structure 309b
Material 305b has outstanding section profile.
Then, as shown in Figure 3 C, after implementing to engage manufacture craft, joint 311 is removed.In some embodiments, set
Protective layer (not illustrating) covers display device 300.In addition, in the first ray structure 309a and the second ray structure 309b top
Another substrate (not illustrating) is set, completely to cover display device 300.Shown on the left of Fig. 3 C, work is made implementing to engage
Skill and after removing joint 311, the first grafting material 305a of display device 300 sectional area be less than the first conductive pad 303a with
Contact area between substrate 101.Clearly, the first grafting material 305a has center c and thickness t, and the first engagement material
Material 305a has a sectional area on the direction parallel to the surface of substrate 101, and the sectional position of this sectional area is in the first engagement
Material 305a center c is up and down in the range of each 15% thickness t.
In other words, the first grafting material 305a has a section on the direction of substrate 301, in this section
In, heart c is all up and down the section profile to cave inward in the range of each 15% thickness t to the first grafting material 305a wherein.
Fig. 4 is the diagrammatic cross-section for illustrating display device 400 according to some embodiments of the present invention.
According to some embodiments, as shown in figure 4, display device 400 has the member similar in appearance to Fig. 3 B display device 300
Part, for the sake of describing simplicity, just do not repeat herein.It is worth noting that, Fig. 4 display device 400 has same thickness
First ray structure 409a and the second ray structure 409b, and the second conductive pad 407a of different-thickness and the 4th conductive pad
407b, clearly, the second conductive pad 407a thickness are less than the 4th conductive pad 407b thickness.In addition, implementing engagement system
After making technique, joint 411 is removed to form display device 400.
Similar in appearance to the manufacture craft of display device 300, display device 400 has first before implementing to engage manufacture craft
And second grafting material 405a, 405b sectional area be less than first and the 3rd connecing between conductive pad 403a, 403b and substrate 401
The technical characteristic of contacting surface product, first and second ray structure 409a, 409b all can be engaged smoothly with substrate 401.Further, since
Second conductive pad 407a thickness is thin compared with the 4th conductive pad 407b, the first grafting material below the second conductive pad 407a
405a has the section profile to cave inward, and the second grafting material 405b below the 4th conductive pad 407b has outwards
Prominent section profile.
Fig. 5 A- Fig. 5 B be according to some embodiments of the present invention, each interstage for illustrating to form display device 500
Diagrammatic cross-section.Display device 500 has the element similar in appearance to Fig. 3 B display device 300, for the sake of describing simplicity, herein
Just do not repeat.
According to some embodiments, as shown in Figure 5A, patterning is set respectively on conductive pad 503a, 503b in first and the 3rd
First and second grafting material 505a, 505b.It is worth noting that, the first and second grafting material 505a of patterning,
There is gap or hole inside 505b.In some embodiments, as shown in Figure 5A, have in the first grafting material 505a of patterning
First gap 506a, and there is the second gap 506b in the second grafting material 505b patterned.
Then, as shown in Figure 5 B, implement engagement manufacture craft, by joint 511 by the first and second ray structure 509a,
509b engages with substrate 501 simultaneously, with the display device 500 formed below of joint 511, wherein between the first gap 506a and second
Gap 506b is squeezed and reduces become the first hole 506a ' and the second hole 506b ' respectively.In further embodiments, it is real
After applying engagement manufacture craft, the gap rather than void shape of the first gap 506a and the second gap 506b still for elongate.This
Outside, after implementing to engage manufacture craft, joint 511 is removed to form display device 500.
Before display device 500 is to implement to engage manufacture craft with the identical place of display device 300, first and second
Grafting material 505a, 505b sectional area are less than first and the 3rd contact surface between conductive pad 503a, 503b and substrate 501
Product.In addition, compared to display device 300, due to first and second grafting material 505a, 505b of display device 500 inside
With more gap or hole, between first and second conductive pad 503a, 507a, and the 3rd and the 4th conductive pad 503b, 507b
Between there is bigger accommodation space, implement engage manufacture craft after, can more ensure the first and second ray structure 509a,
Can smoothly be engaged between 509b and substrate 501, and will not generating element damage or it is short-circuit the problem of.
In addition, shown on the left of Fig. 5 B, the first grafting material 505a of display device 500 sectional area is less than the first conduction
Pad the contact area between 503a and substrate 501.Clearly, line A '-A ' are the first grafting material 505a parallel to substrate
Center line on the direction on 501 surfaces, and the first grafting material 505a has a thickness t, and the first grafting material 505a section
Online the A '-A ' in long-pending sectional position are up and down in the range of each 15% thickness t.
In other words, the first grafting material 505a has a section on the direction of substrate 501, in this section
In, the first online A '-A ' of grafting material 505a are all up and down the section profile to cave inward in the range of each 15% thickness t.
Fig. 6 A- Fig. 6 C are according to some embodiments of the present invention, illustrate line A-A or line B-B along Fig. 5 A, or along Fig. 5 B
Top views of line the A '-A ' or line B '-B ' grafting materials of display device 500 on conductive pad.It is worth noting that, the present invention
Embodiment is not limited to this.
In some embodiments, as shown in Figure 6 A and 6 B, conductive pad 503 can be that circular or square (conductive pad 503 can include
First and the 3rd conductive pad 503a, 503b), and the grafting material 505 on conductive pad 503 has and is a substantially circular shape or square
Profile (grafting material 505 can include first and second grafting material 505a, 505b).Significantly, since grafting material
There is gap 506 (gap 506 can include first and second gap 506a, 506b) in 505, in the line A-A or line B- along Fig. 5 A
B, or along line A '-A ' or line the B '-B ' of Fig. 5 B display devices 500 top view, gap 506 exposes grafting material 505
A part for the conductive pad 503 of lower section.
In further embodiments, as shown in Figure 6 C and 6 D shown in FIG., there is the gap 506 of one or more in grafting material 505.
Fig. 6 A, Fig. 6 B, the grafting material 505 shown in Fig. 6 C and Fig. 6 D can pass through the patterning system comprising photoetching and etching process
Make technique and formed.
In another embodiment, as shown in Fig. 6 E and Fig. 6 F, multiple grafting materials 505 are set on single conductive pad 503,
So that there is accommodation space between grafting material 505 on single conductive pad 503.In other embodiments, such as Fig. 6 E and
Shown in Fig. 6 F, multiple spherical grafting materials 505 can be set on single conductive pad 503, grafting material 505 may be, for example, tin ball
Deng conducting particles.
Fig. 7 A- Fig. 7 D be according to some embodiments of the present invention, each interstage for illustrating to form display device 700
Diagrammatic cross-section.
According to some embodiments, as shown in Figure 7 A, multiple first conductive pad 703a, the multiple 3rd are formed on the substrate 701
Conductive pad 703b, multiple first separation material 704a and multiple second separation material 704b.Clearly, will subsequently lighted with first
The region of element engagement sets at least one first separation material 704a, and in the region that will subsequently be engaged with the second light-emitting component
At least one second separation material 704b is set.In some embodiments, subsequently by the region engaged with the first light-emitting component and after
It is continuous that the region engaged with the second light-emitting component is set at least one separation material.In addition, it will subsequently connect with the first light-emitting component
Between the region of conjunction and the region that will be engaged with the second light-emitting component, separation material can be set.First and the 3rd conductive pad 703a,
703b material and manufacture craft can be similar or identical to that first and the 3rd conductive pad 303a, 303b of display device 300, in order to
For the sake of narration is easy, just do not repeat herein.In some embodiments, first and second separation material 704a, 704b can by photoetching and
Etching process is formed, and has identical thickness.In addition, first and second separation material 704a, 704b can be insulating materials,
Such as silica, silicon oxynitride, silicon nitride, the high polymer material for the etching that can develop or foregoing combination.
Continue foregoing, as shown in Figure 7 B, the first of patterning is set respectively on conductive pad 703a, 703b in first and the 3rd
With second grafting material 705a, 705b.It is worth noting that, first and second grafting material 705a, 705b thickness is more than the
One and second separation material 704a, 704b thickness.In addition, first and second grafting material 705a, 705b manufacture craft and material
Material can be similar or identical to that first and second grafting material 305a, 305b of ray structure 300, for the sake of describing simplicity,
This is not just repeated.
Then, as seen in figure 7 c, adsorbed by joint 711 or stick the first ray structure 709a and the second ray structure
709b, the first ray structure 709a thickness are less than the second ray structure 709b.Formed on first ray structure 709a bottom surface
Multiple second conductive pad 707a, the first ray structure 709a and multiple second conductive pad 707a compositions first on its bottom surface
Light-emitting component, and multiple 4th conductive pad 709b are formed on the second ray structure 709b bottom surface, the second ray structure 709b and
Multiple 4th conductive pad 707b on its bottom surface form the second light-emitting component.In some embodiments, first and second is luminous
Structure 709a, 709b can be light emitting diode (LED).In addition, second and the 4th conductive pad 707a, 707b manufacture craft and material
Material can be similar or identical to that second and the 4th conductive pad 307a, 307b of display device 300, for the sake of describing simplicity, herein
Just do not repeat.
According to some embodiments, as illustrated in fig. 7d, implement engagement manufacture craft, sent out by joint 711 by first and second
Photo structure 709a, 709b engage with substrate 701 simultaneously, with the display device formed below 700 of joint 711.Joint 711 applies
Temperature and pressure such as Fig. 3 B the temperature and pressure that is applied of joint 311, for the sake of describing simplicity, just do not repeat herein.
When the second thicker ray structure 709b touches the second separation material 704b, engagement manufacture craft stops.Now, first connect
Condensation material 705a thickness is more than the second grafting material 705b thickness, and the first separation material 704a thickness is less than the first conductive pad
703a, the first grafting material 705a and the second conductive pad 707a thickness summation, and the second separation material 704b thickness is equal to the
Three conductive pad 703b, the second grafting material 705b and the 4th conductive pad 707b thickness summation.In addition, make work implementing to engage
After skill, joint 711 is removed to form display device 700.
Before implementing to engage manufacture craft, because first and second grafting material 705a, 705b thickness is more than first
, can when the second thicker ray structure 709b touches the second separation material 704b with second separation material 704a, 704b thickness
Ensure that first and second ray structure 709a, 709b have all smoothly engaged with substrate 701.
Furthermore due to being provided with first and second separation material 704a, 704b of same thickness on substrate 701, when engagement is made
When making technique stopping, substrate 701 is close to the first ray structure 709a surface and the first ray structure 709a away from substrate 701
The distance between surface is equal to substrate 701 close to the second ray structure 709b surface and the second ray structure 709b away from substrate
The distance between 701 surface, can be more accurately by first and second separation material 704a, 704b of same thickness setting
Control the integral thickness of display device 700.
On the other hand, first and second separation material 704a, 704b can prevent the joining material contacts on different conductive pads, enter
And the problem of avoiding producing short circuit.
Fig. 8 A- Fig. 8 B be according to some embodiments of the present invention, each interstage for illustrating to form display device 800
Diagrammatic cross-section.Fig. 8 A- Fig. 8 B have the element similar in appearance to Fig. 7 C- Fig. 7 D, for the sake of describing simplicity, just do not repeat herein.
In some embodiments, Fig. 8 A and Fig. 7 C difference is first and second separation material 804a, 804b position, such as to scheme
Shown in 8A, first and second separation material 804a, 804b are respectively arranged on first and second ray structure 809a, 809b.It is each
At least one first separation material 804a is set on individual ray structure 809a, and set on each ray structure 809b at least one
Second separation material 804b.In addition, similar in appearance to Fig. 7 C, Fig. 8 A first and second grafting material 805a, 805b thickness is more than the
One and second separation material 804a, 804b thickness.
Continue foregoing, as shown in Figure 8 B, implement engagement manufacture craft, by joint 811 by the first and second ray structures
809a, 809b are simultaneously engaged with to substrate 801, with the display device formed below 800 of joint 811.When the second thicker hair
When the second separation material 804b on photo structure 809b touches substrate 801, engagement manufacture craft stops.Now, the first engagement
Material 805a thickness is more than the second grafting material 805b thickness, and the first separation material 804a thickness is less than the first conductive pad
803a, the first grafting material 805a and the second conductive pad 807a thickness summation, and the second separation material 804b thickness is equal to the
Three conductive pad 803b, the second grafting material 805b and the 4th conductive pad 807b thickness summation.In addition, make work implementing to engage
After skill, joint 811 is removed to form display device 800.
Similar in appearance to display device 700, display device 800 connects before implementing to engage manufacture craft by first and second
The setting of thickness of condensation material 805a, 805b thickness more than first and second separation material 804a, 804b, and same thickness
First and second separation material 804a, 804b setting, on the one hand can ensure that first and second ray structure 809a, 809b all with base
Plate 801 smoothly engages, and on the other hand can be accurately controlled the integral thickness of display device 800.
Fig. 9 A- Fig. 9 D be according to some embodiments of the present invention, each interstage for illustrating to form display device 900
Diagrammatic cross-section.
According to some embodiments, as shown in Figure 9 A, multiple first conductive pad 903a, the multiple 3rd are formed on substrate 901
Conductive pad 903b, multiple first separation material 904a and multiple second separation material 904b.Clearly, each first conductive pad
903a both sides, which all have, sets the first separation material 904a, and all there is the second gap of setting each the second conductive pad 903b both sides
Thing 904b.First and the 3rd conductive pad 903a, 903b material and manufacture craft can be similar or identical to that the of display device 300
One and the 3rd conductive pad 303a, 303b, first and second separation material 904a, 904b material and manufacture craft can be similar in appearance to displays
First and second separation material 304a, 304b of device 300, for the sake of describing simplicity, are not just repeated herein.
Fig. 9 A and Fig. 7 A difference is first and second separation material 904a, 904b position.As shown in Figure 9 A, the first He
Second separation material 904a, 904b can respectively with first and the 3rd conductive pad 903a, 903b contact, and the first and second separation materials
904a, 904b a part can be covered each by first and the 3rd conductive pad 903a, 903b a part.In other embodiments
In, because the distance between the first conductive pad 903a is too small, one can be only set between adjacent two first conductive pad 903a
First separation material 904a；Similarly, a second separation material 904b can be only set between adjacent two the 3rd conductive pad 903b.
Continue foregoing, as shown in Figure 9 B, the first of patterning is set respectively on conductive pad 903a, 903b in first and the 3rd
With second grafting material 905a, 905b.It is worth noting that, first and second grafting material 905a, 905b of patterning thickness
Thickness of the degree more than first and second separation material 904a, 904b.In some embodiments, the first grafting material 905a of patterning can
The first separation material 904a is contacted, and the second grafting material 905b patterned can contact the second separation material 904b.In other realities
Apply in example, the first grafting material 905a of patterning can not contact the first separation material 904a, and the second grafting material patterned
905b can not contact the second separation material 904b.
Then, as shown in Figure 9 C, adsorbed by joint 911 or stick the first ray structure 909a and the second ray structure
909b, the first ray structure 909a thickness are less than the second ray structure 909b.Formed on first ray structure 909a bottom surface
Multiple second conductive pad 907a, and multiple 4th conductive pad 909b are formed on the second ray structure 909b bottom surface.First and
Two ray structure 909a, 909b manufacture craft and material can be similar or identical to that the first and second of display device 300 lights
Structure 309a, 309b, and second and the 4th conductive pad 707a, 707b manufacture craft and material can be similar or identical to that light-emitting junction
Second and the 4th conductive pad 307a, 307b of structure 300, for the sake of describing simplicity, are not just repeated herein.
According to some embodiments, as shown in fig. 9d, implement engagement manufacture craft, sent out by joint 911 by first and second
Photo structure 909a, 909b engage with substrate 901 simultaneously, with the display device formed below 900 of joint 911.Joint 911 applies
Temperature and pressure such as Fig. 3 B the temperature and pressure that is applied of joint 311, for the sake of describing simplicity, just do not repeat herein.
When the second thicker ray structure 909b touches the second separation material 904b, engagement manufacture craft stops.Now, first connect
Condensation material 905a thickness is more than the second grafting material 905b thickness, and the first separation material 904a thickness is less than the first conductive pad
903a, the first grafting material 905a and the second conductive pad 907a thickness summation, and the second separation material 904b thickness is equal to the
Three conductive pad 903b, the second grafting material 905b and the 4th conductive pad 907b thickness summation.In some embodiments, implementing to connect
After closing manufacture craft, the thickness that the first separation material 904a is covered in the part on the first conductive pad 903a is less than the first engagement material
Expect 905a thickness.In addition, after implementing to engage manufacture craft, joint 911 is removed to form display device 900.
Pass through first and second separation material 904a, 904b setting, it can be ensured that first and second ray structure 909a, 909b
All smoothly engaged with substrate 901, and can more accurately control the integral thickness of display device 900.In addition, due to first
All there is a part with second separation material 904a, 904b on the first conductive pad 703a or the 3rd conductive pad 703b, can be true
Protect first and second grafting material 705a, 705b and space inside it is first occupied in manufacture craft is engaged, further prevent
One and second grafting material 705a, 705b be squeezed and outwards extrude, the problem of causing short circuit.
Figure 10 A- Figure 10 B are according to some embodiments of the present invention, illustrate each scala media to form display device 1000
The diagrammatic cross-section of section.Figure 10 A- Figure 10 B have the element similar in appearance to Fig. 9 C- Fig. 9 D, for the sake of describing simplicity, herein just not
Repeat.
In some embodiments, Figure 10 A and Fig. 9 C difference is first and second separation material 1004a, 1004b position,
As shown in Figure 10 A, first and second separation material 1004a, 1004b be respectively arranged at the first and second ray structure 1009a,
On 1009b.Furthermore a first separation material 1004a is only set, this first gap between two neighboring 3rd conductive pad 1007a
Thing 1004a both ends respectively there is a part to cover two adjacent the 3rd conductive pad 1007a.Two neighboring 4th conductive pad
One the second separation material 1004b is only set between 1007b, and this second separation material 1004b both ends have part covering respectively
Two adjacent the 4th conductive pad 1007b.
In other embodiments, the separation material of more than one first can be set between two neighboring 3rd conductive pad 1007a
The second separation material of more than one 1004b can be set between 1004a, two neighboring 4th conductive pad 1007b.In addition, similar in appearance to figure
9C, Figure 10 A first and second grafting material 1005a, 1005b thickness are more than first and second separation material 1004a, 1004b
Thickness.
Continue foregoing, as shown in Figure 10 B, implement engagement manufacture craft, by joint 1011 by the first and second light-emitting junctions
Structure 1009a, 1009b are simultaneously engaged with to substrate 1001, with the display device formed below 1000 of joint 1011.When thicker
When the second separation material 1004b on second ray structure 1009b touches substrate 1001, engagement manufacture craft stops.Now,
First grafting material 1005a thickness is more than the second grafting material 1005b thickness, and the first separation material 1004a thickness is less than
First conductive pad 1003a, the first grafting material 1005a and the second conductive pad 1007a thickness summation, and the second separation material
1004b thickness is equal to the 3rd conductive pad 1003b, the second grafting material 1005b and the 4th conductive pad 1007b thickness summation.
In some embodiments, after implementing to engage manufacture craft, the first separation material 1004a is covered on the first conductive pad 1003a
Partial thickness is less than the first grafting material 1005a thickness.In addition, after implementing to engage manufacture craft, joint is removed
1011 to form display device 1000.
Similar in appearance to display device 900, display device 1000 by first and second separation material 1004a, 1004b setting,
It can ensure that first and second ray structure 1009a, 1009b all smoothly engage with substrate 1001, and can more accurately control aobvious
The integral thickness of showing device 1000.In addition, because first and second separation material 1004a, 1004b are all located at a part
On second conductive pad 1007a or the 3rd conductive pad 1007b, it can be ensured that first and second grafting material 1005a, 1005b are connecing
Close and its internal space is first occupied in manufacture craft, further prevent first and second grafting material 1005a, 1005b to be squeezed
And outwards extrude, the problem of causing short circuit.
Figure 11 A- Figure 11 E are according to some embodiments of the present invention, illustrate each scala media to form display device 1100
The diagrammatic cross-section of section.
According to some embodiments, as shown in Figure 11 A, multiple first conductive pad 1103a, Duo Ge are formed on substrate 1101
Three conductive pad 1103b, multiple first separation material 1104a and multiple second separation material 1104b.First and the 3rd conductive pad 1103a,
1103b material and manufacture craft can be similar or identical to that first and the 3rd conductive pad 303a, 303b of display device 300,
One and second separation material 1104a, 1104b material and manufacture craft can be similar in appearance to the first and second gaps of display device 300
Thing 304a, 304b, for the sake of describing simplicity, just do not repeat herein.
Continue foregoing, as shown in Figure 11 B, the shape on substrate 1101, the first conductive pad 1103a and the 3rd conductive pad 1103b
Into coating glue 1113.In some embodiments, coating glue 1113 is non-solid insulating materials, and the refractive index for being coated with glue 1113 is situated between
Between air and ray structure, in the range of about 1 to about 2.4.In some embodiments, the refractive index of glue 1113 is coated with about
In the range of 1.4 to about 1.6.Coating glue 1113 has the function of taking light and protection.In other embodiments, being coated with glue 1113 can
More cover first and second separation material 1104a, 1104b.
Then, as shown in Figure 11 C, first and second grafting material 1105a, 1105b are set on coating glue 1113, and the
One and second grafting material 1105a, 1105b the embedded coating glue 1113 of a part in.It is worth noting that, first and second connect
Condensation material 1105a, 1105b thickness are more than first and second separation material 1104a, 1104b thickness.In some embodiments, the
One and second grafting material 1105a, 1105b can be spherical conducting particles, such as tin ball or plating nickel gold metal ball.In addition, the
One and second grafting material 1105a, 1105b first and the 3rd conductive is arranged on corresponding to difference by way of spraying or transferring
Pad on the coating glue 1113 on 1103a, 1103b.
As shown in Figure 11 D, adsorbed by joint 1111 or stick the first ray structure 1109a and the second ray structure
1109b, the first ray structure 1109a thickness are less than the second ray structure 1109b.On first ray structure 1109a bottom surface
Multiple second conductive pad 1107a are formed, and multiple 4th conductive pad 1109b are formed on the second ray structure 1109b bottom surface.The
One and second ray structure 1109a, 1109b manufacture craft and material can be similar or identical to that the first and of display device 300
Second ray structure 309a, 309b, and second and the 4th conductive pad 1107a, 1107b manufacture craft and material can similar or phase
Second and the 4th conductive pad 307a, 307b of ray structure 300 are same as, for the sake of describing simplicity, is not just repeated herein.
According to some embodiments, as depicted in fig. 11E, implement engagement manufacture craft, by joint 1111 by first and second
Ray structure 1109a, 1109b are simultaneously engaged with to substrate 1101, with the display device formed below 1100 of joint 1111.Connect
The temperature and pressure that the first 1111 temperature and pressure such as Fig. 3 B applied joint 311 is applied, for the sake of describing simplicity, herein
Just do not repeat.When the second thicker ray structure 1109b touches the second separation material 1104b, engagement manufacture craft stops.
Now, the first grafting material 1105a thickness is more than the second grafting material 1105b thickness, the first separation material 1104a thickness
Less than the first conductive pad 1103a, the first grafting material 1105a and the second conductive pad 1107a thickness summation, and the second separation material
1104b thickness is equal to the 3rd conductive pad 1103b, the second grafting material 1105b and the 4th conductive pad 1107b thickness summation.
In addition, after implementing to engage manufacture craft, joint 1111 is removed to form display device 1100.
Compared to display device 700,800,900 and 1000, display device 1100, can be light by being coated with the setting of glue 1113
Easy setting the first and second grafting materials 1105a, 1105b, and reduce overall manufacturing process steps.
Figure 12 A- Figure 12 E are according to some embodiments of the present invention, illustrate each scala media to form display device 1200
The diagrammatic cross-section of section.Figure 12 A- Figure 12 E have the element similar in appearance to Figure 11 A- Figure 11 E figures, for the sake of describing simplicity, herein
Just do not repeat.
In some embodiments, as illustrated in fig. 12, multiple first conductive pad 1203a and multiple are formed on substrate 1201
Three conductive pad 1203b.First and the 3rd conductive pad 1203a, 1203b material and manufacture craft can be similar or identical to that display dress
300 first and the 3rd conductive pad 303a, 303b is put, for the sake of describing simplicity, is not just repeated herein.
Continue foregoing, as shown in Figure 12 B, similar in appearance to Figure 11 B, formed in first and the 3rd on conductive pad 1203a, 1203b
It is coated with glue 1213.In some embodiments, Figure 11 B coating glue can be similar or identical to that by being coated with the manufacture craft of glue 1213 and material
1113 manufacture craft and material, is not just repeated herein.
Then, as indicated in fig. 12 c, similar in appearance to Figure 11 C, first and second grafting materials are set on coating glue 1213
1205a, 1205b, and in first and second grafting material 1205a, 1205b embedded coating glue 1113 of a part.Some are implemented
In example, first and second grafting material 1205a, 1205b manufacture craft and material can be similar or identical to that Figure 11 C the first and
Second grafting material 1105a, 1105b manufacture craft and material, is not just repeated herein.
As indicated in fig. 12d, similar in appearance to Figure 11 D, adsorbed by joint 1211 or stick the first ray structure 1209a and second
Ray structure 1209b, the first ray structure 1209a thickness are less than the second ray structure 1209b.First ray structure 1209a
Bottom surface on form multiple second conductive pad 1207a, and multiple 4th conductive pads are formed on the second ray structure 1209b bottom surface
1209b.First and second ray structure 1209a, 1209b manufacture craft and material can be similar or identical to that display device 300
First and second ray structure 309a, 309b, and second and the 4th conductive pad 1207a, 1207b manufacture craft and material can
Second and the 4th conductive pad 307a, 307b of ray structure 300 are similar or identical to that, for the sake of describing simplicity, herein just not
Repeat.
Figure 12 D and Figure 11 D difference is first and second separation material 1204a, 1204b position.As indicated in fig. 12d,
First and second separation material 1204a, 1204b are respectively arranged on first and second ray structure 1209a, 1209b.It is worth noting
, first and second separation material 1204a, 1204b thickness of the thickness less than first and second grafting material 1205a, 1205b
Degree.
Continue foregoing, as shown in figure 12e, implement engagement manufacture craft, by joint 1211 by the first and second light-emitting junctions
Structure 1209a, 1209b are simultaneously engaged with to substrate 1201, with the display device formed below 1200 of joint 1211.Joint 1211
The temperature and pressure that the temperature and pressure of application such as Fig. 3 B joint 311 is applied, for the sake of describing simplicity, is not just weighed herein
It is multiple.When the second separation material 1204b on the second thicker ray structure 1209b touches substrate 1201, manufacture craft is engaged
Stop.Now, the first grafting material 1205a thickness is more than the second grafting material 1205b thickness, the first separation material
1204a thickness is less than the first conductive pad 1203a, the first grafting material 1205a and the second conductive pad 1207a thickness summation,
And second separation material 1204b thickness be equal to the 3rd conductive pad 1203b, the second grafting material 1205b and the 4th conductive pad 1207b
Thickness summation.In addition, after implementing to engage manufacture craft, joint 1211 is removed to form display device 1200.
Similar in appearance to display device 1100, display device 1200 can easily set first by being coated with the setting of glue 1213
With second grafting material 1205a, 1205b, and the manufacturing process steps that reduction is overall.
Figure 13 A- Figure 13 E are according to some embodiments of the present invention, illustrate each scala media to form display device 1300
The diagrammatic cross-section of section.
According to some embodiments, as shown in FIG. 13A, multiple first conductive pad 1303a and multiple are formed on substrate 1301
3rd conductive pad 1303b.First and the 3rd conductive pad 1303a, 1303b material and manufacture craft can be similar or identical to that display
First and the 3rd conductive pad 303a, 303b of device 300, for the sake of describing simplicity, are not just repeated herein.
Continue foregoing, as shown in Figure 13 B, the shape on substrate 1301, the first conductive pad 1303a and the 3rd conductive pad 1303b
Into the coating glue 1313 comprising separation material 1304.The manufacture craft and material for being coated with glue 1313 and separation material 1304 can similar or phases
Coating glue 1113, first and second separation material 1104a, 1104b shown in Figure 11 B are same as, for the sake of describing simplicity, herein just
Do not repeat.In some embodiments, after the coating glue 1313 comprising separation material 1304 is formed, positioned at the first conductive pad 1303a
The separation material 1304 of top is the first separation material 1304a, and separation material 1304 above the second conductive pad 1303b is the
Two separation material 1304b.In addition, the viscosity of the content of separation material 1304 and coating glue 1313 in coating glue 1313 can be according to system
Adjusted as process requirements.
Then, as shown in fig. 13 c, first and second grafting material 1305a, 1305b are set on coating glue 1313, and the
One and second grafting material 1305a, 1305b the embedded coating glue 1313 of a part in.It is worth noting that, first and second connect
Condensation material 1305a, 1305b thickness are more than the thickness of separation material 1304.In some embodiments, the first and second grafting materials
1305a, 1305b manufacture craft and material can be similar or identical to that Figure 11 C first and second grafting material 1105a, 1105b
Manufacture craft and material, just do not repeat herein.
As illustrated in figure 13d, adsorbed by joint 1311 or stick the first ray structure 1309a and the second ray structure
1309b, the first ray structure 1309a thickness are less than the second ray structure 1309b.On first ray structure 1309a bottom surface
Multiple second conductive pad 1307a are formed, and multiple 4th conductive pad 1309b are formed on the second ray structure 1309b bottom surface.The
One and second ray structure 1309a, 1309b manufacture craft and material can be similar or identical to that the first and of display device 300
Second ray structure 309a, 309b, and second and the 4th conductive pad 1307a, 1307b manufacture craft and material can similar or phase
Second and the 4th conductive pad 307a, 307b of ray structure 300 are same as, for the sake of describing simplicity, is not just repeated herein.
According to some embodiments, as shown in figure 13e, implement engagement manufacture craft, by joint 1311 by first and second
Ray structure 1309a, 1309b engage with substrate 1301 simultaneously, with the display device formed below 1300 of joint 1311.Joint
The temperature and pressure that the 1311 temperature and pressure such as Fig. 3 B applied joint 311 is applied, for the sake of describing simplicity, herein just
Do not describe.When the 4th conductive pad 1307b on the second thicker ray structure 1309b is touched on the second conductive pad 1303b
During the second separation material 1304b, engagement manufacture craft stops.Now, the first grafting material 1305a thickness is more than the second engagement
Material 1305b thickness, the first separation material 1304a thickness are less than the first grafting material 1305a thickness, and the second separation material
1304b thickness is equal to the second grafting material 1105b thickness.In addition, after implementing to engage manufacture craft, joint is removed
1311 to form display device 1300.
Similar in appearance to display device 1100 and 1200, display device 1300 can easily be set by being coated with the setting of glue 1313
The first separation material 1304a, the second separation material 1304b, the first grafting material 1305a and the second grafting material 1305b are put, and can be subtracted
Few overall manufacturing process steps.
In order to solve in the manufacture craft of eutectic bonding, due to the difference in thickness of ray structure or conductive pad, cause to send out
The problem of can not smoothly being engaged between photo structure and substrate, the embodiment of the present invention is by reducing the sectional area of grafting material or will connect
The mode of condensation material patterning, produces accommodation space between the conductive pad on substrate and ray structure so that because extruding and
Caused excessive grafting material enters this accommodation space, to avoid the problem of short-circuit between conductive pad.
In addition, the embodiment of the present invention is between substrate and ray structure by setting multiple contour separation materials, to ensure
When engaging manufacture craft and stopping, the surface of the remote substrate of each ray structure to the distance of substrate be it is consistent, it is another
Aspect, by the way that on substrate or ray structure, separation material is set between adjacent conductive pad, it can avoid in engagement manufacture craft
Afterwards, short circuit is produced between adjacent two conductive pad on substrate or ray structure.
The part of several embodiments outlined above, so as to can be more in skilled person in the technical field of the invention
Understand the viewpoint of embodiments of the invention.In skilled person in the technical field of the invention it should be understood that they can be with
Based on embodiments of the invention, the embodiment for designing or changing other manufacture crafts and structure to reach with introduce herein is identical
Purpose and/or advantage.In skilled person in the technical field of the invention it should also be appreciated that such equivalent structure
Have no deviating from spirit and scope of the invention, and they can do of all kinds without prejudice under the spirit and scope of the present invention
Change, substitution and replacement.
Claims (20)
1. a kind of display device, including：
First conductive pad, it is arranged on a substrate, there is a contact area wherein between first conductive pad and the substrate；
First grafting material, it is arranged on first conductive pad, wherein first grafting material is parallel to the substrate surface
There is a sectional area on direction；
Second conductive pad, it is arranged on first grafting material；And
First ray structure, it is arranged on second conductive pad,
Wherein the sectional area of first grafting material is less than the contact area of first conductive pad.
2. the position of display device as claimed in claim 1, the wherein sectional area is above and below the center of first grafting material
In the range of the thickness of each 15% first grafting material.
3. display device as claimed in claim 1, wherein first grafting material have the section profile to cave inward.
4. there is gap or hole in display device as claimed in claim 1, wherein first grafting material.
5. display device as claimed in claim 1, in addition to：
3rd conductive pad, it is arranged on the substrate；
Second grafting material, it is arranged on the 3rd conductive pad, wherein second grafting material has outstanding section wheel
It is wide；
4th conductive pad, it is arranged on second grafting material；And
Second ray structure, it is arranged on the 4th conductive pad.
6. display device as claimed in claim 5, wherein the first grafting material thickness are more than the second grafting material thickness.
7. display device as claimed in claim 5, the wherein thickness of first ray structure are less than second ray structure
Thickness.
8. there is gap or hole in display device as claimed in claim 5, wherein second grafting material.
9. a kind of display device, including：
First conductive pad, it is arranged on a substrate；
First grafting material, it is arranged on first conductive pad；
Second conductive pad, it is arranged on first grafting material；
First ray structure, it is arranged on second conductive pad；And
First separation material, it is arranged between the substrate and first ray structure.
10. display device as claimed in claim 9, wherein first separation material contact the substrate or first ray structure,
And the thickness of first separation material is less than the thickness summation of first conductive pad, first grafting material and second conductive pad.
11. display device as claimed in claim 9, the part of wherein first separation material extend to first conductive pad with
Between second conductive pad, the part of first separation material contacts first conductive pad or second conductive pad, and the part
Thickness be less than first grafting material thickness.
12. display device as claimed in claim 9, in addition to：
3rd conductive pad, it is arranged on the substrate；
Second grafting material, it is arranged on the 3rd conductive pad, wherein the thickness of first grafting material is more than second engagement
The thickness of material；
4th conductive pad, it is arranged on second grafting material；
Second ray structure, it is arranged on the 4th conductive pad；And
Second separation material, it is arranged between the substrate and second ray structure.
13. display device as claimed in claim 12, the wherein both ends of second separation material contact respectively the substrate and this
Two ray structures, and the thickness of second separation material is equal to the 3rd conductive pad, second grafting material and the 4th conductive pad
Thickness summation.
14. display device as claimed in claim 12, a part for wherein second separation material extends to the 3rd conductive pad
Between the 4th conductive pad, second separation material contacts the substrate or second ray structure, and second separation material should
Partial both ends contact the 3rd conductive pad and the 4th conductive pad respectively.
15. display device as claimed in claim 9, in addition to：
Glue is coated with, is arranged between the substrate and first ray structure, wherein first grafting material is arranged at the coating glue
It is interior, and first grafting material is spherical.
16. display device as claimed in claim 15, wherein first separation material are spherical, it is arranged in the coating glue, and
Contact first conductive pad and second conductive pad.
17. a kind of forming method of display device, including：
Form one first conduction to be padded on a substrate, there is a contact area wherein between first conductive pad and the substrate；
One second conduction is formed to be padded on one first ray structure；
One first grafting material is formed on first conductive pad, wherein first grafting material is parallel to the substrate surface
There is a sectional area, the sectional area of first grafting material is less than the contact area of first conductive pad on direction；And
Implement an engagement manufacture craft, first ray structure is bonded to the substrate.
18. the forming method of display device as claimed in claim 17, in addition to：
Before the engagement manufacture craft is implemented, one first separation material is formed on the substrate or first ray structure, and should
The thickness of first grafting material is more than the thickness of first separation material；And
After the engagement manufacture craft is implemented, the end thereof contacts of first separation material substrate, and first separation material is another
End thereof contacts first ray structure.
19. a kind of forming method of display device, including：
One first conduction is formed to be padded on a substrate；
One second conduction is formed to be padded on a ray structure；
A separation material is formed on the substrate or the ray structure；
A coating glue is formed on the substrate and first conductive pad；
A grafting material is formed on the coating glue, and the grafting material is embedded in the coating glue, wherein the thickness of the grafting material
Thickness of the degree more than the separation material；And
Implement an engagement manufacture craft, the ray structure is bonded to the substrate.
20. a kind of forming method of display device, including：
One first conduction is formed to be padded on a substrate；
One second conduction is formed to be padded on a ray structure；
A coating glue is formed on the substrate and first conductive pad, or formed the coating glue in the ray structure and this second lead
In electrical pad, wherein there is a separation material in the coating glue；
A grafting material is formed on the coating glue, and the grafting material is embedded in the coating glue, wherein the thickness of the grafting material
Thickness of the degree more than the separation material；And
Implement an engagement manufacture craft, the ray structure is bonded to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/644,047 US20180019234A1 (en) | 2016-07-13 | 2017-07-07 | Display devices and methods for forming the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662361543P | 2016-07-13 | 2016-07-13 | |
| US62/361,543 | 2016-07-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107623012A true CN107623012A (en) | 2018-01-23 |
| CN107623012B CN107623012B (en) | 2020-04-28 |
Family
ID=61086751
Family Applications (1)
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| CN201710061424.2A Active CN107623012B (en) | 2016-07-13 | 2017-01-26 | Display device and forming method thereof |
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